共查询到18条相似文献,搜索用时 171 毫秒
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共振隧穿器件应用电路概述——共振隧穿器件讲座(2) 总被引:1,自引:0,他引:1
在“共振隧穿器件概述”的基础上,对共振隧穿器件应用电路作了全面概括的介绍。首先对共振隧穿器件应用电路的特点、分类和发展趋势作了简述;进一步对由RTDH/EMT构成的单-双稳转换逻辑单元(MOBILE)和以它为基础构成的RTD应用电路,包括柔性逻辑、静态随机存储(SRAM)、神经元、静态分频器等电路的结构、工作原理和逻辑功能等进行了介绍。关于RTD/HEMT构成的更为复杂的电路,如多值逻辑、AD转换器以及RTD光电集成电路等将在本讲座最后部分进行讲解。 相似文献
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带间共振隧穿二极管(RITD)是导带与价带间发生共振隧穿的两端器件,其特点是启始电压VT和峰值电压Vp较低,电流峰谷比PVCR较大。在导出RITD物理模型和其电流密度方程的基础上重点介绍了InAs/AlSb/GaSbⅡ类异质结RITD、n+InAlAs/InGaAs/InAlAs/In-GaAs/p+InAlAsp-n结双势阱Ⅰ类RITD以及δ掺杂RITD三种RITD的器件结构、材料结构、工作原理、器件特性和参数等,并对这三种RITD的特点进行了比较和讨论。 相似文献
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依据RTD/HEMT串联型RTT的概念,设计了RTD/HEMT单片集成材料结构,该结构采用分子束外延技术生长.采用湿法化学腐蚀、金属剥离、台面隔离和空气桥互连技术,研制了RTD/HEMT串联型RTT,并对RTT及RTT中RTD和HEMT的直流特性进行了测试.测试结果表明:在室温下,器件具有明显的栅控负阻特性,正接型RTT的最大峰谷电流之比在2.2左右,反接型RTT的最大峰谷电流之比在4.6左右.实验为RTD/HEMT串联型RTT性能的优化和RTD/HEMT单片集成电路的研制奠定了基础. 相似文献
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依据RTD/HEMT串联型RTT的概念,设计了RTD/HEMT单片集成材料结构,该结构采用分子束外延技术生长.采用湿法化学腐蚀、金属剥离、台面隔离和空气桥互连技术,研制了RTD/HEMT串联型RTT,并对RTT及RTT中RTD和HEMT的直流特性进行了测试.测试结果表明:在室温下,器件具有明显的栅控负阻特性,正接型RTT的最大峰谷电流之比在2.2左右,反接型RTT的最大峰谷电流之比在4.6左右.实验为RTD/HEMT串联型RTT性能的优化和RTD/HEMT单片集成电路的研制奠定了基础. 相似文献
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通过对共振隧穿器件的特点、分类、工作原理、电流成分、器件参数等的介绍,为初学人员或非专业爱好人员提供一个对共振隧穿器件全面的、概括性的认识。 相似文献
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已研制成了肖特基栅共振隧穿晶体管,在双势垒结构上蒸发铂金形成栅。通过调制准二维电子积累层的面积进而达到控制隧穿电流的目的。并对发射极正反接电压不同而出现的不同调制现象进行了分析。 相似文献
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The concepts of the low-conductance drain (LCD) design approach for lattice-matched InAlAs/InGaAs/InP HEMTs are demonstrated for improved device performance. The tradeoff for LCD HEMT characteristics is a tapered current gain cutoff frequency f t under high drain-to-source bias. This behavior is, in principle, due to the fact that the LCD approach increases the effective gate length of the HEMTs in exchange for reduced peak channel electric field. Two-dimensional PISCES simulation was used to optimize the improvements while simultaneously minimizing this undesirable effect for an LCD HEMT structure 相似文献
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用MBE设备在半绝缘的InP衬底上依次生长高电子迁移率晶体管(HEMT)外延材料和共振遂穿二极管(RTD)外延材料,在此材料结构基础上研究和分析了RTD与HEMT器件单片集成工艺中的隔离工艺、欧姆接触工艺、HEMT栅挖槽工艺和空气桥工艺等几步关键工艺,给出了这些工艺的相关参数。利用上述工艺成功地制作了RTD和HEMT器件,并在室温下分别测试了RTD器件和HEMT器件的电学特性。测试表明:在室温下,RTD器件的峰电流密度与谷电流密度之比(PVCR)为3.66;HEMT器件的最大跨导约为370 mS/mm,在Vds=1.5 V时的饱和电流约为391 mA/mm。这将为RTD与HEMT的单片集成研究奠定工艺基础。 相似文献
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《Electron Devices, IEEE Transactions on》1985,32(1):11-17
