Low-Noise and High-Detectivity GaN-Based UV Photodiode With a Semi-Insulating Mg-Doped GaN Cap Layer

GaN-based ultraviolet photodiodes with a semi-insulating Mg-doped GaN cap layer were fabricated and characterized. Dark leakage current of the aforementioned photodiodes was much smaller than that of the conventional ones without the Mg-doped GaN cap layer due to a thicker and higher potential barrier and less amounts of interface states after inserting the Mg-doped GaN cap layer. The ultraviolet to visible rejection ratio is 3.44 x 10³ by inserting a semi-insulating Mg-doped GaN cap layer with a -IV applied bias. In this study, we also discuss the noise characteristics. It was found that minimum noise equivalent power and maximum detectivity of our photodiode were 1.2 x 10^-12 W and 9.34 x 10¹¹ cmHz^0.5 W^-1, respectively.     

Schottky diodes based on nanocrystalline p-GaN and n-GaN in thin film form

Nanocrystalline n-GaN and p-GaN in thin film form were deposited onto fused silica substrates by high-pressure d.c. magnetron sputtering of Si (1 at%) and Be (1 at%) doped GaN targets, respectively. Schottky diode structures for both the p- and n-type nanocrystalline GaN (Au/p-GaN/Al and Al/n-GaN/Au) were fabricated out of the above films. Corresponding current-voltage and capacitance-voltage characteristics of the Schottky diodes were recorded and analyzed in the light of the existing theories.     

High temperature assessment of nitride-based devices

The high temperature characterization of GaN-based devices, including high electron mobility transistors (HEMTs), p-i-n photodiodes and surface acoustic wave (SAW) filters is reported. Transmission line method (TLM) measurements reveal the reversible behaviour of both the ohmic contact resistance and the two-dimensional electron gas (2DEG) mobility. AlGaN/GaN HEMTs on sapphire and SiC substrates present a reduction of the drain current and the transconductance as temperature increases. The responsivity of InGaN/GaN photodiodes is enhanced and shifted to larger wavelengths with temperature, recovering its original value after the thermal cycle. The temperature coefficient of frequency of SAW filters on AlN epilayers on different substrates has been measured. The influence of temperature on the different surface acoustic modes is compared.     

Innovational radiation sensor by integrating AL2O3:C optically stimulated luminescent dosemeter and GaN detectors

We report a new dosimetry concept that is built on an earlier integrated sensor concept by our group at University of Washington to integrate a radiation-dosimetry-quality Al2O3:C and a high quantum-efficiency GaN-based p-i-n photodiode on one side, and light emitting diodes (LEDs) on the opposite side as the stimulation source. The performance of the sensor has been evaluated by computer simulation, the performance of GaN photodiodes and studying the GaN films. The absorption spectrum of the GaN film was measured and indicated that the GaN photodiodes would not respond to the output wavelengths of the stimulating LEDs. The electrical properties and the performance of GaN p-i-n photodiode under irradiation were simulated. The results showed that the sensor offered comparable radiation sensitivity to current technologies and could be operated in active mode.     

AlGaN/GaN Schottky Barrier Photodetector With Multi-${rm Mg}_{rm x} {rm N} _{rm y} $/GaN Buffer

AlGaN/GaN heterostructure Schottky barrier photodetector (PD) with multi-Mg_xN_y/GaN buffer was proposed and fabricated. Compared with AlGaN/GaN heterostructure PD prepared on conventional low-temperature GaN buffer, it was found that we can reduce dark leakage current by more than three orders of magnitude. It was also found that we can use the multi-Mg_xN_y/GaN buffer to suppress photoconductance gain, enhance UV-to-visible rejection ratio, reduce noise level and enhance the detectivity.     

