GaN 基蓝光发光二极管分布布拉格反射器的设计

采用传输矩阵法对GaN基蓝光发光二极管分布布拉格反射器(DBR)反射光谱进行研究.计算发现正入射时S偏振(TE模)与P偏振(TM模)反射带是一致的; S偏振和P偏振反射带随着入射角的增大都向高频(短波)方向移动,且两者之间的差别也随之增大,DBR反射带蓝移快慢与入射介质相关;低折射率入射介质时DBR具有更宽角度响应.通过修改结构参数多次计算表明;入射角修正的方法能较快地找到提高全方向反射的结构.复合DBR以降低反射率或者成倍增加膜层厚度为代价实现大角度范围的反射,复合DBR比传统DBR有更好的光谱特性,这对提高发光二极管的出光效率有现实意义.     

GaN基蓝光发光二极管分布布拉格反射器设计研究

采用传输矩阵法对GaN基蓝光发光二极管分布布拉格反射器（DBR）反射光谱进行研究。计算发现正入射时S偏振(TE模)与P偏振(TM模)反射带是一致的;S偏振和P偏振反射带随着入射角的增大都向高频(短波)方向移动,且两者之间的差别也随之增大,DBR反射带蓝移快慢与入射介质相关;低折射率入射介质时DBR具有更宽角度响应。通过修改结构参数多次计算表明：入射角修正的方法能较快的找到提高全方向反射的结构。复合DBR以降低反射率或者成倍增加膜层厚度为代价实现大角度范围的反射。复合DBR比传统DBR有更好的光谱特性,这对提高发光二极管的出光效率有现实意义。     

具有背面反射镜的GaN基高压LED

High-voltage light-emitting diodes （HV-LED） with backside reflector, including Ti305/SiO2 distributed Bragg reflector （DBR） or hybrid reflector combining DBR and Al or Ag metal layer, are investigated using Monte Carlo ray tracing method. The hybrid reflector leads to more enhancement of light-extraction efficiency （LEE）. Moreover, the LEE can also be improved by redesigning the thicknesses of DBR. HV-LED with four redesigned DBR pairs （4-MDBR）, and those with a hybrid reflector combining 4-MDBR and Al metal layer （4-MDBR-Al）, are fabricated. Compared to 4-MDBR, the enhancement of light-output power induced by 4-MDBR-A1 is 4.6%, which is consistent with the simulated value of 4.9%.     

Selective wet etching of p-GaN for efficient GaN-based light-emitting diodes

The selective wet etching of a p-GaN layer by using a solution of KOH in ethylene glycol (KE) was studied to enhance the optical and electrical performance of the GaN-based light-emitting diodes (LEDs). The surface of the p-GaN, which was selectively etched in the KE solution, showed hexagonal-shaped etch pits. The light-output power of etched LEDs was improved by 29.4% compared to that of the nonetched LED. This improvement was attributed to the increase in the probability of photons to escape due to the increased surface area of textured surface and the reduction in contact resistance of the ohmic layer resulting from the increased contact area and hole concentration on the textured p-GaN. The reverse leakage current of the LED was also greatly decreased due to the surface passivation and the removal of defective regions from the p-GaN.     

Design and fabrication of highly efficient GaN-based light-emitting diodes

A promising fabrication method and an innovative geometrical design for highly efficient GaN-based light-emitting diodes (LEDs) were investigated based on the current spreading phenomenon. Based on theoretical considerations, it was possible to determine the critical transparent-electrode thickness, which resulted in significant improvements in the electrical and optical characteristics of LEDs. In addition, we were able to define conditions for an ideal geometrical design and the resulting product exhibited significant improvements in characteristics in spite of the fact that a transparent electrode, acting as a p-type current spreader, was not used. Considering the simple fabrication process and good device performance, the proposed fabrication methods, as well as the innovative geometrical design, have considerable promise for use in practical applications.     

