Transparent, amorphous and organics-free ZnO thin films produced by chemical solution deposition at 150 °C

We have studied the low-temperature processing of ZnO by chemical solution deposition. A transparent, stable precursor solution prepared from zinc acetate dihydrate dissolved in 2-methoxyethanol was spin-coated on SiO_x/Si, soda-lime glass and polymer substrates and heated at 150 °C. Selected thin films deposited on SiO_x/Si were additionally heated at 450 °C.Microstructural and chemical analyses showed that the thin films heated at 150 °C in air were amorphous, contained no organic residues and had a root mean square roughness of 0.7 nm. The films deposited on SiO_x/Si and heated at 450 °C were crystallised and consisted of randomly oriented grains with a diameter of about 20 nm. All thin films were transparent, exhibiting a transmission of over 80% in the visible range. The resistivity of the 120-nm thick ZnO films processed at 150 °C was 57 MΩ cm and upon heating at 450 °C it decreased to 1.9 kΩ cm.     

Ion sputtering rates of C, CrxCy, and Cr at different Ar ion incidence angles

To study the ion sputtering of a layered structure with different layer densities and ion sputtering yields a trilayer structure of C-graphite(46 nm)/Cr_xC_y(60 nm)/Cr(69 nm) was sputter deposited onto smooth silicon substrates. The ion sputtering rates of amorphous carbon, amorphous Cr_xC_y and polycrystalline Cr were determined by means of Auger electron spectroscopy depth profiling as a function of the angle of incidence of two symmetrically inclined 1 keV Ar⁺ ion beams in the range between 22° and 82°. The sputtering rates were calculated from the known thicknesses of the layers and the sputtering times necessary to remove the individual layers. It was found that the sputtering rates of C-graphite, Cr_xC_y carbide and Cr were strongly angle dependent. The experimental sputtering yields were in agreement with the theoretical results obtained by calculation of the transport of ions in solids, but the sputtering yields of C-graphite measured at ion incidence angles larger than 29° were smaller than the simulated ones.     

Optical and electrical properties of heat-resistant Sb-doped Sn1 − xHfxO2 transparent conducting films

To examine variations in the transparent conducting properties after annealing at high temperatures, 300-nm thick Sb-doped Sn_1 − xHf_xO₂ (x = 0.00-0.10) films were deposited onto silica glass substrates by the RF sputtering method and annealed in air up to 1000 °C at 200 °C increments. After annealing, all the Sb-doped SnO₂ films were transparent and electrically conductive, but large cracks, which decreased the electrical conductivity, were generated in several films due to crystallization or the thermal expansion difference between the film and substrate. Only the film deposited at room temperature in an Ar and O₂ mixed atmosphere did not crack after annealing, and its electrical conductivity exceeded 100 S cm^− 1 even after annealing at 1000 °C in air. Hf-doping blue shifted the fundamental absorption edges in the UV region in the Sb-doped Sn_1 − xHf_xO₂ films. Additionally, the optical transmission at 310 nm, T₃₁₀, increased as the Hf concentration increased, whereas the electrical conductivity was inversely proportional to the Hf concentration. On the other hand, thinner films (150-nm thick) with x = 0.00 showed both a high electrical conductivity over 100 S cm^− 1 and a high transparency T₃₁₀ = 65% after high temperature annealing.     

Investigation of brittle failure in transparent conductive oxide and permeation barrier oxide multilayers on flexible polymers

An oxide multilayer structure—consisting of an indium zinc oxide (IZO) conductive layer, a silicon oxide (SiO_x, x = 1.8) water vapor permeation barrier, and an aluminum oxide (Al₂O₃) interlayer—coated on polyethylene terephthalate (PET) is proposed as a transparent flexible substrate for display and photovoltaic applications. Vital properties of the multilayer, such as the low water vapor impermeability of the SiO_x barrier and the high conductance of the IZO film, degraded considerably because of the crack formation in bend geometries, attributed to the large difference between elastic properties of the oxide films and polymers. In order to suppress the crack formation, a 10-nm-thick Al₂O₃ interlayer was sputtered on Ar ion-beam treated PET surfaces prior to a SiO_x plasma-enhanced chemical vapor deposition (PECVD) process. Changes in the conductance and water vapor impermeability were investigated at different bending radii and bending cycles. It was found that the increases in resistance and water vapor transmission rate (WVTR) were significantly suppressed by the ion-beam PET pretreatment and by the sputtered Al₂O₃ interlayer. The resistance and WVTR of IZO/SiO_x/Al₂O₃/PET systems could be kept low and invariable even in severely bent states by choosing the SiO_x thickness properly. The IZO (135 nm)/SiO_x (90 nm)/Al₂O₃ (10 nm)/PET system maintained a resistance of 3.2 × 10^− 4 Ω cm and a WVTR of < 5 × 10^− 3 g m² d^− 1 after 1000 bending cycles at a bending radius of 35 mm.     

