Four‐segment oscillator circuit for piezoelectric sensing devices

Novel circuit design is proposed for a low‐frequency quartz crystal oscillator circuit that consists of four segments. The characteristics of the negative resistance in a low‐frequency Complementary Metal Oxide Semiconductor (CMOS)‐inverter quartz oscillator were reviewed for the two modes of SC (stress‐compensated) cut mode and the overtone of low‐frequency mode; separation of two modes and suppression of overtone oscillation were demonstrated successfully. Experimental results and an estimate of the absolute value of the negative resistance are presented for the four‐segment oscillator circuit and the conventional Colpitts circuit and two new types of oscillator circuits. © 2011 Institute of Electrical Engineers of Japan. Published by John Wiley & Sons, Inc.     

Suppression of overtone oscillation and low‐current operation using novel‐design scheme for quartz crystal oscillators

A novel design is proposed for a low‐frequency quartz crystal oscillator circuit. Negative resistance in a low‐frequency CMOS‐inverter quartz oscillator was reviewed for the fundamental mode at 32 kHz and the overtone oscillation at 200 kHz. Suppression of the overtone oscillation, appropriate gain, and drive current reduction are realized by adding only three circuit components. Experimental results and an estimate of the absolute value of the negative resistance are presented for the conventional Colpitts circuit and two types of the quartz crystal oscillator circuit. © 2011 Institute of Electrical Engineers of Japan. Published by John Wiley & Sons, Inc.     

Short‐term stability in the intermediate region between quartz crystal oscillation and LC oscillation

In a quartz crystal oscillator circuit, an LC resonance circuit was inserted that enabled major enlargement of the variable range of frequency compared with the conventional Colpitts or Pierce quartz crystal oscillator. The short‐term stability of the oscillation was measured with Allan variance in the intermediate region between the quartz resonance and LC resonance, showing higher stability compared with the common LC oscillator. The analytical result is presented showing continuous transition from the quartz resonance to the LC resonance. © 2012 Institute of Electrical Engineers of Japan. Published by John Wiley & Sons, Inc.     

A linear,ultra wideband,low‐power, 2.1–5 GHz,VCO

A linear, Ultra Wideband, low‐power VCO, suitable for UWB‐FM applications is proposed, forming the main part of a UWB‐FM transmitter. The VCO is designed in TSMC 90thinspacenm digital CMOS process and includes a Source‐Coupled Multivibrator, used as current‐controlled oscillator (CCO) which generates output frequencies between 2.1 and 5 GHz and a voltage‐to‐current (V‐to‐I) converter which translates the VCO input voltage modulation signal to current. Two single‐ended inverter buffers are employed to drive either a differential or a single‐ended UWB antenna. The presented VCO is designed for 1 V power supply and exhibits a linear tuning range of 2.1–5 GHz, a differential output power of ?7.83 dBm±0.78 dB and low power consumption of 8.26 mW, including the output buffers, at the maximum oscillation frequency. It is optimized for a very high ratio of tuning range (81.69%) over power consumption equal to 9.95 dB. The desired frequency band of 3.1–5 GHz for UWB‐FM applications is covered for the entire industrial temperature range (?40 to 125^°C). Copyright © 2010 John Wiley & Sons, Ltd.     

A 120–420 MHz delay‐locked loop with multi‐band voltage‐controlled delay unit

A low‐jitter and low‐power dissipation delay‐locked loop (DLL) is presented. A proposed multi‐band voltage control delay unit (MVCDU) is employed to extend the operation frequency of the DLL by controlling the delay cell within the MVCDU. The jitter of DLL is reduced due to MVCDU's low sensitivity. The delay cell in the MVCDU employs a differential configuration to further reduce the noise impact from the fluctuation in the supply and ground voltage. The operating frequency of the proposed DLL ranges from 120 to 420 MHz. The proposed design has been fabricated in a TSMC 0.18µm CMOS process. The measured RMS and peak‐to‐peak jitters are 4.86 and 34.55 ps, respectively, at an operating frequency of 300 MHz. The power dissipation is below 14.85 mW at an operating frequency of 420 MHz. Copyright © 2010 John Wiley & Sons, Ltd.     

