共查询到20条相似文献,搜索用时 31 毫秒
1.
2.
3.
《现代表面贴装资讯》2010,(1):25-26
“世界工厂”不是中国的专利。既然它可由日本转移到中国,同样也存在转移到其他地区的可能。当世界进入后危机时代,全球经济格局正在调整的大环境下,以来料加工模式为基础的“中国制造”还能维系吗? 相似文献
4.
中国的SMT产业正在迎来大发展的春天。绝大多数世界级公司都制定了自己的中国战略,鉴于SMT产业横贯低、中、高产业的特性,全球SMT产业正在向中国整体转移,成为“中国制造”的有机部分。 相似文献
5.
6.
要抓住跨国公司向外转移生产能力的机会,加强合资合作,扩大生产规模,完善产业发展链条,努力成为面向全球的软件产品生产加工基地和研究开发基地。 相似文献
7.
8.
提出现代化通信网正加快向数字化,综合化,宽带化,智能化,个人化方向发展,同步数字系列,异步转移模式,光纤用户环路,无线接入系统等一批新技术在得到广泛应用的同时,必须加快电信建设的标准化工作,并建议标准化工作应在新技术研究开发早期阶段介入制定,提高我国的电信标准五国际电信标准的接国速度。 相似文献
9.
《无线电技术与信息》2005,(5):85-86
5月8日,全球GSM协会原中国区总裁雷鸣在接受记者越洋电话采访时表示:由于受到GSM协会战略重心转移到印度、巴西的影响,雷鸣已于近期正式辞去中国区总裁一职。 相似文献
10.
目前,世界电子产品制造业正在向亚洲转移。中国的消费市场巨大,其手机市场对半导体的消耗量在世界上排在第一位。与此同时,行业内的客户需要更具差异化的解决方案,由于市场对价格的压力很大,在不断提高产品复杂程度的同时,还要尽量降低成本。现在,中国不只是进行生产加工,还要向研发和拥有更多知识产权方向转移,这就需要更大的人力资源投入,特别是工程技术和管理资源方面的投资,中国市场的需求量是非常大的。 相似文献
11.
12.
13.
Benchmarking semiconductor manufacturing 总被引:6,自引:0,他引:6
We are studying the manufacturing performance of semiconductor wafer fabrication plants in the US, Asia, and Europe. There are great similarities in production equipment, manufacturing processes, and products produced at these plants. Nevertheless, data reported here show that important quantitative measures of productivity vary by factors of 3 to as much as 5 across an international sample of 16 plants. We conducted on-site interviews with manufacturing personnel to better understand reasons for the observed wide variations in productivity. We have identified factors in the areas of information systems, organizational practices, process and technology improvements, and production control that correlate strongly with productivity 相似文献
14.
Microsystems packaging is fundamentally dependent on the manufacture of microelectronic, photonic, radio frequency (RF), and MEMS devices. The system-on-package (SOP) approach has been identified as a key strategy for integrating these strategic packaging technologies. Because of rising costs, the challenge before SOP manufacturers is to offset capital investment with greater automation and technological innovation in the fabrication process. To reduce manufacturing cost, several important subtasks have emerged, including increasing fabrication yield, reducing product cycle time, maintaining consistent levels of product quality and performance, and improving the reliability of processing equipment. Because of the large number of steps involved, maintaining product quality in an SOP manufacturing facility requires the control of hundreds of process variables. The interdependent issues of high yield, high quality, and low cycle time are addressed by the ongoing development of several critical capabilities in state-of-the-art computer-integrated manufacturing (CIM) systems: in situ process monitoring, process/equipment modeling, real-time process control, and equipment diagnosis. Recently, the use of computational intelligence in various manufacturing applications has increased, and the SOP manufacturing arena is no exception to this trend. Artificial neural networks, genetic algorithms (GAs), and other techniques have emerged as powerful tools for assisting CIM systems in performing various process monitoring, modeling, and control functions. This paper reviews current research in these areas, as well as the potential for deployment of these capabilities in state-of-the-art SOP manufacturing facilities. 相似文献
15.
16.
《Engineering Management Review, IEEE》2003,31(3):3-3
This publication contains reprint articles for which IEEE does not hold copyright. You may purchase this article from the Ask*IEEE Document Delivery Service at http://www.ieee.org/services/askieee/ 相似文献
17.
The concept of a CIM (computer-integrated manufacturing) networking architecture for integration of factory and office communications is introduced. Some potential problems in CIM networking and approaches for their solution are elucidated. A simulation methodology is presented for evaluating the performance of integrated networks with different protocols and architectures and under diverse operating conditions 相似文献
18.
Coordination mechanisms for multi-agent manufacturing systems:applications to integrated manufacturing scheduling 总被引:2,自引:0,他引:2
The advent of information technology (IT) has made today's manufacturing systems increasingly distributed. Typically such a system consists of a complex array of computer-based decision units, controllers and databases. Rather than dealing with each component individually, it is necessary to have a new paradigm for management of manufacturing systems, so that all the components and their operations can be managed in an integrated fashion. The multi-agent framework presented in this paper is such a paradigm for achieving system integration. The authors specifically emphasize the coordination mechanisms needed for ensuring the orderly operations and concerted decision making among the components-i.e., agents-of the manufacturing systems. The application of the framework to a printed circuit board manufacturing system and the performance results are also described 相似文献
19.
Micromachined microsensors for manufacturing 总被引:1,自引:0,他引:1
The rapid development of microelectromechanical systems (MEMS) technologies in recent years has provided a high degree of spatial miniaturization and integration of electromechanical components, which enable integrated sensing and control in manufacturing. This article provides an overview of the state of the art of micromachined microsensors for the measurement of mechanical signals in the manufacturing industry for automobiles, manufacturing, medical equipment, environment, robotics, food, and other consumer products. Measurements of pressure, acceleration, and acoustic emission (AE) are the three physical quantities that are most encountered in industrial and manufacturing applications. Discussed are the major design parameters of such microsensors, such as dynamic range, sensitivity, resolution, and accuracy and provide a real-world application. Also discussed are the issues related to the spatial integration of signal processing, power supply, and wireless communication with the sensing elements, which are of direct relevance to the overall performance of the microsensors. 相似文献
20.
Huijbregts E.P. Hua Xue Jess J.A.G. 《Semiconductor Manufacturing, IEEE Transactions on》1995,8(2):188-194
The impact of spot defects on the susceptibility for electrical failure of a net is analyzed. Based on this analysis, a general routing cost function is presented, in which the manufacturability of a net is taken into account in conjunction with traditional routing objectives. The new cost function, relating the process spot defects to the routing procedure has been implemented. Failure probabilities are analyzed for the benchmark layouts obtained by our routing tool using both the original cost function and the new cost function. The results show that the failure probability of a layout is significantly decreased if the spot defect mechanism is taken into account in the routing procedure, while the area of the layout is kept constant 相似文献