AlInGaN量子阱垒层材料的优化

采用k·p方法理论,考虑了极化电场和自由载流子重新分布等因素,通过薛定谔方程和泊松方程自洽求解得到InGaN/AlInGaN,InGaN/GaN,InGaN/InGaN,InGaN/AlGaN量子阱导带和价带的能带结构,并由此计算了不同量子阱结构的自发发射谱.分析对比发现AlInGaN材料特有的自发极化和压电极化效应在阱垒界面处形成的极化电荷对量子阱发光特性有重要的影响.以AlInGaN为垒,优化其中各元素的组分可以减小极化电场的影响,提高量子阱自发发射谱强度.同时,综合考虑了极化电荷和势垒高度的影响,提出了具体的优化方法,并给予了物理解释.     

阱宽和垒厚对lnGaN/GaN多量子阱结构光电特性的影响

通过求解修正的基于K·p方法的有效质量哈密顿方程并与泊松方程进行自洽,得到在极化效应影响下的不同阱宽和垒厚的InGaN/GaN多量子阱导带和价带的能带结构,并计算了不同多量子阱结构的自发辐射谱.仿真结果表明:阱宽和垒厚对InGaN/GaN多量子阱结构的光电子学特性有很大的影响.随着阱宽和垒厚的增加,InGaN/GaN多...     

InGaN/GaN多量子阱电池的垒层结构优化及其光学特性调控

InGaN基量子阱作为太阳电池器件的有源区时,垒层厚度设计以及实际生长对其光学特性的影响极为重要.采用金属有机化学气相沉积(MOVCD)技术,在蓝宝石衬底上外延生长了垒层厚度较厚的InGaN/GaN多量子阱,使用高分辨X射线衍射和变温光致发光谱研究了垒层厚度对InGaN多量子阱太阳电池结构的界面质量、量子限制效应及其光学特性的影响.较厚垒层的InGaN/GaN多量子阱的周期重复性和界面品质较好,这可能与垒层较薄时对量子阱的生长影响有关.同时,厚垒层InGaN/GaN多量子阱的光致发光光谱峰位随温度升高呈现更为明显的“S”形(红移-蓝移-红移)变化,表现出更强的局域化程度和更高的内量子效率.     

预应变InGaN/GaN多量子阱发光特性调控研究

为了减弱InGaN/GaN量子阱内的压电极化场,在蓝紫光InGaN/GaN多量子阱激光器结构中采用了预应变InGaN插入层,通过变温电致发光和高分辨X射线衍射测量研究了预应变插入层对量子阱晶体质量和发光特性的影响。实验结果显示,常温下有预应变层的量子阱电致发光谱积分强度显著提高。模拟计算进一步表明,预应变层对量子阱内压电极化场有调制效果,有利于量子阱中的应力弛豫,可以有效减弱量子限制斯塔克效应,有助于提高量子阱的发光效率。     

InGaN基蓝色发光二极管量子阱阻挡层的优化设计

计算比对了不同垒层构型量子阱的极化电场,对极化场下能级结构、载流子浓度分布、自发辐射复合速率和缺陷所造成的Shockley-Reao-Hall(SRH)非辐射复合速率进行了研究,确定内建电场引起的量子阱区域载流子浓度分布均匀性是影响器件效能高低的关键因素.对大电流下晶格优化的A10.02In0.1Ga0.88N四元材料作为量子阱垒层的器件效能和发光特性下降的原因进行了深入分析,同时提出了具体的解决方法.     

垒层Si掺杂对多量子阱InGaN绿光LED性能的影响

InGaN系绿光LED的量子阱结构具有较高的In含量,InN与GaN之间较大的晶格失配度使得绿光器件的量子限制Stark效应更显著。对内建电场的屏蔽可以有效提高载流子的辐射复合效率。论文探讨了绿光多量子阱中垒层的Si掺杂对绿光器件性能的影响。研究发现,多量子阱中垒层适度Si掺杂(3.4×1016 cm-3)可以改善多量子阱结构界面质量和In组分波动,在外加正向电流的作用下更大程度地屏蔽极化电场;同时,还能够增强电流的横向扩展性,提高活化区的有效发光面积。然而,多量子阱中垒层的过度Si掺杂对于绿光LED器件的性能带来诸多的负面影响,比如加剧阱垒晶格失配、漏电途径明显增加等,致使器件光效大幅度降低。     

