The effects of LT AlN buffer thickness on the properties of high Al composition AlGaN epilayers

To fabricate nitride-based ultraviolet optoelectronic devices, a deposition process for high-Al-composition AlGaN (Al content > 50%) films with reduced dislocation densities must be developed. This paper describes the growth of high-Al-composition AlGaN film on (0001) sapphire via a LT AlN nucleation layer by low pressure metalorganic chemical vapor deposition (LPMOCVD). The influence of the low temperature AlN buffer layer thickness on the high-Al-content AlGaN epilayer is investigated by triple-axis X-ray diffraction (TAXRD), scanning electron microscopy (SEM), and optical transmittance. The results show that the buffer thickness is a key parameter that affects the quality of the AlGaN epilayer. An appropriate thickness results in the best structural properties and surface morphology.     

Cathodoluminescence study of crystalline quality of (Al, In, Ga)N heterostructures

Wurtzite InGaN/GaN and AlGaN/GaN heterostructures grown by metal organic vapor phase epitaxy were studied using cathodoluminescence (CL) combined with secondary electron microscopy (SEM) and scanning transmission electron microscopy (STEM). The surface morphology of samples containing InGaN layers is dominated by three types of defects: mesa-like hexagonal structures, hexagonal pyramids and micropipes. At the positions of pyramids the whole epilayer is thicker than at defect free positions, while at the positions of micropipes the whole epilayer is much thinner. The luminescence efficiency as well as the emission wavelength are influenced by these defects. In SL structures an increasing SL period thickness in the growth direction was observed. Panchromatic CL images show intensity inhomogeneity in both InGaN/GaN and AlGaN/GaN heterostructure, which are related to local variations of the interface quality. In AlGaN/GaN SQW structures a broad deep-level luminescence band at around 543 nm was observed, which is generally absent in InGaN/GaN heterostructures. This deep-level emission is strongly enhanced in defect positions.     

Nanoheteroepitaxy of GaN on a nanopore array of Si(111) surface

Nanoheteroepitaxial (NHE) growth of GaN using AlN/AlGaN as a graded buffer layer by metalorganic chemical vapor deposition has been demonstrated on the nanoporous patterned Si(111) substrates. The nanopore array on Si(111) has been fabricated by using anodized aluminum oxide membrane as an induced couple plasma dry etching mask. The reduction of the threading dislocation density and relaxation of the tensile stress in NHE GaN are revealed by transmission electron microscopy (TEM), micro-Raman spectrum and photoluminescence spectrum, respectively. Cross-sectional TEM analysis shows that dislocations nucleated at the interface are forced to bend into (0001) basal plane. Red shift in the E₂ (TO) phonon peak of micro-Raman spectrum indicates the relaxation of tensile stress in the nanoheteroepitaxial lateral overgrowth of GaN. A single step ELO without mask on nanopatterned Si(111) substrates is a simple and promising way for the improvement of the quality of GaN on Si substrates.     

Improvement of GaN epilayer by gradient layer method with molecular-beam epitaxy

We demonstrated a molecular beam epitaxy method to resolve the dilemma between structural and morphological quality in growth of the GaN epilayer. A gradient buffer layer was grown in such a way that the N/Ga ratio was gradually changed from nitrogen-rich to gallium-rich. The GaN epitaxial layer was then grown on the gradient buffer layer. In the X-ray diffraction analysis of GaN(002) rocking curves, we found that the full width at half-maximum was improved from 531.69″ to 59.43″ for the sample with a gradient buffer layer as compared to a purely gallium-rich grown sample. Atomic force microscopy analysis showed that the root-mean-square roughness of the surface was improved from 18.28 nm to 1.62 nm over an area of 5 × 5 μm² with respect to a purely nitrogen-rich grown sample. Raman scattering showed the presence of a slightly tilted plane in the gradient layer. Furthermore we showed that the gradient layer can also slash the strain force caused by either Ga-rich GaN epitaxial layer or AlN buffer layer.     

