文献与摘要（144）

电子设备体积缩小带来了热管理问题,挠性PCB与刚性PCB有同样的热管理问题。文章比较了挠性PCB与刚性PCB热管理方面的差异,主要在基材类型和结构不同带来了导热性不同。移动设备不可能再用传统的风扇散热或增加空间对流散热。为解决挠性PCB的热管理问题选用热传导率优的材料,可采用附加金属板、粘贴导热带或导热膜等措施。当然热管理方法选择也要兼顾FPCB的挠曲性和成本。     

无铅焊接与表面贴装连接器

随着电子行业不断要求更小的移动技术产品的趋势，对于移动设备和新技术（如消费电子产品和LCD屏幕）来说，印刷电路板（PCB）上的实际空间资源变得越来越紧张。为了尽量降低各种连接器所占用的PCB空间（包括双面印刷电路板）并迎合高速CEM组装提高生产率的要求，连接器技术已经从标准的PCB插孔式（pin-through-hole,PTH)组装和波峰爆组装转变为现在普遍采用的表面贴装技术（SMT）焊接组装工艺。     

细密线路加工工艺研究

结合行业发展趋势以及在PCB加工过程中的实战经验,通过生产数据总结和试验研究,对细密线路加工影响因素进行了系统全面的分析,从加工工艺、设备选择、物料选择等多纬度进行分析和试验验证,总结出一套适合PCB细密线路生产的解决方案。     

浅述PCB电性测试设备的发展趋势

新的封装技术以及新的工艺将逐步在PCB的制程上使用,PCB的电性能测试将显得格外重要,本文介绍了现阶段PCB电性能测试技术的发展和分类,PCB电性能测试技术和测试设备的现状,未来PCB测试设备的发展方向以及测试设备急需突破的技术瓶颈。     

激光直接成像技术(Ⅱ)——LDI的工艺及材料

激光直接成像(LDI)直接利用数据流、驱动设备在PCB上成像。一方面可以提高细导线制造精度和合格率,使多层PCB对位更加准确:另一方面缩短生产流程,加快周转速度,降低成本,对提高在当今PCB制造业中的竞争力有着重要地位,因而备受关注。通常,在PCB部门接收CAD数据后,可以装入LDI设备的计算机系统或其它CAM工作站上,在对数据进行常规CAM处理后,还要使之格栅化,以适应像素(pixel)阵列的成像方式,并与所用激光束匹配。图1为一典型激光成像设备原理图,从中可以看出数据与光束的关系。光束与平台都在各自方向上移动,激光是连续发射的,但不全打在PCB上,而是通过     

多功能高精度印制板生产设备巡视

随着电子设备的便携和移动化,用户对厚度更薄、孔径更小、布线密度更高的印制电路板(PCB)需要十分殷切,因此,PCB生产设备制造商积极开发和提供能满足用户需求日益变化的新设备。写入线宽为50μm的激光成像系统已上市,装有紧急断路装置和报警装置的层压板自动切割机已大量供应,为保护环境和节约资源,制造商已开发并提供去离子水回收装置和废水、废气处理设备。     

PCB分析仪实现高速高精度PCB测试

根据安捷伦科技公司所获取的数据,预计从2014年底到2017年,PCB的制造市场每年平均成长率约5％,其中10％是来自于移动终端的PCB,如手机、平板或PC等。为了保证产品的品质,很多情况下,工厂需要对移动产品的PCB进行全测。但由于对移动PCB的测量速度、阻抗要求都比较高,并且元器件的数量非常多,因此,不仅要求对PCB进行全自动测量,     

定颖电子将在厦门设立新光电板厂

定颖电子为充分掌握中国勃兴的面板业向南移动商机，经董事会决议投资2400万美元在厦门海沧出口加工区设立新PCB厂，主要仍以掌握光电板客户为主。     

中国PCB设备发展概况及前瞻

近年来,中国PCB设备在PCB行业发展的带动下发展十分迅猛.PCB设备在PCB制造中占、有极为重要的地位,达到PCB企业总投资的60％以上,PCB技术的提升是依赖于PCB设备水平的提升.中国PCB设备的发展速度快、规模大,但也存在一定的制约因素.我们期待中国的PCB设备行业能为促进PCB行业技术的提高起到更大的推动作用.     

在PCB中集成光数据流的制造

介绍了在PCB中采用埋入光互连波导形成集成光数据流的技术。     

Fabrication and Reliability of Rigid-Flexible Optical Electrical Printed Circuit Board for Mobile Devices

A rigid-flexible optical and electrical printed circuit board (RFOE-PCB) was fabricated using a conventional PCB manufacturing process for mobile devices. The RFOE-PCB was designed to be embedded with a flexible 45-ended optical waveguide. In order to apply it to mobile devices, a repeating folding test and an environment test were carried out for physical and optical reliability. The RFOE-PCB successfully passed the reliability tests.     

Photonic nano-device for optical signal processing

Micro/nanostructure photonic devices offer a variety of enabling properties,including low powerconsumption,cost-efficient,compact size,and reliability.These distinctive features have been exploited in a wealth of applications ranging from telecommunication and optical interconnect to photonic network on chip.In this paper,we review two main classes of micro/nanostructure photonic devices,to provide the kinds of functions for optical signal processing.     