InGaN/GaN和InGaN/AlGaN多量子阱中应变对光致发光特性的影响

对蓝宝石衬底上的InGaN/GaN和InGaN/AlGaN多量子阱结构和经激光剥离去除衬底的InGaN/GaN和InGaN/AlGaN多量子阱结构薄膜样品,进行了光致发光谱、高分辨XRD和喇曼光谱测量.PL测量结果表明,相对于带有蓝宝石衬底的样品,InGaN/GaN多量子阱薄膜样品的PL谱峰值波长发生较小的蓝移,而InGaN/AlGaN多量子阱薄膜样品的PL谱峰值波长发生明显的红移;喇曼光谱的结果表明,激光剥离前后E2模的峰值从569.1减少到567.5cm-1.这说明激光剥离去除衬底使得外延层整体的压应力得到部分释放,但InGaN/GaN与InGaN/AlGaN多量子阱结构中阱层InGaN的应力发生了不同的变化.XRD的结果证实了这一结论.     

InGaN/GaN和InGaN/AlGaN多量子阱中应变对光致发光特性的影响

对蓝宝石衬底上的InGaN/GaN和InGaN/AlGaN多量子阱结构和经激光剥离去除衬底的InGaN/GaN和InGaN/AlGaN多量子阱结构薄膜样品,进行了光致发光谱、高分辨XRD和喇曼光谱测量.PL测量结果表明,相对于带有蓝宝石衬底的样品,InGaN/GaN多量子阱薄膜样品的PL谱峰值波长发生较小的蓝移,而InGaN/AlGaN多量子阱薄膜样品的PL谱峰值波长发生明显的红移;喇曼光谱的结果表明,激光剥离前后E2模的峰值从569.1减少到567.5cm-1.这说明激光剥离去除衬底使得外延层整体的压应力得到部分释放,但InGaN/GaN与InGaN/AlGaN多量子阱结构中阱层InGaN的应力发生了不同的变化.XRD的结果证实了这一结论.     

InGaN/GaN 和 InGaN/AlGaN 多量子阱中应变对光致发光特性的影响

对蓝宝石衬底上的InGaN/GaN和InGaN/AlGaN多量子阱结构和经激光剥离去除衬底的InGaN/GaN和InGaN/AlGaN多量子阱结构薄膜样品，进行了光致发光谱、高分辨XRD和喇曼光谱测量. PL测量结果表明，相对于带有蓝宝石衬底的样品，InGaN/GaN多量子阱薄膜样品的PL谱峰值波长发生较小的蓝移，而InGaN/AlGaN多量子阱薄膜样品的PL谱峰值波长发生明显的红移；喇曼光谱的结果表明，激光剥离前后E2模的峰值从569.1减少到567.5cm-1. 这说明激光剥离去除衬底使得外延层整体的压应力得到部分释放，但InGaN/GaN与InGaN/AlGaN多量子阱结构中阱层InGaN的应力发生了不同的变化. XRD的结果证实了这一结论.     

InGaN/GaN超晶格垒层用于InGaN发光二极管发光增强研究

设计了InGaN/GaN超晶格垒层替代p-GaN和n-GaN附近传统GaN垒层的InGaN/GaN多量子阱(MQW)发光二极管(LEDs)结构。通过数值方法模拟出两种LED结构的光功率-电压(L-V)曲线、电致发光(EL)谱、能带图、电子浓度分布和辐射复合速率。结果表明InGaN/GaN超晶格替代n-GaN附近GaN垒层的LED结构比替代p-GaN附近GaN垒层的LED显示出更高的发光强度。这种发光增强的原因是InGaN/GaN超晶格替代n-GaN附近GaN垒层可以提高电子注入效率和辐射复合速率。     

Non-Markovian gain and luminescence of an InGaN-AlInGaN quantum-well with many-body effects

The optical gain and the luminescence of an InGaN quantum well with quaternary AlInGaN barriers is studied theoretically. We calculated the non-Markovian optical gain and the luminescence for the strained-layer wurtzite quantum well taking into account of many-body effects. It is predicted that both optical gain and luminescence are enhanced significantly when aluminum and indium are introduced into the quaternary barrier composition. Adding the aluminum to the barrier will increase of the confinement potentials for electrons and holes, while the indium will reduce the biaxial strain, which in turn reduces the internal field caused by spontaneous polarization and piezoelectric effects.     