A CCII‐based wide frequency range square waveform generator

In this paper, we propose a novel current‐mode solution suitable for the square waveform generation. The designed oscillator, which utilizes only two positive second‐generation current conveyors as active blocks, six resistors and a capacitor, is based on a current differentiation, instead of voltage integration, typical of developed solutions both in voltage‐mode and in current‐mode approaches, so avoiding circuit limitations due to the node saturation effects. The proposed circuit has been designed, as an integrated solution at transistor level, in a standard CMOS technology, with low‐voltage (± 1V) and low‐power (430µW) characteristics. Simulation results have confirmed the good circuit behaviour, also for working temperature drifts, showing good linearity in a wide oscillation frequency range, which can be independently adjusted through either capacitive (in the range pF ? µF) or resistive (in the range M Ω–G Ω) external passive components. Waiting for the chip fabrication, preliminary measurements have been performed using a laboratory breadboard employing the CCII with AD844 commercial component and sample capacitors and resistors. The experimental results have shown good agreement with both simulations and theoretical expectations. Copyright © 2011 John Wiley & Sons, Ltd.     

A 5 GHz quadrature relaxation oscillator with mixing for improved testability or compact front‐end implementation

We demonstrate by measurements on a test circuit that a 5 GHz relaxation oscillator with accurate quadrature outputs and low phase‐noise can be obtained, and that these favorable properties can be preserved while the mixing function is performed by this oscillator. This is useful either to measure the quadrature error at a low frequency, or to implement a low‐intermediate frequency (IF) or zero‐IF (homodyne) radio frequency front‐end. Copyright © 2008 John Wiley & Sons, Ltd.     

A 0.6 V, 2.11 MHz, 62 dB SFDR active‐RC filter in 0.13µm CMOS process

Active‐RC biquad is proposed, which allows the DC level of the input of operational amplifier (op‐amp) to be different from that of the op‐amp output, enabling the low‐voltage operation. The proposed biquad realizes a second‐order transfer function with only one op‐amp, rendering even lower power consumption. By cascading two biquads, a 0.6 V fourth‐order filter is realized in a 0.13µm CMOS technology. While dissipating only 0.42 mW, the filter shows 2.11 MHz cut‐off frequency and 62 dB spurious‐free dynamic range. Copyright © 2008 John Wiley & Sons, Ltd.     

A 0.8‐V supply bulk‐driven operational transconductance amplifier and Gm‐C filter in 0.18 µm CMOS process

A low voltage bulk‐driven operational transconductance amplifier (OTA) and its application to implement a tunable Gm‐C filter are presented. The linearity of the proposed OTA is achieved by nonlinear terms cancelation technique, using two paralleled differential topologies with opposite signs in the third‐order harmonic distortion term of the differential output current. The proposed OTA uses 0.8 V supply voltage and consumes 31.2 μW. The proposed OTA shows a total harmonic distortion of better than ?40 dB over the tuning range of the transconductance, by applying 800 mV_ppd sine wave input signal with 1 MHz frequency. The OTA has been used to implement a third‐order low‐pass Gm‐C filter, which can be used for wireless sensor network applications. The filter can operate as the channel select filter and variable gain amplifier, simultaneously. The gain of the filter can be tuned from ?1 to 23 dB, which results in power consumptions of 187.2 to 450.6 μW, respectively. The proposed OTA and filter have been simulated in a 0.18 µm CMOS technology. Simulations of process corners and temperature variations are also included in the paper. Copyright © 2014 John Wiley & Sons, Ltd.     

0.3‐V bulk‐driven programmable gain amplifier in 0.18‐µm CMOS

A new solution for an ultra low voltage bulk‐driven programmable gain amplifier (PGA) is described in the paper. While implemented in a standard n‐well 0.18‐µm complementary metal–oxide–semiconductor (CMOS) process, the circuit operates from 0.3 V supply, and its voltage gain can be regulated from 0 to 18 dB with 6‐dB steps. At minimum gain, the PGA offers nearly rail‐to‐rail input/output swing and the input referred thermal noise of 2.37 μV/Hz^1/2, which results in a 63‐dB dynamic range (DR). Besides, the total power consumption is 96 nW, the signal bandwidth is 2.95 kHz at 5‐pF load capacitance and the third‐order input intercept point (IIP₃) is 1.62 V. The circuit performance was simulated with LTspice. Copyright © 2016 John Wiley & Sons, Ltd.     

