7.1 GHz bandwidth monolithically integratedIn0.53Ga0.47As/In0.52Al0.48As PIN-HBT transimpedance photoreceiver

A monolithically integrated photoreceiver using an InAlAs/InGaAs HBT-based transimpedance amplifier has been fabricated and characterized. The p-i-n photodiode is implemented using the base-collector junction of the HBT. The 5 μm×5 μm emitter area transistors have self-aligned base metal and non-alloyed Ti/Pt/Au contacts. Discrete transistors demonstrated f_T and f_max of 54 GHz and 51 GHz, respectively. The amplifier demonstrated a -3 dB transimpedance bandwidth of 10 GHz and a gain of 40 dBΩ. The integrated photoreceiver with a 10 μm×10 μm p-i-n photodiode showed a -3 dB bandwidth of 7.1 GHz     

High-performance In0.52Al0.48As/In0.53Ga0.47As HFET compatible with optical-detectorintegration

The authors report the successful demonstration of a 1.0-μm gate InAlAs/InGaAs heterojunction FET (HFET) on top of thick InGaAs layers using lattice-matched molecular beam epitaxy (MBE). This scheme is compatible with metal-semiconductor-metal (MSM) photodetector fabrication. The authors measured the performance of InAlAs/InGaAs HFETs from 0 to 40 GHz. Device performance is characterized by peak extrinsic transconductances of 390 mS/mm and as-measured cutoff frequencies up to 30 GHz for a nominal 1.0-μm-gate-length HFET. HFET device measurements are compared for samples growth with and without the thick underlying InGaAs optical-detector absorbing layer     

Fabrication of In0.25Ga0.75As/InGaAsPstrained SQW lasers on In0.05Ga0.95As ternarysubstrate

A uniform In_0.05Ga_0.95As ternary substrate was grown by using liquid encapsulated Czochralski (LEC) technique with a method of supplying GaAs source material at a constant temperature, and InGaAs/InGaAsP strained single quantum well (SQW) lasers were fabricated on the substrate for the first time. The lasers lased at 1.03 μm and exhibited low threshold current density of 222 A/cm² and excellent characteristic temperature of 221 K, showing that the ternary substrate has a sufficient quality for laser fabrication     

A resistive-gate In0.53Ga0.47As/InPheterostructure CCD

The first InGaAs/InP charge-coupled device (CCD) is demonstrated, exhibiting a charge transfer efficiency (CTE) of 0.98 at 13 MHz and 1 GHz. Cooling the device improves the CTE to greater than 0.99 at 13-MHz clock frequency. The 0.76-eV In_0.53Ga_0.47As bandgap makes this structure applicable to direct-detection short-wavelength infrared (SWIR) imagers     

Performance of interface engineeredSiNx/ICL/InP/In0.53Ga0.47As/InP dopedchannel HIGFET's

SiN_x/InP/InGaAs doped channel passivated heterojunction insulated gate field effect transistors (HIGFETs) have been fabricated for the first time using an improved In-S interface control layer (ICL). The insulated gate HIGFETs exhibit very low gate leakage (10 nA@V_GS =±5 V) and I_DS (sat) of 250 mA/mm. The doped channel improves the DC characteristics and the HIGFETs show transconductance of 140-150 mS/mm (L_g=2 μm), f_t of 5-6 GHz (L_g=3 μm), and power gain of 14.2 dB at 3 GHz. The ICL HIGFET technology is promising for high frequency applications     

High-frequency submicrometerAl0.48In0.52As/In0.53Ga0.47As heterostructure bipolar transistors

The high speed scaling of an Al_0.48In_0.52As/In_0.53Ga_0.47 As submicrometer heterostructure bipolar transistor (HBT) is presented. Transistors with emitter dimensions of 0.5×11 and 3.5×3.5 μm² exhibit unity current-gain cutoff frequencies of 63 and 70 GHz, respectively. Emitter current density greater than 3.3×10⁵ A/cm² is demonstrated in a submicrometer AlInAs/InGaAs HBT. The analysis shows that the device speed is limited by the parasitic collector charging time     

High-performance monolithically integratedIn0.53Ga0.47As/InP p-i-n /JFET optical receiverfront-end with adaptive feedback control

