Miscibility Gap in the Fe-Cu-Ni System at 1173 K

The isothermal section of the Fe-Cu-Niternary system at 1173 K was determined bymicroprobe analysis and diffusion triple technique.The experimental results show that this isothermalsection only contains a miscibility gap region,andthe maximal Ni content in the miscibility gap is 44.7at.-%Ni.     

Overview of transient liquid phase and partial transient liquid phase bonding

Transient liquid phase (TLP) bonding is a relatively new bonding process that joins materials using an interlayer. On heating, the interlayer melts and the interlayer element (or a constituent of an alloy interlayer) diffuses into the substrate materials, causing isothermal solidification. The result of this process is a bond that has a higher melting point than the bonding temperature. This bonding process has found many applications, most notably the joining and repair of Ni-based superalloy components. This article reviews important aspects of TLP bonding, such as kinetics of the process, experimental details (bonding time, interlayer thickness and format, and optimal bonding temperature), and advantages and disadvantages of the process. A wide range of materials that TLP bonding has been applied to is also presented. Partial transient liquid phase (PTLP) bonding is a variant of TLP bonding that is typically used to join ceramics. PTLP bonding requires an interlayer composed of multiple layers; the most common bond setup consists of a thick refractory core sandwiched by thin, lower-melting layers on each side. This article explains how the experimental details and bonding kinetics of PTLP bonding differ from TLP bonding. Also, a range of materials that have been joined by PTLP bonding is presented.     

Fe-Co-Nb三元系相图的1173 K等温截面

根据扩散偶局部平衡原理,用电子探针微区成分分析,测定了Fe-Co-Nb三元系1173 K的等温截面相图.结果表明,Fe-Co-Nb三元扩散偶在1173 K时生成Fe7Nb6,Fe2Nb和Co7Nb6,Co3Nb、Co2Nb五种中间化合物.Fe7Nb6与Co7Nb6形成连续固溶体(Fe,Co)7Nb6.Fe-Co-Nb三元系的1173 K等温截面由αFe αCo Co3Nb,αFe Co3Nb Co2Nb,αPe Fe2Nb Co2Nb,Fe2Nb Co2Nb (Fe,Co)7Nb6四个三相区组成,没有发现三元化合物.     

Transient liquid phase bonding of HfC-based ceramics

Transient liquid phase (TLP) bonding enables joining at lower temperatures than traditional bonding techniques and preserves the potential for high-temperature applications, making it particularly attractive for joining ultra-high-temperature ceramics (UHTCs) such as carbides and borides. The feasibility of a TLP joint between “pure” carbides has been recently demonstrated. The present study examines the interactions that occur between undoped HfC or MoSi₂-doped HfC and a Ni/Nb/Ni multilayer interlayer during TLP bonding. Bonding is performed at 1400 °C for 30 min in a high-vacuum furnace. SEM–EDS characterization shows that the reaction layer formed at the interlayer/ceramic interface contains mixed carbides and depending upon the ceramic, Ni–Nb–Hf, or Ni–Nb–Hf–Si, or Ni–Nb–Si alloys. Nanoindentation tests traversing the reaction layer between the bulk ceramic and Nb foil midplane also show a clear transition zone across which the indentation modulus and hardness vary. Crack-free joints have been obtained with undoped HfC. The addition of 5 vol% MoSi₂ introduces small (<5 μm long) isolated cracks within the reaction layer, whereas with 15 vol% MoSi₂ added, cracking was pervasive within the reaction layer. When the reaction layer exceeds a critical thickness, as in the case of the bond obtained with HfC doped with 15 vol% MoSi₂, residual stresses become sufficiently large to cause extensive cracking and bond failure. The results suggest a need to characterize and balance the positive role of additives on sintering with the potentially deleterious role they may have on joining.     

