Effect of annealing temperature on magnetic property of Si1 − xCrx thin films

Polycrystalline Si_1 − xCr_x thin films have been prepared by magnetron sputtering followed by rapid thermal annealing (RTA) for crystallization. RTA was performed at 800 °C for 5 min, 1200 °C for 30 s and 1200 °C for 2 min, in a N₂ flow. The magnetic hysteresis loops were observed at room temperature in all the samples except for RTA at 800 °C for 5 min, and the annealing caused the decrease of saturation magnetization relative to the as-grown film. X-ray diffraction spectra and Raman spectra showed that the annealing process lead the deposited amorphous film to be crystallized and CrSi₂ phase formed. The magnetism of the films was determined by the competition between crystallinity and precipitation of diamagnetic CrSi₂ phase.     

Dye-sensitized solar cells with TiO2 nanocrystalline films prepared by conventional and rapid thermal annealing processes

Titanium oxide (TiO₂) thin films are prepared by the sol-gel method and annealed at 600 °C by conventional (CTA) and rapid thermal annealing (RTA) processes on fluorine-doped tin oxide -coated glass substrates for application as the work electrode for the dye-sensitized solar cells (DSSC). TiO₂ thin films are crystallized using a conventional furnace and the proposed RTA process at annealing rates of 5 °Cmin⁻¹ and 600 °Cmin⁻¹, respectively. The TiO₂ thin films are characterized by X-ray diffraction, scanning electron microscopy and Brunauer-Emmett-Teller analysis. Based on the results, the TiO₂ films crystallized by RTA show better crystallization, higher porosity and larger surface area than those of CTA. The short-circuit photocurrent and open-circuit voltage values increased from 5.2 mAcm⁻² and 0.6 V for the DSSC with the CTA-derived TiO₂ films to 8.3 mAcm⁻² and 0.68 V, respectively, for the DSSC containing RTA-derived TiO₂ films.     

Grain coarsening mechanism of Cu thin films by rapid annealing

Cu thin films have been produced by an electroplating method using nominal 9N anode and nominal 6N CuSO₄·5H₂O electrolyte. Film samples were heat-treated by two procedures: conventional isothermal annealing in hydrogen atmosphere (abbreviated as H₂ annealing) and rapid thermal annealing with an infrared lamp (abbreviated as RTA). After heat treatment, the average grain diameters and the grain orientation distributions were examined by electron backscattering pattern analysis. The RTA samples (400 °C for 5 min) have a larger average grain diameter, more uniform grain distribution and higher ratio of (111) orientation than H₂ annealed samples (400 °C for 30 min). This means that RTA can produce films with coarser and more uniformly distributed grains than H₂ annealing within a short time, i.e. only a few minutes. To clarify the grain coarsening mechanism, grain growth by RTA was simulated using the phase field method. The simulated grain diameter reaches its maximum at a heating rate which is the same order as that in the actual RTA experiment. The maximum grain diameter is larger than that obtained by H₂ annealing with the same annealing time at the isothermal stage as in RTA. The distribution of the misorientation was analyzed which led to a proposed grain growth model for the RTA method.     

Microstructure and hardness of SiC-TiC nanocomposite thin films prepared by radiofrequency magnetron sputtering

Silicon carbide-titanium carbide (SiC-TiC) nanocomposite thin films were prepared by radiofrequency magnetron sputtering using SiC-TiC composite targets fabricated by spark plasma sintering. The SiC thin films were amorphous at substrate temperatures below 573 K and crystallized in the cubic crystal system (3C) at substrate temperatures greater than 773 K. Cubic SiC-TiC nanocomposite thin films, which contain a mixture of 3C-SiC and B1-TiC phases, were obtained at a TiC content of greater than 20 mol%. The amorphous films possessed a dense cross-section and a smooth surface. The morphology of the SiC-TiC nanocomposite thin films changed from granular to columnar with increasing substrate temperature. The SiC-TiC nanocomposite thin films prepared at TiC content of 70-80 mol% and substrate temperature of 573 K showed the highest hardness of 35 GPa.     

