共查询到18条相似文献,搜索用时 140 毫秒
1.
采用分子束外延(MBE)生长方法,使用γ-Al2O3材料作为新型过渡层,在Si(∞1)衬底上获得了没有裂纹的GaN外延层,实验结果表明使用γ-Al2O3过渡层有效地缓解了外延层中的应力.通过生长并测试分析几种不同结构的外延材料,研究了复合衬底γ-Al2O3/Si(001)生长GaN情况,得到了六方相GaN单晶材料,实现了GaN c面生长.预铺薄层Al及高温AlN层可以提高GaN晶体质量,低温AlN缓冲层可以改善GaN表面的粗糙度.为解决Si(001)衬底上GaN的生长问题提供了有益的探索. 相似文献
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采用分子束外延(MBE)生长方法,使用γ-Al2O3材料作为新型过渡层,在Si(∞1)衬底上获得了没有裂纹的GaN外延层,实验结果表明使用γ-Al2O3过渡层有效地缓解了外延层中的应力.通过生长并测试分析几种不同结构的外延材料,研究了复合衬底γ-Al2O3/Si(001)生长GaN情况,得到了六方相GaN单晶材料,实现了GaN c面生长.预铺薄层Al及高温AlN层可以提高GaN晶体质量,低温AlN缓冲层可以改善GaN表面的粗糙度.为解决Si(001)衬底上GaN的生长问题提供了有益的探索. 相似文献
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通过改变高温AlN形核层生长时提前通入TMAl的时间,分别在Si(111)衬底上生长了4个1μm厚的GaN样品,并对每个样品的GaN外延材料进行了分析研究。通过显微镜观察发现,Al的沉积时间为12 s时,GaN材料表面光亮,基本没有裂纹。另外通过喇曼谱和光荧光谱(PL)测试得出,随着生长初期Al沉积时间的增加(8~15 s),GaN外延层的水平应力逐渐减小(由1.28 GPa减小到0.67 GPa),Al的沉积时间为12 s时GaN外延材料的应力较小。同时,GaN材料(002)和(102)晶面的X射线衍射摇摆曲线表明,Al的沉积时间为12 s时GaN外延材料的晶体质量最好。 相似文献
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采用分子束外延(MBE)生长方法,使用γ-Al2O3材料作为新型过渡层,在Si(001)衬底上获得了没有裂纹的GaN外延层,实验结果表明使用γ-Al2O3过渡层有效地缓解了外延层中的应力. 通过生长并测试分析几种不同结构的外延材料,研究了复合衬底γ-Al2O3/Si (001)生长GaN情况,得到了六方相GaN单晶材料,实现了GaN c面生长. 预铺薄层Al及高温AlN层可以提高GaN晶体质量,低温AlN缓冲层可以改善GaN表面的粗糙度. 为解决Si(001)衬底上GaN的生长问题提供了有益的探索. 相似文献
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通过改变AlN形核层的生长温度分别在Si(111)衬底上生长了两个GaN样品,并对GaN外延材料表面的六角形缺陷进行了分析研究。通过显微镜和扫描电镜(SEM)观测发现,AlN形核层在高温下生长时,GaN材料表面会产生大量六角形缺陷。通过电子能谱(EDS)分析得出GaN六角形缺陷中含有大量的Si元素以及少量的Ga和Al元素,其中Si元素从Si衬底中高温扩散而来。在降低AlN形核层的生长温度后,GaN材料表面的六角形缺陷随之消失。表明AlN形核层在较低的温度下生长时可以有效地抑制Si衬底表面Si原子的扩散,减少外延层中由于衬底Si反扩散引起的缺陷。 相似文献
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采用MOCVD技术在r面蓝宝石衬底上采用两步AlN缓冲层法外延制备了a面GaN薄膜.利用高分辨X射线衍射技术和Raman散射技术分析了样品的质量以及外延膜中的残余应力.实验结果表明:样品的(1120)面的X射线双晶摇摆曲线的半峰宽仅为0.193°,Raman光谱中E2高频模的半峰宽仅为3.9cm-1,这些说明a面GaN薄膜具有较好的晶体质量;X射线研究结果表明样品与衬底的位相关系为:[11(2)0]GaN ||[1(1)02]sapphire,[0001]Gan||[(11)01]sapphire和[(11)00]GaN[11(2)0]sapphire;高分辨X射线和Raman散射谱的残余应力研究表明,采用两步AlN缓冲层法制备的a面GaN薄膜在平面内的残余应力大小与用低温GaN缓冲层法制备的a面GaN薄膜不同,我们认为这是由引入AlN带来的晶格失配和热失配的变化引起的. 相似文献
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Jarod C. Gagnon Mihir Tungare Xiaojun Weng Jeffrey M. Leathersich Fatemeh Shahedipour-Sandvik Joan M. Redwing 《Journal of Electronic Materials》2012,41(5):865-872
In situ wafer curvature measurements were used in combination with postgrowth structural characterization to study the evolution
of film stress and microstructure in GaN layers grown by metalorganic chemical vapor deposition on N+ ion-implanted AlN/Si (111) substrates. The results were compared with growth on identical unimplanted substrates. In situ stress measurements revealed that, for the unimplanted sample, the GaN initiated growth under compressive stress of −1.41 GPa
which arose due to lattice mismatch with the AlN buffer layer. In contrast, GaN growth on the ion-implanted sample began at
lower compressive stress of −0.84 GPa, suggesting a reduction in epitaxial stress. In both cases, the compressive growth stress
was fully relaxed after ~0.7 μm and minimal tensile stress was generated during growth. During post-growth cooling, tensile stress was introduced in the
