添加H2对SiH4/N2/Ar等离子体淀积的氮化硅电学和光学特性的影响

研究了加H2对SiH4/N2/Ar高密度、低离子能量的等离子体淀积的氮化硅薄膜(淀积的衬底温度为400℃)电学和光学性能的影响。实验结果表明,加入H2使氮化硅薄膜的光学带隙增加,其折射率以及在氢氟酸缓冲液中腐蚀速率减小,而XPS测试的N、Si原子比没有改变,均为1.3。FTIR测量表明,样品中Si-H键的密度低于仪器检测限,而添加H2的样品中N-H键密度稍增加。此外,由淀积的氮化硅膜构成的MIS结构的高频C-V测试(1 MHz)显示,当氢气流量从零增加到8sccm时,高频C-V的回滞幅度从(0.40±0.05)V降低到(0.10±0.01)V。基于这些实验结果和理论分析,表明了加适量H2能够促进弱的Si-Si键以及Si和N的悬挂键向Si-N键转化。     

HWP-CVD氮化硅薄膜的结构和光学特性

采用傅立叶红外吸收谱和紫外-可见透射谱研究了螺旋波等离子体增强化学气相沉积法制备的氢化非晶氮化硅薄膜的原子间键合结构和光学特性。结果表明,在不同硅、氮活性气体配比R下,薄膜表现出不同的Si/N比和H原子键合方式,富氮样品中H原子主要和N原子结合,而富硅样品中主要和Si原子结合。随着R的增加,薄膜的光学带隙E_g和E₀₄逐渐减小,此结果关联于薄膜结构无序性程度的增加,而薄膜的(E₀₄-E_g)和Tauc斜率B值之间存在着相互制约关系。     

有机发光器件的低温氮化硅薄膜封装

利用等离子体化学气相沉积(PECVD)技术，采用不同的沉积条件(20—180℃的基板温度范围和10—30W的射频功率)制备了氮化硅薄膜，研究了沉积条件对氮化硅薄膜性质和防水性能的影响。实验发现随着基板温度的增加，氮化硅薄膜的密度、折射率和Si／N比相应增加，而沉积速率和H含量相应减少；随着射频功率的增加，氮化硅薄膜的沉积速率、密度、折射率和Si／N比相应增加，而H含量相应减少。水汽渗透实验发现即使基板温度降低为50℃，所沉积的氮化硅薄膜仍然具有良好的防水性能。实验结果表明低温氮化硅薄膜可以有效地应用于有机发光器件（OLED)的封装。     

a-Si:H基薄膜中SiH及SiH_2键构成对n型直拉单晶硅片钝化效果的影响研究

n型单晶硅表面本征非晶硅基薄膜(a-Si∶H)的钝化作用是高效率非晶硅/晶体硅异质结太阳电池的关键。本文采用掺氧和热处理的方式改变本征非晶硅基薄膜(a-Si∶H)样品中Si H和Si H2键构成,利用Sinton WCT-120少子寿命测试仪及傅里叶红外光谱测试仪分析样品性能,研究Si H和Si H2键构成对n型直拉单晶硅片(n-Cz-Si)表面钝化效果的影响。结果表明:1掺氧和热处理均会增加a-Si∶H中Si H2键相对于Si H键的比例;2在200~350℃范围内,随着热处理温度的升高,薄膜中Si H2键相对于Si H键的比例增加,薄膜对n-Cz-Si的钝化效果先变好,在275℃时达到极值后变差;3a-Si∶H薄膜中Si H2键和Si H键的相对含量对n-Cz-Si表面的钝化效果有直接的影响,根据实验结果,Si H2与Si H键相对含量在一定范围时钝化效果最好,过高或过低均不利于钝化。     

退火温度对(Bi0.8La0.2)2Ti2O7薄膜物理和电学性质的影响

采用化学溶液沉积法,在Si[100]衬底上制备了掺La的(Bi0.8La0.2)2Ti2O7薄膜,研究了退火温度对薄膜结晶性及电学性能的影响.研究发现,随着退火温度的升高,样品的结晶性越来越好;漏电流密度随之降低,表明绝缘性逐渐增强.实验证明该薄膜具有良好的绝缘性和较高的介电常数.     