GaN epilayer on separately deposited buffer layer by hot wall epitaxy

High quality GaN epilayers were grown on a sapphire substrate using a hot wall epitaxy method. We have investigated the crystal, optical, and electrical properties of GaN epilayers grown as functions of the nitridation condition of the substrate and the growth condition of GaN buffer layer. In order to study an effective method to grow a buffer layer for the growth of high quality GaN epilayer, the buffer layers were formed on the nitridated substrate using two different methods. One is separately deposited buffer layer (SDBL), and the other is co-deposited buffer layer (CDBL). It was observed that the growth condition of the buffer layer had a strong influence on the crystal and optical properties of GaN epilayer. A strong band edge emission peak at 3.474 eV was observed from the photoluminescence spectrum measured at 5 K for GaN epilayer grown at the optimum condition of the buffer layer. The carrier concentration and mobility of undoped GaN epilayer grown with a growth rate of 0.5 μm h⁻¹ were 2 × 10¹⁸ cm⁻³ and >50 cm³ V⁻¹ s⁻¹ at room temperature, respectively.     

Asymmetry of the Defect Structure of Semipolar GaN Grown on Si(001)

The defect structure of a thick (~15 μm) semipolar gallium nitride (GaN) layer grown by hydride–chloride vapor phase epitaxy on a Si(001) substrate with buffer layers has been studied by transmission electron microscopy. The asymmetry of the defect structure of GaN epilayer has been revealed and analyzed. The influence of this asymmetry on the rate of decrease in the density of threading dislocations in the growing epitaxial layer is discussed.

     

Structural properties of GaN grown on AlGaN/AlN stress mitigating layers on 100-mm Si (111) by ammonia molecular beam epitaxy

The structural properties of GaN grown on AlGaN/AlN stress mitigating layers on 100-mm diameter Si (111) substrate by ammonia molecular beam epitaxy have been reported. High resolution X-ray diffraction, micro-Raman spectroscopy, transmission electron microscopy and secondary ion mass spectroscopy have been used to study the influence of AlN thickness and AlGaN growth temperature on the quality of GaN. GaN grown on thicker AlN showed reduced dislocation density and lesser tensile strain. Three-dimensional growth regime was observed for GaN grown at lower AlGaN growth temperature while higher AlGaN growth temperature resulted in two-dimensional growth mode. The dislocation bending and looping at the AlGaN/AlN interface was found to have significant influence on the dislocation density and strain in the GaN layer. The evolution and interaction of threading dislocations play a major role in determining the quality and the strain states of GaN.     

MgO缓冲层对PZT/AlGaN/GaN异质结构电学性能的影响

采用脉冲激光沉积(PLD)技术,以MgO作为缓冲层,在AlGaN/GaN半导体异质结构上沉积了Pb(Zr0.52T0.48) O3 (PZT)铁电薄膜,从而形成金属-铁电-介质-半导体结构(MFIS).XRD扫描结果表明,通过MgO缓冲层对界面结构的优化,实现了PZT薄膜沿(111)面择优取向生长.电流-电压(I-V ...     

Influence of AlN buffer layer thickness and deposition methods on GaN epitaxial growth

A gallium nitride (GaN) epitaxial layer was grown by metal-organic chemical vapor deposition (MOCVD) on Si (111) substrates with aluminum nitride (AlN) buffer layers at various thicknesses. The AlN buffer layers were deposited by two methods: radio frequency (RF) magnetron sputtering and MOCVD. The effect of the AlN deposition method and layer thickness on the morphological, structural and optical properties of the GaN layers was investigated. Field emission scanning electron microscopy showed that GaN did not coalesce on the sputtered AlN buffer layer. On the other hand, it coalesced with a single domain on the MOCVD-grown AlN buffer layer. Structural and optical analyses indicated that GaN on the MOCVD-grown AlN buffer layer had fewer defects and a better aligned lattice to the a- and c-axes than GaN on the sputtered AlN buffer layer.     

