共查询到19条相似文献,搜索用时 109 毫秒
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By Joseph Y. Lee Jinyong Ahn JeGwang Yoo Joonsung Kim Hwa-Sun Park Shuichi Okabe 《电子工业专用设备》2007,36(5):40-50
在20世纪90年代,球栅阵列封装(BGA)和芯片尺寸封装(CSP)在封装材料和加工工艺方面达到了极限。这2种技术如同20世纪80年代的表面安装器件(SMD)和70年代通孔安装器件(THD)一样,在电学、机械、热性能、尺寸、质量和可靠性方面达到最大值。目前,三维封装正在成为用于未来采用的先进印制板(PCB)制造工艺的下一个阶段。它们可以分为圆片级封装、芯片级封装、和封装面。叠层封装(PoP)是一种封装面叠层封装类型的三维封装技术[15]。 相似文献
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晶圆级芯片尺寸封装(WCSP)消除了类似传统的芯片键合、引线键合和倒装芯片贴装过程的封装工序。这种办法可以为半导体产品用户实现更快的上市时间。WCSP封装应用空间正在扩大到新的领域,并根据管脚数量和器件类型进行细分。WCSP封装正在集成无源、分立元件、射频和存储器器件方面得到应用,并扩展到逻辑集成电路和MEMS器件。但伴随着这种应用的增长出现了很多问题,其中包括随着芯片尺寸和管脚数量的增长对电路板可靠性的影响。概述当今的挑战,以及这些集成和硅通孔技术的未来趋势。 相似文献
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后摩尔时代的封装技术 总被引:2,自引:1,他引:1
童志义 《电子工业专用设备》2008,37(9)
综述了进入后摩尔时代半导体业界面临制造技术极限的挑战所进行的各种应对措施的现状,着重介绍了叠层封装、系统级封装、晶圆级封装、硅通孔技术等一些新型的三维垂直封装技术在电子电路集成方面的进展及高密度3D芯片封装的前景。 相似文献
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文章主要论述了微机电系统(MEMS)和微系统诸如微传感器、驱动器和微流体元件的电机封装技术、封装等级和封装技术相关的问题.首先陈述并讨论了典型的MEMS产品诸如微压传感器、加速度计和微泵;微电子封装和微系统封装技术,重点阐述芯片级封装技术和器件级封装技术问题.芯片级封装技术主要涉及芯片钝化、芯片隔离和芯片压焊;器件级封... 相似文献
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包含微机电系统(MEMS)混合元器件的埋置型叠层封装,此封装工艺为目前用于微电子封装的挠曲基板上芯片(COF)工艺的衍生物。COF是一种高性能、多芯片封装工艺技术,在此封装中把芯片包入模塑塑料基板中,通过在元器件上形成的薄膜结构构成互连。研究的激光融除工艺能够使所选择的COF叠层区域有效融除,而对封装的MEMS器件影响最小。对用于标准的COF工艺的融除程序进行分析和特征描述,以便设计一种新的对裸露的MEMS器件热损坏的潜在性最小的程序。COF/MEMS封装技术非常适合于诸如微光学及无线射频器件等很多微系统封装的应用。 相似文献
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后摩尔时代的封装技术 总被引:4,自引:2,他引:2
童志义 《电子工业专用设备》2010,39(6):1-8
介绍了在高性能的互连和高速互连芯片(如微处理器)封装方面发挥其巨大优势的TSV互连和3D堆叠的三维封装技术。采用系统级封装(SiP)嵌入无源和有源元件的技术,有助于动态实现高度的3D-SiP尺寸缩减。将多层芯片嵌入在内核基板的腔体中;采用硅的后端工艺将无源元件集成到硅衬底上,与有源元件芯片、MEMS芯片一起形成一个混合集成的器件平台。在追求具有更高性能的未来器件的过程中,业界最为关注的是采用硅通孔(TSV)技术的3D封装、堆叠式封装以及类似在3D上具有优势的技术,并且正悄悄在技术和市场上取得实实在在的进步。随着这些创新技术在更高系统集成中的应用,为系统提供更多的附加功能和特性,推动封装技术进入后摩尔时代。 相似文献
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微电子封装的新进展领域及对SMT的新挑战 总被引:2,自引:0,他引:2
介绍了几种微电子新型封装材料,如LTCC、AIN、金刚石、AI-Sic和无铅焊接材料等,论述了正在发展中的新型先进封装技术,如WLP、3D和SIP等,并对封装新领域MEMS和MOEMS作了简介.最后,就这些新技术对SMT的新挑战作了些探讨. 相似文献
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Sungho Jin 《Journal of Electronic Materials》2003,32(12):1366-1370
In packaging of microelectromechanical systems (MEMS), optical, and electronic devices, there is a need to directly bond a
wide variety of inorganic materials, such as oxides, nitrides, and semiconductors. Such applications involve hermetic-sealing
components, three-dimensional MEMS assembly components as well as active semiconductor or optical components, dielectric layers,
diffusion barriers, waveguides, and heat sinks. These materials are known to be very difficult to wet and bond with low melting-point
solders. New Sn-Ag- or Au-Sn-based universal solders doped with a small amount of rare-earth (RE) elements have been developed,
which now allow direct and powerful bonding onto the surfaces of various MEMS, optical, or electronic device materials. The
microstructure, interface properties, and mechanical behavior of the bonds as well as the potential packaging applications
of these new solder materials for MEMS and optical fiber devices are described. Various packaging-related structural, thermal,
or electrical issues in MEMS are also discussed. 相似文献
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杨建生 《电子工业专用设备》2011,40(5):15-20
包含微机电系统(MEMS)混合元器件的埋置型叠层封装,此封装工艺为目前用于微电子封装的挠曲基板上芯片(COF)工艺的衍生物.COF是一种高性能、多芯片封装工艺技术,在此封装中把芯片包入模塑塑料基板中,通过在元器件上形成的薄膜结构构成互连.研究的激光融除工艺能够使所选择的COF叠层区域有效融除,而对封装的MEMS器件影响... 相似文献