C2H2流量对SiCN薄膜结构及阻挡性能的影响

采用C2H2和N2作为反应气体、多晶Si作为靶材,利用射频磁控溅射系统沉积了SiCN薄膜。利用傅里叶红外光谱仪、X射线衍射仪、四探针测试仪等研究了C2H2流量对薄膜结构、介电常数以及阻挡性能的影响。结果表明,薄膜为非晶结构,1000℃退火下未出现结晶,稳定性很好;随着C2H2流量的增大,薄膜表面颗粒呈现增大趋势;C原子取代Si原子占据薄膜中的网络位置,薄膜形成了以C-N键为主的网络结构;制得的SiCN薄膜介电常数在4.2~5.8之间,C,N含量以及薄膜结构是影响介电性能的关键因素,高温使得Cu穿过薄膜中的缺陷与Si发生互扩散是薄膜阻挡性能失效的主要原因。     

分子动力学模拟不同入射能量的SiF2与SiC的相互作用

采用分子动力学模拟方法研究了入射能量对SiF2与SiC样品表面相互作用的影响。本次模拟选择的入射初始能量分别为0.3,1,5,10和25 eV。模拟结果显示SiF2分解率与Si和F原子的沉积率有密切的关系。沉积的Si和F原子在SiC表面形成一层SixFy薄膜。随入射能量的增加,薄膜厚度先增加后减小,薄膜中Si-Si键密度增大。构成薄膜的主要成分SiFx(x=1~4)中主要是SiF和SiF2,随入射能量的增加,薄膜成分由SiF2向SiF转变。     

氧离子束辅助激光淀积生长ZnO/Si的XPS探究

为了探究ZnO/Si内部化学成分及有关信息,用氧离子束辅助(O+-assisted)脉冲激光淀积(PLD)法在不同实验条件下生长成ZnO/Si(111)样品.利用X射线光电子能谱(XPS)对长成的ZnO/Si异质结构进行了异位测试.通过对O1s峰及其肩状结构进行拟合、分析,得到了原子数密度比n(O)∶n(Zn),进而探究了原子数密度比与生长质量的关系.结果表明,用氧离子束辅助PLD法,可在较低的衬底温度190℃和适当O+束流条件下,生长出正化学比接近于1,且c轴单一取向最佳的ZnO/Si薄膜.用氧离子束辅助PLD淀积法生长ZnO薄膜,可以改善缺氧状况,能提供一个富氧环境.     

气体流量比对反应溅射Si3N4薄膜的影响

利用射频磁控反应溅射法,以高纯Si为靶材,高纯N2气为反应气体,在Si衬底上制备出了Si3N4薄膜,研究了气体流量比对薄膜质量的影响.结果表明,薄膜的沉积速率主要与气体的流量比有关,随着气体流量比的增加,沉积速率下降,靶面的溅射由金属模式过渡到氮化物模式;薄膜中N/Si的原子比增加;红外吸收谱的Si-N键的振动峰向标准峰逼近.     

Bi4Ti3O12铁电薄膜I-V特性的研究

采用溶胶-凝胶工艺(Sol-Gel)在Pt/Ti/SiO2/p-Si衬底上成功制备了低漏电流Bi4Ti3O12(BIT)铁电薄膜,对所得样品的漏导行为进行了研究.研究表明,Bi4Ti3O12薄膜的漏电流密度在+3V偏压下低于10-9A/cm2,满足器件应用的要求.在不同场强下薄膜的漏导机制不同,而且正向和负向电场作用下I-V曲线明显不同,正向漏电流明显小于负向漏电流.电压低于2V时,薄膜以欧姆导电机制为主,电压在2～5.4V(加正向电压)或2.2～3.6V(加负向电压)时,BIT薄膜应以Schottky emission导电机制为主;而对于较高的场强下,BIT薄膜以Space-charge limited currents(SCLC)导电机制为主.     

Structural and optical properties of AlxOy/Pt/AlxOy multilayer absorber

We report on the microstructure and optical properties of Al_xO_y–Pt–Al_xO_y interference-type multilayer films, deposited by electron beam (e-beam) deposition onto corning 1737 glass, silicon (1 1 1) and copper substrates. The structural properties were investigated by Rutherford backscattering spectrometry, X-ray diffraction, scanning electron microscopy, energy dispersive X-ray spectroscopy and atomic force microscopy. The optical properties were extracted from specular reflection/transmission, diffuse reflectance and emissometer measurements. The stratification of the coatings consists of a semi-transparent middle Pt layer sandwiched between two layers of Al_xO_y. The top and bottom Al_xO_y layers were non-stoichiometric with no crystalline phases present. The Pt layer is in the fcc crystalline phase with a broad size distribution and spheroidal shape in and between the rims of Al_xO_y. The surface roughness of the stack was found to be comparable to the inter-particle distance. The optical calculations confirm a high solar absorptance of ∼0.94 and a low thermal emittance of ∼0.06 for the multilayer stack, which is attributed not only to the optimized nature of the multilayer interference stacks, but also to the specific surface morphology and texture of the coatings. These optical characteristics validate the spectral selectivity of the Al_xO_y–Pt–Al_xO_y interference-type multilayer stack for use in high temperature solar-thermal applications.     

