新型隧道带间级联双波长半导体激光器

提出了通过隧道带间级联实现半导体激光器有多个激射波长的新型物理思想 ,并以GaAs为隧道结 ,InGaAs应变量子阱为有源区 ,利用金属有机物化学气相沉积 (MOCVD)生长了含有两个有源区的双波长半导体激光器。制备了 90 μm条宽的脊型波导器件结构 ,测试得到了能同时激射 95 1nm和 986nm两个波长的双波长半导体激光器 ,腔面未镀膜时的斜率效率达到了 1 12W A ,垂直远场为基模 ,水平方向发散角为 10° ,垂直方向发散角为 36°。     

新型大功率双波长半导体激光器的研制

提出了一种新结构半导体双波长激光器 ,即用隧道结把两个发射不同波长的激光器结构通过外延生长的方法连接起来。通过计算和设计 ,制备了性能良好的大功率激射的双波长半导体激光器。双波长器件的实际激射波长分别为 95 1 nm和 987nm,为基模激射。器件在 5 3 0 m A直流工作时输出功率达到 5 0 0 m W,斜率效率为1 .3 3 W/A。在 2 A电流时功率达 2 .4W,斜率效率为 1 .3 8W/A;3 A电流时功率达 3 .1 W,斜率效率为 1 .2 1 W/A。     

双端抽运的30 W光纤激光器实验研究

报道了双端抽运连续输出的掺Yb^3 双包层高功率光纤激光器。实验采用了中心波长在975nm附近的两种输出形式的半导体激光器(LD)作为抽运源，测量了不同抽运条件下的输出功率特性和光谱特性。在仅尾纤输出的半导体激光器抽运下获得了斜率效率为42％，峰值波长为1103．8nm的9．2W激光输出；在仅准直输出的半导体激光器抽运下获得了斜率效率为57％，峰值波长为1104．4nm的20．0W激光输出；当两个半导体激光器在双端同时抽运时，获得光纤激光最大输出功率为30．6W，输出峰值波长为1108．4nm，以及49％的总体光一光转换效率。     

双波长可调外腔半导体激光器

提出了一种基于体布拉格光栅（VBG）和横向啁啾体布拉格光栅（TCVBG）组合的双光栅外腔半导体激光器,该外腔半导体激光器采用反射率15%的体光栅和反射率17%的啁啾体布拉格光栅作为反馈元件和模式选择元件,实现特定波长的选择和调谐,实验研究了外腔激光器的功率-电流特性、光谱特性和波长调谐特性。实验结果表明:双光栅外腔半导体激光器最大输出功率为1.96 W,斜率效率为0.94 W/A,外腔效率达到78%。输出光谱为双波长,一个波长为808.6 nm,另一个波长连续可调,通过改变横向啁啾体光栅的位置,该波长可从800 nm调谐至815 nm,可调范围达15 nm,在整个可调范围内两个波长的谱线宽度（FWHM）均小于0.3 nm。     

隧道再生结构的垂直腔面发射激光器激射特性研究

对隧道再生多有源区内腔接触式垂直腔面发射激光器(VCSEL)材料特性进行了实验研究,得到了VCSEL外延片量子阱增益谱峰值波长、谐振腔谐振波长、DBR反射谱中心波长及材料的生长厚度偏差等重要信息。如果谐振腔谐振波长比增益谱峰值波长长20nm以上,阈值条件很难得到满足,器件很难实现激射。符合模拟参数生长的双有源区隧道再生VCSEL实现了室温激射。氧化孔径8.3μm器件,在11mA注入电流下,获得5mW的输出功率,斜率效率0.702mW/mA,激射波长970nm。     

一种用于光时域反射仪的1550nm半导体激光器

光时域反射仪(OTDR)是通信链路中光纤特性测试的专用仪器,半导体激光器是OTDR的关键元器件,激光器的性能直接影响OTDR的测试距离、测试精度等。为适应OTDR的应用需求,提出并研制了一种非对称分别限制(SCH)激光器,SCH结构可有效提高激光器的输出功率和斜率效率。同时,采用应变多量子阱结构来提高器件的温度特性。研制的1 550nm±20nm工作波长的激光器,其单模尾纤输出功率大于等于60mW(工作电流300mA,25℃),激光器上升/下降时间小于1ns,完全满足OTDR长距离、高精度测试的使用要求。     

大功率单隧道结半导体激光器的研制简

针对大功率隧道结半导体激光器因光学灾变损伤(COD)而导致输出光功率无法进一步提高的问题,通过优化器件材料结构,提高了其COD阈值.采用标准的半导体激光器制作工艺,制作了发光区条宽为200 μm、腔长为900 μm的单隧道结半导体激光器.在脉冲宽度为200 ns、重复频率为5 kHz的室温下进行测试,器件峰值功率超过70 W,并且无明显COD现象发生.在20 A工作电流下,器件峰值波长为907 nm,光谱宽度为7 nm,斜率效率为1.88,接近相同工作电流下单有源层激光器的两倍.     

