A high-efficiency CMOS image sensor with air gap in situ MicroLens (AGML) fabricated by 0.18-/spl mu/m CMOS technology

The air gap in situ microlens (AGML) above-pixel sensor with 0.18-/spl mu/m CMOS image sensor technology has been successfully developed to dramatically improve the optical crosstalk and pixel sensitivity. We demonstrated excellent crosstalk diminution with the structure on small pixels. Compared with conventional 2.8 /spl mu/m square pixel, adopting the AGML can reduce the optical crosstalk up to 64%, and provide 21% in enhancement of photosensitivity at 0/spl deg/ incident angle. Furthermore, under 20/spl deg/ incident angle the optical crosstalk reduction and sensitivity enhancement are increased to 89% and 122%, respectively. Therefore, the AGML structure makes pixel size be further scaled down to less than 2.8 /spl mu/m square and maintain good performance.     

Light guide for pixel crosstalk improvement in deep submicron CMOS image sensor

Light guide, a novel dielectric structure consisting of PE-Oxide and FSG-Oxide, has been developed to reduce crosstalk in 0.18-/spl mu/m CMOS image sensor technology. Due to the difference in refraction index (1.46 for PE-Oxide and 1.435 for FSG-Oxide), major part of the incident light can be totally reflected at the interface of PE-Oxide/FSG-Oxide, as the incidence angle is larger than total reflection angle. With this light guide, the pixel sensing capability can be enhanced and to reduce pixel crosstalk. Small pixels with pitch 3.0-/spl mu/m and 4.0-/spl mu/m have been characterized and examined. In 3.0-/spl mu/m pixel, optical crosstalk achieves 30% reduction for incidence angle of light at 10/spl deg/.     

Crosstalk and microlens study in a color CMOS image sensor

The paper describes results of crosstalk investigations and microlens (/spl mu/-lens) scan experiments in a color CMOS image sensor with active pixel structure . The investigation of optical and electrical crosstalk was made on 7.8- and 5.6-/spl mu/m pixels by using samples with continuous shift of color filter (CF ) and /spl mu/-lens across the array. As a result of this investigation, the distribution of sensitivity inside a pixel has been determined. By using minimum crosstalk criteria, the optimum parameters of the /spl mu/-lens manufacturing process and optimum position of the /spl mu/-lens was determined. The paper presents color maps of pixel sensitivity and crosstalk criteria as well as snapshots illustrating sensitivity distribution and collection area. The paper presents spectral characteristics measured at different relative apertures (f-number) as well. The quantitative analysis of spectral responses allowed us to determine the contribution of each component to the overall crosstalk.     

Color mixing improvement of CMOS image sensor with air-gap-guard ring in deep-submicrometer CMOS technology

In this letter, color mixings of a CMOS image sensor with air-gap-guard-ring (AGGR) and conventional structures were investigated in 0.18-/spl mu/m CMOS image sensor technology. As the light incident angle is increased from 0/spl deg/ to 15/spl deg/, conventional pixel shows serious color mixing. For example, the maximum photo responses of blue, green1, green2, and red pixels are shifted from 490 to 520 nm, 530 to 500 nm, 530 to 600 nm, and 600 to 580 nm, respectively. However, pixels with AGGR not only keep correct spectral response without peak shift but also achieve 5%-50% crosstalk reduction, thus preventing the sensor from color mixing efficiently.     

A surface micromachined optical scanner array using photoresist lenses fabricated by a thermal reflow process

This paper presents the design, fabrication, and operation of a newly developed micromechanical optical scanner array using a translating microlens. We have used photoresist reflow technique to form a microlens on a surface micromachined XY-stage of the scratch-drive actuation mechanism. The lens scanner is placed at the focal length from an incident optical fiber to collimate the transmitting light. The collimated beam is steered two-dimensionally by the XY-motion of the microlens with respect to the incident fiber. We also have developed a theoretical model to predict appropriate initial resist thickness and diameter for the scanning lens. An optical scanning angle of /spl plusmn/7/spl deg/ has been demonstrated by sliding a microlens of 670-/spl mu/m focal length at a physical stroke of /spl plusmn/67 /spl mu/m. Typical angular positioning resolution has been estimated to be 0.018/spl deg/.     