一种平滑大气湍流效应的小型化光学天线设计

大气湍流严重影响着无线光通信链路的可靠性和稳定性,已经成为无线光通信设备面向工程化应用的瓶颈。文章通过对比分析用来平滑、克服大气湍流效应的不同方法与手段,提出了一种基于空间分集技术的光学天线设计方案,以期满足工程化应用的需要。     

Demodulation algorithm with movement robustness for optical camera communications

Due to the low sampling rate of the camera based receiver, the movement of communication devices becomes a factor that cannot be ignored in the demodulation of optical camera communications (OCC). In this paper, we propose the block matching demodulation (BMD) algorithm, which is a movement-robust and optical-interference-resistant demodulation method for OCC. The BMD algorithm can resist the movement of communication devices by locating communication light source per image and immunize optical interference by utilizing the fast time-varying characteristic of communication light source. Moreover, in order to enhance the reliability of communication systems, BMD algorithm and Manchester decoding are combined to realize error detection and correction without increasing the overhead of encoding. Finally, we build a practical mobile OCC system to test the performance of BMD algorithm. Experimental results show that the BMD algorithm can resist the movement of communication devices effectively and achieve reliable demodulation.     

Multiple impact characterization of wafer level packaging (WLP)

Wafer level packaging (WLP) of connectivity RF components for mobile devices has emerged as a low-cost and high performance, enabling technology. WLP devices are electronic components with an exposed die that utilizes a ball pitch compatible with standard surface mount technology (SMT) equipment and common printed circuit board (PCB) design techniques. WLP allows the devices to be directly mounted to the PCB of portable devices. One concern of adopting WLP for mobile device applications is reliability under multiple dynamic loading conditions, such as phone drop, due to the fragile nature of the exposed silicon die and the unique packaging designs. A series of dynamic 4-point bend tests were conducted to evaluate the multiple impact reliability of WLP samples. The purpose of this work was to better understand the failure modes and actual reliability of WLP under uniaxial loading, which is commonly observed in mobile drop simulations and tests. The results have been applied to WLP failure prediction for the system-level drop test by using simulation technology.     

改进Friese光致旋转理论的模拟及实验分析

为验证改进Friese光致旋转理论的合理性和可靠度,搭建了实时、快速测量单轴双折射样品粒子转动情况的光镊实验平台。捕获激光微束首先被聚光镜收集,经二向色镜和成像透镜后被四象限探测器接受,四象限探测器的信号变化反映了微观物体在囚禁光阱的运动情况,然后使用数据采集卡采集四象限探测器的信号,最后通过信号和图像处理分析得到样品粒子的运动情况,并把实验结果与理论分析对比。结果表明,改进Friese理论的模拟曲线与测得的实验数据更相符。该激光光镊系统可用于驱动微纳机械装置、测量微纳系统的力学参数以及组装生物器件等。     

半导体器件热特性的光学测量技术及其研究进展

热失效是影响半导体器件的性能和可靠性的主要原因,热特性和温度测量是整个电子系统热设计过程中的关键环节.光学测量方法具有非接触、无损伤的优势,在半导体及电子系统研究领域应用日益广泛.评述了各种半导体器件热特性光学测量技术的工作原理、实验装置、技术指标、应用现状,总结了现有方法中的关键问题和发展方向.     

Reliability of the OS-280M Optical Submarine Repeater

The development phase of the OS-280M optical submarine cable system is finished, and currently the mass production lines for the system are arranged so as to satisfy the specific performances and the reliability requirements for the TPC-3 system within its system life of 25 years. KDD developed the reliability assurance system of the repeater components, which began three years ago. In this paper, we will introduce the reliability design of the OS-280M system and will report on the reliability test results obtained until the present time. In conclusion, it will be demonstrated that all of repeater components, i.e., optical semiconductor devices, monolithic IC's, several kinds of optical devices, and conventional components could satisfy the reliability requirements for the OS-280M system.     

光纤通信仍然是最主要的传输技术

ITU组织的4年一度的国际电信博览会是通信领域规模最大的展览会 ,Telecom99又是国际电信博览会中规模最大的一次。本报告以参观Telecom99所了解的情况为基本内容 ,介绍了近年来光通信技术的发展情况 ,说明光纤通信仍然是最主要的传输技术。本报告从光纤通信设备和系统、光纤光缆、光器件、光仪表、工程施工及其它等几个角度介绍光纤通信在核心网方面的最新进展 ,光接入网的技术另有专题报告 ,本文不再赘述。     

Modern IC packaging trends and their reliability implications

Reliability aspects are of extreme importance for assembly and packaging, which has become a limiting factor for both cost and performance of electronic systems. On the one hand reliability can be negatively influenced by modern front-end and packaging technology, on the other hand new applications and corresponding field requirements can result in the need for new reliability tests e.g. for mobile devices. Today the three main package trends for mobile devices towards ongoing miniaturization and higher system integration are ball grid array type packages, leadless packages, and wafer level type packages. We present reliability implications based on examples of failures in these modern packaging technologies. We highlight the importance of design for reliability based on results of simulations for a leadless package. For the future it is necessary that test conditions must follow the field requirements to guarantee optimum reliability results.