Optimization of AlxOy/Pt/AlxOy multilayer spectrally selective coatings for solar-thermal applications

Spectrally selective Al_xO_y/Pt/Al_xO_y multilayer absorber coatings were deposited onto corning 1737 glass, Si (111) and copper substrates using electron beam (e-beam) vacuum evaporator at room temperature. The employment of ellipsometric measurements and optical simulation was proposed as an effective method to optimize and deposit multilayer solar absorber coatings. The optical constants (n and k) measured using spectroscopic ellipsometry, showed that both Al_xO_y layers, which used in the coatings, were dielectric in nature and the Pt layer was semi-transparent. The optimized multilayer coatings exhibited high solar absorptance α ∼ 0.94 ± 0.01 and low thermal emittance ? ∼ 0.06 ± 0.01 at 82 °C. The Rutherford backscattering spectroscopy (RBS) data of Al_xO_y/Pt/Al_xO_y multilayer absorber indicated the Al_xO_y layers present in the coating were nearly stoichiometry. The scanning electron microscope analysis (SEM) result indicated that the average diameter and inter-particles distance of Pt grains were statistically about 146 ± 0.17 nm and 6-10 ± 0.2 nm respectively.     

Interfacial microstructure of NiSix/HfO2/SiOx/Si gate stacks

Integration of NiSi_x based fully silicided metal gates with HfO₂ high-k gate dielectrics offers promise for further scaling of complementary metal-oxide- semiconductor devices. A combination of high resolution transmission electron microscopy and small probe electron energy loss spectroscopy (EELS) and energy dispersive X-ray analysis has been applied to study interfacial reactions in the undoped gate stack. NiSi was found to be polycrystalline with the grain size decreasing from top to bottom of NiSi_x film. Ni content varies near the NiSi/HfO_x interface whereby both Ni-rich and monosilicide phases were observed. Spatially non-uniform distribution of oxygen along NiSi_x/HfO₂ interface was observed by dark field Scanning Transmission Electron Microscopy and EELS. Interfacial roughness of NiSi_x/HfO_x was found higher than that of poly-Si/HfO₂, likely due to compositional non-uniformity of NiSi_x. No intermixing between Hf, Ni and Si beyond interfacial roughness was observed.     

t-Model mechanism of high-Tc cuprates

A doublon formalism ofd-p model Hubbard Hamiltonian is studied only with transfer integrals, and without the superexchange term. This gives excellent doping-dependent features ofT _c in high-T _c cuprates.     

Effect of pressure onTc in La2-xBaxCuO4 withx=0.125

The superconducting transition temperature,T _c , of La_2–x Ba _x CuO₄ has been measured under high pressure up to 8 GPa.T _c is found to change drastically at the pressure where the structural phase transition takes place. This finding clearly indicates that there exists an intimate relation between the crystal structure and superconductivity.     

Properties of CdxPb1−xTe thin films

Thin films of Cd_xPb_1?xTe have been grown on mica substrates using a flash evaporation technique and isothermal substrate heaters. The Cd concentration of the films was found to increase with decreasing substrate temperature and increasing deposition rates. The Hall coefficient changed from positive to negative with increasing substrate temperature, as did the Seebeck coefficient. Both these changes were associated with an increase in the rate of re-evaporation of Te and an improvement in the crystallinity of the films. Carrier mobilities less than bulk values were obtained; scattering mechanisms are discussed.     

Magnetron sputtering of TiOxNy films

This article reports on the characterization and preparation of N-doped titanium dioxide (TiO₂) films by reactive magnetron sputtering from Ti(99.5) targets in a mixture of Ar/O₂/N₂ atmosphere on unheated glass substrates. A dual magnetron system supplied by a dc bipolar pulsed power source was used to sputter the TiO_xN_y films. The amount of N in the TiO_xN_y film ranges from 5 to 40 at%. Its structure was measured using X-ray diffraction (XRD), the optical band gap was calculated from Tauc plots and the decrease of the water contact angle α_ir after the film activation by UV irradiation was investigated as a function of at% of N in the TiO_xN_y film. The yellow-coloured TiO_xN_y films with high (≈8 at%) amount of N exhibited a strong decrease of the band gap E_g down to 2.7 eV. A significant decrease of the water contact angle α_ir after UV irradiation has been observed for 2 μm thick transparent nanocrystalline (anatase+rutile) N-doped TiO₂ films containing less than 6 at% of N.     

Optimization of the thickness of glass/TiO2/Ag/Ti/TiO2/SiON multilayer film

The TiO₂/Ag/Ti/TiO₂/SiON multilayer film was deposited on glass substrate at room temperature using magnetron sputtering method. By varying the thickness of each layer, the optical property was optimized to achieve good selective spectral filtering performance in Vis-NIR region. The multilayer film achieves maximum transmittance of 92.7% at 690 nm, in which the both TiO₂ layers are 33 nm. For good conductivity and transmittance, a 4 nm Ti layer and a 30 nm SiON layer are necessary.