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微电子机械系统是一种新兴技术,它几乎影响着每一个科学技术领域,如交通、无线通信、航天、化学以及光波系统。目前许多工业领域期待选用微电子机械系统来解决技术上的问题。以下简述了微电子机械系统技术的基础概念、所用材料、加工工艺等;重点综述了基于MEMS技术的通信器件及其应。 相似文献
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集成硅微悬臂梁融合式传感器制造技术 总被引:5,自引:3,他引:2
简要地描述了以各种微结构的硅悬臂梁作为敏感元件构成的不同用途的新型融合式传感器及其列阵;介绍了硅微悬臂梁融合式传感器的设计和制造工艺;对笔者正在研究的硅微悬臂梁与光纤组合式列阵感器作了初步的报道。研究结果表明这是一种很有前途的技术。 相似文献
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微电子机械系统 (MEMS)是一种新兴技术 ,它几乎影响着每一个科学技术领域 ,如交通、无线通信、航天、化学以及光波系统。目前许多工业领域期待选用微电子机械系统来解决技术上的问题。简述了微电子机械系统技术的基础概念、所用材料、加工工艺等 ;并重点综述了该技术在光纤通信系统中的广泛应用。 相似文献
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硅微谐振式加速度计具有体积小、成本低、动态范围宽、高精度准数字频率信号输出等优势,但零偏、标度因数等关键性能指标受到了温度等因素的制约,尚不能满足高精度导航制导的高性能要求。因此,本文在简要介绍硅微谐振式加速度计温度特性及温度误差来源的基础上,综述了近年来国内外学者针对硅微谐振式加速度计进行的温度补偿方面的研究,包括无源温度补偿技术、有源温度补偿技术;介绍了无源温度补偿技术与有源温度补偿技术常用的方法和最新的研究成果;分析总结了各种方法的优缺点,提出探索更加精确的测温手段、热隔离效果更好的隔离装置以设计一种低功耗、预热时间短、控制稳定性强的微烘箱系统进行器件层的加热控温,以及寻求无源补偿技术与有源补偿技术相结合的更多可能性以获得温度补偿最优组合是后续温度补偿工作的重点研究方向。 相似文献
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HE Gaofa TANG Yike ZHOU Chu e HE Xiaoping WU Ying College of Mechanical Engineering Chongqing University Chongqing China College of Mechanical Power Engineering Chongqing University of Science Technology Chongqing China Institute of Electronic Engineering China Academe Engineering Physics Mianyang China 《机械工程学报(英文版)》2011,(3):495-500
For the purpose of improving the precision of the inertial guidance system,it is necessary to enhance the accuracy of the accelerometer.Combining the micro-fabrication processes with resonant sensor technology,a high-resolution inertial-grade novel micro resonant accelerometer is studied.Based on the detecting theory of the resonant sensors,the accelerometer is designed,fabricated,and tested.The accelerometer consists of one proofmass,two micro leverages and two double-ended-tuning-fork (DETF) resonators.The sensing principle of this accelerometer is based on that the natural frequency of the DETF resonator shifts with its axial load which is caused by inertial force.The push-pull configuration of the DETF is for temperature compensation.The two-stage micro leverage mechanisms are employed to amplify the force and increase the sensitivity of the accelerometer.The micro leverage and the resonator are modeled for static analysis and nonlinear modal analysis via theory method and finite element method (FEM),respectively.The geometrical parameters of them are optimized.The amplification factor of the leverage is 102,and the sensitivity of the resonator on theory is about 62 Hz/g.The samples of the accelerometer are fabricated with deep reactive ion etching (DRIE) technology which can get a high-aspect ratio structure for contributing a greater sensing-capacitance.The measuring results of the samples by scanning electron microscopy (SEM) show that the process is feasible,because of the complete structure,the sound combs and micro leverages,and the acceptable errors.The frequency of the resonator and the sensitivity of the accelerometer are tested via printed circuit board (PCB),respectively.The result of the test shows that the frequency of the push-resonator is about 54 530 Hz and the sensitivity of the accelerometer is about 55 Hz/g.The amplification factor of the leverage is calculated more accurately because the coupling of the two stages leverage is considered during derivation of the analysis formula.In addition,the novel differential structure of the accelerometer can greatly improve the sensitivity of the accelerometers. 相似文献
