Fabrication of ceramic microcomponents using deep X-ray lithography

In the last years the fabrication of micro components made from ceramic materials became more and more evident with respect to the pronounced chemical stability and the outstanding thermomechanical properties in comparison to plastics and metals. The aim of this work is the lithographic generation of ceramic microstructures avoiding an intermediate molding step using SU8 as pronounced sensitive resist matrix filled with fine ceramic powder in the submicron range. Focus of the research was to investigate the composite formation, patterning by x-ray lithography, developing, debinding and sintering to form stable ceramic parts. The addition of fine ceramic particles to low viscous liquids like SU8-10 leads to an increase of the viscosity. For a successful debinding and sintering a volume content of at least 40% ceramic is required resulting in a change of the viscosity from around 2 Pas up to a value of 1000 Pas at 25 °C and low shear rates. A modified casting procedure was developed for the formation of uniform resist films with a thickness around 300 m. Optimized exposure and development parameters allow the fabrication of good quality resist structures that can be further transformed into ceramic structures by sintering. Details of the work and results will be presented and discussed in this paper.At this point the authors would like to thank all people who supported this work.     

Fabrication of ceramic microcomponents and microreactor for the steam reforming of ethanol

Ceramics have several advantages over other materials in MEMS, such as heat resistance, hardness, corrosion resistivity even in harsh environments, chemical inertness for biological applications and catalytic activity of surfaces and so on. For these advantages ceramic microstructures will be very potentially useful in microsystem, especially in microreactor. A novel method for the high aspect ratio micro ceramic structures fabrication based on deep X-ray lithography and lost-mold technique is developed. By using this method, ceramic microreactors have been successfully fabricated. The ceramic microreactor consists of 14 identical microchannels in parallel, each with typical dimensions of approximately 300 μm in width, 400 μm in height and 20 mm in length. The Ni film catalyst with thickness of 300 nm is uniformly coated through sputtering process. The steam reforming of Ethanol into hydrogen on the ceramics microreactor was studied at temperatures between 500 and 700°C. The microreactors have been characterized by studying of C₂H₆O conversion, H₂ selectivity, and product stream composition.     

Manufacturing costs for microsystems/MEMS using high aspect ratio microfabrication techniques

The emphasis on high aspect ratio micromachining techniques for microsystems/MEMS has been mainly to achieve novel devices with, for example, high sensing or actuation performance. Often these utilize deep structures (100–1,000 μm) with vertical wall layers but with relatively modest spatial resolution (1–10 μm). As these techniques move from research to industrial manufacture, the capital cost of the equipment and the cost of device manufacture become important, particularly where more than one micromachining technique can meet the performance requirements. This paper investigates the layer-processing costs associated with the principal high aspect ratio micromachining techniques used in microsystems/MEMS fabrication, particularly silicon surface micromachining, wet bulk etching, wafer bonding, Deep Reactive Ion Etching, excimer laser micromachining, UV LIGA and X-ray LIGA. A cost model (MEMSCOST) has been developed which takes the financial, operational and machine-dependent parameters of the different manufacturing techniques as inputs and calculates the layer-processing costs at the wafer and chip level as a function of demand volume. The associated operational and investment costs are also calculated. Cost reductions through increases in the wafer size and decreases in chip area are investigated, and the importance of packaging costs demonstrated.     

Quasi-static and cyclic testing of specimens with high aspect ratios produced by micro-casting and micro-powder-injection-moulding

 The presented investigations of material properties of micro-components have been carried out in one project of the DFG Collaborative Research Centre (SFB) 499 “Development, production and quality assurance of moulded micro-components made out of metallic and ceramic materials” [SFB01]. The aim of this SFB is to develop production methods for micro-components in large-, middle and short-batches, where the applied metallic and ceramic materials can sustain high stresses and are wear-resistant, e.g. in relation to plastics. A micro-turbine and a sun-and-planet gearing with three stages (outside diameter: 1.9 mm; already realised in plastic [THü99]) are planned as a demonstration device. However, for the design of such micro-components, no reliable data for material states in small dimensions are available. Therefore, bending-specimens made out of micro-cast Stabilor G and out of micro-powder-injection-moulded ZrO₂ were investigated with respect to their behaviour under quasi-static as well as under cyclic loading. Received: 10 August 2001/Accepted: 24 September 2001     