The study of Pt Schottky contact on porous GaN for hydrogen sensing

This article reports the studies of Pt Schottky contact on porous n-type GaN for hydrogen sensing. A simpler and improved electroless etching method has been developed to generate porous GaN in which high uniformity of the porous area could be achieved. Hydrogen sensor was subsequently fabricated by depositing Pt Schottky contacts onto the porous GaN sample. For comparative study, a standard hydrogen sensor was also prepared by depositing Pt Schottky contacts on the as-grown sample. Hydrogen detection was carried out at room temperature and 100 °C. This Pt/porous GaN sensor exhibited a significant change of current upon exposure to 2% H₂ in N₂ gas as compared to the standard Pt/GaN sensor. Morphological studies by scanning electron microscopy revealed that Pt contact deposited on porous GaN having a very rough surface morphology with pores distributed all over the contact layer. Therefore, the increase of current could be attributed to the unique microstructure at porous Pt/porous GaN interface which allowed higher accumulation of hydrogen and eventually led to stronger effect of the H-induced dipole layer.     

Temperature-dependent electric fields in GaN Schottky diodes studied by electroreflectance

Electroreflectance studies of Pt/GaN Schottky diodes were performed in the temperature range between 5 and 300 K. The data were analysed using the electric field-dependent dielectric function of GaN and a multi-layer formalism. We observed a thermal activation of electric fields underneath the Schottky contact. The results are explained in terms of temperature-dependent ionised impurity concentration by a model with two donor levels.     

AlGaN/GaN-based diodes and gateless HEMTs for gas and chemical sensing

The characteristics of Pt/GaN Schottky diodes and Sc/sub 2/O/sub 3//AlGaN/GaN metal-oxide semiconductor (MOS) diodes as hydrogen and ethylene gas sensors and of gateless AlGaN/GaN high-electron mobility transistors (HEMTs) as polar liquid sensors are reported. At 25/spl deg/C, a change in forward current of /spl sim/6 mA at a bias of 2 V was obtained in the MOS diodes in response to a change in ambient from pure N/sub 2/ to 10% H/sub 2// 90% N/sub 2/. This is approximately double the change in forward current obtained in Pt/GaN Schottky diodes measured under the same conditions. The mechanism appears to be formation of a dipole layer at the oxide/GaN interface that screens some of the piezo-induced channel charge. The MOS-diode response time is limited by the mass transport of gas into the test chamber and not by the diffusion of atomic hydrogen through the metal/oxide stack, even at 25/spl deg/C. Gateless AlGaN/GaN HEMT structures exhibit large changes in source-drain current upon exposing the gate region to various polar liquids, including block co-polymer solutions. The polar nature of some of these polymer chains lead to a change of surface charges in gate region on the HEMT, producing a change in surface potential at the semiconductor/liquid interface. The nitride sensors appear to be promising for a wide range of chemicals, combustion gases and liquids.     

Influence of annealing effects on the electrical and microstructural properties of Se Schottky contacts on n-type GaN

The electrical and microstructural properties of Se/n-gallium nitride (GaN) Schottky diode have been investigated by current–voltage (I–V), capacitance–voltage (C–V) and transmission electron microscopy (TEM) measurements as a function of annealing temperature. The Se/n-GaN Schottky contact exhibited an excellent rectification behavior. The barrier height of the as-deposited Se/n-GaN Schottky contact is 0.94 eV (I–V) and 1.55 eV (C–V), respectively. However, the barrier height of Se/n-GaN Schottky diode decreases to 0.90 eV (I–V) and 1.33 eV (C–V) upon annealing at 200 °C. Cheung’s and modified Norde functions are employed to determine the barrier height and series resistance. TEM results reveal that the Se film becomes fully crystallized for the contact annealed at 200 °C compared to the as-deposited contact without the reaction between Se film and GaN substrate. It is observed that the barrier height of Se/n-GaN Schottky diode decreases with increasing annealing temperature. This could be associated with the decrease in series resistance caused by the phase transformation from high resistance amorphous Se to low resistance crystalline Se. Further, the interface states density is found to be increased with the increasing annealing temperature. The Schottky emission mechanism is found to dominate the reverse leakage current in Se/n-GaN Schottky diodes irrespective of annealing temperatures.     