An optical transimpedance receiver front-end that is adaptable to a wide range of bit-rates up to 3 Gb/s has been realized by monolithically integrating high efficiency p-i-n photodiodes with low noise InGaAs junction field effect transistors. The transimpedance-bandwidth product of the receiver is 2.8 THz Ω. The average equivalent input noise current for full circuit bandwidth is 4.0 pA/√Hz. The preamplifier for nonreturn to zero data transmission without equalization of the frequency response at 1.55 μm offers a sensitivity of -41.5 dBm and -29.5 dBm at 140 Mb/s and 2.4 Gb/s, respectively. The dynamic range is 17 dB at 2.4 Gb/s and exceeds 30 dB at 500 Mb/s     

Rapid isothermal annealing of high- and low-energy ion-implantedInP and In0.53Ga0.47As

Rapid isothermal annealing (RIA) was performed on 0.5-16-MeV Si ⁺, 1-MeV Be⁺, and 150-keV Ge⁺ implanted InP:Fe and 380-keV Fe⁺ implanted InGaAs. Annealings were performed in the temperature range 800-925°C using an InP proximity wafer in addition to the Si₃N₄ dielectric cap. Dopant activations close to 100% were obtained for 3×10¹⁴ cm^-2 Si⁺ and 2×10¹⁴ cm^-2 Be⁺ implants in InP:Fe. For the elevated temperature (200°C) 1×10¹⁴ cm^-2 Ge⁺ implant, a maximum of 50% activation was obtained. No redistribution of dopant was observed for Si and Ge implants due to annealing. However, redistribution of dopant was seen for Be and Fe implants due to annealing. Phosphorous coimplantation has helped to eliminate the Be in-diffusion problem in InP, but did not help to reduce Fe in-diffusion and redistribution in InGaAs. Using an RIA cycle with low temperature and short duration is the only solution to minimize Fe redistribution in InGaAs     

Backgating in pseudomorphic In0.15Ga0.85As/Al0.25Ga0.75As MODFET's with a GaAs:Er buffer layer

A new GaAs:Er buffer layer grown by MBE has been developed which significantly reduces backgating currents (by 3 to 4 orders of magnitude) in pseudomorphic InGaAs/AlGaAs modulation-doped field effect transistors (MODFET's). The buffer layer is highly resistive, in the 10 ²-10⁵ Ω·cm range over the Er-doping range investigated. Presence of internal Schottky barriers resulting from high-density ErAs precipitates has been proposed to he the cause of the high resistivity     

InP-based enhancement-mode pseudomorphic HEMT with strainedIn0.45Al0.55As barrier andIn0.75Ga0.25As channel layers

Using strained aluminum-rich In_0.45Al_0.55As as Schottky contact materials to enhance the barrier height and indium-rich In_0.75Ga_0.25As as channel material to enhance the channel performance, we have developed InP-based enhancement-mode pseudomorphic InAlAs/InGaAs high electron mobility transistors (E-PHEMT's) with threshold voltage of about 170 mv. A maximum extrinsic transconductance of 675 mS/mm and output conductance of 15 mS/mm are measured respectively at room temperature for 1 μm-gate-length devices, with an associated maximum drain current density of 420 mA/mm at gate voltage of 0.9 V. The devices also show excellent rf performance with cutoff frequency of 55 GHz and maximum oscillation frequency of 62 GHz. To the best of the authors' knowledge, this is the first time that InP-based E-PHEMT's with strained InAlAs barrier layer have been demonstrated     

Strained layer InxGa1-xAs/GaAs and InxGa1-xAs/InyGa1-yPmultiple-quantum-well optical modulators grown by gas-source MBE

The first results on low-power p-i-n diode modulator structures using strained multiple quantum wells (MQW's) of InGaAs/InGaP grown by gas-source molecular beam epitaxy (MBE) on GaAs are presented. A comparison of transmission, reflection, and photocurrent spectra for these nonresonant devices with those fabricated from InGaAs/GaAs indicates larger modulation, with a maximum change in reflection of >42% observed at 5-V bias at a wavelength of 0.96 μm     

0.2-μm gate-length atomic-planar doped pseudomorphic Al0.3Ga0.7As/In0.25Ga0.75As MODFETswith fT over 120 GHz