Dynamic and metadynamic recrystallization of Hastelloy X superalloy

Hot compression tests in the temperature range of 900–1150 °C and strain rates varying between 0.001 and 0.5 s⁻¹ were performed on Hastelloy X superalloy in order to investigate the kinetics of hot deformation. An Arrhenius-type equation was used to characterize the dependence of the flow stress on deformation temperature and strain rate. The results showed that dynamic recrystallization (DRX) as well as metadynamic recrystallization (MDRX) occurred during hot working. A novel technique has been developed for calculating the DRX kinetics parameters on the basis of the Johnson-Mehl-Avrami-Kolmogorov (JMAK) and isothermal transformation rate equations. The variation of grain size in the DRX and MDRX regimes correlated with the standard Zener–Hollomon parameter.     

Dendritic coarsening of γ′ phase in a directionally solidified superalloy during 24,000 h of exposure at 1173 K

Dendritic coarsening of γ′ was investigated in a directionally solidified Ni-base superalloy during exposure at 1173 K for 24,000 h. Chemical homogeneity along different directions and residual internal strain in the experimental superalloy were measured by electronic probe microanalysis (EPMA) and electron back-scattered diffraction (EBSD) technique. It was indicated that the gradient of element distribution was anisotropic and the inner strain between dendrite core and interdendritic regions was different even after 24,000 h of exposure at 1173 K, which influenced the kinetics for the dendrite coarsening of γ′ phase.     

La对Ni-Cr-W-Mo耐热合金1173K恒温氧化行为的影响

研究了不同La含量Ni-Cr-W-Mo耐热合金的1173 K恒温氧化行为.结果表明:La能明显提高合金的抗氧化能力.不同La含量合金的抗氧化性能从劣到优依次为:La含量为0%、0.048%、0.026%、0.087%.添加超过0.026%的合金由于析出La化合物,使La的固溶量未呈线性增加,而在0.048%处出现拐点.氧化中由于La化物不参与氧化,因此合金的抗氧化能力主要取决于La在合金中的实际固溶量,固溶的La形成LaCrO3是La提高合金抗氧化能力的主要原因.LaCrO3在氧化物晶界处的偏聚阻碍了Cr3+的扩散,并可作为MnCr2O4异制形核的核心,促进细小的MnCr2O4生成并弥散分布于Cr2O3之间,形成混合氧化膜,提高了氧化膜的粘附性,亦成为提高抗氧化能力的因素.     

Numerical modelling of transient liquid phase bonding and other diffusion controlled phase changes

Diffusion in material of inhomogeneous composition can induce phase changes, even at a constant temperature. A transient liquid phase (TLP), in which a liquid layer is formed and subsequently solidifies, is one example of such an isothermal phase change. This phenomenon is exploited industrially in TLP bonding and sintering processes. Successful processing requires an understanding of the behaviour of the transient liquid layer in terms of both diffusion-controlled phase boundary migration and capillarity-driven flow. In this paper, a numerical model is presented for the simulation of diffusion-controlled dissolution and solidification in one dimension. The width of a liquid layer and time to solidification are studied for various bonding conditions. A novel approach is proposed, which generates results of a high precision even with coarse meshes and high interface velocities. The model is validated using experimental data from a variety of systems, including solid/solid diffusion couples.     

Determination of J-integral R-curves for Hastelloy X and inconel 617 up to 1223 K using the potential drop technique

For Hastelloy X (T = 308 K and T = 1223 K) and for Inconel 617 (T = 308 K, 473 K, 673 K, 873 K, 973 K, 998 K, 1023 K, 1048 K, 1073 K, 1173 K, and 1223 K) the J-integral R-curves have been determined. For Hastelloy X at 308 K the multispecimen technique has been compared with the single specimen method using the potential drop technique. At 1223 K Hastelloy X delivered a low J₀-integral value. Inconel 617 showed a smooth increase in J₀ with increasing temperature, up to 998 K; above this temperature even for large loadline displacements only blunting behaviour has been observed. The same tendency has been found for the evaluation of the tearing modulus. With increasing temperature the tearing modulus increases. In the temperature range from 998 K to 1223 K the tearing modulus increases by about one order of magnitude. For both alloys the onset of stable crack growth in most cases is earlier than the load maximum is reached in the load versus load-line displacement curves.     