Schottky contacts of refractory metal nitrides on gallium nitride using reactive sputtering

Schottky contacts of refractory metal nitrides formed by reactive sputtering on n-type gallium nitride (GaN) were electrically evaluated, including film resistivity, Schottky characteristics and thermal stability. For the metal nitrides of TiN_x, MoN_x and ZrN_x, resistivities of 108.3, 159.0 and 270.0 μΩcm were obtained, respectively. Current-voltage (I-V) characteristics showed that the ideality factor varied from 1.03 to 1.16, while the Schottky barrier height (SBH) varied from 0.66 to 0.79 eV for the three kinds of Schottky contacts. Especially for the ZrN_x contact, the ideality factor and SBH were improved after annealing at 800 °C for 30 s. Schottky contact utilizing a refractory metal nitride on GaN shows its potential to develop thermally stable GaN devices.     

Nanoscale investigation of AlGaN/GaN-on-Si high electron mobility transistors

AlGaN/GaN HEMTs are devices which are strongly influenced by surface properties such as donor states, roughness or any kind of inhomogeneity. The electron gas is only a few nanometers away from the surface and the transistor forward and reverse currents are considerably affected by any variation of surface property within the atomic scale. Consequently, we have used the technique known as conductive AFM (CAFM) to perform electrical characterization at the nanoscale. The AlGaN/GaN HEMT ohmic (drain and source) and Schottky (gate) contacts were investigated by the CAFM technique. The estimated area of these highly conductive pillars (each of them of approximately 20-50?nm radius) represents around 5% of the total contact area. Analogously, the reverse leakage of the gate Schottky contact at the nanoscale seems to correlate somehow with the topography of the narrow AlGaN barrier regions producing larger currents.     

AlGaN/GaN肖特基二极管中金属电极的制备方法研究

本文主要研究AlGaN/GaN二极管制备工艺中Ohmic Contact金属和Schottky Contact金属电极的制备,主要讨论了金属电极材料的选取,退火温度和退火时间对接触电阻的影响,最后得出了Ohmic Contact的比接触电阻和TiN的淀积参数。     

High-Power High-Speed Schottky Photodiodes for Analog Fiber-Optic Microwave Signal Transmission Lines

Technical Physics Letters - Design and manufacturing technology of high-power microwave Schottky photodiodes with microstripe leads have been developed based on an InAlAs/InGaAs heterostructure....     

Improved optical and electrical characteristics of free-standing GaN substrates by chemical polishing utilizing photo-electrochemical method

The optical and electrical properties of GaN(0001) surfaces treated by a novel chemical polishing method are described. Scanning microscopic photoluminescence images reveal that the polished GaN surface shows improved luminescence properties compared to the untreated surface. Current-voltage measurements of Schottky barriers formed using the GaN substrates show that the polished GaN surface has a lower reverse leakage current, and that the barrier height and ideality factor are improved after the polishing treatment.     

Gallium arsenide metal-semiconductor-metal photodiodes as optoelectronic mixers for microwave single-sideband modulation

Gallium arsenide (GaAs) metal-semiconductor-metal (MSM) photodetectors have unique properties including high-bandwidth, linearity, and biphase response that make them suitable as mixers and programmable weights for microwave and communications applications. An optical technique for microwave single-sideband modulation that uses GaAs MSM photodiodes as mixers is reported. It uses MSM Schottky photodiodes formed in a GaAs/Al(0.3)Ga(0.7)As materials system to detect microwave in-phase and quadrature signals on optical carriers. Modulation of the photodetector bias voltages results in a single-sideband modulation of the microwave signal. Radio frequency and undesired-sideband suppression of 36 and 27 dB, respectively, were achieved. The optical wavelength was 850 nm, and the bandwidth of the photodetectors was >/=29 GHz.     

GaN-UV photodetector integrated with asymmetric metal semiconductor metal structure for enhanced responsivity

Fabrication of very thin GaN ultraviolet photodetectors on Si (111) substrate integrated with asymmetric (Pt–Ag, Pt–Cr) metal–semiconductor–metal (MSM) structure have been illustrated. Designed GaN photodetection device displays significant enhancement in responsivity for asymmetric (Pt–Ag) MSM structure (280 mA/W) in comparison to symmetric (Pt–Pt) MSM structure (126 mA/W) at 10 V bias. The fabricated asymmetric and symmetric devices also exhibit fast response time in the range of 30–59 ms. The enhancement in responsivity using asymmetric MSM structure ascribed to large difference in work function which lead to change in Schottky barrier height of the metal semiconductor junction. Additionally, power dependent photoresponse analysis of GaN asymmetric (Pt–Ag) ultraviolet photodetector was showing a responsivity of 116 mA/W at low optical power of 1 mW. Such GaN asymmetric MSM ultraviolet photodetectors having high responsivity can extensively be used for low power, high speed ultraviolet photo detection applications.     

