基于分子动力学的金属钛纳米切削过程研究（英文）

采用基于分子动力学的仿真方法建立了金属钛纳米切削分子动力学模型,选择了有代表性的切削条件,通过仿真得到瞬间原子位置图像并对切削过程中材料去除现象、加工表面形成过程、系统势能和工件温度等的变化进行了分析。发现在金属钛的纳米切削过程中切屑和加工表面是由于晶格能的释放和位错的不断延伸扩展形成的。已加工表面原子的弹性恢复和晶格重构能够减缓总势能和温度不断增加的趋势,并使其伴随有微小波动。     

基于分子动力学的金属钛纳米切削过程研究

本文采用基于分子动力学的仿真方法建立了金属钛纳米切削分子动力学模型,选择了有代表性的切削条件,通过仿真得到瞬间原子位置图像并对切削过程中材料去除现象、加工表面形成过程、系统势能和工件温度等的变化进行了分析。发现在金属钛的纳米切削过程中切屑和加工表面是由于晶格能的释放和位错的不断延伸扩展形成的。已加工表面原子的弹性恢复和晶格重构能够减缓总势能和温度不断增加的趋势,并使其伴随有微小波动。     

微织构刀具DEFORM-3D切削性能仿真分析及实验研究

运用DEFORM-3D仿真软件对YG8硬质合金微织构刀具的切削性能进行仿真分析,研究了YG8硬质合金刀具在沟槽微织构、凹坑微织构和无微织构3种表面微织构下的切削温度和切削应力.利用激光加工技术对YG8硬质合金刀具表面进行沟槽微织构的加工,运用该刀具对铝合金进行切削实验,分析微织构对刀具切削性能的影响.结果表明:微织构刀具产生的切削热更少,与切屑间的摩擦力更低.在一定的润滑条件下,微织构刀具具有更好的切削性能.     

紫铜表面微铣削加工最小切削厚度分析

最小切削厚度是微铣削加工的一个重要参数,准确地确定最小切削厚度能够减小加工精度和刀具磨损.用切削刃钝圆半径为6μm的?0.15微铣刀,在进给速度为30 mm/min、转速为10000 r/min条件下,对切削紫铜表面进行仿真分析,得出最小切削厚度值为0.9μm.为验证仿真正确性,在同样的工艺条件下对紫铜材料进行加工实验...     

铝基碳化硅激光辅助微切削仿真及实验研究

为探究激光辅助切削技术对高体积分数铝基碳化硅材料加工质量的影响,利用ABAQUS有限元仿真软件,建立体积分数45%的铝基碳化硅材料切削仿真模型,对铝基碳化硅材料受热后温度场的分布和不同切削参数下的应力分布进行了仿真研究。对铝基碳化硅材料进行了单因素切削实验及激光辅助正交精密微切削实验研究,对实验结果进行分析与探讨。实验结果表明,铝基碳化硅材料在受热后切削过程中应力值有所减小,激光辅助切削技术能有效改善被加工铝基碳化硅材料的表面粗糙度,减少表面形貌缺陷,同时降低刀具磨损。     

基于分子动力学的金属钛纳米振动切削研究

采用分子动力学模拟方法进行了金属钛的纳米振动切削和普通纳米切削的比较研究.结果表明:在相同仿真条件下,单向振动X、Y向切削力平均值仅为普通切削的1/3左右;椭圆振动切削(elliptical vibration cutting,EVC)相比单向振动切削,剪切角变大,切屑的塑性变形降低,同时主切削力以及背吃刀力值均降低;单向振动切削和EVC的切削温度呈近似正弦脉冲变化, 对比普通加工,振动切削的温度显著下降;相比于单向振动切削EVC的工件平均切削温度略高.     

基于微切削的仿真模型研究

相对于宏观尺度的普通切削,微切削具有以尺寸效应为特征的独特性,宏观切削理论和方法不再适用于微切削的研究.文章从有限元、分子动力学、多尺度模型三个方面分析了微切削仿真模型的特点及其在微切削研究中的应用,并进一步对微切削仿真模型的应用前景和未来发展趋势进行了分析和研究.     

单晶材料纳米加工的分子动力学模拟研究进展

分子动力学模拟技术是纳米加工研究的重要方法之一。本文概述了经典分子动力学模拟的基本原理和方法,并结合分子动力学模拟的发展历程,从单晶材料纳米加工的物相转变、结构及热力学特性、介质的影响以及加工后亚表面变形层特性这5个方面,综述了分子动力学模拟在单晶材料纳米加工研究中的应用,最后分析了单晶材料分子动力学模拟中存在的一些问题及需要关注的方向。      

微织构刀具DEFORM-3D切削性能仿真分析及实验研究（英文）

运用DEFORM-3D仿真软件对YG8硬质合金微织构刀具的切削性能进行仿真分析,研究了YG8硬质合金刀具在沟槽微织构、凹坑微织构和无微织构3种表面微织构下的切削温度和切削应力。利用激光加工技术对YG8硬质合金刀具表面进行沟槽微织构的加工,运用该刀具对铝合金进行切削实验,分析微织构对刀具切削性能的影响。结果表明:微织构刀具产生的切削热更少,与切屑间的摩擦力更低。在一定的润滑条件下,微织构刀具具有更好的切削性能。     