Investigation of low resistance transparent MoO3/Ag/MoO3 multilayer and application as anode in organic solar cells

Depending on the resistivity and transmittance, transparent conductive oxides (TCO) are widely used in thin film optoelectronic devices. Thus doped In₂O₃ (ITO), ZnO, SnO₂ are commercially developed. However, the deposition process of these films need sputtering and/or heating cycle, which has negative effect on the performances of the organic devices due to the sputtering and heat damages. Therefore a thermally evaporable, low resistance, transparent electrode, deposited onto substrates room temperature, has to be developed to overcome these difficulties. For these reasons combination of dielectric materials and metal multilayer has been proposed to achieve high transparent conductive oxides. In this work the different structures probed were: MoO₃ (45 nm)/Ag (x nm)/MoO₃ (37.5 nm), with x = 5-15 nm. The measure of the electrical conductivity of the structures shows that there is a threshold value of the silver thickness: below 10 nm the films are semiconductor, from 10 nm and above the films are conductor. However, the transmittance of the structures decreases with the silver thickness, therefore the optimum Ag thickness is 10 nm. A structure MoO₃ (45 nm)/Ag (10 nm)/MoO₃ (37.5 nm) resulted with a resistivity of 8 × 10^− 5 Ω cm and a transmittance, at around 600 nm, of 80%. Such multilayer structure can be used as anode in organic solar cells according to the device anode/CuPc/C₆₀/Alq₃/Al. We have already shown that when the anode of the cells is an ITO film the introduction of a thin (3 nm) MoO₃ layer at the interface anode (ITO)/organic electron donor (CuPc) allows reducing the energy barrier due to the difference between the work function of ITO and the highest occupied molecular orbital of CuPc [1]. This property has been used in the present work to achieve a high hole transfer efficiency between the CuPc and the anode. For comparison MoO₃/Ag/MoO₃/CuPc/C₆₀/Alq₃/Al and ITO/MoO₃/CuPc/C₆₀/Alq3/Al solar cells have been deposited in the same run. These devices exhibit efficiency of the same order of magnitude.     

Application of plasma polymerized siloxane films for the corrosion protection of titanium alloy

Organosilicon film and SiO_x-like film are deposited on titanium alloy (Ti6Al4V) surfaces by atmospheric pressure (~ 10⁵ Pa) dielectric barrier discharge to improve its corrosion resistance in Hanks solution. Hexamethyldisiloxane (HMDSO) is used to be the chemical precursor. The organosilicon film deposited in Ar/HMDSO system has high growth rate (75 nm/min) and low surface roughness (3 nm), while the SiO_x-like film deposited in Ar/O₂/HMDSO system has lower growth rate (35 nm/min) and slightly higher surface roughness (9 nm). The potentiodynamic polarization tests show that both the two siloxane films coated Ti6Al4V samples have more positive corrosion potential and one order of magnitude lower corrosion current density than the substrate, indicating the corrosion resistance of Ti6Al4V can be improved by depositing siloxane film on its surface. In particular, as the surface is more compact and cross-linked, the SiO_x-like film has better corrosion resistance than the organosilicon film.     

Deposition and characterization of ultra-high barrier coatings for flexible electronic applications

A barrier structure consisting of SiO_x and SiN_x films was deposited on the polymer substrate at 80 °C via plasma-enhanced chemical vapor deposition (PECVD). However, the low radius of curvature (R_c) of the barrier-coated substrate may cause the inconvenience of the following fabrication processes. By depositing a 150 nm-SiN_x film, the R_c of the barrier-coated polycarbonate (PC) substrate can increase from 80 to 115 mm without inducing any cracks in the barrier structure. Furthermore, the thermal stress of the barrier structure can be adjusted via extending the PECVD process duration in the chamber and replacing PC by the polyethersulone (PES) substrate. The R_c can increase to ∼356 mm by depositing the 150 nm-SiN_x film on the other side of the PES substrate. Finally, the calcium test result of the barrier films/PES/SiN_x sample was calculated to be around 3.05 × 10⁻⁶ g/m²/day, representing that the barrier structure did not fail after modification.     