Influence of rapid thermal annealing on surface texture-etched Al-doped ZnO films prepared by various magnetron sputtering methods

The influence of rapid thermal annealing (RTA) on surface texture formation as well as the light management obtainable by wet-chemically etching was investigated for transparent conducting Al-doped ZnO (AZO) thin films prepared by various types of magnetron sputtering deposition (MSD) with an oxide target. Texture-etched AZO films prepared by an r.f. (13.56 MHz) power-superimposed d.c. magnetron sputtering deposition (rf + dc-MSD) exhibited a higher haze value than found in equivalent films prepared by d.c. MSD. The order that the RTA treatment and the etching were conducted considerably affected the obtainable surface texture. Conducting the etching after a heat treatment with RTA in air resulted in larger etch pits as well as higher haze values than were obtained in AZO films that were etched before the RTA. A high haze value generally above 70% in the range from visible to near infrared (at wavelengths up to 1200 nm) was obtained in texture-etched AZO thin films that were prepared by rf + dc-MSD and etched after RTA at a temperature of 500 °C for 3 min.     

UV-/thermal processing of sol-gel-derived lead-magnesium-niobium titanate thin films

This work aimed to describe the sol-gel synthesis and preparation of a near-morphotropic phase boundary lead-magnesium-niobium titanate (PMNT) material system, and to investigate the influences of room-temperature-UV-irradiation and rapid thermal annealing (RTA) processes on the properties of its thin films. It was postulated that the use of UV-irradiation prior to thermal processing could play a role in the generation of a structural difference that would manifest itself via the formation of a higher film thickness, which was more pronounced at higher RTA temperatures The PMNT thin film system described here (particularly those annealed at higher temperatures) appeared to be potentially suitable for ultrahigh-value-capacitor applications; the unexposed film annealed at 750 °C exhibited the highest high k value (1425) with a strongly pronounced perovskite phase (97%).     

Improved thermoelectric performance of highly-oriented nanocrystalline bismuth antimony telluride thin films

Improved thermoelectric performance of highly-oriented nanocrystalline bismuth antimony telluride thin films is described. The thin films are deposited by a flash evaporation method, followed by annealing in hydrogen. By optimizing the annealing conditions, the resulting thin films exhibit almost perfect orientation with the c-axis normal to the substrate, and are composed of nano-sized grains with an average grain size of 150 nm. The in-plane electrical conductivity and Seebeck coefficient were measured at room temperature. The cross-plane thermal conductivity of the thin films was measured by a 3ω method, and the in-plane thermal conductivity was evaluated by using an anisotropic factor of thermal conductivity based on a single crystal bulk alloy with almost the same composition and carrier concentration. The measured cross-plane thermal conductivity is 0.56 W/(m K), and the in-plane thermal conductivity is evaluated to be 1.05 W/(m K). Finally, the in-plane power factor and figure-of-merit, ZT, of the thin films are 35.6 μW/(cm K²) and 1.0 at 300 K, respectively.     

Optical properties and hydrophilic behaviors of TaOxNy thin films with and without rapid thermal annealing

TaO_xN_y thin films were prepared using DC reactive sputtering of Ta target with the variation of (O₂ + N₂)/Ar ratio, followed by rapid thermal annealing (RTA) at 800 °C for 5 min. During RTA, the amorphous structure of the as-deposited films would transform to crystallized phases that might contain either TaON, or Ta₂O_5, or both. With the increase of (O₂ + N₂)/Ar ratio, Ta₂O₅ phase becomes more dominant, while TaON was formed in an opposite way. Elemental analysis also shows the same trend. Hydrophilicity and optical properties of these films were found to be dependent on phases formed after annealing. The optical band gap was measured and calculated to be in the range of 2.43 eV (510 nm) to 3.94 eV (315 nm). The films with low band gap values exhibited super hydrophilicity behavior under visible light irradiation, mainly due to their light absorption had been extended to visible light range. Clearly, it was due to the existence of TaON phase.     

