基于电磁仿真和测试的表面贴装器件建模

为了建立表面贴装器件的计算机辅助设计等效电路模型,必须考虑到寄生效应和测试夹具带来的影响,因此必须对测试夹具进行去嵌。以表贴电阻为例介绍了基于数值分析法和测量法去除夹具效应和提取电阻等效电路模型的方法。所提取的等效电路模型能够在高达10 GHz的频率范围内表征器件。     

Experimental equivalent-circuit modeling of SMD inductors forprinted circuit applications

An understanding of the high-frequency parasitic and packaging effects of passive surface-mounted devices (SMDs) can be gained from equivalent-circuit characterization of the device. We develop a circuit model which accurately characterizes the nonideal behavior of SMD inductors mounted on a printed circuit board (PCB), considering the device packaging and the interaction between board layout and component parasitics. The model is valid over a wide frequency band up to the first resonance of the inductor. The equivalent-circuit parameters are extracted in closed form from an accurate measurement of the S-parameters of the board-mounted SMD inductor, without the necessity for cumbersome optimization procedures normally followed in RF circuit synthesis. This procedure of measuring the component in its designed PCB environment is referred to as extrinsic characterization, in contrast to the conventional intrinsic characterization employed in RF bridges and LCR meters, which does not include the board layout effects. The developed closed-form model can be directly incorporated in commercial CAD packages, and thus, it simplifies the analysis of electromagnetic field behavior in PCBs, such as prediction of radiated emissions, signal integrity, and EMI     

A derived physically expressive circuit model for multilayer RF embedded passives

In this paper, a derived physically expressive circuit model is presented for automatically deriving an equivalent-circuit model of a multilayered embedded RF passive. The scheme is based on the partial-element equivalent-circuit (PEEC) model and a simple circuit transformation. By defining an appropriate cutoff criterion that is related to the highest frequency of interest, most of the internal nodes in the coupling circuit generated by the PEEC model can be approximately absorbed by the remaining frequency-independent LC elements progressively. The model is very simple to implement and has apparent physical meaning. Mathematically, this model progressively recombines the least significant system pole with other less significant poles. The resultant physically expressive circuit model will be very useful in designing multilayer embedded RF circuits. Four examples are given for demonstrating the validity and effectiveness of the scheme.     

Analysis of high speed p-i-n photodiode S-parameters by a novel small-signal equivalent circuit model

A novel small-signal radio frequency (RF) equivalent-circuit of the side-illuminated input tapered waveguide-integrated p-i-n photodiodes (WG PIN PD) is proposed. The proposed RF equivalent-circuit involves both the carrier-transit effect and the external resistance-capacitance (RC) time constant limitation on the frequency response of the p-i-n PD. The carrier-transit effect is realized by adding an RC circuit to an ideal voltage-controlled current source as the input opto-RF equivalent circuit. The carrier transit-time effect is equivalently represented by the time-constant of this input RC circuit. This new equivalent circuit model fits well with both the measured reflection and optoelectronic conversion parameters of the WG PIN PD in a broad frequency range from 45 MHz to 50 GHz.     

射频系统的系统级封装

论述了高速数据处理和高密度封装技术的特点及对射频系统封装的特殊要求,介绍了射频系统封装的基本技术和一种包含LNA、PPA、滤波器及天线开关的射频系统级封装模块.概述了射频系统级封装的设计、仿真和测试的方法和步骤.     

射频系统的系统级封装

射频系统级封装是近年发展起来的实现射频电子系统的一种创新技术。对高速数据处理和高密度封装技术的特点及对射频系统封装的特殊要求进行论述．介绍了射频系统封装的基本技术和一种包含LAN、PPA、滤波器、天线开关等的射频系统级封装组件。论述了射频系统级封装的系统设计、仿真、测试的方法和步骤。     

射频系统封装的发展现状和影响

电子产品小型化将进一步依赖微电子封装技术的进步.SiP（系统封装）所强调的是将一个尽可能完整的电子系统或子系统高密度地集成于单个封装体内,随着其技术的研究不断深入,封装规模不断扩大,其作用不断提升,它在射频领域中的应用特性也日趋突出,成为实现视频系统小型化、轻量化、高性能和高可靠的有效方法.针对当前RF SiP（射频系...     