Characterisation of high aspect ratio non-conductive ceramic microstructures made by spark erosion

The spark erosion process is widely used for micro structuring. Its possibility to structure materials independent of their material properties like high hardness or melting temperature enables to address a large material diversity. However the process requires a minimal electrical conductivity of 0.1 Scm⁻¹. Nevertheless recent research has shown that the usage of an assisting electrode makes a processing of non-conductive materials possible. Thus even ceramics like Al₂O₃ or ZrO₂ can be processed. These materials are becoming more and more interesting for industrial application and the field of miniaturisation due to their outstanding material characteristics like high hardness, bending strength, melting temperature and chemical inertness. In this study a new lacquer based assisting electrode is used to erode bars in zirconia samples. For this purpose a modular tool concept is established. Bars with aspect ratios of more than 80 are generated. The achieved bar heights are 1.5 mm and the smallest bar width is 8 μm. Furthermore a characterisation of the sidewall angles showed mean values between 0.4° and 2.2° depending on the bar height and width.     

Replication processes for metal and ceramic micro parts

To cover the demand for effective manufacturing of metal and ceramic micro components two process technologies are described. The first one can be regarded as a special variant of micro powder injection molding (MicroPIM): inmold-labeling using powder filled feedstocks. Its basic procedures are the backfitting of powder filled foils by an injected PIM-Feedstock and the subsequent co-debinding and co-sintering steps. For example, two-material ceramic parts with microstructured surfaces could be produced and compacted with mostly tight interfaces. The second process conduct combines two-component and insert injection molding with an electroforming process. Since all process steps involved are based on technologies suitable for series production, low product costs per unit will be realistic. Surface qualities and dimensional accuracies are comparable or even better than achieved if applying alternative processes like MicroPIM.     

Challenges with high aspect ratio nanoimprint

When nanoimprint is not used for lithography purposes (NIL), but for the direct patterning of polymeric layers, high aspect ratio patterns may be of interest for a number of applications. The definition of such patterns in a nanoimprint process deals with two aspects, a successful filling of the high aspect ratio cavities of the stamp used, followed by a successful separation of the high aspect ratio structures defined in the polymeric layer on the substrate, from the stamp. These two aspects are addressed by shedding light to the impact of capillary effects during the filling of high aspect ratio cavities, and to the deformation processes involved in the separation of the stamp from the polymeric structures, where adhesional energies have to be overcome without cohesional failure. Both aspects are discussed in terms of the geometries involved, the stamp geometries as well as the polymeric layer thickness, and correlations with thermally-assisted (T-NIL) and UV-assisted (UV-NIL) processing are deduced. The aspects discussed are typical of a nanoimprint situation with thin polymeric layers on hard substrates.     

Micro-ECM for production of microsystems with a high aspect ratio

The most used processes for production of microsytem components are basically from the semiconductor technology. The material properties of used silicon often dont achieve the demands of for example: micro-surgery, biotechnology life science, fluidics or high temperature environment. For microstructuring of highly stressed metals, like stainless and heat resisting steels, cold work tool steels, hot work tool steels and nickel-base-alloys and a variety of metals there is no manufacturing-process. An interesting possibility for structuring this type of materials are the electrochemical machining processes (ECM). Some new developed ECM-sinking-processes are working with oscillating tool-electrode, to improve shape accuracy.     

Replication and bonding techniques for integrated microfluidic systems

From the technical and economic points of view, systems integration, and packaging represent a crucial step in the production of microsystems. Compared to purely silicon- or glass-based systems, the variety of materials and geometries available for purely polymer microfluidic systems is much larger, due to the outstanding material properties. Moreover, polymers may be shaped and joined by comparably simple methods. Examples are polymer microreplication as well as various bonding methods. With them, complete polymer microsystems can be integrated. In addition, a number of established, compatible processes are available for the integration of functional elements that may also be made of other materials.