体布拉格光栅外腔半导体激光器温度特性研究北大核心CSCD

使用COMSOL软件对体布拉格光栅(volume Bragg grating, VBG)外腔半导体激光器进行稳态热分析模拟仿真,研究VBG对半导体激光器的温度特性的影响。利用15%、20%两种VBG对888 nm半导体激光器进行外腔锁模,测试并分析外腔锁模条件下半导体激光器的输出特性和温度特性。结果表明,VBG外腔结构能够改善半导体激光器的光谱特性,提高半导体激光器的工作温度。在25℃条件下,当采用15%衍射效率的体光栅进行外腔锁模时,最大输出光功率为10.7 W,输出波长稳定在888 nm,光谱线宽为0.3 nm。     

塑封隧道结脉冲半导体激光器的研制

报道了一种新型塑料封装隧道结脉冲半导体激光器.采用MOCVD生长了隧道结串联双叠层激光器材料.激光器芯片为标准宽发射区结构.采用塑封结构,在脉冲宽度小于500ns,重复频率小于8kHz工作条件下,其输出光功率斜率效率达到1.7W/A, 是标准单芯片的1.7倍.采用塑封结构,克服了金属封装玻璃光窗在受冲击时易碎的弱点,其抗冲击达到20kg以上,且封装成本低廉.     

隧道再生半导体激光器热弛豫积累过程研究

针对隧道再生半导体激光器,建立了内部的热源分布模型。利用有限元方法模拟计算得到了两有源区隧道再生半导体激光器在不同占空比下工作时的热弛豫积累过程。模拟结果表明,芯片达到平衡前的热弛豫积累时间和达到热平衡时的温度均随注入电流占空比的增加而增加,热弛豫积累时间小于200ms。芯片内部温度分布表明,靠近衬底的有源区温度略高于靠近热沉的有源区温度,但温度差较小,热效应造成的波长漂移不会造成双峰现象。实验测量了在相同的边界条件下,不同占空比下器件的峰值波长,将其转换为温升,与模拟结果吻合。     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

A rigorous proof of MIMO channel capacity’s increase with antenna number

It is well known that adding more antennas at the transmitter or at the receiver may offer larger channel capacity in the multiple-input multiple-output（MIMO） communication systems. In this letter, a simple proof is presented for the fact that the channel capacity increases with an increase in the number of receiving antennas. The proof is based on the famous capacity formula of Foschini and Gans with matrix theory.     

Teleportation of an arbitrary unknown N-qubit entangled state under the controlling of M controllers

A new quantum protocol to teleport an arbitrary unknown N-qubit entangled state from a sender to a fixed receiver under M controllers(M < N) is proposed. The quantum resources required are M non-maximally entangled Greenberger-Home-Zeilinger (GHZ) state and N-M non-maximally entangled Einstein-Podolsky-Rosen (EPR) pairs. The sender performs N generalized Bell-state measurements on the 2N particles. Controllers take M single-particle measurement along x-axis, and the receiver needs to introduce one auxiliary two-level particle to extract quantum information probabilistically with the fidelity unit if controllers cooperate with it.     

Diode-end-pumped Nd:YVO4/LBO lasers with 4.2W continuous-wave output at 457 nm

A continuous-wave (CW) 457 nm blue laser operating at the power of 4.2 W is demonstrated by using a fiber coupled laser diode module pumped Nd: YVO4 and using LBO as the intra-cavity SHG crystal With the optimization of laser cavity and crystal parameters, the laser operates at a very high efficiency. When the pumping power is about 31 W, the output at 457nm reaches 4.2 W, and the optical to optical conversion efficiency is about 13.5% accordingly. The stability of the out putpower is better than 1.2% for 8 h continuously working.     

Call for Papers

正Wireless Body-area Networks The last decade has witnessed the convergence of three giant worlds:electronics,computer science and telecommunications.The next decade should follow this convergence in most of our activities with the generalization of sensor networks.In particular with the progress in medicine,people live longer and the aging of population will push the development of wireless personal networks