A 4.8–6.8 GHz low phase noise LC VCO in 0.13‐µm CMOS technology

This letter presents a novel LC voltage controlled oscillator (VCO) supporting the high‐speed serial transmission standard of RapidIO in 0.13‐µm complementary metal‐oxide semiconductor technology. The low phase noise is achieved through several techniques including current source switching, parallel coupled negative transconductance cell, and varactor bias combination scheme. Measured results of proposed circuit show a low phase noise of ?120 dBc/Hz at 1 MHz offset from 6.25 GHz carrier and tuning range of 4.8 ~ 6.8 GHz (34.48%) while consuming 7.4 mW under the supply voltage of 1.2 V. Copyright © 2015 John Wiley & Sons, Ltd.     

A bidirectional isolated DC/DC converter as a core circuit for 3.3‐kV/6.6‐kV power conversion systems in the next generation

This paper describes a bidirectional isolated DC/DC converter considered as a core circuit for next‐generation 3.3‐kV/6.6‐kV high‐power‐density power conversion systems. The DC/DC converter is intended to use power switching devices based on SiC and/or GaN, which will be available on the market in the near future. A 350‐V, 10‐kW, and 20‐kHz DC/DC converter is designed, constructed, and tested in this paper. It consists of two single‐phase full‐bridge converters with the latest trench‐gate Si‐IGBTs and a 20‐kHz transformer with a nano‐crystalline soft‐magnetic material core and litz wires. The transformer plays an essential role in achieving galvanic isolation between the two full‐bridge converters. The overall efficiency from the DC‐input to DC‐output terminals is accurately measured to be as high as 97%, excluding gate drive circuit and control circuit losses from the whole loss. Moreover, loss analysis is carried out to estimate effectiveness in using SiC‐based power switching devices. The loss analysis clarifies that the use of SiC‐based power devices may bring a significant reduction in conducting and switching losses to the DC/DC converter. As a result, the overall efficiency may reach 99% or higher. © 2008 Wiley Periodicals, Inc. Electr Eng Jpn, 163(2): 75–83, 2008; Published online in Wiley InterScience ( www.interscience.wiley.com ). DOI 10.1002/eej.20505     

A configurable 2‐Gbps LVDS transceiver in 150‐nm CMOS with pre‐emphasis,equalization, and slew rate control

A configurable full‐duplex low‐voltage differential signaling transceiver is presented, which can be configured to operate either for smaller differential channels (a few inches of striplines) or for longer channels (10 m of twisted pair cables). The configurability is embedded in the form of functionalities like pre‐emphasis, equalization, and slew rate control within the transceiver. The transmitter employs a hybrid voltage–current‐mode driver, which due to replica action, achieves a high‐impedance current‐mode signal dispatch and at the same time provides a matched impedance at the near end for improved intersymbol interference. The transmitter achieves slew rate control through a band‐limited pre‐driver, while the pre‐emphasis is achieved through a capacitive feed‐forward. The receiver employs a large‐input common‐mode first stage enclosed in a common‐mode control loop that enables its first stage to also act like a domain shifter (VDDIO‐to‐VDDCORE) reducing the overall power consumption. The equalization in the receiver is implemented by using carefully sized active inductive loads inside the receiver. The transceiver is designed and fabricated in 150‐nm complementary metal–oxide–semiconductor, sharing the space with a larger die, occupying an area of 400 × 400μm. The measurement results demonstrate that the transceiver is operating at 2 Gbps both for a 4‐in microstrip and a 10‐m twisted pair CAT6 cable with 30 and 180 ps of total jitter, respectively. The built‐in impedance calibrator minimizes the spread in the on‐die termination at the near end provided by the transmitter‐minimizing bit error rate across process, voltage, and temperature corners. The transmitter consumes a total power of 17 mW operating at 2 Gbps, that is, 8.5 pJ/bit of energy consumption; the receiver consumes a total power of 3.5 mW while driving a load of 5 pF at 2 Gbps. Copyright © 2016 John Wiley & Sons, Ltd.