Microstructural evolution in nanostructured gold films

Thin Au films in the thickness range t = 1.5-126 nm were coated by DC sputtering on SiO_x/Si substrates at room temperature inside a vacuum chamber with a base pressure of about 1 × 10^− 2 mbar (1 Pa). The film structure, nanograin characteristics, and the surface roughness as a function of thickness were analyzed using X-ray diffraction, scanning tunneling microscopy and transmission electron microscopy. The results reflect the microstructural evolution with film thickness. They help us to understand the mode of grain growth, which is monomodal-normal columnar as well as spherical. By determination of the dynamic scaling exponent derived from power law dependence of the mean grain size and film thickness, the prevailed mechanism of grain growth is deduced to be the diffusion of mobile Au atoms in grain boundaries. The surface roughness increases with the film thickness following a power law: R_rms ~ t^b. The linear fitted value for b is 0.60.     

Preparation of homogeneous VOX thin films by ion beam sputtering and annealing process

Polycrystalline VO_x thin films that were prepared for thermal-sensitive material of far infrared sensor had been deposited on Si substrates by ion beam sputtering deposition. Scanning electron microscopy images indicated that VO_x thin films (oxygen pressure of 1.5×10⁻³ Pa) were grown into compact and ultra-fine grains (?50 nm), the film surfaces seemed smooth and uniform. Four-point probe measurements showed that the homogeneity of the films was better than 98% in a size of 30×30 mm². The four-point probe measurement on hot plate presented the sheet resistance and the temperature coefficient of resistance of the VO_x thin film that were 50 kΩ/square and −0.021 K⁻¹ at 28°C, respectively. In addition, some samples annealed in Ar atmosphere had their resistance decreased. Thus, vanadium oxide films containing more amount VO₂ were obtained.     

A novel magnetron sputtering for flexible coatings as a function for production of high quality films

A novel sputtering technique combining the symmetric compressive magnets with cylindrical cathode has been developed to mass produce high-quality oxide and nitride films on plastic sheets. The discharge characteristics of our sputtering can supply about three times larger power efficiencies than that of the conventional magnetron sputtering. Moreover, in continuous dielectric sputtering experiments, the substrate temperature was kept lower than 60 °C. The refractive index of SiN_X and SiO₂ thin film at 500 nm is 1.86 and 1.46 respectively. Moreover, 4 layered anti-reflection coatings of silicon nitride and oxide films deposited on both sides of the PET sheet is achieved to fabricate, and the reflection less than 1% is realized in the range from 420 to 680 nm.     

Detection of various self-assembled monolayers by AlN-based film bulk acoustic resonator

Various self-assembled monolayers such as carcinoembryonic antigen (CEA), beta actin, and bovine serum albumin (BSA) were detected using an AlN-based film bulk acoustic resonator (FBAR). AlN thin film was deposited by reactive RF magnetron sputtering, on a substrate of Mo (100 nm)/Ti (34 nm)/SiO₂ (480 nm)/Si (300 μm)/Si₃N₄ (300 nm). The film showed a strongly c-axis preferred orientation with a main (0 0 2) peak, as well as a good full width at half maximum (FWHM) of 2.50° in XRD and rocking curve results. The AlN-based FBAR was confirmed to have a resonant frequency of 2.477 GHz and a sensitivity of 3514 Hz cm²/ng. In beta actin, BSA, and CEA, the frequency properties showed variation values of 472.142, 932.573, and 685.421 kHz and mass sensitivities of 3530, 3506, and 3514 Hz-cm²/ng, respectively. The FBAR sensor was confirmed to be very useful for detecting target antigens through the binding of an antigen and an anti-body.     

Novel properties of AZO film sputtered in Ar+H2 ambient at high temperature

AZO (ZnO:Al) transparent conductive thin film was prepared by RF magnetron sputtering with a AZO (98 wt% ZnO 2 wt% Al₂O₃) ceramic target in the same Ar+H₂ ambient at different substrate temperatures ranging from 100 to 300 °C. The minimum resistivity of AZO films was 7.9×10⁻⁴ Ω cm at the substrate temperature of 200 °C. The average transmission in the visible rang was more than 90%. Scanning electron microscopy and XRD analyses showed that the surface morphology of the AZO samples altered with the increasing of the substrate temperature. AZO film prepared at 200 °C in the pure Ar ambient was also made as comparison about the resistivity, carrier concentration and the average crystallite size. The resistivity became about 3 times higher. The carrier concentration became lower and the average crystallite size was smaller.     