Frequency Scalable Model for MEMS Capacitive Shunt Switches at Millimeter-Wave Frequencies

This paper presents an approach to RF microelectromechanical systems (MEMS) capacitive shunt switch design from $K$-band up to $W$-band based on the scalability of the RF MEMS switch with frequency. The parameters of the switch's equivalent-circuit model also follow scaling rules. The measurement results of the fabricated switches show an excellent agreement with simulations that allow to validate the MEMS model in the entire band from 20 up to 94 GHz. This model is going to be used in the phase shifter circuit design for antenna array applications. The first 60-GHz phase shifter results are also reported here.      

Modelling and Analysis of Cuk Converter Using Current Injected Equivalent Circuit Approach

The current-injected equivalent-circuit approach has been developed for modelling and analysis of switching dc-dc converters and is very versatile. This approach can also be applied for modelling and analysis of complex converters or cascaded converters. To demonstrate the ability of the current-injected equivalent-circuit approach, the modelling and analysis of a Cuk converter is carried out. A small signal equivalent-circuit model is obtained which represents both input and output properties of the nonlinear converter. The results are presented in the form of linear equivalent-circuit models, as well as transfer functions.     

Methods to reduce radiation from split ground planes in RF and mixed signal packaging structures

Split ground planes are sometimes used in RF and mixed signal packages in order to isolate the RF and analog circuits from the digital circuits. Undesired radiation in a packaging environment may occur when a signal trace is routed over a slot in the ground plane. This paper examines and investigates ways to eliminate signal coupling into split ground plane structures and assesses the impact of this reduced coupling on signal integrity in a packaging environment. Suggested methods to reduce coupling of energy into the slot are to alter the shape of the slot with RF chokes or corrugations.     

Three-dimensional high-frequency distribution networks. I.Optimization of CPW discontinuities

This paper describes a systematic study of coplanar waveguide discontinuities that are requisite components of high-frequency distribution networks. The specific geometries addressed are air bridges, right-angle bends, tee junctions, and Wilkinson dividers. Relative to typical monolithic-microwave integrated-circuit designs, the components studied herein are electrically large in order to minimize signal attenuation. The large size leads to pronounced parasitic effects, and the emphasis of this study was to optimize the electrical performance using simple compensation techniques. The optimization methods are developed using full-wave simulation and equivalent-circuit modeling, and are verified experimentally up to 60 GHz. Part II of this paper describes the implementation and packaging of the components to realize a three-dimensional W-band distribution network     

RF/微波无线系统中的MEMS技术

着重论述了RF/微波MEMS元件及其制造技术、封装要求和设计,并在此基础上阐述RF/微波MEMS元件的应用电路和系统。     

RF-MEMS开关的应用技术浅析

概述RF-MEMS开关的应用现状,针对RF-MEMS开关封装后射频性能恶化的问题,分析了封装的必要性,强调了单片级封装对功能化模块的集成优势;针对RF-MEMS开关的使用寿命不能满足系统应用的问题,比较不同的切换方式下的使用寿命,介绍冷切换与射频信号通断的时间关系,给出了一种延长开关使用寿命的解决方案。进一步推动RF-MEMS开关在系统方面的应用。     

电子元器件封装技术发展趋势

晶圆级封装、多芯片封装、系统封装和三维叠层封装是近几年来迅速发展的新型封装方式,在推动更高性能、更低功耗、更低成本和更小形状因子的产品上,先进封装技术发挥着至关重要的作用。晶圆级芯片尺寸封装(WCSP)应用范围在不断扩展,无源器件、分立器件、RF和存储器的比例不断提高。随着芯片尺寸和引脚数目的增加,板级可靠性成为一大挑战。系统封装(SIP)已经开始集成MEMS器件、逻辑电路和特定应用电路。使用TSV的三维封装技术可以为MEMS器件与其他芯片的叠层提供解决方案。     

A PEEC with a new capacitance model for circuit simulation ofinterconnects and packaging structures

