纳米电子器件-高峰值峰谷电流比InP基共振隧穿二极管的实现

利用分子束外延技术研制出InP基IhAs/In0.53Ga0.47As/AlAs共振隧穿二极管,其中势垒为10个单分子AlAs,势阱由8个单分子层In0.53Ga0.47As阱和4个单分子层InAs子阱组成.室温下峰值电流密度接近3kA/cm2,峰和谷的电流密度比率达到19.     

InP衬底AlAs/In0.53Ga0.47As RTD的研制

报道了InP衬底AlAs/In0.53Ga0.47As/AlAs两垒一阱结构共振隧穿二极管(RTD)器件的研制.结构材料由分子束外延制备,衬底片为(001)半绝缘InP单晶片,器件制作选用台面结构.测得室温下的峰值电流密度为1.06×105 A/cm2,峰-谷电流比为7.4,是国内报道的首例InP材料体系RTD器件.     

InP衬底AlAs/In0.53Ga0.47As RTD的研制

报道了InP衬底AlAs/In0.53Ga0.47As/AlAs两垒一阱结构共振隧穿二极管(RTD)器件的研制.结构材料由分子束外延制备,衬底片为(001)半绝缘InP单晶片,器件制作选用台面结构.测得室温下的峰值电流密度为1.06×105 A/cm2,峰-谷电流比为7.4,是国内报道的首例InP材料体系RTD器件.     

InP材料体系RTD的研制

报道了InP衬底AlAs /In0.53Ga0.47As/AlAs结构共振隧穿二极管(RTD)的研制过程.衬底片选用(001)半绝缘InP单晶片,结构材料使用分子束外延(MBE)技术制备,并用PL谱对外延片进行测试,器件采用台面结构.测得RTD器件室温下的峰谷电流比(PVCR)为7.4,峰值电流密度(Jp)为1.06×105A/cm-2,是国内首例成功的InP材料体系RTD.     

InP基PIN型探测器中接触层掺杂对In_(0.53)Ga_(0.47)As材料光致发光特性的影响

利用MOCVD在InP衬底上制备InP/In0.53Ga0.47As/InP双异质结PIN型材料,通过对本征层In0.53Ga0.47As材料的光致荧光谱研究,发现PIN结构中两侧InP材料的掺杂特性对中间In0.53Ga0.47As材料的光致发光特性有明显的影响。本文通过对两侧InP材料的变掺杂处理,实现了In0.53Ga0.47As材料光致发光特性的有效提高。     

高峰谷电流比的高掺杂发射区In0.53Ga0.47As/AlAs共振隧穿二极管

利用空气桥工艺设计和制作了高掺杂发射区In0.53Ga0.47As/AlAs共振隧穿二极管（RTD）。在室温下,器件的峰谷电流比大于40,峰值电流密度为24kA/cm2。建立了RTD器件等效电路模型,并从直流和微波测试结果中提取出器件参数。高峰谷电流比的RTD器件具有非常小的电容,有利于在微波/太赫兹领域中的应用。     

室温下高峰谷电流比、高峰电流密度的双势垒共振隧穿二极管

在半绝缘GaAs衬底上制作了AlAs/GaAs/In0.1Ga0.9As/GaAs/AlAs双势垒共振隧穿二极管.在GaAs层中加入In0.1Ga0.9As层用以降低势垒两边的势阱深度,从而提高了器件的峰谷电流比和峰电流密度.为了减小器件的接触电阻和电流的非均匀性,使用了独特形状的集电极,总的电流密度也因此提高.薄栅也有助于提高器件的PVCR和峰电流密度.在室温下测得其峰谷电流比高达13.98,峰电流密度大于89kA/cm2.     

室温下高峰谷电流比、高峰电流密度的双势垒共振隧穿二极管

在半绝缘GaAs衬底上制作了AlAs/GaAs/In0.1Ga0.9As/GaAs/AlAs双势垒共振隧穿二极管.在GaAs层中加入In0.1Ga0.9As层用以降低势垒两边的势阱深度,从而提高了器件的峰谷电流比和峰电流密度.为了减小器件的接触电阻和电流的非均匀性,使用了独特形状的集电极,总的电流密度也因此提高.薄栅也有助于提高器件的PVCR和峰电流密度.在室温下测得其峰谷电流比高达13.98,峰电流密度大于89kA/cm2.     

离子损伤对等离子体辅助分子束外延生长的 Ga NAs/ Ga As和Ga In NAs/ Ga As量子阱的影响

研究了离子损伤对等离子体辅助分子束外延生长的 Ga NAs/ Ga As和 Ga In NAs/ Ga As量子阱的影响 .研究表明离子损伤是影响 Ga NAs和 Ga In NAs量子阱质量的关键因素 .去离子磁场能有效地去除了等离子体活化产生的氮离子 .对于使用去离子磁场生长的 Ga NAs和 Ga In NAs量子阱样品 ,X射线衍射测量和 PL 谱测量都表明样品的质量被显著地提高 .Ga In As量子阱的 PL 强度已经提高到可以和同样条件下生长的 Ga In As量子阱相比较 .研究也表明使用的磁场强度越强 ,样品的光学质量提高越明显     

