RF磁控溅射制备Al_2O_3薄膜及其介电性能研究

以-αAl2O3为靶材,采用射频磁控溅射法制备了非晶Al2O3薄膜。利用X射线衍射仪、扫描电镜、划痕仪、表面粗糙轮廓仪和阻抗仪研究了不同溅射功率和不同溅射气压对薄膜制备的影响,探索了不同溅射功率下制备的Al2O3薄膜的介电常数和介电损耗与频率的关系。试验结果表明,制备的非晶Al2O3薄膜表面平滑致密;随着工作气压的增加,薄膜沉积速率增加;随着溅射功率的增加,Al2O3薄膜的沉积速率和介电常数逐渐增加、介电损耗逐渐减小;随着频率的增加,Al2O3薄膜的介电常数逐渐减小,高频阶段趋于稳定。     

射频磁控溅射法制备HfSiON高k薄膜的结构特性

在室温下,采用射频磁控溅射法在p型Si(111)衬底上制备了HfSiON高k栅介质薄膜。用X射线光电子能谱(XPS)分析了HfSiON薄膜的成分,用掠入射X射线衍射(XRD)检测了薄膜的结构,用高分辨率扫描电子显微镜(HRSEM)、原子力显微镜(AFM)观察了薄膜断面和表面形貌。XRD谱显示,HfSiON薄膜经900℃高温退火处理后仍为非晶态。HRSEM断面和AFM形貌像显示所制备的薄膜具有非常平整的表面,表明薄膜具有优良的热稳定性。电学测试表明,HfSiON薄膜具有较好的介电特性,其介电常数较高为18.9,漏电流密度较低在+1.5V为2.5×10-7A/cm2。这些特性表明HfSiON薄膜是一种很有希望替代SiO2的新型高k栅介质材料,同时也表明射频磁控溅射法是一种制备HfSiON新型高k栅介质薄膜的有效方法。     

反应RF磁控溅射法制备非晶氧化硅薄膜及其特性研究

在氧气和氩气的混合气体中,在没有额外加热的条件下用反应射（RF）溅射硅靶制备了非晶氧化硅（a-SiO2)薄膜,并测试分析了薄膜的结构和电特性与O2／Ar流量比的关系。当固定氩气流量,改变氧气流量时,薄膜沉积速率先急剧减少,再增大,然后又减少。当O2／Ar≥0．075时,得到满足化学配比的氧化硅薄膜。并且,随着O2／Ar流量比的增大,薄膜的电阻,电场击穿强度都有所增大,而在HF缓冲溶液（BHF）中的腐蚀速率下降,所有的样品中无明显的H－OH水分子的红外吸收峰。比较发现反应射频（RF）磁控溅射法制备的a-SiO2薄膜具有良好的致密性和绝缘性。     

反应RF磁控溅射法制备非晶氧化硅薄膜及其特性研究

在氧气和氩气的混合气体中，在没有额外加热的条件下用反应射频（RF）溅射硅靶制备了非晶氧化硅(a-SiO     

射频反应磁控溅射制备低辐射薄膜

采用射频反应磁控溅射法制备了低辐射薄膜.对低辐射膜的薄膜结构的设计和测试结果表明：较合适的膜层结构是空气/二氧化钛/钛/银/二氧化钛/玻璃基片的多层结构.用扫描电镜分析了保护层钛层的作用,研究表明：银膜很容易氧化失效,失去反射红外紫外光作用,在表面镀覆钛保护层可以很好地保护银,避免银氧化,从而提高使用寿命.用分光光度计测试样品的透射率,当保护层钛层厚度为1 nm时,相应的膜系在可见光区（380 nm～780 nm）,最高透射率可达82.4%,平均透射率是75%;在近红外区（780 nm～2500 nm）的平均透射率为16.2%,可以满足建筑物幕墙玻璃等低辐射膜的要求.     

磁控溅射制备大面积原子级平滑超低电阻率TiN薄膜电极

利用射频反应磁控溅射法制备了大面积原子级平滑的TiN薄膜电极,针对衬底偏压对TiN电极性能与结构的影响进行了系统探究.采用四探针方阻测试仪、XPS、GIXRD和AFM等测试手段对TiN薄膜电极的电阻率、化学成分、择优取向、表面形貌及薄膜均匀性进行表征分析.结果表明,施加-200 V衬底偏压可获得超低电阻率的TiN薄膜电...     