Effects of Built-In Polarization and Carrier Overflow on InGaN Quantum-Well Lasers With Electronic Blocking Layers

Effects of built-in polarization and carrier overflow on InGaN quantum-well lasers with a ternary AlGaN or a quaternary AlInGaN electronic blocking layer (EBL) have been numerically investigated by employing an advanced device-simulation program. The simulation results indicate that the characteristics of InGaN quantum-well lasers can be improved by using the quaternary AlInGaN EBL. When the aluminum and indium compositions in the AlInGaN EBL are appropriately designed, the built-in charge density at the interface between the InGaN barrier and the AlInGaN EBL can be reduced. Under this circumstance, the electron leakage current and the laser threshold current can obviously be decreased as compared with the laser structure with a conventional AlGaN EBL when the built-in polarization is taken into account in the calculation. Furthermore, the AlInGaN EBL also gives a higher refractive index than the AlGaN EBL, which is a benefit for a higher quantum-well optical confinement factor in laser operations.     

Characterization of quaternary AlInGaN epilayers and polarization-reduced InGaN/AlInGaN MQW grown by MOCVD

We have demonstrated the growth of quaternary AIlnGaN compounds at different growth temperatures and pressures with metalorganic chemical vapor deposition (MOCVD). The optical properties of the samples have been investigated by photoluminescence (PL) at different temperatures. The results show that the sample grown at higher temperature (850℃) exhibits the best optical quality for its sharp band edge luminescence and weak yellow luminescence. The AlInGaN exhibited three-dimensional (3D) growth mode at higher pressure. The band edge emission almost disappeared. With the optimization of AlInGaN growth parameters, we replaced the traditional barrier in InGaN/GaN multiple quantum wells (MQWs) with AlInGaN barriers. The peak wavelength for the InGaN/AlInGaN-MQW based light emitting diodes (LEDs) was very stable at various injection current levels because of the polarization-matched InGaN/AlInGaN MQWs.     

Double-Recessed High-Frequency AlInGaN/InGaN/GaN Metal–Oxide Double Heterostructure Field-Effect Transistors

We demonstrate a low-threshold AlInGaN/InGaN/GaN metal-oxide semiconductor double heterostructure field-effect transistor (MOS-DHFET) for high-frequency operation. A combination of an InGaN channel (for carrier confinement), a DRE process, and a new digital-oxide-deposition technique helped us to achieve MOS-DHFET devices with extremely low subthreshold leakage currents. This reduction in output conductance (short channel effect) resulted in a high cutoff gain frequency f_T of about 65 GHz and a current gain frequency f _max of 94 GHz. The devices exhibited high drain-currents of 1.3 A/mm and delivered RF powers of 3.1 W/mm at 26 GHz with a 35 V drain bias.     

Enhanced carrier confinement in AlInGaN-InGaN quantum wells in near ultraviolet light-emitting diodes

To increase carrier confinement, the GaN barrier layer was substituted with an AlInGaN quaternary barrier layer which was lattice-matched to GaN in the GaN-InGaN multiple quantum wells (MQWs). Photoluminescence (PL) and high-resolution X-ray diffraction measurements showed that the AlInGaN barrier layer has a higher bandgap energy than the originally used GaN barrier layer. The PL intensity of the five periods of AlInGaN-InGaN MQWs was increased by three times compared to that of InGaN-GaN MQWs. The electroluminescence (EL) emission peak of AlInGaN-InGaN MQWs ultraviolet light-emitting diode (UV LED) was blue-shifted, compared to a GaN-InGaN MQWs UV LED and the integrated EL intensity of the AlInGaN-InGaN MQWs UV LED increased linearly up to 100 mA. These results indicated that the AlInGaN-InGaN MQWs UV LED has a stronger carrier confinement than a GaN-InGaN MQWs UV LED due to the larger barrier height of the AlInGaN barrier layer compared to a GaN barrier layer.     