Fluoropolymer-assisted graphene electrode for organic light-emitting diodes

Organic light-emitting diodes (OLEDs) were fabricated on a graphene electrode, with synthesized graphene being transferred and simultaneously doped with supporting polymers. Poly[methyl methacrylate] (PMMA) and fluoropolymer (CYTOP) layers were used as the supporting polymers. The sheet resistance of CYTOP-assisted graphene (CYTOP-G) with 4 layers of graphene is 200 Ω/sq., which is lower than that of PMMA-assisted graphene (PMMA-G, 330 Ω/sq.) The transmittance value of PMMA-G and CYTOP-G with 4 graphene layers is higher than 85%. CYTOP-G is shown to exhibit a higher tolerance to UV–O₃ treatment and thermal annealing than PMMA-G. Work function of CYTOP-G is 4.7 eV, which is higher than that of PMMA-G (4.3 eV). X-ray photoemission and Raman spectroscopy data indicate that CYTOP-G has numerous C-F bonds on the surface exhibiting p-type semiconductor properties, owing to the high electronegativity of fluorine. The turn-on voltage of an OLED based on CYTOP-G with 4 graphene layers is 4.2 V, which is lower than that of indium tin oxide (ITO)-based one (4.5 eV). Furthermore, the luminance ratio of graphene-based OLEDs to ITO-based OLEDs was calculated to be 104% for CYTOP-G, and 97% for PMMA-G. According to the ultraviolet photoemission spectra, the hole injection barrier in CYTOP-G is lower by about 0.5 eV than the hole injection barrier in PMMA-G. These results are very encouraging to the prospect of replacing ITO electrodes with graphene ones in OLED applications.     

Electrical-efficiency analysis of GaN-based light-emitting diodes with interdigitated-mesa geometry

We propose a novel method to analyze the current-voltage (I-V) characteristics of GaN-based light-emitting diodes (LEDs) with different p-type electrodemesa geometries. The electrical efficiency is analyzed by calculating the electric field under the quasi-coplanar electrodes of GaN-based LEDs. The experimental results for GaN-based LEDs of chip sizes of 350×350 μm² and 1,000 × 1,000 μm² with interdigitated fingers are compared. A good agreement is obtained between the experimental and theoretical electrical efficiency of the GaN LEDs with a chip size of 1,000×1,000 μm². The current-crowding effect is analyzed by measuring the electroluminescence spectra of the devices. The result indicates that the current-crowding effect is largely reduced by increasing the number of interdigitated fingers. The electrical efficiency of a LED with a chip size of 1,000×1,000 μm² can be also enhanced by increasing the number of interdigitated fingers, showing the advantages of GaN LED with interdigitated-mesa geometries.     

Improvement of thermal management of high-power GaN-based light-emitting diodes

The thermal management of high-power light-emitting-diode (LED) devices employing various die-attach materials is analyzed. Three types of die-attach materials are tested, including silver paste, Sn–3 wt.% Ag–0.5 wt.% Cu (SAC305) solder, and SAC305 solder added with a small amount of carbon nanotubes (CNTs). The analysis of thermal management is performed by comparing the temperatures of the LED chips in use and the total thermal resistances of the LED devices obtained respectively from the thermal infrared images and thermal transient analysis. Due to the high thermal conductivity of CNT, the addition of CNTs into the SAC305 solder reduces the total thermal resistance and chip temperature of the LED device, and the thermal management of the LED devices is improved accordingly.     

功率型LED电压温度系数的研究

理论上详细分析了LED正向电压随温度变化的物理机理,并在大的电流范围(0.1～200 mA)和温度范围(60～350 K)内,对AlGaInP、InGaN材料系功率型LED正向电压随温度的变化关系进行了系统的实验研究.发现在恒定电流下,两者的变化关系可分为高温区和低温区两段.在高温区两者为线性反比关系,并且电压温度系数与正向电流有关,在低温区正向电压随温度减小而突然急剧增大.理论很好地解释了实验结果.     

具有微米/纳米复合粗化ITO的GaN基LED

Three types of textured indium-tin-oxide （ITO） surface, including nano-texturing and hybrid micro/nano-texturing with micro-holes （concave-hybrid-pattem） or micro-pillars （convex-hybrid-pattern）, were applied to GaN-based light-emitting diodes （LEDs）. The nano-texturing was realized by maskless wet-etching, and the micro-texturing was achieved by standard photolithography and wet-etching. Compared to LED chips with flat ITO surface, those with nano-pattern, concave-hybrid-pattern, and convex-hybrid-pattern exhibit enhancement of 11.3%, 15.8%, and 17.9%, respectively, for the light-output powers at 20 mA. The electrical performance has no degradation. Moreover, the convex-hybrid-pattern show higher light-output efficiency under small injection current, while the concave-hybrid-pattern exhibit better light-output efficiency at large injection current. The light- extraction efficiency is simulated by use of two-dimensional finite difference time domain method, and the numer- ical results are consistent with the experiments.     