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文中介绍通过采用MEMS(micro electro mechanical systems)技术制造的硅压阻力敏元件结合智能集成化信号调理技术设计了适合批量制造的小型化坚固封装的通用汽车压力传感器.通过智能调理技术将传感器的零位和满度进行温度校准实现了宽温度工作范围内的高精度测量,并且适合于批量制造. 相似文献
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MEMS方法制造小型PEM燃料电池电极 总被引:1,自引:0,他引:1
小型PEM燃料电池电极有着比较复杂的细微结构,电极担负了收集电荷,传输燃料,催化剂载体和构架支撑的功能.介绍了一种新的带有燃料传输孔的硅片电极制造方法,并且在它的表面上生长了一层多孔硅薄膜,以利于燃料传输,扩散和渗透.多孔硅孔径分布和深度范围从百纳米到几十纳米.当催化剂Pt溅射到它表面时,受多孔硅形状的限制,Pt就形成了不连续微小颗粒,对乙醇有比较强的催化作用.用此电极组装的电池,使用乙醇或甲醇燃料时分别有0.55V和0.6V的输出电压. 相似文献
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针对非制冷红外热成像中的双材料硅微悬臂梁阵列的结构要求,在MEMS常见加工工艺的基础上,提出了单个硅微悬臂梁的制作工艺路线。工艺中使用高浓度HF溶液释放牺牲层磷硅玻璃(PSG)。探讨了双层材料氮化硅和铝之间的断裂及氮化硅和硅基底之间的粘连问题,对工艺中影响成品率的关键因素残余应力进行了分析。 相似文献
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Introduction Using Micro-Electro-Mechanical System 《光学精密工程》2002,10(6):632-633
1 Introduction
Using Micro-Electro-Mechanical System(MEMS)technology, many devices and systems can be miniaturized. Micro pressure sensors and micro accelerometers(air-bag sensor) are examples that are widely commercialized. In the case of optical system,some optical components need to be combined to implement the function desired for optical processing. 相似文献
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在压阻式硅微二维加速度计的基础上,提出了一种MEMS硅微三维加速度计.该加速度计微结构包括由四梁-柱体组成的二维水平检测单元和双T型垂直检测单元两部分,通过双T型检测单元和微型柱体与四梁检测单元检测空间三维方向的加速度值.建立了该结构的数学模型并用有限元分析软件Ansys对敏感弹性元件进行力学特性分析.最后对加工出的加速度计进行性能测试.测试结果表明,该加速度计3个方向频响曲线平坦、灵敏度高、线性度好,轴间耦合度小,X向灵敏度为2.17 mV/g,非线性度为0.63%,y向灵敏度为2.08 mv/g,非线性度为0.75%,Z向灵敏度为1.66mV/g,非线性度为1.13%. 相似文献
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利用烧结-脱溶法制备出了多孔铜材料,并通过形貌观察和压缩试验对其孔结构和力学性能进行了表征.结果表明:以工业纯铜粉末和尿素颗粒为原材料,经过压实、烧结和脱溶处理,可获得具有开孔结构、孔隙率60%~80%、孔径100~400 μm的多孔铜.该材料压缩应力与其密度直接相关,与孔径没有明显的关系.随密度增加(即孔隙率下降),压缩屈服强度和流变应力上升;随孔径变化,压缩应力-应变曲线变化不明显. 相似文献
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硅微机械陀螺仪的机械灵敏度与驱动和检测模态的谐振频率差Δf成反比,而Δf处的谐振峰是影响陀螺带宽的直接因素,带宽约0.54Δf,因此,带宽和机械灵敏度往往成为两个互为矛盾的指标。基于自动控制原理中介绍的偶极子理论提出了偶极子补偿控制技术,该方法在不影响机械灵敏度的前提下可有效拓展陀螺带宽。首先,对涉及到的双质量硅微机械陀螺仪的结构形式和工作原理进行了介绍,指出陀螺实际工作的检测模态是由检测同相和反相模态叠加而成,设计了陀螺开环检测回路,分析了带宽是由驱动反相和检测反相模态的谐振频率差决定,并结合检测力反馈激励法验证了上述结论;其次,根据偶极子工作原理设计了偶极子补偿控制器的系统传递函数和电路,并对相关内容进行了仿真,验证了电路参数的准确性;最后,基于偶极子补偿控制器建立了硅微机械陀螺仪闭环检测系统,分析了该系统的稳定性,并对该系统的带宽特性进行了仿真和测试,结果显示带宽由原来的13 Hz拓展到了76 Hz,很好地证明了本文提出方法的可行性。此外,鉴于双质量陀螺的实际检测模态,在消除了第一个Δf谐振峰对带宽的影响后,由检测同、反相模态叠加产生的共轭零点引起的幅值谷为带宽进一步提高的限制因素。 相似文献
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Dicing of fabricated MEMS (microelectromechanical system) devices is sometimes a source of challenge, especially when devices are overhanging structures. In this work, a modified cleaving technique is developed to precisely separate fabricated devices from a silicon substrate without requiring a dicing machine. This technique is based on DRIE (deep reactive ion etching) which is regularly used to make cleaving trenches in the substrate during the releasing stage. Other similar techniques require some extra later steps or in some cases a long HF soak. To mask the etching process, a thick photoresist is used. It is shown that by applying different UV (ultraviolate) exposure and developing times for the photoresist, the DRIE process could be controlled to etch specific cleaving trenches with less depth than other patterns on the photoresist. Those cleaving trenches are used to cleave the wafer later, while the whole wafer remains as one piece until the end of the silicon etching despite some features being etched all the way through the wafer at the same time. The other steps of fabricating and releasing the devices are unaffected. The process flow is described in details and some results of applying this technique for cleaving fabricated cantilevers on a silicon substrate are presented. 相似文献