Characterization and deblurring of lateral crosstalk in CMOS image sensors

Lateral crosstalk in CMOS imaging arrays deter effective utilization of small pixel sizes (e.g., < 5.0 /spl mu/m /spl times/ 5.0 /spl mu/m) now permitted by technology scaling. A simple measurement setup for empirical characterization of lateral crosstalk in CMOS image sensors is presented. A demonstration of deblurring operations based on the obtained blur model of lateral crosstalk is also provided. Several well-known linear deconvolution filters are employed in the demonstration. The tradeoffs in sharpness restoration, high-frequency noise amplification, and the intensity clipping effect in the design of linear deblurring operation for the application of lateral crosstalk are illustrated.     

Polymeric 2/spl times/2 electrooptic switch consisting of asymmetric Y junctions and Mach-Zehnder interferometer

2/spl times/2 electrooptic switches consisting of a pair of asymmetric Y junctions and Mach-Zehnder interferometer have been demonstrated in polymeric waveguides. The switching voltage is 15 V with 1.5 cm long electrode for TM polarized light at 1.3 /spl mu/m. When the branching angle of the asymmetric Y junction is 0.2/spl deg/, crosstalk of -27 to -22 dB are obtained for both input arms. The measured insertion loss by the lens coupling is about 9-10 dB.     

640 /spl times/ 512 pixel long-wavelength infrared narrowband, multiband, and broadband QWIP focal plane arrays

A 640 /spl times/ 512 pixel, long-wavelength cutoff, narrowband (/spl Delta//spl lambda///spl lambda//spl sim/10%) quantum-well infrared photodetector (QWIP) focal plane array (FPA), a four-band QWIP FPA in the 4-15 /spl mu/m spectral region, and a broadband (/spl Delta//spl lambda///spl lambda/ /spl sim/ 42%) QWIP FPA having a 15.4 /spl mu/m cutoff have been demonstrated. In this paper, we discuss the electrical and optical characterization of these FPAs, and their performance. In addition, we discuss the development of a very sensitive (NEDT /spl sim/ 10.6 mK) 640 /spl times/ 512 pixel thermal imaging camera having a 9 /spl mu/m cutoff.     

Investigation of a periodically segmented waveguide Fabry-Pe/spl acute/rot interferometer for use as a chemical/biosensor

We present a periodically segmented waveguide Fabry-Pe/spl acute/rot interferometer (PSW-FPI) intended to be used for tagless real-time chemical/ biological sensing through bulk-material interaction. The differential sensor detects changes in the refractive index (RI) of a sample regardless of its absolute RI value. Experiments with a series of sucrose solutions of various concentrations are compared with theoretical results, and a very good match is found between the two. The theoretical sensitivity limit for a 50-dB-signal-to-noise-ratio (SNR) measurement system is estimated as /spl delta/n=3/spl middot/10/sup -7/. For a 29-dB-SNR measurement system, a measured sensitivity limit of /spl delta/n=4/spl middot/10/sup -5/ is comparable with the previously reported sensitivities of label-free real-time optical biosensors (2/spl middot/10/sup -5/-5/spl middot/10/sup -5/). However, the total required sensing length (720 /spl mu/m) of our PSW-FPI sensor is much shorter than that of the previously reported devices (9-20 mm).     