Electrical transport of bottom-up grown single-crystal Si(1-x)Ge(x) nanowire

In this work, we fabricated an Si(1-x)Ge(x) nanowire (NW) metal-oxide-semiconductor field-effect transistor (MOSFET) by using bottom-up grown single-crystal Si(1-x)Ge(x) NWs integrated with HfO(2) gate dielectric, TaN/Ta gate electrode and Pd Schottky source/drain electrodes, and investigated the electrical transport properties of Si(1-x)Ge(x) NWs. It is found that both undoped and phosphorus-doped Si(1-x)Ge(x) NW MOSFETs exhibit p-MOS operation while enhanced performance of higher I(on)～100?nA and I(on)/I(off)～10(5) are achieved from phosphorus-doped Si(1-x)Ge(x) NWs, which can be attributed to the reduction of the effective Schottky barrier height (SBH). Further improvement in gate control with a subthreshold slope of 142?mV?dec(-1) was obtained by reducing HfO(2) gate dielectric thickness. A comprehensive study on SBH between the Si(1-x)Ge(x) NW channel and Pd source/drain shows that a doped Si(1-x)Ge(x) NW has a lower effective SBH due to a thinner depletion width at the junction and the gate oxide thickness has negligible effect on effective SBH.     

Characterization of Pt/a-plane GaN Schottky contacts using conductive atomic force microscopy

We investigated the local electrical properties of Pt Schottky contacts to a-plane n-type GaN using conductive atomic force microscopy (C-AFM). Current-voltage characteristics obtained by C-AFM showed rectifying properties, indicating nano-scale Schottky junction formation. Two-dimensional current maps revealed that the surface microstructures of GaN influenced transport properties of the junctions.     

Electrical and structural characterizations of non-polar AlGaN/GaN heterostructures

A non-polar AlGaN/GaN structure is a strong candidate for the high-voltage device that can operate in enhancement-mode compared to the depletion-mode operation that is practically unavoidable for a standard polar AlGaN/GaN structure. Growth of non-polar GaN is non-trivial and a two-step nucleation scheme was developed to produce high-quality non-polar a-plane AlGaN/GaN structures on r-plane sapphire. The anisotropic nature of non-polar GaN requires a modification to a typical polar GaN-based transistor fabrication process. A KOH wet etch proceeded by a dramatically different mechanism compared to the standard polar c-face AlGaN/GaN structure. This device with Pt/Au Schottky gate displayed a barrier height of 0.76 eV and an ideality factor of 4 at 20 °C.     

Growth and characteristics of self-assembly defect-free GaN surface islands by molecular beam epitaxy

GaN surface nano-islands of high crystal quality, without any dislocations or other extended defects, are grown on a c-plane sapphire substrate by plasma-assisted molecular beam epitaxy. Nano-island growth requires special conditions in terms of V/III ratio and substrate temperature, distinct from either film or nanocolumn growth. The insertion of a nitrided Ga layer can effectively improve the uniformity of the nano-islands in both shape and size. The islands are well faced truncated pyramids with island size ranged from 30 to 110 nm, and height ranged from 30 to 55 nm. On, the other hand, the density and facet of the GaN surface islands would be affected by the growth conditions. An increase of the V/III ratio from 30 to 40 led to an increase in density from 1.4 x 10(9) to 4.3 x 10(9) cm(-2) and an evolution from {1-21-1} facets to {1-21-2} facets. The GaN layers containing the surface islands can moderate the compressive strain due to the lattice and thermal mismatch between GaN and c-sapphire. Conductive atomic force microscopy shows that the off-axis sidewall facets are more electrically active than those at the island center. The formation of the GaN surface islands is strongly induced by the Ehrlich-Schwoebel barrier effect of preexisting islands grown in the early growth stage. GaN surface islands are ideal templates for growing nano-devices.