单晶锗纳米切削过程分子动力学仿真与实验研究

为深入理解单晶锗纳米切削特性,提高纳米锗器件光学表面质量,采用三维分子动力学(MD)模拟方法研究了单点金刚石压头与单晶锗表面的接触和滑动过程。研究了压头在滑动切削过程中的材料变形、切削力、切屑堆积、表面形貌尺寸。仿真结果表明,随着垂直载荷的增加,切削力、表面形貌尺寸、切屑堆积在接触过程中逐渐增加,且与切削速度无明显关联。切削过程中切削力波动的根本原因是由于单晶锗晶格破坏引起位错的产生和能量波动。为了验证仿真结果的正确性,使用纳米划痕仪对单晶锗进行了纳米切削实验。实验结果与仿真结果一致,验证了MD模型的正确性和有效性。     

Study of the mechanism of nanoscale ductile mode cutting of silicon using molecular dynamics simulation

In cutting of brittle materials, it was observed that there is a brittle-ductile transition when two conditions are satisfied. One is that the undeformed chip thickness is smaller than the tool edge radius; the other is that the tool cutting edge radius should be small enough—on a nanoscale. However, the mechanism has not been clearly understood. In this study, the Molecular Dynamics method is employed to model and simulate the nanoscale ductile mode cutting of monocrystalline silicon wafer. From the simulated results, it is found that when the ductile cutting mode is achieved in the cutting process, the thrust force acting on the cutting tool is larger than the cutting force. As the undeformed chip thickness increases, the compressive stress in the cutting zone decreases, giving way to crack propagation in the chip formation zone. As the tool cutting edge radius increases, the shear stress in the workpiece material around the cutting edge decreases down to a lower level, at which the shear stress is insufficient to sustain dislocation emission in the chip formation zone, and crack propagation becomes dominating. Consequently, the chip formation mode changes from ductile to brittle.     

Crack initiation in relation to the tool edge radius and cutting conditions in nanoscale cutting of silicon

In cutting of brittle materials, experimentally it was observed that there is a ductile–brittle transition when the undeformed chip thickness is increased from smaller to larger than the tool cutting edge radius of the zero rake angle. However, how the crack is initiated in the ductile–brittle mode transition as the undeformed chip thickness is increased from smaller to larger than the tool cutting edge radius has not been fully understood. In this study, the crack initiation in the ductile–brittle mode transition as the undeformed chip thickness is increased from smaller to larger than the tool cutting edge radius has been simulated using the Molecular Dynamics (MD) method on nanoscale cutting of monocrystalline silicon with a non-zero edge radius tool, from which, for the first time, a peak deformation zone in the chip formation zone has been found in the transition from ductile mode to brittle mode cutting. The results show that as the undeformed chip thickness is larger than the cutting edge radius, in the chip formation zone there is a peak deformation depth in association with the connecting point of tool edge arc and the rake face, and there is a crack initiation zone in the undeformed workpiece next to the peak deformation zone, in which the material is tensile stressed and the tensile stress is perpendicular to the direction from the connecting point to the peak. As the undeformed chip thickness is smaller than the cutting edge radius, there is no deformation peak in the chip formation zone, and thus there is no crack initiation zone formed in the undeformed workpiece. This finding explains well the ductile–brittle transition as the undeformed chip thickness increases from smaller to larger than the tool cutting edge radius.     

Virtual cutting and optimization of three-axis milling processes

This paper presents generalized process simulation and optimization strategies to predict and improve the performance of three-axis milling operations. Cutter-part engagement conditions are extracted from a solid modeling system, which can handle free form part surfaces found in dies and molds. The cutting force distribution along the engaged cutting edge-part surface is evaluated based on the laws of mechanics of milling. By integrating the distributed force along the cutting edge, total forces, torque and power are either predicted analytically using closed-form solutions, or numerically if the cutting tool shape is discontinuous. Simulation results are then used in a constraint-based optimization scheme to maximize the material removal rate (MRR) by calculating acceptable feedrate levels. The proposed virtual milling system is demonstrated experimentally in milling a stamping die with free form surfaces.     

Multiscale simulation of nanometric cutting of single crystal copper —— effect of different cutting speeds

A multiscale simulation has been performed to determine the effect of the cutting speed on the deformation mechanism and cutting forces in nanometric cutting of single crystal copper. The multiscale simulation model, which links the finite element method and the molecular dynamics method, captures the atomistic mechanisms during nanometric cutting from the free surface without the computational cost of full atomistic simulations. Simulation results show the material deformation mechanism of single crystal copper greatly changes when the cutting speed exceeds the material static propagation speed of plastic wave. At such a high cutting speed, the average magnitudes of tangential and normal forces increase rapidly. In addition, the variation of strain energy of work material atoms in different cutting speeds is investigated.     