The growth behavior of GaN film on Si(111) substrate by an ion-beam assisted evaporation process

Highly oriented GaN thin films were grown on Si(111) substrate using an ion beam assisted evaporation method. Nitrogen ions, with a kinetic energy of about 40 eV, was supplied by a Kaufman ion source; and Ga vapor was supplied by thermal evaporation. The surface morphology of the nucleation layer, and the crystalline properties of 200–300 nm thick GaN epi-layer were investigated by atomic force microscopy, transmission electron microscopy, and X-ray diffraction. Film grown under a Ga-rich flux condition produced film growth behavior of large islands of hexagonal configuration. Crystallinity on such film, however, was of poorer quality than other films with smaller islands, grown under high nitrogen ion flux conditions. The full width at half-maximum of (0002) diffraction peak was measured at 52 arcminutes for the GaN epilayer single-stepwise grown at 660°C. Ion-enhanced decomposition occurred, causing no film formation at substrate temperatures above 710°C. Additionally, the effect of predeposition of a buffer layer on GaN crystallinity was investigated for surface roughness. AFM measurement revealed that the GaN buffer layer grown on Si(111) showed smooth surface under the relatively N₂⁺-sufficient condition. The introduction of thin GaN buffer layer, grown at 600°C under N₂⁺-sufficient condition, worked on reducing the lattice-mismatch stress and in-plane misorientation of grains, and thus enhancing the crystallinity of the two-stepwise grown GaN epi-layer. Characteristic behavior of GaN epi-layers, single or two stepwise grown on Si(111), show a type of granular (columnar) epitaxy.     

Influence of double buffer layers on properties of Ga-polarity GaN films grown by rf-plasma assisted molecular-beam epitaxy

Ga-polarity GaN thin films were grown on sapphire (0001) substrates by rf-plasma assisted molecular beam epitaxy (MBE) using a double buffer layer, which consisted of an intermediate-temperature GaN buffer layer (ITBL) grown at 690 °C and a conventional AlN buffer layer deposited at 740 °C. Raman scattering spectra showed that the E₂ (high) mode of GaN film grown on conventional AlN buffer layer is at about 570 cm⁻¹, and shifts to 568 cm⁻¹ when an ITBL was used. This indicates that the ITBL leads to the relaxation of residual strain in GaN film caused by mismatches in the lattice constants and coefficients of thermal expansion between the GaN epilayer and the sapphire substrate. Compared to the GaN film grown on the conventional AlN buffer layer, the GaN film grown on an ITBL shows higher Hall mobility and substantial reduction in the flicker noise levels with a Hooge parameter of 3.87×10⁻⁴, which is believed to be, to date, the lowest reported for GaN material. These results imply that the quality of Ga-polarity GaN films grown by MBE can be significantly improved by using an ITBL in addition to the conventional low-temperature AlN buffer layer.     

MOCVD growth of GaN layer on InN interlayer and relaxation of residual strain

100 nm InN layer was grown on sapphire c-plane using a metal-organic chemical vapor deposition (MOCVD) system. Low temperature (LT) GaN layer was grown on InN layer to protect InN layer from direct exposure to hydrogen flow during high temperature (HT) GaN growth and/or abrupt decomposition. Subsequently, thick HT GaN layer (2.5 μm thick) was grown at 1000 °C on LT GaN/InN/sapphire template. Microstructure of epilayer-substrate interface was investigated by transmission electron microscopy (TEM). From the high angle annular dark field TEM image, the growth of columnar structured LT GaN and HT GaN with good crystallinity was observed. Though thickness of InN interlayer is assumed to be about 100 nm based on growth rate, it was not clearly shown in TEM image due to the InN decomposition. The lattice parameters of GaN layers were measured by XRD measurement, which shows that InN interlayer reduces the compressive strain in GaN layer. The relaxation of compressive strain in GaN layer was also confirmed by photoluminescence (PL) measurement. As shown in the PL spectra, red shift of GaN band edge peak was observed, which indicates the reduction of compressive strain in GaN epilayer.     