Transient liquid phase bonding of a microduplex stainless steel using amorphous interlayers

Abstract

Microduplex stainless steels are two phase alloys which show excellent corrosion resistance and toughness. In order to join these special steels, fusion welding processes are normally used and a second post-weld heat treatment is necessary to regain the original ferrite to austenite ratio. In this study, transient liquid phase diffusion bonding was used to join a 2205 duplex stainless steel with the aid of amorphous interlayers. The research compares a Ni–B–Si ternary system with that of an Fe–B–Si interlayer, and compositional, microstructural and mechanical assessment was used to determine the quality of the bonds produced. These preliminary results show that the nickel based interlayer stabilises the austenitic phase along the bond length, which hinders grain growth across the joint region. In contrast, the iron based interlayer produces diffusion bonds, which show microstructural and compositional homogeneity across the joint region. Furthermore, mechanical and pitting corrosion tests show that transient liquid phase diffusion bonds can achieve properties similar to those of the parent alloy.     

Evaluation of transient liquid phase bonding between nickel-based superalloys

Induction brazing of Inconel 718 to Inconel X-750 using Ni-7Cr-3Fe-3.2B-4.5Si (wt.-%) foil as brazing filler metal was investigated in this paper. Brazing was conducted at the temperature range 1373–1473 K for 0–300 s in a flow argon environment. Both interfacial microstructures and mechanical properties of brazed joints were investigated to evaluate joint quality. The optical and scanning electron microscopic results indicate that good wetting existed between the brazing alloy and both Inconel 718 and Inconel X-750. Microstructures at joint interfaces of all samples show distinct multilayered structures that were mainly formed by isothermal solidification and following solid-state interdiffusion during joining. The diffusion of boron and silicon from brazing filler metal into base metal at the brazing temperature is the main controlling factor pertaining to the microstructural evolution of the joint interface. The element area distribution of Cr, Fe, Si, Ni and Ti was examined by energy dispersive X-ray analysis. It was found that silicon and chromium remain in the center of brazed region and form brittle eutectic phases; boron distribution is uniform across joint area as it readily diffuses from brazing filler metal into base metal. The influence of heating cycle on the microstructures of base material and holding time on the mechanical properties of brazed joint were also investigated.     

Transient liquid phase bonding of titanium to aluminium nitride

Titanium has been successfully joined to aluminium nitride AlN at a temperature as low as 795 °C, using Ag–Cu Cusil^® commercial braze alloy. While reactive wetting and spreading proceeds at the AlN/braze alloy interface, chemical interactions develop at the titanium side rendering possible isothermal solidification of the joint. The determining factor in the solidification process is the fast formation of TiCu₄ crystals by heterogeneous nucleation and growth in the liquid phase. As a consequence, the braze alloy is depleted in Cu and solid Ag precipitates. After annealing, the re-melting temperature of the resulting joint can be increased up to about 910 °C which is nearly 130 °C higher than the melting point of the starting braze alloy.     

Transient liquid phase bonding of AA 6082 aluminium alloy

Transient liquid phase bonding (TLP) on AA 6082 samples were performed under ambient non‐vacuum conditions, which was possible by a suitable pre‐treatment. This treatment involves a zincate treatment followed by copper plating, which is a common industrial process and can be performed in large batches. This treatment allows to remove the natural aluminium oxide layer and to protect the aluminium surface from excessive oxidation. Different bonding conditions were investigated and showed the feasibility of the transient liquid phase bonding process for AA 6082. Energy dispersive X‐ray spectroscopy (EDX) investigations showed that the isothermal solidification is already terminated after 5 min. The microstructure of the bonding zone showed no metallurgical discontinuity such as eutectic microstructure or intermetallic Al–Cu phases. However the microstructure shows numerous voids with a size of approximately 30 µm in the bonding zone. It is assumed that these voids were formed during the bonding process due to solidification shrinkage and the presence of interfacial oxide layers. The transient liquid phase bonded samples that were mechanically tested under tensile load showed an average strength of approximately 270 MPa, the minimum yield strength required for the base material according to EN 754‐2 is 255 MPa. Due to the notch effect of the voids, the tensile sample failed under forced fracture and showed no plastic deformation.     