Microstructural evolution of sol-gel derived ZnO thin films

Zinc oxide thin films, with thicknesses between ∼ 20 and 450 nm, were prepared by spin-coating a sol-gel precursor solution (zinc acetate dihydrate and monoethanolamine in an isopropanol solvent) onto glass substrates, followed by heat treatment at temperatures through 773 K. At 298 and 373 K, the films exhibited the structure of a lamellar ZnO precursor, Layered Basic Zinc Acetate (LBZA). At higher temperatures, LBZA released intercalated water and acetate groups and dehydroxylated to form zinc oxide nanograins with wurtzite structure, which were preferentially oriented in the c-axis direction. Both the degree of the films' c-axis orientation and the topography of their surfaces varied with heat treatment and precursor concentration. For films calcined at 773 K, a minimum of micron-scale surface wrinkles coincided with a maximum in c-axis preference at intermediate concentrations, suggesting that release of mechanical stress during densification of thicker films may have disrupted the ordering process that occurs during heat treatment.     

Effects of oxygen flow ratios and annealing temperatures on Raman and photoluminescence of titanium oxide thin films deposited by reactive magnetron sputtering

Titanium oxide (TiO_x) thin films were deposited on the Si(100) substrates by direct-current reactive magnetron sputtering at 3-15 % oxygen flow ratios (FO₂% = FO₂/(FO₂ + FAr) × 100%), and then annealed by rapid thermal annealing (RTA) at 350-750 °C for 2 min in air. The phase, bonding and luminescence behaviors of the as-deposited and annealed TiO_x thin films were analyzed by X-ray diffraction (XRD), Raman spectroscopy and photoluminescence (PL) spectroscopy, respectively. The as-deposited TiO_x films were amorphous from XRD and showed weak Raman intensity. In contrast, the distinct crystalline peaks of anatase and rutile phases were detected after RTA at 550-750 °C from both XRD and Raman spectra. A mixture of anatase and rutile phases was obtained by RTA at 3 FO₂% and its amount increased with annealing temperature. Only the anatase phase was detected in the 6-15 FO₂% specimens after RTA. The PL spectra of all post-annealed TiO_x films showed a broad peak in visible light region. The PL peak of TiO_x film at 3 FO₂% at 750 °C annealing can be fitted into two Gaussian peaks at ~ 486 nm (2.55 eV) and ~ 588 nm (2.11 eV) which were attributed to deep-level emissions of oxygen vacancies in the rutile and anatase phases, respectively. The peak around 550 nm was observed at 6-15 FO₂% which is attributed to electron-hole pair recombination from oxygen vacancy state in anatase phase to valence band. The variation of intensity of PL peaks is concerned with the formation of the rutile and anatase phases at different FO₂% and annealing temperatures.     

Structure and microwave dielectric properties of Bi1.5Zn1.0Nb1.5O7 thin films deposited on alumina substrates by pulsed laser deposition

Bi_1.5Zn_1.0Nb_1.5O₇ (BZN) thin films were deposited on polycrystalline alumina substrates by pulsed laser deposition at different substrate temperatures. The phase structure and surface morphology were characterized using X-ray diffractometer (XRD) and atomic force microscopy. Microwave dielectric properties were performed using split-post dielectric resonator method at spot frequencies of 10, 15 and 19 GHz, respectively. The XRD results indicate that the as-deposited Bi_1.5Zn_1.0Nb_1.5O₇ thin films deposited at 650 °C are amorphous in nature. The dielectric permittivity and loss tangent of the amorphous BZN thin films are 75.5 and 0.013 at 10 GHz, respectively. As the measure frequency increased to 19 GHz, the dielectric permittivity slightly decreases and loss tangent slightly increases. BZN thin films were crystallized after the post-annealing by a rapid thermal annealing in air for 30 min. The crystallized BZN thin films exhibit the excellent dielectric properties and frequency responses. The dielectric permittivity and loss tangent of the crystallized BZN thin films are 154 and 0.038 at 10 GHz, respectively.     

Modification of optical and electrical properties of ITO using a thin Al capping layer

In this study, the work function, transmittance, and resistivity of indium tin oxide (ITO) thin films were successfully modified by depositing an Al capping layer on top of ITO with subsequent thermal annealing. The 5 nm thick Al layer was deposited by a conventional dc magnetron sputtering method and the layer was converted into an aluminum oxinitride by subjecting the sample to rapid thermal annealing (RTA) under a nitrogen atmosphere. The films exhibited a high transmittance of 86% on average within the visible wavelength region with an average resistivity value of 7.9 × 10^− 4 Ω cm. Heat-treating the Al/ITO films via RTA resulted in the decrease of the optical band gap from that of bare ITO. In addition, the films showed red-shift phenomena due to their decreased band gaps when the heat-treatment temperature was increased. The resultant electrical and optical characteristics can be explained by the formation of aluminum oxinitride on the surface of the ITO films. The work function of the heat-treated films increased by up to 0.26 eV from that of a bare ITO film. The increase of the work function predicts the reduction of the hole-injection barrier in organic light-emitting diode (OLED) devices and the eventual use of these films could provide much improved efficiency of devices.     