Failure modes and effects analysis for high-power GaN-based light-emitting diodes package technology

In this study, nondestructive test is developed to analyze the structure failure of LED package. The relationship between thermal resistance analysis and LED package failure structure is build with T3Ster thermal transient tester and scanning electron microscope (SEM). The failure LED device with defect in the attaching layer and gap between LED chip and copper are designed advisedly. The failure factors of LED package have been measured with thermal resistance analysis and SEM cross-section images. The thermal dissipation performance of LED with defect in the attaching layer is indicated by thermal resistance analysis combined with SEM cross-section images. The blister in attaching layer results in 4.4 K/W additional thermal resistance. The gap between LED chip and copper also makes high additional thermal resistance with 8.6 K/W. Different failures of LED packages are indicated obviously using thermal transfer analysis. The LED package failure structure such as interface defect between solder and cup-shaped copper is able to forecast without destructive measurement.     

Investigation of GaN-based light-emitting diodes using double photonic crystal patterns

GaN-based LEDs with photonic crystal (PhC) patterns on an n- and a p-GaN layer by nano-imprint lithography (NIL) are fabricated and investigated. At a driving current of 20 mA on Transistor Outline (TO)-can package, the light output power of the GaN-based LED with PhC patterns on an n- and a p-GaN layer is enhanced by a factor of 1.30, and the wall-plug efficiency is increased by 24%. In addition, the higher output power of the LED with PhC patterns on the n- and p-GaN layer is due to better crystal quality on n-GaN and higher scattering effect on p-GaN surface using PhC pattern structure.     

Improving the light output power of GaN-based light-emitting diodes through the use of SiO2 cones

We introduced a simple wet-etching process to form SiO₂ cones and investigated the effect of the size and coverage of the SiO₂ cones on the output power of GaN-based light-emitting diodes (LEDs). The diameter of the cones varies from 2.8 to 17.1 μm and the height from 0.6 to 2.0 μm. It is shown that regardless of the sizes of the cones, all of the LEDs exhibit a same forward-bias voltage of 3.31 V at an injection current of 20 mA. As the size of the cones increases, the light output increases, reaches maximum at cone #3 (12.4 μm in diameter and 2.0 μm in height), and then decrease slightly. For example, the LEDs fabricated with different SiO₂ cones exhibit 11.4–35.9% higher light output power (at 20 mA) than do the LEDs without the cones. The electroluminescence (EL) intensity (at 20 mA) also exhibits cone size dependence similar to that of light output power. For example, the LEDs fabricated with different cones exhibit 7.7–36.3% higher EL intensity than the LEDs without the cones.     

Improvement of GaN-based light-emitting diode by indium-tin-oxide transparent electrode and vertical electrode

A sapphire-etched vertical-electrode nitride semiconductor (SEVENS) light-emitting diode (LED) is fabricated by means of a selective chemical wet-etching technique. The SEVENS-LED formed on sapphire substrate exhibits excellent device performance compared to a conventional NiAu lateral-electrode (LE) GaN-based LED formed on the same sapphire substrate. The integral light-output power of SEVENS-LED is /spl sim/7 mW, which is 1.75 times stronger than that of the conventional NiAu LE-LED (/spl sim/4 mW). The external quantum efficiency of SEVENS-LED is estimated to be approximately 13%.     

题目：电子泄露有关的氮化镓蓝光发射二极管低温发光效率行为

The typical light emission efficiency behaviors of InGaN/GaN multi-quantum well （MQW） blue light- emitting diodes （LEDs） grown on c-plane sapphire substrates are characterized by pulsed current operation mode in the temperature range 40 to 300 K. At temperatures lower than 80 K, the emission efficiency of the LEDs decreases approximately as an inverse square root relationship with drive current. We use an electron leakage model to explain such efficiency droop behavior; that is, the excess electron leakage into the p-side of the LEDs under high forward bias will significantly reduce the injection possibility of holes into the active layer, which in turn leads to a rapid reduction in the radiative recombination efficiency in the MQWs. Combining the electron leakage model and the quasi-neutrality principle in the p-type region, we can readily derive the inverse square root dependent function between the light emission efficiency and the drive current. It appears that the excess electron leakage into the p-type side of the LEDs is primarily responsible for the low-temperature efficiency droop behavior.     