The effect of nitrogen on the properties of zinc nitride thin films and their conversion into p-ZnO:N films

Zinc nitride thin films were deposited by magnetron sputtering using ZnN target in plasma containing either N₂ or Ar gases. The rf-power was 100 W and the pressure was 5 mTorr. The properties of the films were examined with thermal treatments up to 550 °C in N₂ and O₂ environments. Films deposited in Ar plasma were opaque and conductive (ρ ∼ 10^− 1 to 10^− 2 Ω cm, N_D ∼ 10¹⁸ to 10²⁰ cm^− 3) due to excess of Zn in the structure. After annealing at 400 °C, the films became more stoichiometric, Zn₃N₂, and transparent, but further annealing up to 550 °C deteriorated the electrical properties. Films deposited in N₂ plasma were transparent but very resistive even after annealing. Both types of films were converted into p-type ZnO upon oxidation at 400 °C. All thermally treated zinc nitride films exhibited a shoulder in transmittance at around 345 nm which was more profound for the Ar-deposited films and particularly for the oxidized films. Zinc nitride has been found to be a wide band gap material which makes it a potential candidate for transparent optoelectronic devices.     

Temperature effect on structure and surface morphology of indium tin oxide films deposited by reactive ion-beam sputtering

Indium tin oxide (ITO) films were deposited by reactive ion-beam sputtering. The relationship among the surface morphology, the resistivity ρ of the films, the substrate temperature T_S and the film thickness t_F was investigated. The heat power from the ion source during the sputtering was 265 W. T_S increased from 30 to 145 °C with an increase of t_F. The films thinner than 187 nm at T_S lower than 120 °C were amorphous, the film surface was as smooth as the substrate. The films deposited at T_S in the range between 135 and 145 °C were polycrystalline. So, the films thicker than 375 nm were in a multilayer structure of a polycrystalline layer on an amorphous layer. The surface of the polycrystalline films became rough. ρ of the films suddenly decreased at t_F of 375 nm, where the structure of the films changed. Next, the amorphous films with t_F of 39 nm were annealed in the atmosphere. The film structure changed to a polycrystalline structure at annealing temperature T_A of 350 °C. However, the surface roughness of all the films was almost same. As a result, the substrate temperature during the sputtering was important for the deposition of the films with a very smooth surface.     

High frequency properties of Ni75Fe25-SiO2 granular thin films with very high resistivity

Excellent soft magnetic properties have been achieved in low metal volume fraction(x ∼ 0.52) of (Ni₇₅Fe₂₅)_x(SiO₂)_1−x granular film fabricated by magnetron sputtering. The coercivity of 247 A m^− 1 with very high resistivity ρ over 1.18 × 10⁴ μΩ cm has been obtained. At the frequency lower than 1 GHz, the real part μ′ of the complex permeability keeps about 55 and the imaginary part μ? is less than 2. A combined study of TEM and XRD indicates that the sample consists of Ni₇₅Fe₂₅ particles uniformly embedded in insulating SiO₂ matrix. The excellent soft magnetic properties are ascribed to the magnetic dipole interaction between particles. The investigations of field cooled and zero field cooled curves as well as Henkle Plot prove the existence of this intergranular interaction.     

Organic photovoltaic cells fabricated on a SnOx/Ag/SnOx multilayer transparent conducting electrode

Transparent conducting multilayer structured electrode of a few nm Ag layer embedded in tin oxide thin film SnO_x/Ag/SnO_x was fabricated on a glass by RF magnetron sputtering at room temperature. The multilayer of the SnO_x(40 nm)/Ag(11 nm)/SnO_x(40 nm) electrode shows the maximum optical transmittance of 87.3% at 550 nm and a quite low electrical resistivity of 6.5 × 10^− 5 Ω cm, and the corresponding figure of merit (T¹⁰/R_S) is equivalent to 3.6 × 10^− 2 Ω^− 1. A normal organic photovoltaic (OPV) structure of poly(3,4-ethylenedioxythiophene):poly(styrene sulfonate)/polythiophene:phenyl-C60-butyric acid methyl ester/Al was fabricated on glass/SnO_x/Ag/SnO_x to examine the compatibility of OPV as a transparent conducting electrode. Measured characteristic values of open circuit voltage of 0.62 V, saturation current of 8.11 mA/cm² and fill factor of 0.54 are analogous to 0.63 V, 8.37 mA/cm² and 0.58 of OPV on commercial glass/indium tin oxide (ITO) respectively. A resultant power conversion efficiency of 2.7% is also very comparable with the 3.09% of the same OPV structure on the commercial ITO glass as a reference, and which reveals that SnO_x/Ag/SnO_x can be appropriate to OPV solar cells as a sound transparent conducting electrode.     

