元素Ag 对Sn －9Zn 钎料组织及性能影响

通过实验研究了元素Ag对Sn-9Zn共晶钎料微观组织、熔点、显微硬度及抗腐蚀性的影响。结果表明,添加Ag元素后,能使Sn-9Zn合金组织和性能得到明显改善,其中Ag和Zn形成AgZn₃化合物,可以抑制粗大针状Zn相组织的生长,并呈放射状,对合金基体起到很好的弥散强化作用;熔点提高2 ℃;润湿性提高20%;显微硬度提高10.02%;腐蚀电位明显提高,抗腐蚀性能得到改善,接近于传统Sn-37Pb钎料。     

铅对Sn3.5Ag0.5Cu合金钎料性能的影响

利用显微硬度计、差热分析仪等仪器设备,研究了铅对Sn3.5Ag0.5Cu钎料合金性能的影响。实验结 果表明,铅对Sn3.5Ag0.5Cu钎料合金性能有较大的影响,添加铅后,Sn3.5Ag0.5Cu钎料合金熔化温度下降了8%; 钎料合金的润湿性得到改善;当w (Pb)达到0.5%时,Sn3.5Ag0.5Cu钎料合金显微硬度显微硬度值最大,达到21.5 HV之后快速下降。     

Effect of elements Ni and Co on morphology and type of IMC at Sn-3Ag-0.5Cu solder joint interface

The intermetallic compound (IMC)is hard and brittle,and its forming and growth at soldering joint interface is an important issue in joint reliability. The data obtained by digital optical electronic microscope indicate that the addition of element Co changes the IMC morphology from ball-like and bar-like to distinct and sharp in crest lines and edges. The addition of elements Ni and Co in Sn-3Ag-0.5Cu solder promotes the nucleation and makes the IMC size finer.The electron probe microanalysis(EPMA)determines the chemical compositions and confirms that the IMC is changed into the(Cu,Co,Ni)_6Sn_5+(Cu,Co,Ni)_3Sn_4 mixed type from the type of Cu_6Sn_5 with the elements Ni and Co in the solder.     

元素Cu对BNi-7钎料组织和润湿性能的影响

在钎焊温度为980℃,保温时间为30 min的条件下,向BNi-7钎料中添加质量分数为9%的合金元素Cu,利用扫描电镜、同步热分析仪以及对比实验,分析元素Cu对BNi-7钎料微观组织、熔化特性以及润湿性能的影响.结果表明,添加合金元素Cu,钎料润湿铺展过程中相的种类不变,但Ni基固溶体厚度增加,共晶组织里的韧性Ni(Fe,Cr,Cu)固溶体数量增加;随着合金元素Cu的添加,钎料的固液相线温度逐渐降低,但熔化温度范围增大;对于添加9%Cu的BNi-7钎料,由于前驱膜的变宽,促进了钎料的润湿,润湿性能良好.     

Preparation and properties of 4.25Cu-0.75Ni/NiFe_2O_4 cermet

1INTRODUCTION NiFe2O4cermets,whichareexpectedtobe usedastheinertanodesforaluminumelectrolysis, havelowcorrosionandoxidation,goodelectricalconductivityandhighthermalshockresistance[15]. Nickelferritespinelformsacorrosion resistant networkthatcontainstheelectricallyconductivecopper basedmetallicphase.Especially,Gregget al[6]foundacermetofNiFe2O4 18%NiO 17%Cu (massfraction),whichshowedfavorablecorrosion andconductivitypropertiesasinertanodesinsmalllaboratorycells.However,itwasalsoshowedth…     

熔体过热对Sn-Cu焊料合金凝固组织及焊接性能的影响

以Sn-5Wt%Cu无铅焊料合金为研究对象,探索了熔体过热对合金熔体结构、凝固组织和焊接性能的影响.运用四探针电阻法发现合金熔体过热至758℃附近后发生了明显的不可逆结构突变;熔体过热处理后的金相组织观察表明,该不可逆结构转变使合金凝固组织明显细化和弥散化、合金焊接接头的界面化合物层变得更薄、且界面粗糙度也得到了一定的改善.在260℃左右的铜基板铺展实验中,焊料合金的铺展面积增大了5%,润湿角减小了13%,其润湿性有较大提高.     

锆基非晶合金在NaOH溶液中的腐蚀行为

用电化学极化曲线研究锆基非晶合金Zr53.5Cu26.5Ni5Al12Ag3在25℃和60℃温度下,在0.01 mol/L和0.1 mol/L的NaOH溶液中腐蚀100 h的腐蚀行为,并用金相显微镜和扫描电镜对腐蚀前后试样的表面形貌进行观察与分析.极化曲线的测试结果表明：锆基非晶合金在25℃下,在浓度为0.01 mol/L和0.1 mol/L的NaOH溶液中浸泡100 h,随着NaOH溶液浓度的升高,非晶合金的耐腐蚀能力下降;锆基非晶合金在25℃和60℃下,在浓度为0.01 mol/L的NaOH溶液中浸泡100 h,随着NaOH溶液温度的升高,非晶合金的耐腐蚀能力下降;锆基非晶合金和晶态合金在60℃下,在浓度为0.1 mol/L的NaOH溶液中浸泡100 h,非晶合金的耐腐蚀性能优于晶态合金.最后根据电化学腐蚀原理,从腐蚀介质温度和浓度方面的性质探讨锆基合金耐蚀性能的因素.     