平面射频磁控溅射法制备YSZ薄膜及性能

研究了应用射频磁控溅射法在不同基板上制备ＹＳＺ薄膜和工艺条件对其微观结构的影响。结果表明,在清洁的基板上制备的ＹＳＺ 薄膜经６００ ℃以上热处理后,薄膜表面致密均匀,无裂纹,薄膜与基板的结合紧密。薄膜具有较高的电导率,完全可以作为固体电解质使用。     

能量过滤磁控溅射技术制备ITO薄膜及其特性研究

采用磁控溅射(DMS)和能量过滤磁控溅射(EFDMS)技术在玻璃衬底上制备ITO透明导电薄膜。利用扫描电子显微镜、原子力显微镜、X射线衍射、紫外-可见分光光度计、四探针电阻仪、椭偏光谱仪等对薄膜的性能进行表征和分析,初步探讨了EFDMS技术的成膜机理。研究发现与DMS技术相比,EFDMS技术可有效降低薄膜的表面粗糙度,并且薄膜光电性能有一定改善。     

反应RF磁控溅射法制备氧化铝薄膜及其介电损耗

在氧气和氩气的混合气氛中,利用反应射频磁控溅射铝靶制备了非晶氧化铝薄膜,其直流介电强度为３－４ＭＶ／ｃｍ。当固定氩气流量,改变氧分压时,薄膜沉积速率先减小,再增大,然后又减小。适当的低工作气压和溅射功率下,薄膜的介电损耗可以达到０．４％,小于已报道的关于非晶氧化铝薄膜的损耗。从１００Ｈｚ到５ＭＨｚ,所有的样品均未显示出可见的极化驰豫引起的损耗峰。     

Characterization of zirconium oxynitride films obtained by radio frequency magnetron reactive sputtering

Thin ZrN_xO_y films are deposited on Si (100) substrates by radio frequency (RF) reactive magnetron sputtering of a zirconium target in an argon-oxygen-nitrogen mixture. The Φ_N2/Φ_{(Ar + N2 + O2)} ratio was varied in the range 2.5%-100% while the oxygen flux was kept constant. The films were characterized by combining several techniques: X-ray photoelectron spectroscopy, X-ray diffraction and Secondary Ion Mass Spectroscopy. The relationship between structural and compositional properties and the sputtering parameters was investigated. Increasing nitrogen partial pressure in the gas mixture, a chemical and structural evolution happens. At lowest nitrogen flux, ZrN cubic phase is formed with a very small amount of amorphous zirconium oxynitride. At highest nitrogen flux, only crystalline ZrON phases were found. For the films obtained between these two extremes, a co-presence of ZrN and ZrON can be detected. In particular, chemical analysis revealed the co-presence of ZrO₂, ZrN, ZrON and N-rich zirconium nitride which is correlated with the Φ_N2/Φ_{(Ar + N2 + O2)} values. A zirconium nitride crystal structure with metal vacancies model has been considered in order to explain the different chemical environment detected by X-ray photoelectron spectroscopy measurements. The metal vacancies are a consequence of the deposition rate decreasing due to the target poisoning. It's evident that the growth process is strongly influenced by the zirconium atoms flux. This parameter can explain the structural evolution.     

Thermochromic properties of vanadium oxide films prepared by dc reactive magnetron sputtering

A transparent vanadium oxide film has been one of the most studied electrochromic (EC) and Thermochromic (TC) materials. Vanadium oxide films were deposited at different substrate temperatures up to 400 °C and different ratios of the oxygen partial pressure (P_O2). SEM, AFM and X-ray diffraction's results show detail structure data of the films. IR mode assignments of the films measured by IR reflection-absorbance in NGIA (near grazing incidence angle) are given. It is found that the film has V₂O₅ and VO₂ combined structures. The films exhibit clear changes in transmittance when the environment temperature (T_e) is varied, especially in the 3600-4000 cm^− 1 range. Applying a T_e that is higher than a critical temperature (T_c) to the samples, the as-RT (room temperature) deposited film with 9% P_O2 has a transmittance variation of 30%, but the films that were deposited on a heated substrate of 400 °C have little variation. There is tendency of bigger variation in transmittance for the sample deposited at a larger P_O2, when it is applied by 200 °C T_e.     

氧分压对RF磁控溅射ZrO2薄膜生长特性的影响

采用反应射频(RF)磁控溅射法在n型(100)单晶S基片上沉积了ZrO2膜,研究了氧分压与ZrO：薄膜的表面粗糙度和沉积速率、SiO2中间界层的厚度以及ZrO2薄膜的折射率之间关系。结果表明：随着氧分压增高,薄膜的沉积速率降低,表面粗糙度线性地增加;在低的氧分压情况下,Si基片表面的本征SiO2层的厚度增加幅度较小,在高的氧分压情况下,Si基片表面的本征SiO2层的厚度有较大幅度地增加;在O2／Ar混和气氛下,溅射沉积的ZrO2薄膜的折射率受氧分压的影响不显著,而在纯氧气气氛环境下,ZrO2薄膜的折射率明显偏低,薄膜的致密性变差。     