The authors report the DC and RF performance of nominally 0.2-μm-gate length atomic-planar doped pseudomorphic Al_0.3Ga_0.7As/In_0.25Ga_0.75As modulation-doped field-effect transistors (MODFETs) with f_T over 120 GHz. The devices exhibit a maximum two-dimensional electron gas (2 DEG) sheet density of 2.4×10¹² cm^-2, peak transconductance g _m of 530-570 mS/mm. maximum current density of 500-550 mA/mm, and peak current-gain cutoff frequency f_T of 110-122 GHz. These results are claimed to be among the best ever reported for pseudomorphic AlGaAs/InGaAs MODFETs and are attributed to the high 2 DEG sheet density, rather than an enhanced saturation velocity, in the In_0.25Ga_0.75As channel     

On the non-ideal characteristics of Schottky-Barrier-gate diodes inIn0.52Al0.48As/In0.53Ga0.47As heterostructure FET's on InP substrates

We report results of determination of the zero-field barrier heights of Schottky-barrier-gate-diodes in InAlAs/InGaAs heterostructure modulation doped FET's by exploiting their temperature dependent I-V characteristics. The field-emission model has been found to account for the gate current flow mechanism particularly at temperatures below 200 K. Using this model the influence of the InAlAs/InGaAs heterostructure potential barrier on the gate current has been delineated and a possible cause behind the current's wide-range of variability, from 10^-1 to 10² A/cm² within 100 mV forward bias, has been suggested     

Enhanced power performance of enhancement-mode Al0.5Ga0.5As/In0.15Ga0.85As pHEMTs using alow-k BCB passivation

Surface passivation technology plays an important role, especially in E-mode pHEMTs applications, and a new passivation technology has been proposed in this study. This novel benzocyclobutene (BCB) passivation layer takes advantage of the low dielectric permittivity (2.7) and a low loss tangent (0.0008). In this letter, we not only suppress the gate-to-drain leakage current but also improve the device power performance under a high input power swing by using a BCB passivation layer. The passivated 1.0 μm-long gate pHEMTs exhibit a better off-state performance than the unpassivated ones. The maximum output power under a 2.4-GHz operation is 118 mW/mm, with a linear power gain of 11.1 dB and a power-added efficiency is 60%     

The structural and electrical properties of the SrTa2O6/In0.53Ga0.47As/InP system

The structural and electrical properties of SrTa₂O₆(SrTaO)/n-In_0.53GaAs_0.47(InGaAs)/InP structures where the SrTaO was grown by atomic vapor deposition, were investigated. Transmission electron microscopy revealed a uniform, amorphous SrTaO film having an atomically flat interface with the InGaAs substrate with a SrTaO film thickness of 11.2 nm. The amorphous SrTaO films (11.2 nm) exhibit a dielectric constant of ∼20, and a breakdown field of >8 MV/cm. A capacitance equivalent thickness of ∼1 nm is obtained for a SrTaO thickness of 3.4 nm, demonstrating the scaling potential of the SrTaO/InGaAs MOS system. Thinner SrTaO films (3.4 nm) exhibited increased non-uniformity in thickness. From the capacitance-voltage response of the SrTaO (3.4 nm)/n-InGaAs/InP structure, prior to any post deposition annealing, a peak interface state density of ∼2.3 × 10¹³ cm⁻² eV⁻¹ is obtained located at ∼0.28 eV (±0.05 eV) above the valence band energy (E_v) and the integrated interface state density in range E_v + 0.2 to E_v + 0.7 eV is 6.8 × 10¹² cm⁻². The peak energy position (0.28 ± 0.05 eV) and the energy distribution of the interface states are similar to other high-k layers on InGaAs, such as Al₂O₃ and LaAlO₃, providing further evidence that the interface defects in the high-k/InGaAs system are intrinsic defects related to the InGaAs surface.     

Characterization of surface-undoped In0.52Al0.48As/In0.53Ga0.47As/InP high electron mobilitytransistors

High-performance 0.3-μm-gate-length surface-undoped In_0.52 Al_0.48As/In_0.53Ga_0.47As/InP high-electron-mobility transistors (HEMTs) grown by molecular beam epitaxy (MBE) have been characterized and compared with a surface-doped structure. At 18 GHz, the surface-undoped HEMT has achieved a maximum stable gain (MSG) of 19.2 dB compared to 16.0 dB for the surface-doped structure. The higher MSG value of the surface-undoped HEMTs is obtained due to the improved g_m/g₀ ratio associated with the surface-induced electric field spreading effect. Comparison of identical 0.3-×150-μm-gate devices fabricated on surface-undoped and -doped structures has shown greatly improved gate leakage characteristics and much lower output conductance for the surface-undoped structure. It is demonstrated that the surface potential, modulated by different surface layer designs, affects the charge control in the conducting channel, especially the carrier injection into the buffer, resulting in excess output conductance. Several millimeter-wave coplanar waveguide (CPW) monolithic distributed amplifiers have been successfully fabricated by using the surface-undoped HEMT structure. A high gain per stage distributed amplifier with 170-dB±1-dB small-signal gain across a frequency band of 24-40 GHz, a W-band monolithic integrated circuit with 6.4-dB gain at 94 GHz, and a broad bandwidth distributed amplifier with 5-dB gain across a frequency band of 5 to 100 GHz have been demonstrated by using the surface-undoped structures     