Characterizing the bond strength of geopolymers at ambient and elevated temperatures

This paper presents characterization of bond strength of geopolymers at ambient and elevated temperatures. The bond strength of 18 different formulations of metakaolin (MK)/fly ash (FA) based geopolymers is evaluated through double shear tests in 20–300 °C temperature range. The test parameters include fly ash content, SiO₂/K₂O ratio, solid-to-liquid ratio and Si/Al ratio. In addition the effect of additives, namely short carbon fibers, basalt fibers and styrene–acrylate emulsion in MK/FA precursor, on bond strength is studied. Data from the tests show that geopolymers exhibit slightly lower bond strength than that of epoxy resin at room temperature, however geopolymers retain much higher bond strength in 100–300 °C range. Addition of small quantity of short carbon fibers in MK/FA precursor does not significantly influence bond strength of geopolymers at ambient temperature, but greatly improve bond strength retention in 100–300 °C through crack control mechanism.     

A fixed-grid numerical modelling of transient liquid phase bonding and other diffusion-controlled phase changes

A transient liquid phase (TLP), in which a liquid layer is formed and subsequently solidifies, and other diffusion-controlled phase changes are generally associated with moving phase-change interfaces. Both fixed and variable grid discretization models have been formulated to investigate these diffusion-controlled problems. However, all numerical efforts to date have employed one of the approaches explicitly to track the moving interfaces across which there exist step changes in concentrations. In this article, the fixed-grid source-based method originally developed to simulate the temperature fields for melting-solidification phase change processes has been adopted to simulate diffusion-controlled dissolution and solidification. This method solves a unique diffusion equation for the different phases and the moving interfaces using implicit time integration. Compared with previously developed models, it is not only simpler in numerical formulation and procedure, but also more convenient to extend to many phases and high-dimensional problems. We report here the detailed formulation of the relevant equations, and compare and validate the model using experimental data and previous modelling predictions for several systems available from the existing literature.     

Transient liquid phase bonding of 2124 aluminium metal matrix composite

Abstract

The transient liquid phase (TLP) bonding of particle reinforced aluminium metal matrix composites (MMCs) using copper interlayers often results in the segregation of SiC particles to the bond region, and this has the effect of producing bonds with poor mechanical strengths. In this preliminary study, the TLP bonding of a 2124 aluminium alloy MMC is investigated using nickel interlayers, and the initial results show that good bonds are produced with no effect on the SiC dispersion in the matrix. The absence of segregation is attributed to the high diffusivity of the nickel in the aluminium MMC, which produces rapid isothermal solidification at the bonding temperature. Bond shear tests show that near parent metal strengths are possible when thin nickel interlayers are used, and failure occurs at the MMC/bond interface. When thick interlayers are used, failure is predominately through the centre of the bondline.     

Forming behavior and workability of Hastelloy X superalloy during hot deformation

The hot deformation behavior of Hastelloy X superalloy has been characterized using hot compression tests in the temperature range of 900–1150 °C and strain rates varying between 0.001 and 0.5 s⁻¹. The results showed that both kinds of softening mechanisms, dynamic recovery and dynamic recrystallization, occurred during hot working. Hot workability of this alloy has been analyzed by calculating flow localization parameter and construction of workability map for occurrence of shear band. In addition, on the basis of flow stress data obtained as a function of temperature and strain rate in compression, power dissipation map and instability map for hot working have been developed.     

Hastelloy X激光熔覆工艺及组织性能

基于激光熔覆的增材制造方法,研究了镍基超级合金Hastelloy X的组织和力学性能.采用光纤激光器对Hastelloy X粉末进行熔覆试验,通过对激光熔覆工艺参数进行优化,制造了宏观表面无缺陷的Hastelloy X试样.结果表明,与传统锻造Hastelloy X方法相比,激光熔覆方法使材料在制造过程中发生再结晶,出现晶粒尺寸较小的细等轴晶粒,提高了材料的显微硬度和抗拉强度,韧性降低.利用扫描电子显微镜(SEM)对Hastelloy X的拉伸断口进行了分析,研究了Hastelloy X在750℃下的高温拉伸断裂机理,为混合型断裂.