Influences of process parameters on texture and microstructure of NiO films

The experimental result shows that the preferred orientations of NiO thin films are closely related to the working pressure of argon. All of NiO(111), NiO(200), and NiO(220) diffraction peaks are observed in the XRD patterns and exhibited random orientation of NiO film when the film is deposited in low Ar pressure of 0.67 Pa. As the Ar pressure is increased to 2.67 Pa, only the NiO(200) peak appears and shows (200)-textured NiO films. However, the lattice parameter of NiO film deposited in high Ar pressure of 2.67 Pa is 0.426 nm, which is much larger than that of the NiO bulk (0.417 nm). The lattice parameter can be reduced by post-annealing the film because the interstitial Ar atoms are released from the NiO lattice, decreasing continuously from 0.423 to 0.417 nm as the NiO films are annealed by rapid thermal annealing (RTA) from 300 to 600 °C.     

Rapid Thermal Annealing of ZnO Nanocrystalline Films for Dye-Sensitized Solar Cells

Nanocrystalline ZnO thin films were prepared by the sol–gel method and annealed at 600 °C by conventional (CTA) and rapid thermal annealing (RTA) processes on fluorine-doped tin oxide (FTO)-coated glass substrates for application as the work electrode for a dye-sensitized solar cell (DSSC). ZnO films were crystallized using a conventional furnace and the proposed RTA process at annealing rates of 5 °C/min and 600 °C/min, respectively. The ZnO thin films were characterized by X-ray diffraction (XRD) and atomic force microscopy (AFM) analyses. Based on the results, the ZnO thin films crystallized by the RTA process presented better crystallization than films crystallized in a conventional furnace. The ZnO films crystallized by RTA showed higher porosity and surface area than those prepared by CTA. The results show that the short-circuit photocurrent (J _sc) and open-circuit voltage (V _oc) values increased from 4.38 mA/cm² and 0.55 V for the DSSC with the CTA-derived ZnO films to 5.88 mA/cm² and 0.61 V, respectively, for the DSSC containing the RTA-derived ZnO films.     

不同退火方式对0.7BiFeO3-0.3PbTiO3薄膜的铁电性能及漏电流的影响

利用溶胶凝胶法在LaNiO3/SiO2/Si衬底上制备了0.7BiFeO3-0.3PbTiO3(BFPT7030)薄膜,研究了快速退火及常规退火两种不同的后续退火处理方式对薄膜铁电性能及漏电流性能的影响.XRD测试表明,经快速退火处理的BFPT7030薄膜结晶完好,呈现出单一的钙钛矿相.SEM测试结果显示,经快速退火处理的BFPT7030薄膜结晶充分,但经常规退火处理的BFPT7030薄膜表面致密性较好,且在升温速率为2℃/min时薄膜的晶粒更细小.经快速退火处理的BFPT7030薄膜的铁电性能较为优异,在升温速率为20℃/s时,其剩余极化Pr为22μC/cm2,矫顽场Ec为70 kV/cm,并具有较小的漏电流.XPS测试结果表明,经常规退火处理的BFPT7030薄膜其铁离子的价态波动较小.     

Effect of processing temperature on characteristics of metal-ferroelectric (BiFeO3)-insulator (HfLaO)-silicon capacitors

The effect of temperature in rapid thermal annealing (RTA) process on the physical and electrical properties of bismuth ferrite ceramic thin films on HfLaO/p-Si substrates has been investigated. In metal-ferroelectric-insulator-silicon (MFIS) capacitors, the high-k HfLaO dielectric layer was prepared as the insulator layer. On HfLaO/Si substrates the bismuth ferrite thin film was fabricated via sputtering process with a BiFeO₃ (BFO) target at room temperature followed by RTA. The RTA temperature ranged from 500 to 700 °C. It is found that the root mean square roughness of ceramic films increases for high-temperature process. The maximum ferroelectric memory window is 1.6 V obtained from a sweep voltage of ± 4 V at the lowest RTA temperature of 500 °C. This good ferroelectric memory performance can be attributed to the low leakage current as a result of smooth surface of nanocrystalline ferroelectric BFO and Bi₂Fe₄O₉ thin films.     