Sliding mode cutting force regulator for turning processes

Continuous sliding mode control is applied to turning processes for cutting force regulation. The motivation of the use of the slide mode control scheme is to solve the nonlinearity problem caused by the feedrate override command element in the commercial CNC machine tool. When the adaptive control algorithm is applied to the commercial CNC machine tool, it is one of the practical methods that the programmed feedrate is overridden after the control algorithm is carried out. However, most CNC lathe manufacturers offer limited number of data bits for feedrate override, thus resulting in nonlinear behavior of the machine tools. Such nonlinearity brings ‘quantized' or discrete effect so that the optimal feedrate is rounded off before being fed into the CNC system. To compensate for this problem, continuous sliding mode control is applied. Simulation and experimental results are presented in comparison with those obtained from applying adaptive control which is a widely used approach in cutting force regulation. Adaptive control loses its effectiveness in the presence of nonlinearity since it generally requires linear parametrization of the control law or the system dynamics. Experiments are conducted under various machining conditions, subject to changes in spindle speed, material of work-piece, and type of machining process. The suggested slide mode controller shows smoother cutting force fluctuation, which cannot be achieved by the conventional adaptive controller. The experimental set-up reflects the emphasis on the practicality of the sliding mode controller. In order to avoid the use of a dynamometer in the course of measuring the cutting force, the indirect cutting force measuring system is used by means of feed drive servo-motor current sensing.     

超细晶硬质合金刀具车削不锈钢的切削温度研究

超细晶硬质合金刀具由于具有更高的硬度和抗弯强度,可以满足现代制造业的更高要求,在难加工材料高速切削领域显示出明显优势。在不锈钢材料的加工过程中,切削温度对刀具的磨损有极大的影响,而多数实验方法很难测得刀具表面具体的温度分布。借助DEFORM仿真分析软件,模拟超细晶硬质合金刀具对304不锈钢的车削过程;依据正交试验方法,分析切削用量三要素切削速度、进给量和背吃刀量对刀具温度的影响规律;通过实际车削实验与仿真结果进行比较,并与普通晶粒硬质合金刀具进行对比。结果表明:与普通晶粒硬质合金刀具加工相似,切削速度对超细晶粒硬质合金刀具温度的影响程度最大,其次是进给量,最后是背吃刀量;超细晶粒硬质合金比普通晶粒硬质合金刀具具有更好的散热性,尤其在较高速度条件下切削,优势更加明显。     

Diamond machining of silicon: A review of advances in molecular dynamics simulation

Molecular dynamics (MD) simulation has enhanced our understanding about ductile-regime machining of brittle materials such as silicon and germanium. In particular, MD simulation has helped understand the occurrence of brittle–ductile transition due to the high-pressure phase transformation (HPPT), which induces Herzfeld–Mott transition. In this paper, relevant MD simulation studies in conjunction with experimental studies are reviewed with a focus on (i) the importance of machining variables: undeformed chip thickness, feed rate, depth of cut, geometry of the cutting tool in influencing the state of the deviatoric stresses to cause HPPT in silicon, (ii) the influence of material properties: role of fracture toughness and hardness, crystal structure and anisotropy of the material, and (iii) phenomenological understanding of the wear of diamond cutting tools, which are all non-trivial for cost-effective manufacturing of silicon. The ongoing developmental work on potential energy functions is reviewed to identify opportunities for overcoming the current limitations of MD simulations. Potential research areas relating to how MD simulation might help improve existing manufacturing technologies are identified which may be of particular interest to early stage researchers.     

微细电火花加工放电蚀除过程的分子动力学模拟研究

电火花加工的放电蚀除过程是在极短时间内和极微小空间内发生的,导致用观测和理论分析的方法进行研究都极其困难,因此其放电蚀除机理至今仍未能被明确的解释.论文应用分子动力学方法对微细电火花加工的放电蚀除过程和熔融区的形成及形状等进行了模拟研究,该研究基于放电通道变化的热源模型,并与放电通道恒定情况下的模拟结果进行了对比,证明...     

Ag-Al-O体系中纳米Ag形成过程研究

为了研究Al-Ag固溶体在氧化气氛下热处理过程中Ag的扩散行为与转变过程,采用雾化与高能球磨相结合的方法制备合金粉末,氧化反应合成制备Ag/Al2O3复合材料,通过BSE、XRD、分子动力学的方法,对形成过程的物相变化进行研究。结果表明:Al-Ag固溶体在600K能够实现较高的单质Ag的析出量,析出的Ag能够控制在纳米尺度内,析出过程伴随着Al2O3致密氧化膜的形成以及内部合金相的转变,计算模型合理地解释和预测了实验结果。     

影响等离子切割机使用效果的几个因素

介绍了影响等离子切割机使用效果的几个主要因素如工件材质、切割电流、空气压力和流量、喷嘴孔径、操作手法等。以及电极制造材料和消耗特性。采用图文并茂的形式力求最大限度的帮助焊工理解等离子切割的常识．提高切割效果。