Anomalous luminescence efficiency enhancement of short-term aged GaN-based blue light-emitting diodes

The origin of anomalous luminescence efficiency enhancement of short-term aged GaN-based blue light-emitting diodes was studied. We found that the intensity of the electroluminescence and photoluminescence spectra were both increased in the very beginning period of aging. With the help of a rate-equation model, we concluded that this kind of luminescence efficiency enhancement is a joint effect of the defect reduction in active layers and the changes out of active layers, for example the Mg acceptor annealing.     

Effects of p-type GaN thickness on optical properties of GaN-based light-emitting diodes

The influence of p-type Ga N(p Ga N) thickness on the light output power(LOP) and internal quantum efficiency(IQE) of light emitting diode(LED) was studied by experiments and simulations. The LOP of Ga N-based LED increases as the thickness of p Ga N layer decreases from 300 nm to 100 nm, and then decreases as the thickness decreases to 50 nm. The LOP of LED with 100-nm-thick pG a N increases by 30.9% compared with that of the conventional LED with 300-nm-thick p Ga N. The variation trend of IQE is similar to that of LOP as the decrease of Ga N thickness. The simulation results demonstrate that the higher light efficiency of LED with 100-nm-thick p Ga N is ascribed to the improvements of the carrier concentrations and recombination rates.     

Electrical characteristics of In/ITO p-type ohmic contacts for high-performance GaN-based light-emitting diodes

We have investigated the annealing-induced improved electrical properties of In(10 nm)/ITO(200 nm) contacts with p-type GaN. The contacts become ohmic with a specific contact resistance of 2.75×10^–3 Ω cm² upon annealing at 650 °C in air. X-ray photoemission spectroscopy (XPS) Ga 2p core levels obtained from the interface regions before and after annealing indicate a large band-bending of p-GaN, resulting in an increase in the Schottky barrier height. STEM/energy dispersive X-ray (EDX) profiling results exhibit the formation of interfacial In-Ga-Sn-oxide. Based on the STEM and XPS results, the ohmic formation mechanisms are described and discussed. It is also shown that patterning by nano-imprint lithography improves the light output power of blue LEDs by 18–28% as compared to that of LEDs fabricated with unpatterned In/ITO contacts.     

两步粗化技术提高自支撑氮化镓基倒装LED的光提取效率

The light extraction enhancement of freestanding GaN-based flip-chip light-emitting diodes(FSFCLEDs)using two-step roughening methods is investigated.The output power of LEDs fabricated by using one-step and two-step roughening methods are compared.The results indicate that two-step roughening methods show more potential for light extraction.Compared with flat FS-FCLEDs,the output power of FS-FCLEDs with a nanotextured hemisphere surface shows an enhancement of 90.7%.     

大功率平面连接结构倒装LED的热仿真及热分析

Conventional GaN-based flip-chip light-emitting diodes （CFC-LEDs） use Au bumps to contact the LED chip and Si submount, however the contact area is constrained by the number of Au bumps, limiting the heat dissipation performance. This paper presents a flat surface high power GaN-based flip-chip light emitting diode （SFC-LED）, which can greatly improve the heat dissipation performance of the device. In order to understand the thermal performance of the SFC-LED thoroughly, a 3-D finite element model （FEM） is developed, and ANSYS is used to simulate the thermal performance. The temperature distributions of the SFC-LED and the CFC-LED are shown in this article, and the junction temperature simulation values of the SFC-LED and the CFC-LED are 112.80 ℃ and 122.97℃C, respectively. Simulation results prove that the junction temperature of the new structure is 10.17 ℃ lower than that of the conventional structure. Even if the CFC-LED has 24 Au bumps, the thermal resistance of the new structure is still far less than that of the conventional structure. The SFC-LED has a better thermal property.