刻蚀腔InGaAsP/InP双异质结激光器的制作与特性

本文报道了用反应离子刻蚀（RIE）与晶向湿法化学腐蚀（XWCE）相结合沿InP衬底（110）方向获得工作波长1．3μm的InGaAsP／InP双异质结激光器的腔面的方法．用CH4：H2：Ar2的混合物作干法刻蚀的反应气体，用H2SO4：HCl：H2O2作湿法腐蚀的腐蚀剂，我们获得了质量较好的激光器的光学腔面．用一个刻蚀腔面与一个解理面组成激光器的F－P腔，我们获得了它的宽接触阈值电流和微分量子效率与用传统的解理腔面的激光器的宽接触阈值电流与微分量子效率相当的激光器．     

AlInAs氧化物限制1.3μm低阈值边发射激光器

研究制作了一种利用AlInAs氧化物作为限制的1.3μm边发射AlGaInAs多量子阱激光器.有源层上方和下方的AlInAs波导层被氧化作为电流限制层.这种结构提供了良好的侧向电流限制和光场限制.当电流通道为5μm宽时,获得了12.9mA的阈值电流和0.47W/A的斜率效率.与具有相同宽度的脊条的脊波导结构的激光器相比,这种AlInAs氧化物限制的激光器的阈值电流降低了31.7%,斜率效率稍微有所提高.低阈值和高效率的特性表明,氧化AlInAs波导层能够提供良好的侧向电流限制.这种AlInAs氧化物限制的激光器垂直方向的远场半高全宽角为36.1°,而水平方向的是21.6°,表明AlInAs氧化物对侧向光场也有很强的限制能力.     

AlInAs氧化物限制1.3μm低阈值边发射激光器

研究制作了一种利用AlInAs氧化物作为限制的 1.3μm边发射AlGaInAs多量子阱激光器 .有源层上方和下方的AlInAs波导层被氧化作为电流限制层 .这种结构提供了良好的侧向电流限制和光场限制 .当电流通道为 5 μm宽时 ,获得了 12 9mA的阈值电流和 0 4 7W /A的斜率效率 .与具有相同宽度的脊条的脊波导结构的激光器相比 ,这种AlInAs氧化物限制的激光器的阈值电流降低了 31 7% ,斜率效率稍微有所提高 .低阈值和高效率的特性表明 ,氧化AlInAs波导层能够提供良好的侧向电流限制 .这种AlInAs氧化物限制的激光器垂直方向的远场半高全宽角为36 1° ,而水平方向的     

高饱和电流14xx nm应变量子阱激光器的研制

报道了14xx nm应变量子阱(SQW)激光器管芯的研制成果。通过金属有机化学气相沉积(MOCVD)生长工艺生长14xx nm AlGaInAs/AlInAs/InP应变量子阱外延片,采用带有锥形增益区的脊型波导结构制作激光器管芯。生长好的外延片按照双沟脊型波导激光器制备工艺进行光刻、腐蚀,制作P面电极(溅射 TiPtAu)、减薄、制作N面电极(蒸发AuGeNi),然后将试验片解理成Bar;为获得高的单面输出功率,用电子回旋共振等离子体化学气相沉积(ECR)进行腔面镀膜,HR=90%,AR=5%;解理成的管芯P面朝下烧结到铜热沉上,TO3封装后在激光器综合测试仪进行测试。管芯功率达到440 mW以上,饱和电流3 A以上,峰值波长1430 nm,远场发散角为40°×14°。     

半径5μm的定向输出圆盘形微腔激光器

基于三维时域有限差分法,对半径为5μm的径向直连波导微腔激光器的模式及定向输出特性进行研究,得到了波长在1550nm附近的高品质因子(Q)横电模的Q值与光场分布特性。基于半导体平面加工工艺制备了AlGaInAs/InP圆盘形微腔激光器,微腔半径为5μm,波导宽度为1μm。该激光器在298K下实现了连续单模输出,阈值电流为4mA。在注入电流为9mA时,激光器的边模抑制比可达33.4dB。基于速率方程拟合了激光器模式强度随注入电流的变化,得到激光器的自发辐射因子约为5.5×10~(-3)。     

AllnAs/InP异质隧道结的设计与器件应用

应用高掺杂pn结和异质结能带理论,计算了AllnAs/InP异质隧道结的电学特性,发现其性能优于AllnAS和InP同质隧道结,并得出了掺杂浓度与隧道电流的关系曲线.采用气态源分子束外延(GSMBE)设备生长了面电阻率约为10~(-4)Ω·cm~2的AllnAs/InP异质隧道结结构,并应用于制作1.3μm垂直腔面发射激光器(VCSEL),器件在室温下脉冲激射.