     

Replication and bonding techniques for integrated microfluidic systems

From the technical and economic points of view, systems integration, and packaging represent a crucial step in the production of microsystems. Compared to purely silicon- or glass-based systems, the variety of materials and geometries available for purely polymer microfluidic systems is much larger, due to the outstanding material properties. Moreover, polymers may be shaped and joined by comparably simple methods. Examples are polymer microreplication as well as various bonding methods. With them, complete polymer microsystems can be integrated. In addition, a number of established, compatible processes are available for the integration of functional elements that may also be made of other materials.     

ARATIO: Calculating grain aspect ratios from serial-section data

ARATIO, a FORTRAN program, uses data entered from SEM micrographs of consecutive thin sections of rocks to measure three orthogonal caliper diameters for each grain or pore in the series. Such output data can be used to analyze grain or pore size, shape packing, and orientation within the sample or sampled formation. The program then can produce tables showing the distribution of the diameters, and also will store the data for further processing.     

不同宽高比的V型随行波表面减阻仿真研究

为获得内壁具有不同宽高比的V型随行波的管道模型的微观流场及减阻规律,使用计算机软件对各模型进行了不同速度下的一系列数值仿真计算。在建模过程中为减小计算量,采用了二维管道剖面代替三维管道模型的方法,并选用了更适于旋转流和近壁湍流的湍流RNG K-ε模型进行计算。仿真结果表明：在流动中,管道内壁随行波产生有利于壁面减阻的旋涡,且旋涡疏密与随行波的宽高比有关。相同高度条件下,减阻效果会随着随行波宽高比的变大而增强。结果为减阻技术的工程化应用提供了重要依据。     

The micromilling process for high aspect ratio microstructures

High aspect ratio microstructures are currently created by several processes which include lithography (X-ray, deep ultraviolet, etc.) and mechanical machining (diamond machining, microdrilling, etc.) The lithographic processes require more extensive processing equipment such as an energy source, mask/mask holder/mask aligner, photoresist and substrate, and chemical development capacity. In addition, these processes are serial in nature and each adds to the tolerances of the finished structure. The current mechanical processes provide for the direct removal of the substrate material in a single step but are more limited in the geometric patterns which can be created. In conventional machining, the process which provides the most versatility in geometric patterns is milling. The micromilling process has two basic components. The first is the fabrication of small milling cutters with very sharp cutting edges. The second is the actual removal of the workpiece material with a very precise and repeatable machine tool. Several basic cutter designs have been fabricated using focused ion beam micromachining and are undergoing testing. The cutter diameters are nominally 100 micrometers and 22 micrometers. Results have been obtained which show that this process can be very effective for the rapid fabrication of molds and mask structures.     

The micromilling process for high aspect ratio microstructures

 High aspect ratio microstructures are currently created by several processes which include lithography (X-ray, deep ultraviolet, etc.) and mechanical machining (diamond machining, microdrilling, etc.). The lithographic processes require more extensive processing equipment such as an energy source, mask/mask holder/mask aligner, photoresist and substrate, and chemical development capacity. In addition, these processes are serial in nature and each adds to the tolerances of the finished structure. The current mechanical processes provide for the direct removal of the substrate material in a single step but are more limited in the geometric patterns which can be created. In conventional machining, the process which provides the most versatility in geometric patterns is milling. The micromilling process has two basic components. The first is the fabrication of small milling cutters with very sharp cutting edges. The second is the actual removal of the workpiece material with a very precise and repeatable machine tool. Several basic cutter designs have been fabricated using focused ion beam micromachining and are undergoing testing. The cutter diameters are nominally 100 micrometers and 22 micrometers. Results have been obtained which show that this process can be very effective for the rapid fabrication of molds and mask structures. Received: 30 October 1995 / Accepted: 4 March 1996     