A 2.0-/spl mu/m pixel pitch MOS image sensor with 1.5 transistor/pixel and an amorphous Si color filter

In this paper, an ultrafine pixel size (2.0/spl times/2.0 /spl mu/m/sup 2/) MOS image sensor with very high sensitivity is developed. The key technologies that realize the MOS image sensor are a newly developed pixel circuit configuration (1.5 transistor/pixel), a fine 0.15-/spl mu/m design rule, and an amorphous Si color filter (Si-CF). In the new pixel circuit configuration, a unit pixel consists of one photodiode, one transfer transistor, and an amplifier circuit with two transistors that are shared by four neighboring pixels. Thus, the unit pixel has only 1.5 transistors. The fine design rule of 0.15 /spl mu/m enables reduction of wiring area by 40%. As a result, a high aperture ratio of 30% is achieved. A newly developed Si-CF realizes the 1/10 thickness of that of the conventional organic-pigment CF, giving rise to high light-collection efficiency. With these three technologies combined, a high sensitivity of 3400 electrons/lx/spl middot/s is achieved even with a pixel size of 2.0/spl times/2.0 /spl mu/m/sup 2/.     

Coupling efficiencies in reflective self-organized lightwave network (R-SOLNET) simulated by the beam propagation method

The reflective self-organized lightwave network (R-SOLNET) enables the formation of self-aligned waveguides in the photorefractive (PR) material between misaligned optical devices by introducing a write beam. The incident write beam from one device and the reflected write beam from the second device induce self-focusing in the PR material and construct a coupling waveguide. A wavelength filter on the waveguide edge is used to facilitate the reflected beam. The beam propagation method reveals that R-SOLNET exhibits higher coupling efficiencies and better tolerances than the one-beam-writing SOLNET and the free-space coupling. The apparent usefulness of R-SOLNET is remarkable for gaps wider than 100 /spl mu/m in 8-/spl mu/m-wide waveguide circuits. For 240-/spl mu/m gap, coupling efficiency better than 50% can be achieved even when the lateral misalignment is as large as 4 /spl mu/m. The results indicate that R-SOLNET may be useful for vertical waveguide constructions of optical z-connections in three-dimensional intrachip optical interconnects and switching systems, as well as for self-aligned optical couplings with devices that cannot emit write beams such as vertical-cavity surface-emitting lasers, photodetectors, and electrooptic switches.     

A 256-element CMOS imaging receiver for free-space optical communication

This paper describes a CMOS imaging receiver for free-space optical (FSO) communication. The die contains 256 optical receive channels with -47 dBm optical sensitivity and 30 dB optical dynamic range at 500 kb/s/channel while consuming 67 mW. Received signals are amplified by digitally self-calibrated open-loop amplifiers and digitized before clock and data recovery. The sampled data also provide inputs for digital automatic gain and offset control loops closed around the analog amplifier chain to compensate for signal variations due to atmospheric turbulence and daylight interference. Gain control logic can adapt to incident signals over the 30 dB dynamic range within 28 bit periods. Low-power logic design and analog circuit techniques are used to minimize digital crosstalk to single-ended photodetectors referenced to a bulk substrate. Local arbitration circuitry at each channel forms an intrachip data passing network to multiplex received data words from the 16 /spl times/ 16 array onto a common off-chip bus. The 1.6 M transistor mixed-signal die fabricated in a 0.25 /spl mu/m CMOS process measures 6.5/spl times/6.5 mm/sup 2/. Reception at 500 kb/s through a 1.5 km atmospheric channel is demonstrated with 3 mW optical transmit power during nighttime and daylight hours.     

Light emission near 1.3 /spl mu/m using ITO-Al/sub 2/O/sub 3/-Si/sub 0.3/Ge/sub 0.7/-Si tunnel diodes

We have fabricated Sn : In/sub 2/O/sub 3/ (ITO)-Al/sub 2/O/sub 3/ dielectric on Si/sub 1-x/Ge/sub x/-Si metal-oxide-semiconductor tunnel diodes which emit light at around 1.3 /spl mu/m, for x=0.7. The emitted photon energy is smaller than the bandgap energy of Si, thus, avoiding strong light absorption by the Si substrate. The optical device structure is compatible with that of a metal-oxide-semiconductor field-effect transistor, since a conventional doped poly-Si gate electrode will be transparent to the emitted light. Increasing the Ge composition from 0.3 to 0.4 only slightly decreases the light-emitting efficiency.     