AlGaN/GaN high electron mobility transistors with InGaN back-barriers

A GaN/ultrathin InGaN/GaN heterojunction has been used to provide a back-barrier to the electrons in an AlGaN/GaN high-electron mobility transistor (HEMT). The polarization-induced electric fields in the InGaN layer raise the conduction band in the GaN buffer with respect to the GaN channel, increasing the confinement of the two-dimensional electron gas under high electric field conditions. The enhanced confinement is especially useful in deep-submicrometer devices where an important improvement in the pinchoff and 50% increase in the output resistance have been observed. These devices also showed excellent high-frequency performance, with a current gain cut-off frequency (f/sub T/) of 153 GHz and power gain cut-off frequency (f/sub max/) of 198 GHz for a gate length of 100 nm. At a different bias, a record f/sub max/ of 230 GHz was obtained.     

Growth of InGaN and double heterojunction structure with InGaN back barrier

We study the growth of an InGaN and AIGaN/GaN/InGaN/GaN double heterojunction structure by metalorganic chemical vapor deposition (MOCVD).It is found that the crystal quality of the InGaN back barrier layer significantly affects the electronic property of the AIGaN/GaN/InGaN/GaN double heterojunction.A high crystal quality InGaN layer is obtained by optimizing the growth pressure and temperature.Due to the InGaN layer polarization field opposite to that in the AIGaN layer,an additional potential barrier is formed between the GaN and the InGaN layer,which enhances carrier confinement of the 2DEG and reduces the buffer leakage current of devices.The double heterojunction high-electron-mobility transistors with an InGaN back barrier yield a drain induced barrier lowering of 1.5 mⅤ/Ⅴ and the off-sate source-drain leakage current is as low as 2.6μA/mm at VDs = 10 Ⅴ.     

Optical properties in p-type doping of nitrides quaternary alloys multiple quantum wells

Recent progress in the development of materials and devices, based on nitrides semiconductors and their ternary alloys, for high power, high-temperature applications has been remarkable. The AlInGaN quaternary alloy exhibits interesting features, as its emission intensity is higher than the ternary AlGaN alloy for certain Al compositions. In addition, it is possible to reach the near to ultraviolet (UV) region. Highly conductive p-type GaN, AlN and AlInGaN layers are of crucial importance in particular for some electronic and optoelectronic devices. However, the controlled doping and its efficiency have been difficult to obtain due to the deep nature of the Mg acceptor. Besides, very little has been reported on the electronic and optical properties of p-doped h-nitride quantum wells. In this work, photoluminescence and absorption spectra calculations of h-InGaN/AlInGaN and AlInGaN/InGaN multiple quantum wells (MQWs) have been performed by using the k.p theory within the effective mass approximation. The calculations are carried out by solving self-consistently the 8×8 Kane Hamiltonian together with the Poisson equation for the carriers charge density. Exchange-correlation effects are included within the local density approximation. In our calculations, strain effects due to lattice mismatch and the split-off hole band are taken into account. The Stokes shift, due to many-body effects within the quasi two-dimensional hole gas (2DHG), are also presented.     

Polarization-Engineered Enhancement-Mode High-Electron-Mobility Transistors Using Quaternary AlInGaN Barrier Layers

Group III nitride heterostructures with low polarization difference recently moved into the focus of research for realization of enhancement-mode (e-mode) transistors. Quaternary AlInGaN layers as barriers in GaN-based high-electron-mobility transistors (HEMTs) offer the possibility to perform polarization engineering, which allows control of the threshold voltage over a wide range from negative to positive values by changing the composition and strain state of the barrier. Tensile-strained AlInGaN layers with high Al contents generate high two-dimensional electron gas (2DEG) densities, due to the large spontaneous polarization and the contributing piezoelectric polarization. To lower the 2DEG density for e-mode HEMT operation, the polarization difference between the barrier and the GaN buffer has to be reduced. Here, two different concepts are discussed. The first is to generate compressive strain with layers having high In contents in order to induce a positive piezoelectric polarization compensating the large negative spontaneous polarization. Another novel approach is a lattice-matched Ga-rich AlInGaN/GaN heterostructure with low spontaneous polarization and improved crystal quality as strain-related effects are eliminated. Both concepts for e-mode HEMTs are presented and compared in terms of electrical performance and structural properties.