GaN layer of both samples due to thermal expansion mismatch. Post-growth optical microscopy characterization, however, demonstrated
that the ion-implanted sample had lower density of channeling cracks compared with the unimplanted sample. Cross-sectional
transmission electron microscopy images of the sample grown on ion-implanted Si with no post-implantation nitrogen annealing
revealed the formation of horizontal cracks in the implanted region beneath the AlN buffer layer. The weakened layer acts
to decouple the GaN film from the Si substrate and thereby reduces the density of channeling cracks in the film after growth. 相似文献
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Due to the great potential of GaN based devices,the analysis of the growth of crack-free GaN with high quality has always been a research hotspot.In this paper,two methods for improving the property of the GaN epitaxial layer on Si (111) substrate are researched.Sample A,as a reference,only has an AlN buffer between the Si substrate and the epitaxy.In the following two samples,a GaN transition layer (sample B) and an AlGaN buffer (sample C) are grown on the AlN buffer separately.Both methods improve the quality of GaN.Meanwhile,using the second method,the residual tensile thermal stress decreases.To further study the impact of the two introduced layers,we investigate the stress condition of GaN epitaxial layer by Raman spectrum.According to the Raman spectrum,the calculated residual stress in the GaN epitaxial layer is approximately 0.72 GPa for sample B and 0.42 GPa for sample C.The photoluminescence property of GaN epitaxy is also investigated by room temperature PL spectrum. 相似文献
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The polarity of gallium nitride (GaN) nanowire nuclei grown on AlN layers was studied by piezoresponse force microscopy (PFM). N- or Al-polar AlN layers were grown by molecular beam epitaxy (MBE) on Si (111) substrates by use of Al- or N-rich growth conditions, respectively. Short and low density GaN nanowires were then grown on each AlN polarity type. PFM measurements verified the expected AlN layer polarity and further indicated that predominantly N-polar nanowires are produced for growth on both AlN polarity types. Cross-section scanning transmission electron microscopy (STEM) images further reveal that the nanowires on Al-polar AlN films are nucleated on regions in the AlN layer that contain inversion domains, which propagate into the GaN nanowire nuclei. PFM measurements were found to be a convenient technique for mapping the polarity of a statistically significant number of individual GaN nanowires. 相似文献
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Meng Wei Xiaoliang Wang Xu Pan Hongling Xiao CuiMei Wang Qifeng Hou Zhanguo Wang 《Materials Science in Semiconductor Processing》2011,14(2):97-100