Coating of carbon nanotubes with amorphous carbon nitride thin films and characterization of long-term emission stability

The effects of amorphous carbon nitride (CN) thin films that were coated on carbon nanotubes (CNTs) and their thermal treatment were investigated, in terms of the chemical bonding and morphologies of the CNTs and their field emission properties. CNTs were directly grown on conical tip-type tungsten substrates via the inductively coupled plasma-chemical vapor deposition (ICP-CVD) system, and the CNTs were coated with CN films using the RF magnetron sputtering system. The CN-coated CNTs were thermally treated using the rapid thermal annealing (RTA) system by varying the temperature (300-700 °C). The morphologies, microstructures, and chemical compositions of the CN-coated CNTs were analyzed as a function of the thickness of the CN layers and the RTA temperatures. The field emission properties of the CN/CNT hetero-structured emitters, and the fluctuation and long-term stability of the emission currents were measured and compared with those of the conventional non-coated CNT-emitter. The results showed that the electron emission capability of CNT was noticeably improved by coating a thin CN layer on the surface of the CNT. This was attributed to the low work function and negative electron affinity nature of the CN film. The CN-coated CNT-emitter had a more stable emission characteristic than that of the non-coated one. In addition, the long-term emission stability of the CN-coated emitter was further enhanced by thermal treatment, which was verified by x-ray photoelectron spectroscopy (XPS) analysis.     

Control of crystallographic orientation of LiNbO3 films grown by electron-cyclotron resonance plasma sputtering on TiN films

We investigated the orientation of domains in LiNbO₃ (LN) thin films grown by electron-cyclotron resonance plasma sputtering on TiN films with various crystalline states. Deposition at 400 °C on an amorphous TiN produced partially crystallized and apparently c-axis-oriented LN. When TiN crystallized at 460 °C to become polycrystalline grains, the roughened surface randomized the orientation of LN. At 600 °C, the reaction of TiN with oxygen atoms supplied from the plasma created a TiO_x layer. Rapid thermal annealing of amorphous LN films at 460 °C was the best solution for removing these disorientation factors, but annealing of amorphous LN on poly-crystalline TiN yielded no c-axis-oriented domains.     

A study on the electrical properties of Pb(Zr, Ti)O3 thin films crystallized by the electrical resistive heating of Pt thin film

The electrical properties of Pb(Zr, Ti)O₃ thin films annealed by Pt thin film heater were investigated. By the thin film heater, we successfully crystallized Pb(Zr, Ti)O₃ thin films at a high temperature above 750 °C in a few seconds. The thin film heater has some advantages, such as a low thermal budget, little Pb-loss and enhanced surface morphology compared with the conventional furnace because it has a fast heating rate. The electrical properties of the Pb(Zr, Ti)O₃ thin film crystallized by thin film heater improved considerably comparing to those crystallized in conventional furnace. The remanent polarization, breakdown field, and leakage current density measured to be 22.7 μC/cm², 853 kV/cm, and 6.93 × 10⁻⁷ A/cm², respectively.     

One-step electrodeposition of CuGaSe2 thin films

CuGaSe₂ thin films have been prepared by one-step electrodeposition and rapid thermal annealing process. According to composition and morphology analysis, deposition potential of − 0.6 V vs. SCE is considered to be optimum for electrodeposition. From the X-ray diffraction and Raman studies, the as-deposited film exhibits poor crystallinity without the evidence of CuGaSe₂ or other Ga-containing phases, while the rapid thermal annealing-treated film shows chalcopyrite structure CuGaSe₂ phase containing MoSe₂ phase between the Mo substrate and the absorber and minor second phase Cu_2 − xSe. The obtained CuGaSe₂ thin film has a band gap of about 1.68 eV and p-type conductivity.