Fabrication of epitaxial III-nitride cantilevers on silicon (1 1 1) substrates

The molecular beam epitaxy of AlGaN/GaN epilayers on silicon (1 1 1) using an aluminum nitride buffer layer, and subsequent fabrication of free standing III-nitride cantilevers on Si(1 1 1) has been investigated. Transmission electron microscopy (TEM) of cross-section samples reveals a columnar structure consisting of the hexagonal gallium nitride polytype. Selected area diffraction indicates an epitaxial relationship between the gallium nitride and silicon substrate which is described by GaN[0 0 0 1]//Si[1 1 1] and GaN(1 1 0 0)//Si(1 1 1). Imaging of the electronic structure of an AlGaN/GaN interface has been investigated by mapping the variation in the plasmon frequency using an electron energy loss spectrometer on a dedicated scanning transmission electron microscope. Cantilevers were fabricated using a combination of etching processes. Nitride etch rates during inductively coupled plasma dry etch processing using a Cl₂/Ar plasma etchant were obtained by monitoring the optical reflectivity of the nitride films in situ. A peak GaN etch rate of 250 nm/min was measured, the etch rate was found to be strongly dependent on the d.c. self-bias. Thin beams of GaN having a length of 7 μm and 0.7 μm thickness, were fabricated and mechanically released from Si(1 1 1) substrates using a combination of two dry ICP etch processes, using Cl₂/Ar and CF₄/Ar/O₂ chemistries, and a potassium hydroxide (KOH) aqueous wet etch.     

Synthesis and characterization of heteroepitaxial GaN films on Si(111)

We report crack-free and single-crystalline wurtzite GaN heteroepitaxy layers have been grown on Si (111) substrate by metal-organic chemical vapor deposition(MOCVD). Synthesized GaN epilayer was characterized by X-ray diffraction(XRD), atomic force microscope (AFM) and Raman spectrum. The test results show that the GaN crystal reveals a wurtzite structure with the <0001> crystal orientation and XRD ω-scans showed a full width at half maximum (FWHM) of around 583 arcsec for GaN grown on Si substrate with an HT-AlN buffer layer. In addition, the Raman peaks of E₂^high and A₁(LO) phonon mode in GaN films have an obvious redshit comparing to bulk GaN eigen-frequency, which most likely due to tensile strain in GaN layers. But the AO phonon mode of Si has a blueshit which shows that the Si substrate suffered a compressive strain. And we report that the AlN buffer layer plays a role for releasing the residual stress in GaN films.     

Structural and photoluminescence study of thin GaN film grown on silicon substrate by metalorganic chemical vapor deposition

GaN epitaxial layer was grown on Si(111) substrate by metalorganic chemical vapor deposition (MOCVD). The structure consists of 50 nm thick high-temperature grown AlN buffer layer, 150 nm thick AlGaN layer, 30 nm low-temperature grown AlN layer, 300 nm GaN layer, 50 nm AlGaN superlattice layer, followed by 100 nm GaN epitaxial layer. The low-temperature AlN interlayer and AlGaN superlattice layer were inserted as the defect-blocking layers in the MOCVD grown sample to eliminate the dislocations and improve the structural and optical properties of the GaN layer. The dislocation density at the top surface was decreased to ∼ 2.8 × 10⁹/cm². The optical quality was considerably improved. The photoluminescence emission at 3.42-3.45 eV is attributed to the recombination of free hole-to-donor electron. The observed 3.30 eV emission peak is assigned to be donor-acceptor transition with two longitudinal optical phonon side bands. The relationship of the peak energy and the temperature is discussed.     

Epitaxy of gallium nitride in semi-polar direction on Si(210) substrate

The idea of a new method for growing gallium nitride (GaN) epilayers in semi-polar direction by hydride-chloride vapor-phase epitaxy (HVPE) is disclosed. We propose to use Si(210) substrates with the first buffer layer of silicon carbide (3C-SiC) and the second buffer layer of aluminum nitride (AlN). It is experimentally demonstrated for the first time that, under conditions of anisotropic deformation in the GaN/AlN/3C-SiC/Si(210) structure, a GaN epilayer exhibits growth in semi-polar directions.     