Estimation of polarization crosstalk at a micro-bend in Si-photonic wire waveguide

The singlemode Si-photonic wire waveguide allows sharp bends, which significantly expands the design flexibility of optical devices and circuits. Here, the suppression of the polarization crosstalk at a sharp bend will be an important issue, since a large crosstalk affects the performance of devices and circuits. In this study, the three-dimensional (3-D) finite-difference time-domain (FDTD) simulation showed that the crosstalk at a 90/spl deg/-bend with a radius of 0.35-1.75 /spl mu/m is less than -25 dB at a wavelength of 1.55 /spl mu/m. In the experiment, the crosstalk from TE-like to TM-like polarization was evaluated to be -13 dB to -10 dB. This large value was explained by a small tilt of waveguide sidewalls, which seriously increased the crosstalk. In addition, it was found in the calculation that some combinations of bends increase or decrease the crosstalk, and that a U-shape bend is the most effective for the suppression of the crosstalk.     

High efficiency 90/spl deg/ silica waveguide bend using an air hole photonic crystal region

We propose the hybrid integration of an air hole photonic crystal (PhC) structure with a high /spl Delta/ (0.75%) single-mode silica waveguide to achieve an ultracompact high efficiency 90/spl deg/ bend for transverse-magnetic polarized light. Diffraction from the periodic boundary between the PhC and silica waveguide regions is shown to seriously degrade the optical efficiency of the bend. A microgenetic algorithm (/spl mu/GA) combined with a two-dimensional finite-difference time-domain method is used to modify the PhC and its boundary layer to suppress this diffraction which in turn maximizes bend efficiency. The final optimized structure has a 99.4% bend efficiency at a wavelength of 1.55 /spl mu/m and occupies an area of only 27 /spl times/ 27 /spl mu/m.     

A biomorphic digital image sensor

An arbitrated address-event imager has been designed and fabricated in a 0.6-/spl mu/m CMOS process. The imager is composed of 80 /spl times/ 60 pixels of 32 /spl times/ 30 /spl mu/m. The value of the light intensity collected by each photosensitive element is inversely proportional to the pixel's interspike time interval. The readout of each spike is initiated by the individual pixel; therefore, the available output bandwidth is allocated according to pixel output demand. This encoding of light intensities favors brighter pixels, equalizes the number of integrated photons across light intensity, and minimizes power consumption. Tests conducted on the imager showed a large output dynamic range of 180 dB (under bright local illumination) for an individual pixel. The array, on the other hand, produced a dynamic range of 120 dB (under uniform bright illumination and when no lower bound was placed on the update rate per pixel). The dynamic range is 48.9 dB value at 30-pixel updates/s. Power consumption is 3.4 mW in uniform indoor light and a mean event rate of 200 kHz, which updates each pixel 41.6 times per second. The imager is capable of updating each pixel 8.3K times per second (under bright local illumination).     

First fully integrated 2-D array of single-photon detectors in standard CMOS technology

A two-dimensional (2-D) array (4 by 8) of single-photon avalanche diodes integrated in an industrial complementary metal-oxide-semiconductor (CMOS) process is presented. Each pixel combines a photodiode biased above its breakdown voltage in the so-called Geiger mode, a quenching resistor, and a simple comparator. The pitch between the pixels is 75 /spl mu/m and the diameter of each pixel is 6.4 /spl mu/m. The full integration allows reducing the number of charge carriers in a Geiger pulse. The electroluminescence responsible for optical crosstalks between pixels is then reduced leading to a negligible optical crosstalk probability. Thanks to the cleanness of the fabrication process, no afterpulsing effects are noticed. At room temperature, most of the pixels exhibit a dark-count rate of about 50 Hz. The detection probability is almost identical for all 32 pixels of the array with relative variation in the range of a few percents. This letter demonstrates the feasibility of an array of single-photon detectors sensitive in the visible part of the spectrum. Besides low production costs and compactness, an undeniable benefit lies in the potential to easily modify the design to fit a specific application. Furthermore, the CMOS integration opens the way to on-chip data processing.     