Abstract：

By using high doping pn junction and heterojunction energy band model,electrical properties of AlInAs/InP tunnel junction are calculated.It is found that AlInAs/InP hetero-tunnel junction is superior to AlInAs or InP homo-tunnel junction,and the influence of doping level on the tunneling current is discussed.AlInAs/InP tunnel junction structures are grown by gas-source molecular-beam epitaxy (GSMBE) with the specific contact resistivity of about 10~(-4) Ω·cm~2.Then such structures are adopted in the fabrication of 1.3 μm vertical-cavity surface-emitting lasers(VCSEL).     

10Gbit/s高T0无制冷分布反馈激光器

与折射率耦合分布的分布反馈（DFB）激光器相比,不管界面反射率是多少,增益耦合DFB激光器都能稳定地单纵模工作,而且具有高速、低啁啾的特性．本课题组用AlGaInAs/InP材料,采用增益耦合DFB结构,进行了单纵模激光器研发,并对器件特性进行了测试分析．     

10Gbit/s高T0无制冷分布反馈激光器

与折射率耦合分布的分布反馈(DFB)激光器相比,不管界面反射率是多少,增益耦合DFB激光器都能稳定地单纵模工作,而且具有高速、低啁啾的特性.本课题组用AlGaInAs/InP材料,采用增益耦合DFB结构,进行了单纵模激光器研发,并对器件特性进行了测试分析.     

5kHz电光调Q LD端面泵浦Nd:YVO 紫外激光器

介绍了二极管连续激光器（LD）端面泵浦Nd:YVO4晶体，在200~5000Hz电光调Q的情况下激光输出的特性。当二极管输入电流10W，电光Q开关重复频率为1kHz时，355nm激光的平均输出功率为15mW，脉宽为20ns。并对实验结果进行了分析和讨论。     

用离子束刻蚀技术制作DBR激光器用光栅

作为波长1.5μ带光通信和集成光路中的光源,InP系激光器是比较理想而有希望的,特别是分布布拉格反射型(DBR)激光器有很好的动态特性,又有希望实现单片集成化。我们用离子束刻蚀技术制成了DBR激光器用的一级布拉格反射光栅,其周期为2450(?)。本文首先概述了InP离子束刻蚀的一般特性,然后对最佳光栅格子的设计和制作方法作一较详细的论述。     

Monolithic AlGaAs-GaAs single quantum-well ridge lasers fabricatedwith dry-etched facets and ridges

A process has been developed to allow the fabrication of self-aligned etched-facet ridge lasers. The ridge lasers have both their facets and ridges formed through the use of the chemically assisted ion beam etching technique. The ridge and facet of these lasers are self-aligned so that any misalignment during the photolithography does not affect positioning of the laser ridge with respect to the facet. A cavity with a length as short as 3 μ has been fabricated. The longitudinal mode spacing has been experimentally measured as a function of inverse cavity length for both the n_QW=1 and 2 transitions, and the corresponding dispersion terms have been determined     

Monolithic two-dimensional GaAs/AIGaAs laser arrays fabricated by chlorine lon-beam-assisted micromachining

Chlorine ion-beam-assisted etching (IBAE) has been used to micromachine laser facets and deflecting mirrors for monolithic two-dimensional GaAs/AIGaAs laser arrays. Three laser cavity/deflector designs have been successfully implemented. The first utilizes a parabolic deflecting mirror to directly focus the laser radiation; the second consists of a folded cavity with a vertical facet, a top surface facet, and an internal 45° reflector; and the third has a folded cavity with an internal Al_0.2Ga_0.8As/Al_0.8Ga_0.2As dielectric mirror stack and a top surface facet formed in a single etch step with two internal 45° reflectors. The parabolic deflecting mirrors are currently modeled forf- 0.8 collection efficiency, making the first design attractive in incoherent arrays for high-power applications such as pumping Nd:YAG lasers. The other two structures are of interest for incoherent or coherent arrays used in high- and medium-power applications, since the top surface facets can easily be antireflection coated. The design with a dielectric mirror stack is particularly simple to fabricate.     