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An embedded overlay concept for packaging hybrid components containing microelectromechanical systems (MEMS) is described. This packaging process is a derivative of the chip-on-flex (COF) process currently used for microelectronics packaging. COF is a high performance, multichip packaging technology in which die are encased in a molded plastic substrate and interconnects are made via a thin-film structure formed over the components. A laser ablation process has been developed which enables selected areas of the COF overlay to be efficiently ablated with minimal impact to the packaged MEMS devices. Analysis and characterization of the ablation procedures used in the standard COF process was performed to design a new procedure which minimized the potential for heat damage to exposed MEMS devices. The COF/MEMS packaging technology is well-suited for many microsystem packaging applications such as micro-optics and radio frequency (RF) devices. 相似文献
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Joseph P. J. Monajemi P. Ayazi F. Kohl P. A. 《Advanced Packaging, IEEE Transactions on》2007,30(1):19-26
An approach to low-cost, wafer-level packaging of microelectromechanical systems (MEMS), e.g., microresonators, is reported. The process does not require wafer-to-wafer bonding and can be applied to a wide range of MEMS devices. A sacrificial polymer-placeholder is first patterned on top of the MEMS component of interest, followed by overcoating with a low dielectric constant polymer overcoat. The sacrificial polymer decomposes at elevated temperature, and the volatile products from the sacrificial material permeate through the overcoat polymer leaving an embedded air-cavity around the MEMS structure. Thus, the device is released from the sacrificial polymeric material, housed in a protective overcoat. The protected MEMS device can then be handled and packaged like an integrated circuit. The electrical characteristics of the microresonators before and after packaging were essentially the same, showing the packaging scheme does not alter the device performance. This approach is applicable to both surface and bulk micromachined devices 相似文献
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MEMS器件的真空封装是整个工艺过程中的难点,封装的质量决定着整个器件的质量和使用寿命。现有的封装工艺,封装后器件内部真空度不能有效保持,是需要在真空下工作的器件的瓶颈。随着吸气剂的广泛使用,使MEMS器件的真空度保持能力大大提高,但现有的封装工艺设备不能满足吸气剂的激活条件。分析了空气阻尼对MEMS器件品质因数的影响,提出一种将现有的真空共晶设备的改进方法,使之能应用于使用吸气剂的MEMS器件的真空封装工艺。 相似文献
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Stephen F. Bart Susan Zhang Vladimir L. Rabinovich Shawn Cunningham 《Microelectronics Reliability》2000,40(7)
Microelectromechanical systems (MEMS), by their nature as sensors and actuators, require application specific packaging. The package is the near environment of the MEMS device and hence has a direct effect on its thermal behavior, mechanical effects, environmental compatibility and contamination. Therefore, understanding the influence of the packaging on MEMS device performance is critical to a successfully coupled package-device co-design. Here, an automated package-device interaction simulator has been developed. The simulator uses separate finite element method models for both the package and the device analysis and ties the simulations together through parametric behavioral package models. This technique allows the generation of package model libraries and supports the co-design of application specific packaging and MEMS devices. In the current implementation, thermomechanical package models have been implemented. Experimental verification of the technique is demonstrated by the comparison of simulation results to the measured package strain data. Although MEMS device-package interactions are not the only systems that could benefit from this method, they are a significant application area, focused on here. 相似文献