反应射频磁控溅射法制备HfTaO薄膜的热稳定性和光学性能

采用反应射频磁控溅射技术制备HfTaO薄膜,利用X射线衍射(XRD)分析了薄膜的微结构,通过紫外-可见光分光光度计测量了薄膜的透过谱,计算了薄膜的折射率和禁带宽度,利用原子力显微镜观察了薄膜的表面形貌。结果表明,随着Ta掺入量(10%,26%,50%)的增加,HfTaO薄膜的结晶化温度分别为800、900、950℃,Ta掺入量继续增加到72%,经过950℃退火处理的HfTaO薄膜仍然保持非晶态,具有优良的热稳定性。AFM形貌分析显示非晶HfTaO薄膜表面非常平整。在550nm处薄膜折射率n随着Ta掺入量的增大而增大,n的变化区间为1.90～2.15。同时HfTaO薄膜的光学带隙Eg随着Ta掺入量的增大而逐渐减小,Eg的变化区间为4.15～5.29eV。     

射频磁控溅射制备硼碳氮薄膜

采用射频磁控溅射技术,用六角氮化硼和石墨为溅射靶,以氩气(Ar)和氮气(N2)为工作气体,在Si (100)衬底上制备出硼碳氮薄膜.通过X射线衍射(XRD)、傅里叶红外吸收光谱(FTIR)和X射线光电子能谱(XPS)等分析手段对样品结构、组分进行了分析.结果表明,样品的组成原子之间实现了原子级化合,且薄膜为乱层石墨结构.样品中B、C、N的原子比近似为1:1:1.     

直流反应磁控溅射制备非晶掺锌氧化铟沟道层薄膜

采用直流反应磁控溅射In/Zn合金靶材在室温下制备了非晶掺锌氧化铟(a-IZO)薄膜,作为沟道层应用于氧化物薄膜晶体管。通过在沉积过程中适当调节氧气压强,制备的a-IZO薄膜的电阻率可具有10-3～106Ω.cm即109倍的变化范围。在氧气压强Po2=5×10-2Pa制备的薄膜,其可见光范围平均透射率大于85%。试制了基于a-IZO薄膜沟道层的顶栅结构的氧化物薄膜晶体管。测试表明该薄膜晶体管工作在n型沟道增强模式,场效应迁移率为4.25 cm2V-1s-1,电流开关比约为103。实验结果预示a-IZO薄膜在TFT-LCD和AMOLED等平板显示领域具有应用前景。     

磁控溅射制备ZrN_x薄膜离子导体性能研究

采用射频反应磁控溅射工艺,以纯Zr为靶材,在WO3/ITO/Glass基片上采用不同工艺参数沉积ZrNx薄膜,用紫外-可见分光光度计、循环伏安法、X射线衍射仪、扫描电镜等研究了ZrNx薄膜的离子导电性能。研究结果表明,所制备的ZrNx薄膜为非晶态,ZrNx/WO3/ITO/Glass复合膜的光学调节范围最大达57%以上,在离子传导过程中表现出良好的离子导电性能。     

反应磁控溅射法沉积的氟化类金刚石薄膜的结构分析

以高纯石墨作靶、Ar／CHF3作源气体采用射频反应磁控溅射法室温下制备了氟化类金刚石薄膜(F-DLC)。发现随着射频功率的增加,F-DLC薄膜拉曼光谱的D峰与G峰强度之比ID／IG加大,薄膜中芳香环式结构比例上升。红外吸收光谱则显示射频功率增加导致薄膜中的氟含量上升．氟原子与碳原子以及芳香环的耦合加强。控制射频功率可以有效调制薄膜中的氟含量以及芳香环结构的比例,F—DLC可能成为热稳定性较好的碳氟薄膜。     

Structural and optical properties of yttrium trioxide thin films prepared by RF magnetron sputtering

Yttrium trioxide (Y₂O₃) thin films have been deposited on silicon (111) at different RF powers and the sputtering pressures by RF magnetron sputtering. The influences of the RF power and the sputtering pressures on the structural and optical properties of Y₂O₃ thin films were investigated by X-ray photoelectron spectroscopy (XPS), X-ray diffraction (XRD), atomic force microscope (AFM) and spectroscopic ellipsometer (SE). The results show that chemical composition of as-deposited Y₂O₃ film is apparently close to the stoichiometric ratio and it is crystallized but crystallinity is poor. The monoclinic and cubic fluorite-like structure can coexist in as-deposited Y₂O₃ film. A four-layer-structured optical model consisting of silicon substrate, silicon dioxide (SiO₂) interlayer, Y₂O₃ layer and a surface roughness (SR) layer is built for interpreting preferably the results measured by spectroscopic ellipsometry. With the increase of RF power or decrease of sputtering pressure, the refractive index and optical bandgap of sputtered Y₂O₃ film is increased and the extinction coefficients is decreased.