1.58-μm lattice-matched and strained digital alloy AlGaInAs-InPmultiple-quantum-well lasers

A versatile, digital-alloy molecular beam epitaxy (MBE) technique is employed to grow lattice-matched and strained AlGaInAs multiple-quantum well (MQW) 1.58-μm laser diodes on InP. A threshold current density as low as 510 A/cm² has been demonstrated for broad area lasers with 1% strained AlGaInAs MQWs, which is the best MBE result in this material system. A single facet pulsed power as high as 0.56 W is obtained. It is also found that the efficiency and internal loss of digital alloy AlGaInAs QW devices are comparable to lasers grown by conventional MBE     

Fabrication of highly reflective gratings in 1.5 μm semiconductor lasers using focused ion beam-based etching

This paper reports on fabrication of semiconductor/air gratings in 1.5 μm double-section semiconductor lasers to achieve a high reflectivity in order to compensate low round-trip gain. Fabrication of the gratings with varying thicknesses and with thicknesses down to 160 nm is carried out at the gain section of the double-section diode laser using focused ion beam etching (FIBE) and inductively coupled plasma (ICP) techniques. Theoretical results of reflectivity are given for 1.5 μm AlGaInAs/InP semiconductor lasers by adding wavelength dependence of the refractive index into the calculations. We also compare our reflectivity results with that of a commercial simulation program and show a good agreement between them. Our results demonstrate that the gratings fabricated consist of only six air/semiconductor layer pairs and achieve theoretical reflectivity higher than 99%. Due to a high index contrast of the both layers, n_l = 1, n_h ∼ 3.5, a reflectivity bandwidth of >230 nm is obtained in 1.5 μm semiconductor lasers. Finally, lasing operation from AlGaInAs/InP semiconductor lasers with highly reflective grating section is achieved with a low threshold current of ∼8 mA, which is almost three times lower than devices without semiconductor/air gratings.     

基于直接调制和外调制的高速半导体激光光源

直接调制和外调制的半导体激光光源在现代光纤通信系统中有着重要的应用。首先介绍了应用于10 Gb/s接入网系统的直接调制AlGaInAs多量子阱DFB激光器。由于AlGaInAs量子阱的导带不连续性较大,因此基于该材料的半导体激光器具有良好的温度特性,其特征温度达到了88 K。同时,该直接调制激光器的3 dB小信号调制响应带宽超过15 GHz。随后介绍面向40 Gb/s干线传输系统的高速DFB激光器/EA调制器集成光源。该集成光源采用同一外延层集成方案,并采用Al2O3高速微波热沉进行了管芯级封装,在3 V反向偏压下获得大于13 dB的静态消光比,3 dB小信号调制带宽超过40 GHz。     

有铝激光器和无铝激光器特征温度对比研究

为了测量两种有源区材料半导体激光器的温度灵敏度,文中对InGaAsP/GaAs无铝和AlGaInAs/AlGaAs/GaAs有铝的808 nm大功率半导体激光器,采用阈值电流法衡量两种有源区材料激光器的特征温度。在各种温度下实验性地测量激光器的P-I曲线,并采用线性拟合法得到阈值温度线性关系,实验结果表明有铝激光器温度性能明显优于无铝激光器。     

半导体激光器的主要失效机理及其与芯片烧结工艺的相关性

分析了GaAs/CaAlAs高功率半导体激光器的暗线缺陷，腔面损伤退化和电极退化等主要失效机理及主要失效模式。通过样品老化试验，从微观物理角度分析了光功率输出下降与芯片烧结工艺相关性，明确了烧结焊料引起PN结短路，烧结空隙，焊料沾污等是导致半导体激光器退化的一个主要因素。     

High-Power Distributed Feedback Laser Diodes Emitting at 820nm

通过将二级光栅直接刻在脊形波导AlGaInAs/AlGaAs DFB激光器的无铝光波导层上,实现了波长约为820nm,单面功率为30mW的单纵模激光器.由于采用无铝光栅,保证了二次外延质量,从而得到较好的器件性能.激光器的阈值电流为57mA,斜率效率约为0.32mW/mA.