A sensitivity and linearity improvement of a 100-dB dynamic range CMOS image sensor using a lateral overflow integration capacitor

In a CMOS image sensor featuring a lateral overflow integration capacitor in a pixel, which integrates the overflowed charges from a fully depleted photodiode during the same exposure, the sensitivity in nonsaturated signal and the linearity in saturated overflow signal have been improved by introducing a new pixel circuit and its operation. The floating diffusion capacitance of the CMOS image sensor is as small as that of a four transistors type CMOS image sensor because the lateral overflow integration capacitor is located next to the reset switch. A 1/3-inch VGA format (640/sup H//spl times/480/sup V/ pixels), 7.5/spl times/7.5 /spl mu/m/sup 2/ pixel color CMOS image sensor fabricated through 0.35-/spl mu/m two-poly three-metal CMOS process results in a 100 dB dynamic range characteristic, with improved sensitivity and linearity.     

A novel filterless fluorescence detection sensor for DNA analysis

A new method is presented of on-chip optical spectroscopy, functioning without the need for a bandpass filter or grating. The principle of optical spectroscopy is based on the difference of optical absorption coefficients with wavelength. The optical intensity is calculated from the different penetration depths in Si. The key to the new spectrometer is the use of a photogate active pixel providing the selective control of photo-generated charge using the gate voltage. To demonstrate this spectrometer, a novel filterless fluorescence detection sensor has been fabricated in our laboratory, using standard 5-/spl mu/m CMOS silicon integrated circuit technology. The SYBR-Green label fluoresces at 520 nm when exited by 470-nm radiation. In a simulation experiment using two LEDs, the fluorescent intensity detected was 1/300 of the excitation light intensity (intensity of fluorescence was 1 /spl mu/W/cm/sup 2/, while the excitation illumination was 300 /spl mu/W/cm/sup 2/). In an experiment using actual DNA solution containing SYBR-Green, it was confirmed that the fluorescence detection sensor successfully detected the fluorescent label without the need for a filter.     

A new CMOS pixel structure for low-dark-current and large-array-size still imager applications

A pixel structure for still CMOS imager application called the pseudoactive pixel sensor (PAPS) is proposed and analyzed in this paper. It has the advantages of a low dark current, high signal-to-noise ratio, and a high fill factor over the conventional passive pixel sensor imager or active pixel sensor imager. The readout circuit called the zero-bias column buffer-direct-injection structure is also proposed to suppress both the dark current of the photodiode and the leakage current of row switches by keeping both biases of photodiode and the parasitic p-n junction in the column bus at or near zero voltage. The improved double delta sampling circuits are also used to suppress fixed pattern noise, clock feedthrough noise, and channel charge injection. An experimental chip of the proposed PAPS CMOS imager with the format of 352/spl times/288 (CIF) has been fabricated by using a 0.25-/spl mu/m single-poly-five-level-metal (1P5M) n-well CMOS process. The pixel size is 5.8 /spl mu/m/spl times/5.8 /spl mu/m. The pixel readout speed is from 100 kHz to 10 MHz, corresponding to the maximum frame rate above 30 frames/s. The proposed still CMOS imager has a fill factor of 58%, chip size of 3660 /spl mu/m/spl times/3500 /spl mu/m, and power dissipation of 24 mW under the power supply of 3.3 V. The experimental chip has successfully demonstrated the function of the proposed new PAPS structure. It can be applied in the design of large-array-size still CMOS imager systems with a low dark current and high resolution.