AlGaN/GaN Schottky Barrier Photodetector With Multi-${rm Mg}_{rm x} {rm N} _{rm y} $/GaN Buffer

AlGaN/GaN heterostructure Schottky barrier photodetector (PD) with multi-Mg_xN_y/GaN buffer was proposed and fabricated. Compared with AlGaN/GaN heterostructure PD prepared on conventional low-temperature GaN buffer, it was found that we can reduce dark leakage current by more than three orders of magnitude. It was also found that we can use the multi-Mg_xN_y/GaN buffer to suppress photoconductance gain, enhance UV-to-visible rejection ratio, reduce noise level and enhance the detectivity.     

Thermal Oxidation of Silicon Carbide Substrates

Thermal oxidation was used to remove the subsurface damage of silicon carbide (SiC) surfaces. The anisotrow of oxidation and the composition of oxide layers on Si and C faces were analyzed. Regular pits were observed on the surface after the removal of the oxide layers, which were detrimental to the growth of high quality epitaxial layers. The thickness and composition of the oxide layers were characterized by Rutherford backscat-tering spectrometry (RBS) and X-ray photoelectron spectroscopy (XPS), respectively. Epitaxial growth was performed in a metal organic chemical vapor deposition (MOCVD) system. The substrate surface morphol-ogy after removing the oxide layer and gallium nitride (GaN) epilayer surface were observed by atomic force microscopy (AFM). The results showed that the GaN epilayer grown on the oxidized substrates was superior to that on the unoxidized substrates.     

Metalorganic molecular beam epitaxy of GaN and Al(Ga)N on GaAs(001) studied using laser reflectometry and reflectance anisotropy spectroscopy

We report the growth of GaN and AlGaN films on GaAs (0 0 1) substrates in the temperature range 400–800 °C by metalorganic molecular beam epitaxy. An r.f. plasma nitrogen source was used in conjunction with triethylgallium and ethyl-dimethylamine-alane group III sources. Growth was initiated using either a low temperature AlN buffer layer or a graded arsenide-nitride buffer layer. The growth was monitored in real time using in-situ laser reflectometry. The temperature dependence of growth rates for the nitride layers are compared with their arsenide analogs. The relative growth rate of gallium nitride/gallium arsenide from triethylgallium was found to be in the range 54–60%, the Ga incorporation rates are closely comparable when the higher density of GaN is taken into account. The range of growth temperatures for gallium nitride extends to higher temperatures compared with gallium arsenide probably due to lower evaporation rates of Ga bound to the nitride surface. Reflection anisotropy spectra indicate that atomic nitrogen readily reacts with the GaAs (0 0 1)-c (4 × 4) As-stabilized surface at temperatures as low as 400 °C but without the gross faceting that has been observed at higher temperatures.     

Fabrication of epitaxial III-nitride cantilevers on silicon (1 1 1) substrates

The molecular beam epitaxy of AlGaN/GaN epilayers on silicon (1 1 1) using an aluminum nitride buffer layer, and subsequent fabrication of free standing III-nitride cantilevers on Si(1 1 1) has been investigated. Transmission electron microscopy (TEM) of cross-section samples reveals a columnar structure consisting of the hexagonal gallium nitride polytype. Selected area diffraction indicates an epitaxial relationship between the gallium nitride and silicon substrate which is described by GaN[0 0 0 1]//Si[1 1 1] and GaN(1 1 0 0)//Si(1 1 1). Imaging of the electronic structure of an AlGaN/GaN interface has been investigated by mapping the variation in the plasmon frequency using an electron energy loss spectrometer on a dedicated scanning transmission electron microscope. Cantilevers were fabricated using a combination of etching processes. Nitride etch rates during inductively coupled plasma dry etch processing using a Cl₂/Ar plasma etchant were obtained by monitoring the optical reflectivity of the nitride films in situ. A peak GaN etch rate of 250 nm/min was measured, the etch rate was found to be strongly dependent on the d.c. self-bias. Thin beams of GaN having a length of 7 m and 0.7 m thickness, were fabricated and mechanically released from Si(1 1 1) substrates using a combination of two dry ICP etch processes, using Cl₂/Ar and CF₄/Ar/O₂ chemistries, and a potassium hydroxide (KOH) aqueous wet etch.