合金元素对Sn-Bi-Sb-Ag-Cu-Re系无铅钎料性能和组织的影响

研究了合金元素Bi、Sb、Ag、Cu、Re对锡基无铅多元钎料性能和组织的影响.研究结果表明，增加Bi、Ag、Cu含量可以降低液相线温度，Sb可以提高液相线温度；Bi、Cu有提高润湿性能的作用，Sb、Ag、Re在低含量范围内可提高润湿性能；Cu有提高剪切强度的作用，Bi明显使剪切强度降低.钎料的相组成是由在β Sn的基体上分布着金属间化合物Ag3Sn、SnBi和Cu6Sn5构成的，Sb和Re则基本上是固溶在基体中.     

Superheating and melting behaviors of Ag clusters with Ni coating studied by molecular dynamics and experiments

Using molecular dynamics with embedded-atom-type interatomic potentials, we simulated the melting behavior of a spherical Ag3055 cluster coated with Ni. The semi-coherent Ag/Ni interface formed at low temperatures acts as an effective barrier against the surface melting and leads to a substantial superheating of the Ag cluster. The melting point was found to be about 100 K above the equilibrium melting point of the bulk Ag crystal (1230 K?15 K) and about 290 K above that (1040 K) of the free Ag3055 cluster. A superheating of 70 K was observed in the high-temperature differential scanning calorimetry measurement for Ag particles with a mean size of 30 nm embedded in Ni matrix prepared by means of melt-spinning. Melting is initiated locally at the defective interfacial area and then propagates inwards, suggesting a heterogeneously nucleated melting event at the Ag/Ni interface.     

Effect of adding Ce on interfacial reactions between Sn-3.0Ag-0.5Cu solder and Cu substrate

The formation and the growth of Cu-Sn intermetallic compound （IMC） layer at the interface between Sn-3.0Ag-0.5Cu-xCe solder and Cu substrate during soldering and aging were studied. The results show that Cu6Sn5 IMC is observed at the interface between solder and Cu substrate in all conditions. After aging for 120 h,the Cu3Sn IMC is then obtained. With increasing aging time,the scalloped Cu6Sn5 structure changes to a plate structure. The Cu3Sn film always forms with a relatively planar interface. By adding a small amount of the rare earth element Ce （only 0.1%,mass fraction） into the Sn-3.0Ag-0.5Cu solder alloy,the growth rate of the Cu-Sn IMC at the interface of solder alloy system is decreased. When the time exponent is approximately 0.5,the growth of the IMC layer is mainly controlled by a diffusion over the studied time range.     

电子封装中的无铅Sn-3.8Ag-0.5Cu/Cu界面研究

针对钎料与焊盘间形成IMC层的厚度是影响可靠性的一个关键因素．对无铅钎料Sn-3．8Ag-0．5Cu与Cu盘进行了重熔,采用Olympus（光学金相显微镜）,SEM（扫描电镜）和EDX（能谱X射线）界面分析手段,研究了合金Sn-3．8Ag-0．5Cu与Cu焊盘接头的钎焊性和在焊接过程中IMC的形成与长大机理,探讨了IMC厚度与保温时间的变化规律．研究结果表明,无铅钎料合金Sn-3．8Ag-0．5Cu在钎焊务件下与Cu焊盘能够实现良好的连接,其连接层为Cu6Sn5金属间化合物,重熔时的IMC层生长基本上符合抛物线规律．     

稀土Er对Al-Si-Cu钎料显微组织与性能的影响

为了研究微量稀土元素Er对Al-7Si-20Cu钎料合金性能的影响,进行了不同wEr对Al-7Si-20Cu合金熔化温度、润湿性能及力学性能的试验研究.结果表明,添加微量Er对Al-Si-Cu钎料合金的熔化温度无显著影响,但显著提高Al-Si-Cu钎料合金对被焊基体铝合金(LF21)的润湿能力,尤其是当wEr为0.05%~0.1%时最为显著.显微组织分析表明,随着wEr的增加,钎料显微组织细化,特别是针状共晶Si的长度逐渐减小.     

典型添加元素对Sn-Zn系钎料性能的影响

Sn-Zn钎料被认为是传统Sn-Pb共晶钎料的最佳替代合金之一,它以低廉的成本、较好的力学性能以及其共晶成分与Sn-37Pb钎料熔点相近等优点引起了人们的广泛关注,但其润湿性、抗氧化性、抗腐蚀性不够理想.阐述了Bi、A1、In、Ag、Cu及稀土元素(RE)等典型添加元素对Sn-Zn钎料各种性能的影响,以期为Sn-Zn钎...     