In this paper, a modified partial-element equivalent-circuit (PEEC) model, i.e., (L_p, A&oarr;, R, ϵf)PEEC, is introduced. In such a model, no equivalent circuit, but a set of state equations for the variables representing the function of circuit, are given to model a three-dimensional structure. Unlike the original (L_p, P, R, ϵf) PEEC model, the definition of vector potential A&oarr; with integral form and the Lorentz gauge are used in expanding the basic integral equation instead of the definition of the scalar potential φ with integral form. This can directly lead to the state equations, and the capacitance extraction can be replaced by the calculation of the divergence of A&oarr;, which is analytical. For analysis of most interconnect and packaging problems, generally containing complex dielectric structures, the new model can save a large part of computing time. The validity of the new model is verified by the analysis in time and frequency domain with several examples of typical interconnect and packaging structures, and the results with this new method agree well with those of other papers     

埋置型叠层微系统封装技术

包含微机电系统(MEMS)混合元器件的埋置型叠层封装,此封装工艺为目前用于微电子封装的挠曲基板上芯片(COF)工艺的衍生物。COF是一种高性能、多芯片封装工艺技术,在此封装中把芯片包入模塑塑料基板中,通过在元器件上形成的薄膜结构构成互连。研究的激光融除工艺能够使所选择的COF叠层区域有效融除,而对封装的MEMS器件影响最小。对用于标准的COF工艺的融除程序进行分析和特征描述,以便设计一种新的对裸露的MEMS器件热损坏的潜在性最小的程序。COF/MEMS封装技术非常适合于诸如微光学及无线射频器件等很多微系统封装的应用。     

An embedded overlay concept for microsystems packaging

An embedded overlay concept for packaging hybrid components containing microelectromechanical systems (MEMS) is described. This packaging process is a derivative of the chip-on-flex (COF) process currently used for microelectronics packaging. COF is a high performance, multichip packaging technology in which die are encased in a molded plastic substrate and interconnects are made via a thin-film structure formed over the components. A laser ablation process has been developed which enables selected areas of the COF overlay to be efficiently ablated with minimal impact to the packaged MEMS devices. Analysis and characterization of the ablation procedures used in the standard COF process was performed to design a new procedure which minimized the potential for heat damage to exposed MEMS devices. The COF/MEMS packaging technology is well-suited for many microsystem packaging applications such as micro-optics and radio frequency (RF) devices.     

GHz波段nH量级两种平面圆形螺旋电感性能比较

以硅衬底螺旋电感(SIOS)的紧凑集总模型为基础,借助任意三维无源器件全波电磁(EM)场仿真器HFSS(High Frequency Structure Simulator),对差分对称圆形、普通平面圆形两种螺旋电感进行了对比研究.结果表明:品质因数(QF)和3 dB带宽(BW)前者明显优于后者,电感值L后者明显优于后者,自激振荡频率(SRF)两者基本相当.采用文中参数,前者较后者QF提高146.1%,SRF提高31.9%,但后者L值能达到前者3倍以上.模拟结果与理论分析相吻合.     

埋置型叠层微系统封装技术

包含微机电系统(MEMS)混合元器件的埋置型叠层封装,此封装工艺为目前用于微电子封装的挠曲基板上芯片(COF)工艺的衍生物.COF是一种高性能、多芯片封装工艺技术,在此封装中把芯片包入模塑塑料基板中,通过在元器件上形成的薄膜结构构成互连.研究的激光融除工艺能够使所选择的COF叠层区域有效融除,而对封装的MEMS器件影响...     

A chip-on-board packaged bandpass filter using cross-coupled topological optimised hairpin resonators for X-band radar application

Devices that are compact in design and fabrication continue to draw attention for specific applications that require high performance. A compact elliptic bandpass filter using a cross-coupled topological structure with a hairpin resonator optimised for radar applications is presented in this paper. This work presents the design theory and corresponding semiconductor fabrication processes and describes the chip-on-board packaging method in detail. The proposed design of the bandpass filter can not only reduce the size of the device and result in good RF performance, but the accurate semiconductor fabrication process can also ensure high performance further. In addition, the presented chip-on-board packaging method can greatly enhance the reliability and long-term stability of a microwave device, which rarely introduces RF characteristic interference. The simulated, bare-chip measured and final chip-on-board measured results agreed well, which validated the correctness of the proposed approach.