Thermal stability of carrier centers in various types of transparent conductive ZnO and Ga-doped ZnO films

We investigated the thermal stability of the transparent conductive properties of undoped ZnO and Ga-doped ZnO (GZO) films when they were annealed in a high vacuum with stepwise increasing temperature. The ZnO samples included V_O-rich and Zn-rich ZnO films; the primary donors were respectively oxygen vacancies (V_O) or Zn atoms highly unsaturated with oxygen atoms. V_O-rich ZnO was the most unstable against annealing; resistivity initially within the 10⁻³ Ω cm range diverged higher than 10 Ω cm when a critical temperature was exceeded. The critical temperature between 350 and 450 °C depended on the film thickness, which indicated that V_O's were diminished through recombination with migrating interstitial oxygen atoms. In contrast, Zn-rich ZnO films remained highly conductive up to 550 °C. They became more and more transparent and their crystallinity improved at higher annealing temperatures, which was the consequence of metallic-like Zn atoms being removed through desorption from the surface or being accommodated into the crystalline lattice. Comparatively, GZO films were more robust against annealing with their resistivities remaining unchanged up to 350 °C.     

Structure and optical properties of Zr1−xSixN thin films on sapphire

A series of zirconium silicon nitride (Zr_1−xSi_xN) thin films were grown on r-plane sapphire substrates using reactive RF magnetron co-sputtering of Zr and Si targets in a N₂/Ar plasma. X-ray diffraction pole figure analysis, X-ray reflectivity, X-ray photoelectron spectroscopy (XPS), optical microscopy, and optical absorption spectroscopy were used to characterize the film stoichiometries and structures after growth at 200 °C and post-deposition annealing up to 1000 °C in ultra-high vacuum. The atomically clean r-plane sapphire substrates induce high quality (100) heteroepitaxy of ZrN films rather than the (111) orientation observed on steel and silicon substrates, but the addition of Si yields amorphous films at the 200 °C growth temperature. After the annealing treatment, films with Si content x < 0.15 have compressive stress and crystallize into a polycrystalline structure with (100) fiber texture. For x > 0.15, the films are amorphous and remain so even after ultra-high vacuum annealing at 1000 °C. XPS spectra indicate that the bonding changes from covalent to more ionic in character as Si―N bonds form instead of Zr―N bonds. X-ray reflectivity, atomic force microscopy (AFM) and optical microscopy data reveal that after post-deposition annealing the 100 nm thick films have an average roughness < 2 nm, except for Si content near x = 0.15 corresponding to where the film becomes amorphous rather than being polycrystalline. At this stoichiometry, evidence was found for regions of film delamination and hillock formation, which is presumably driven by strain at the interface between the film and sapphire substrate. UV-visible absorption spectra also were found to depend on the film stoichiometry. For the amorphous Si-rich films (x > 0.15), the optical band gap increases with Si content, whereas for Zr-rich films (x < 0.15), there is no band gap and the films are highly conductive.     

Thermally stable transparent conducting and highly infrared reflective Ga-doped ZnO thin films by metal organic chemical vapor deposition

Highly transparent conductive Ga-doped ZnO (GZO) thin films have been prepared on glass substrates by metal organic chemical vapor deposition. The effect of Ga doping on the structural, electrical and optical properties of GZO films has been systematically investigated. Under the optimum Ga doping concentration (∼4.9 at.%), c-axis textured GZO film with the lowest resistivity of 3.6 × 10⁻⁴ Ω cm and high visible transmittance of 90% has been achieved. The film also exhibits low transmittance (<1% at 2500 nm) and high reflectance (>70% at 2500 nm) to the infrared radiation. Furthermore, our developed GZO thin film can well retain the highly transparent conductive performance in oxidation ambient at elevated temperature (up to 500 °C).     

Composite SiOx/fluorocarbon plasma polymer films prepared by r.f. magnetron sputtering of SiO2 and PTFE

Composite films SiO_x/fluorocarbon plasma polymers were prepared by r.f. sputtering from two balanced magnetrons equipped with polytetrafluoroethylene (PTFE) and silica (SiO₂) targets. Argon was used as the working gas. The obtained films were characterised by means of XPS, RBS, FTIR, AFM, TEM, microhardness and static contact angle measurements. The obtained SiO_x/fluorocarbon plasma polymer films reveal different wettability (static contact angle of water ranges from 68° to 40°) and hardness (ranges from 720 to 3200 N/mm²) when the volume fraction ratio (filling factor) of SiO₂ changes from 0.01 to 0.7. The concentration of elements determined by RBS/ERDA varies strongly over this range of filling factors. The heterogeneous structure of the composite films is indicated by TEM at high SiO_x contents.