We studied the influence of high temperature AlN buffer thickness on the property of GaN film on Si (1 1 1) substrate. Samples were grown by metal organic chemical vapor deposition. Optical microscopy, atomic force microscopy and X-ray diffraction were employed to characterize the samples. The results demonstrated that thickness of high temperature AlN buffer prominently influenced the morphology and the crystal quality of GaN epilayer. The optimized thickness of the AlN buffer is found to be about 150 nm. Under the optimized thickness, the largest crack-free range of GaN film is 10 mm×10 mm and the full width at half maximum of GaN (0 0 0 2) rocking curve peak is 621.7 arcsec. Using high temperature AlN/AlGaN multibuffer combined with AlN/GaN superlattices interlayer we have obtained 2 μm crack-free GaN epilayer on 2 in Si (1 1 1) substrates. 相似文献
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R. Venugopal J. Wan M. Melloch G. Kim G. Zank S. Tsoi A. Ramdas 《Journal of Electronic Materials》2003,32(5):371-374
A comparison of gallium-nitride (GaN) films grown on large-area Si(111) using a single aluminum-nitride (AlN) buffer, an AlN/graded-AlxGa1−xN buffer, and the introduction of additional low-temperature (LT)-grown AlN interlayers is reported. A graded-AlGaN buffer
followed by additional LT-AlN interlayers is shown to completely eliminate cracking in nitride films of thickness >2 μm and
also reduce the threading-dislocation density significantly. A partial compensation of GaN-tensile strain by the compressive-lattice
strain induced by the AlGaN and AlN layers is responsible for this effect. The surface roughness is increased by the introduction
of the LT-AlN buffers. 相似文献
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用电子束蒸发方法在Si(111)衬底上蒸发了Au/Cr和Au/Ti/Al/Ti 两种金属缓冲层,然后在金属缓冲层上用气源分子束外延(GSMBE)生长GaN. 两种缓冲层的表面都比较平整和均匀,都是具有Au(111)面择优取向的立方相Au层. 在Au/Cr/Si(111)上MBE生长的GaN,生长结束后出现剥离. 在Au/Ti/Al/Ti/Si(111)上无AlN缓冲层直接生长GaN,得到的是多晶GaN;先在800℃生长一层AlN缓冲层,然后在710℃生长GaN,得到的是沿GaN(0001)面择优取向的六方相GaN. 将Au/Ti/Al/Ti/Si(111)在800℃下退火20min,金属层收缩为网状结构,并且成为多晶,不再具有Au(111)方向择优取向. 相似文献
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激光熔蚀反应淀积AlN薄膜残余应力及热稳定性的研究 总被引:2,自引:1,他引:1
激光熔蚀反应淀积于 Si(10 0 ) ,Si(111)基底上的 Al N薄膜是高质量高取向性的 Al N多晶膜 ,薄膜与基底的取向关系为 Al N(10 0 )∥ Si(10 0 ) ,Al N(110 )∥ Si(111)。薄膜具有较低的残余应力和较好的热稳定性。实验结果表明 ,当氮气压强和放电电压分别为 10 0× 133.33Pa和 6 50 V时 ,薄膜的残余应力低于 3GPa。此样品在纯氧环境 50 0℃时 ,经过 3h的退火 ,红外吸收谱检测未发现有Al2 O3 特征峰出现。对 Al N/Cu双层膜的研究表明所制备的 Al N薄膜在金属薄膜的防护上也有潜在的应用价值。 相似文献
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G. Kipshidze S. Nikishin V. Kuryatkov K. Choi Ìu. Gherasoiu T. Prokofyeva M. Holtz H. Temkin K. D. Hobart F. J. Kub M. Fatemi 《Journal of Electronic Materials》2001,30(7):825-828
Epitaxial layers of AlN and GaN were grown by gas source molecular-beam epitaxy on a composite substrate consisting of a thin
(250 nm) layer of silicon (111) bonded to a polycrystalline SiC substrate. Two dimensional growth modes of AlN and GaN were
observed. We show that the plastic deformation of the thin Si layer results in initial relaxation of the AlN buffer layer
and thus eliminates cracking of the epitaxial layer of GaN. Raman, x-ray diffraction, and cathodoluminescence measurements
confirm the wurtzite structure of the GaN epilayer and the c-axis crystal growth orientation. The average stress in the GaN
layer is estimated at 320 MPa. This is a factor of two less than the stress reported for HVPE growth on 6H-SiC (0001). 相似文献