Effect of the repeated melting of mother ingot on the stability of icosahedral phase precipitated from Zr-Al-Ni-Cu-Ag glass

Since the icosahedral phase (I-phase) was first found in a rapidly solidified Al84Mn16 alloy by Shechtman et al.[1] in 1984, a lot of studies on I-phase have been carried out. The typical systems in which the icosahedral quasicrystals can be formed include Al-[2,3], Pd-[4] and Ti-based[5] ones. In most cases, the I-phase forms as metastable phase and its formation depends on the cooling rate. Later, precipitation of I-phase during the crystallization of Zr-based metallic glass was reported…     

Ti50Cu42Ni8非晶合金力学性能与晶化组织的研究

采用铜模喷注法成功制备出成本较低直径为2mm的Ti50Cu42Ni8大块非晶合金,对其力学性能及铸态与晶化显微组织进行了研究。结果表明：Ti50Cu42Ni8非晶合金具有优异的力学性能,压缩断裂强度可达2008MPa,弹性模量为100GPa,非晶样品的断裂面与轴向成45。,断口出现河流状脉纹及熔滴。其铸态显微组织为无特征组织,480℃和650℃退火后分别出现条状和梅花状晶态相。     

微量铅对Sn-9Zn合金钎料性能的影响

运用差热分析仪、显微硬度计等仪器设备,研究微量铅对Sn-9Zn钎料合金性能的影响。结果表明,微量铅对Sn-9Zn钎料合金性能有较大的影响,其中添加微量铅后,Sn-9Zn钎料合金熔化温度略呈下降趋势,使钎料合金的润湿性得到改善,可以提高Sn-9Zn钎料合金显微硬度,在Pb含量达到1.0%时,显微硬度值可达到31.7。     

Effects of Mg and Ag elements on the aging precipitation of binary Al-Cu alloy

The effect of trace elements Mg and Ag on the aging precipitation has been studied. It has been shown that both Mg and Ag have no obvious effect on the aging pre- cipitates but influence the nucleation and growth velocities of the precipitates in binary Al-Cu alloy if added separately. However, when Al-Cu alloy contains both elements Mg and Ag, Mg and Ag atoms strongly attract each other and form atom clusters along the matrix {111} planes. These atom clusters help the Cu atoms aggregate and nucleate het- erogeneously along the matrix {111} planes, which makes Mg atom clusters the optimized nucleation sites for Ω phase and inhibit the nucleation of θ′ phase.     

Sn-Zn-Bi无铅钎料成分设计

利用二次回归正交组合设计建立了Sn Zn Bi无铅钎料成分与润湿性能、力学性能及抗腐蚀性能的回归方程,分析了成分质量分数对钎料润湿性能、接头剪切强度及钎缝抗腐蚀能力的影响规律。结果表明:增加Zn的质量分数有助于提高接头剪切强度,但同时也使钎料润湿性和钎缝抗腐蚀性能下降;添加适量质量分数的Bi能明显改善钎料的润湿性、接头剪切强度和钎缝抗腐蚀性;Zn、Bi交互作用对钎料和接头性能有一定的影响。在综合考虑成分变化对钎料熔点、熔化温度区间等影响后,优化设计出用于电子工业的w(Zn)=8%～9%、w(Bi)=3%～4%的Sn Zn Bi无铅钎料。     

FeNiMnCuC0．2Alx高熵合金结构及性能研究

通过高频感应加热在真空下制备FeNiMnCuC0．2Alx（x=0、0．1、0．2、0．5mol）高熵合金,对固溶处理后的试样进行结构及性能研究。结果表明,FeNiMnCuC0．2Alx高熵合金具有简单的面心立方结构;添加少量Al（x=0．1、0．2mol）能细化FeNiMnCuC0．2Alx高熵合金晶粒,但x=0．5mol时,晶粒又变得粗大;初生树枝状晶富含Fe、Ni元素,Mn、Cu在枝晶间相内有所聚集,C、Al大体上均匀分布于两相中;x=0时,FeNiMnCuC0．2Alx高熵合金具有高的抗压强度（5218MPa）,x=0．1mol时,舍金抗压强度（4037MPa）和压缩率（〉75％）均较佳,随Al添加量的继续增加,合金压缩性能有所下降,x=0．5mol时,合金表现为脆性断裂。     

钇对ZrCuNiAl系合金非晶形成能力的影响

利用X射线衍射（XRD）和差示扫描量热分析（DSC）研究了添加钇对Zr55 Cu30Ni5Al10Y（=0,1,2,3,4）非晶合金体系玻璃形成能力的影响。用铜模铸造获得的Zr55-xCu30Ni5Al10Y（=0,1,2,3,4）块体非晶合金的临界尺寸从直径6 mm增加到20 mm。分析认为,微量钇的添加可以与合金中的残留氧形成氧化物,降低氧对合金形成非晶态结构的负面效应。因此添加适量的稀土元素钇有利于提高Zr55 Cu30Ni5Al10Y非晶合金体系的玻璃形成能力。