重掺InP生长的InGaAs外延层迁移率的测量

通过衬底剥离技术对以重掺N型磷化铟(N+-InP)衬底生长的In0.53Ga0.47As外延层的迁移率测量方法进行了研究。首先,采用环氧树脂胶将In0.53Ga0.47As外延层粘贴在半绝缘蓝宝石衬底上,以盐酸溶液腐蚀掉InP衬底;之后,采用扫描电子显微镜能谱及金相显微镜对InP衬底的剥离情况及In0.53Ga0.47As薄膜的损伤情况进行了检测;最后采用范德堡法对粘贴在半绝缘蓝宝石衬底上的In0.53Ga0.47As薄膜的迁移率进行了测量。通过对比试验得出,剥离InP衬底的In0.53Ga0.47As薄膜的迁移率测量结果与理论值符合较好,与真值偏差在20%以内。     

Fabrication of an AlAs/In0.53Ga0.47As/InAs Resonant Tunneling Diode on InP Substrate for High-Speed Circuit Applications

在InP衬底上采用感应耦合等离子体刻蚀技术制备了高性能的AlAs/In0.53Ga0.47As/InAs共振隧穿二极管.正向偏压下PVCR=7.57,Jp=39.08kA/cm2;反向偏压下PVCR=7.93,Jp=34.56kA/cm2.在未去除测试电极和引线等寄生参数影响下,面积为5μm×5μm的RTD的阻性截止频率为18.75GHz.最后对非对称的I-V特性进行了分析讨论.     

InP-base resonant tunneling diodes

We have fabricated Ino.53Ga0.47As/AlAs/InP resonant tunneling diodes (RTDs) based on the air-bridge technology by using electron beam lithography processing. The epitaxial layers of the RTD were grown on semiinsulating (100) InP substrates by molecular beam epitaxy. RTDs with a peak current density of 24.6 kA/cm2 and a peak-to-valley current ratio of 8.6 at room temperature have been demonstrated.     

用于高速电路的InP基共振隧穿二极管制作

在InP衬底上采用感应耦合等离子体刻蚀技术制备了高性能的AlAs/In0.53Ga0.47As/InAs共振隧穿二极管.正向偏压下PVCR=7.57,Jp=39.08kA/cm2;反向偏压下PVCR=7.93,Jp=34.56kA/cm2.在未去除测试电极和引线等寄生参数影响下,面积为5μm×5μm的RTD的阻性截止频率为18.75GHz.最后对非对称的I-V特性进行了分析讨论.     

Nine-state resonant tunneling diode memory

The authors demonstrate an epitaxial series combination of eight pseudomorphic AlAs/In_0.53Ga_0.47As/InAs resonant tunneling diodes (RTDs) grown by molecular beam epitaxy on InP. This series RTD produces an eight-peak multiple negative differential resistance characteristic with a peak-to-valley current ratio (PVR) exceeding 2 per peak at a peak current density of approximately 6 kA/cm ². Hysteresis in the current-voltage characteristic is reduced by uniformly Si doping the double-barrier resonant tunneling region at a density of 5×10¹⁶ cm^-3. Using this multiple-peak RTD in series with a field-effect transistor load, a nine-state multivalued memory circuit is demonstrated     

Thin film pseudomorphicAlAs/In0.53Ga0.47As/InAs resonant tunnellingdiodes integrated onto Si substrates

We report high peak-to-valley current ratio (PVR) resonant tunneling diodes (RTDs) bonded to silicon. Pseudomorphic AlAs/In_0.53Ga_0.47As/InAs resonant tunneling diode structures grown on semi-insulating InP with peak-to-valley current ratios as high as 30 at 300 K have been separated from the growth substrate and bonded to silicon substrates coated with Si₃N ₄, forming thin film devices. In addition, thin film multiple stack RTD structures have been bonded to silicon substrates. The I-V characteristics of both the single and multi-stacked thin film RTD's exhibit no signs of degradation after bonding to the host substrate. These results are the first successful demonstration of InP based electronics bonded to a silicon host substrate and enable the integration of RTDs with conventional silicon circuitry     

InP基共振遂穿二极管器件（RTD）研究

我们在实验中对InGaAs/AlAs/InP共振遂穿二极管（RTD）材料结构进行了优化设计,并用MBE设备在(100)半绝缘InP单晶片上生长了RTD外延材料。我们采用电子束光刻工艺和空气桥互连技术,制作了InP基RTD器件。并在室温下测试了器件的电学特性：峰值电流密度24.6kA/cm2,峰谷电流比(PVCR)为8.6。     

High breakdown voltage AlAs/InGaAs quantum barrier varactor diodes

Data are presented on single quantum barrier AlAs/In/sub 0.53/Ga/sub 0.47/As varactor diodes intended as submillimetre wavelength frequency multipliers that exhibit extremely high breakdown voltage and excellent capacitance modulation characteristics. Record breakdown voltages as high as 12 V were achieved with a composite 50AA/50AA/50AA thick In/sub 0.52/Al/sub 0.48//AlAs/In/sub 0.52/Al/sub 0.48/As barrier sandwiched between 3000 AA(1.2*10/sup 17/ cm/sup -3/) In/sub 0.53/Ga/sub 0.47/As depletion regions.<>     

InAlAs/InGaAs heterojunction bipolar transistors with AlAs etch-stop layer

A seven monolayer AlAs layer was used as an etch stop at the emitter-base heterojunction of an Npn In/sub 0.52/Al/sub 0.48/As/In/sub 0.53/Ga/sub 0.47/As HBT. The etch-stop HBTs displayed higher DC gain and similar microwave performance when compared to devices without the AlAs layer.<>