Silicon and selenium implantation and activation in In0.53Ga0.47As under low thermal budget conditions

Si and Se implantations have been systematically investigated in In_0.53Ga_0.47As. Different implant doses and various activation anneals with temperatures up to 700 °C have been examined. Raising Si implant dose from 1 × 10¹⁴ to 1 × 10¹⁵ cm⁻² was found to increase the active doping concentration by about a factor of two. As confirmed by Transmission Electron Microscopy (TEM) and electrical measurements, the rest of the implanted Si ions remain as defects in the crystal and degrade the mobility. It was also confirmed from Secondary Ion Mass Spectrometry (SIMS) that the Si diffusivity in InGaAs is negligible up to 700 °C implant activation anneal making Si a suitable option for the formation of shallow junctions in InGaAs. The activation efficiency, sheet resistance, carrier density and mobility data of 25 keV Se and Si implanted InGaAs layers are also presented under various activation anneal temperatures.     

120nm栅长In0.7Ga0.3As/In0.52Al0.48As HEMTs 器件

利用新型的PMMA/PMGI/ZEP520/PMGI四层胶T形栅电子束光刻技术制备出120nm栅长InP基雁配In0.7Ga0.3As/In0.52Al0.48As 高电子迁移率晶体管。制作出的InP基HEMT器件获得了良好的直流和高频性能,跨导、饱和漏电流密度、阈值电压、电流增益截止频率和最大单向功率增益频率分别达到520 mS/mm, 446 mA/mm, -1.0 V, 141 GHz 及 120 GHz。文中的材料结构和所有器件制备均为本研究小组自主研究开发。     

The influence of gate-feeder/mesa-edge contacting on sidegatingeffects in In0.52Al0.48As/In0.53Ga0.47As heterostructure FET's

Sidegating effects in InAlAs/InGaAs heterostructure field effect transistors (HFETs) were experimentally investigated. Two different configurations of gate feeder across the mesa edges are compared in In _0.52Al_0.48As/In_0.53Ga_0.47As. HFETs. HEMTs and heterostructure insulated-gate FETs (HIGFETs) were fabricated, each with different gate-feeder configurations. HFETs with the gate air bridge over the mesa edge can maintain 99% of the drain-source (I_ds) current level at sidegate voltages (V_sg) extending up to -30 V, while the non-air-bridge configuration of HFETs show a 30% drop of I_ds at the same V _sg. This significant discrepancy of sidegating effect is attributed to depletion region modulation at the mesa edge below the gate feeder. By lifting the gate feeder above the mesa step, sidegating is reduced, which suggests the channel/substrate trap effects are negligibly small. The role of air-bridge structures in determining the sidegating characteristics is discussed     

Effect of a Two-Step Recess Process Using Atomic Layer Etching on the Performance of In0.52Al0.48As/In0.53Ga0.47As p-HEMTs

The characteristics of 0.15- mum InAlAs/InGaAs pseudomorphic high-electron mobility transistors (p-HEMTs) that were fabricated using the Ne-based atomic layer etching (ALET) technology and the Ar-based conventional reactive ion etching (RIE) technology were investigated. As compared with the RIE, the ALET used a much lower plasma energy and thus produced much lower plasma-induced damages to the surface and bulk of the In_0.52AI_0.48As barrier and showed a much higher etch selectivity (~70) of the InP spacer against the In_0.52Al_0.48As barrier. The 0.15-mum InAlAs/InGaAs p-HEMTs that were fabricated using the ALET exhibited improved G_m,max (1.38 S/mm), I_ONn/I_OFF(1.18X10⁴), drain-induced barrier lowering (80 mWV), threshold voltage uniformity (V_th,avg = -190 mV and alpha = 15 mV), and ftau (233 GHz), mainly due to the extremely low plasma-induced damage in the Schottky gate area.