In MESFET and HEMT structures as the gate length is reduced below 0.5 µm in an attempt to achieve amplification at highest possible frequencies, it is essential that the depletion depth under the gate be also reduced in order to preserve a high aspect ratio that ensures a high device voltage gain factor (gm /g0 ) and a reasonable value of stable power gain at high frequencies. Results based on this design approach indicate that an n-A1GaAs/GaAs HEMT structure with 0.25-µm gate length could provide stable power gain in excess of 6 dB at the unity current gain frequency of 92.4 GHz, and for an aspect ratio of ten it is difficult to reduce the gate length below 0.25 µm. 相似文献
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《半导体学报》2010,31(2)
This Daper describes the first domestic Ku-band power AlGaN/GaN HEMT fabricated on a sapphire substrate.The device with a gate width of 0.5 mm and a gate length of 0.35 μm has exhibited an extrinsic current gain cutoff frequency of 20 GHz and an extrinsic maximum frequency of oscillation of 75 GHz.Under V_(DS)=30 V, CW operating conditions at 14 GHz,the device exhibits a linear gain of 10.4 dB and a 3-dB-gain-compressed output power of 1.4 W with a Dower added efficiency of 41%.Under pulse operating conditions,the linear gain is 12.8 dB and the 3-dB-compressed output power is 1.7 W The power density reaches 3.4 W/mm. 相似文献
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Christian Pacha Oliver Kessler Peter Glo¨seko¨tter Karl F. Goser Werner Prost Andreas Brennemann Uwe Auer Franz J. Tegude 《Analog Integrated Circuits and Signal Processing》2000,24(1):7-25
Quantum-effect devices utilizing resonant tunneling are promising candidates for future nano-scale integration. Originating from the technological progress of semiconductor technology, circuit architectures with reduced complexity are investigated by exploiting the negative-differential resistance of resonant tunneling devices. In this paper a resonant tunneling device threshold logic family based on the Monostable-Bistable Transition Logic Element (MOBILE) is proposed and applied to different parallel adder designs, such as ripple carry and binary carry lookahead adders. The basic device is a resonant tunneling transistor (RTT) composed of a resonant tunneling diode monolithically integrated on the drain contact layer of a heterostructure field effect transistor. On the circuit level the key components are a programmable NAND/NOR logic gate, threshold logic gates, and parallel counters. The special properties of MOBILE logic gates are considered by a bit-level pipelined circuit style. Experimental results are presented for the NAND/NOR logic gate. 相似文献
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Ting-Ih Hsu Gerald Swift Jitendra Goel John Berenz Kenichi Nakano 《Journal of Infrared, Millimeter and Terahertz Waves》1986,7(7):999-1004
A 44-GHz amplifier using 0.25-μm gate length and double-heterojunction structure HEMT devices is described. Higher gain and power performance have been obtained from the amplifier using this device at millimeter-wave frequencies. A spot gain of 9.4 dB and a 1-dB gain compression point of +7.5 dBm has been achieved at 43.5 GHz. 相似文献