New development strategies for high aspect ratio microstructures

 In the first step of the LIGA process a resist layer, typically PMMA (polymethylmethacrylate), is pattered by deep X-ray lithography. The exposed parts are subsequently dissolved by an organic developer. The quality and the achievable height of the microstructure is decisively determined by the development process. In order to increase the aspect ratio and maintain the quality of the microstructures the parameters influencing the development process were investigated. In the case of dip development and ultrasound development a strong dependency of the development rate on the temperature, dose value and depth of deposition has been noticed. The development rate increases with increasing dose value and temperature and decreases with increasing depth of deposition. In case of dip development the development course can be described by a phenomenological equation which considers the three mentioned parameters. In the case of ultrasound further parameters have to be taken into account: the geometry and the dimensions of the strucutres. Received: 25 August 1997/Accepted: 3 September 1997     

Replication techniques for speeding up parallel applications on distributed systems

Most methods for programming loosely coupled systems are based on message-passing. Recently, however, methods have emerged based on ‘virtually’ sharing data. These methods simplify distributed programming, but are hard to implement efficiently, as loosely coupled systems do not contain physical shared memory. We introduce a new model, the shared data-object model, that eases the implementation of parallel applications on loosely coupled systems, but can still be implemented efficiently. In our model, shared data are encapsulated in passive data-objects, which are variables of user-defined abstract data types. To speed up access to shared data, data-objects are replicated. This ability to replicate objects is a significant difference with other object-based models (e.g. Emerald and Amber). Also, by replicating logical objects rather than physical pages, our model has many advantages over shared virtual memory systems. This paper discusses the design choices involved in replicating objects and their effect on performance. Important issues are: how to maintain consistency among different copies of an object; how to implement changes to objects; which strategy for object replication to use. We have implemented several options to determine which ones are the most efficient.     

Manufacturing of microstructures with high aspect ratio by micromachining

The development of micromachining plays an important role in miniaturization of microsystems. Micromachining is a very flexible and compared to EDM or ECM a very fast machining process with a high material removal rate. A wide range of materials like polymers, metals and alloys as well as some sorts of ceramics can be machined. Also 3D-structures can be easily manufactured. Additionally, big advances have been made concerning the realization of high aspect ratios for small diameter end mills. Whereas end mills below 100 μm diameter are limited to an aspect ratio of 1.5, end mills of 100 μm diameter are available up to an aspect ration of ten now. A few years ago, end mills in this diameter range were uncoated. Nowadays, there was a big progress in the coating technology so that these end mills can be coated with layers as thin as 0.5 μm.     

A new removable resist for high aspect ratio applications

A variety of different photo resists are used for fabrication of MEMS. Presently good results were reported for SU-8, a chemically amplified negative tone photoresist. But SU-8 has a disadvantage for some applications in LIGA technique, especially in the X-ray mask fabrication. After processing the finished resist pattern are hardly soluble from the substrate. This paper will briefly describe the current status of the development of the new negative tone photoresist CAR 44 whose big advantage is the easy removableness of the cross linked pattern. This work widely uses the contents of the presentation “A New Removable Resist for High Aspect Ratio Applications” to the High Aspect Ratio Micro Structure Technology workshop HARMST 2005 held in Gyeongyu (Republic of Korea), June 10–13, 2005.     

Developing new markets for high aspect ratio micro-machined devices

 This paper reports on the commercialization strategy being developed by MEMStek Products, LLC (formerly CONCIS) to startup a component business using sacrificial LIGA (S-LIGA) as the initial manufacturing technology. S-LIGA provides the ability to fabricate fluidic, mechanical, and optical components and modules in the mesoscopic scale that exists between conventional silicon micro-machining and precision machining tools such as molding, stamping, and embossing. S-LIGA technology commercialization has some unique challenges. The S-LIGA technology must be developed from its current state into a viable manufacturing process. Since nearly every device fabricated sees x-ray exposure at least once, this creates the need for a production oriented synchrotron facility with the capacity for handling substantial wafer volume. Reliably electro-plating into 0.01 mm feature size becomes a major technical challenge to overcome. Finally, targeting the initial applications for the market requires a careful selection of initial customers and partners. Received: 25 August 1997/23 November 1997