The influence of high energy electron irradiation on the Schottky barrier height and the Richardson constant of Ni/4H-SiC Schottky diodes

The influence of high energy electron (HEE) irradiation from a Sr-90 radio-nuclide on n-type Ni/4H–SiC samples of doping density 7.1×10¹⁵ cm⁻³ has been investigated over the temperature range 40–300 K. Current–voltage (I–V), capacitance–voltage (C–V) and deep level transient spectroscopy (DLTS) were used to characterize the devices before and after irradiation at a fluence of 6×10¹⁴ electrons-cm⁻². For both devices, the I–V characteristics were well described by thermionic emission (TE) in the temperature range 120–300 K, but deviated from TE theory at temperature below 120 K. The current flowing through the interface at a bias of 2.0 V from pure thermionic emission to thermionic field emission within the depletion region with the free carrier concentrations of the devices decreased from 7.8×10¹⁵ to 6.8×10¹⁵ cm⁻³ after HEE irradiation. The modified Richardson constants were determined from the Gaussian distribution of the barrier height across the contact and found to be 133 and 163 A cm⁻² K⁻² for as-deposited and irradiated diodes, respectively. Three new defects with energies 0.22, 0.40 and 0.71 eV appeared after HEE irradiation. Richardson constants were significantly less than the theoretical value which was ascribed to a small active device area.     

Effect of electron irradiation on morphological,compositional and electrical properties of nanocluster carbon thin films grown using room temperature based cathodic arc process for large area microelectronics

The influence of 8 MeV electron beam bombardment on room temperature grown nanocluster carbon using cathodic arc process has been studied here. Atomic force microscopy (AFM) study shows that surface roughness varies with varying electron doses. High doses of electrons could causes thermal induce graphitization and morphological changes in the films. Raman spectroscopy analysis reveals that G-peak vary from 1555 cm⁻¹ to 1570 cm⁻¹ and D-peak varying from 1361 cm⁻¹ to 1365 cm⁻¹ indicating the disorderness and presence of both graphitic and diamond-like phases. Room temperature conductivity changes by two to three orders in magnitude. The conductivity in the films could be due to conduction of charge carriers through neighboring islands of conductive chains. Defect states calculated using the differential technique varies from 8 × 10¹⁷cm⁻³ eV⁻¹ to 1.5 × 10¹⁹ cm⁻³ eV⁻¹. Irradiation of nanocluster carbon thin films could be helpful to tune the electrical properties and defect densities of the nanocluster carbon films for various large area, flexible electronic and nano electronic applications.     

A study of charge transport in a novel electroluminescent poly(phenylene vinylene-co-fluorenylene vinylene) based π-conjugated polymer

The charge transport properties in a novel electroluminescent poly{[2-(4′,5′-bis(3″-methylbutoxy)-2′-p-methoxy-phenyl)phenyl-1,4-phenylene vinylene]-co-(9,9-dioctyl-2,7-fluorenylene vinylene)} (BPPPV-PF) have been studied using a time-of-flight (TOF) photoconductivity technique. The TOF transients for holes were recorded over a range of temperatures (207–300 K) and electric fields (1.5 × 10⁵–6.1 × 10⁵ V/cm). The hole transport in this polymer was weakly dispersive in nature with a mobility at 300 K of 5 × 10⁻⁵ cm²/V s at 2.5 × 10⁵ V/cm. This increased to 8.4 × 10⁻⁵ cm²/V s at 6.1 × 10⁵ V/cm. The temperature and field dependence of charge mobility has been analyzed using the disorder formalisms (Bässler’s Gaussian disorder model (GDM) and correlated disorder model (CDM)). The fit with Gaussian disorder (GDM) model yielded the mobility pre-factor μ_∞ = 1.2 × 10⁻³ cm²/V s, energetic disorder parameter σ = 82 meV and positional disorder parameter Σ = 1.73. The average inter-site separation (a = 7 Å) and the charge localization length (L = 3.6 Å) was estimated by assuming the CDM type charge transport. The microscopic charge transport parameters derived for this polymer are almost identical to the reported values for fully conjugated polymers with high chemical purity. The results presented indicate that the charge transport parameters can be controlled and optimized for organic optoelectronic applications.     

2 MeV ion irradiation effects on AlGaN/GaN HFET devices

AlGaN/GaN heterostructure field effect transistors (HFETs) were irradiated with 2 MeV protons, carbon, oxygen, iron and krypton ions with fluences ranging from 1 × 10⁹ cm^?2 to 1 × 10¹³ cm^?2. DC, pulsed I–V characteristics, loadpull and S-parameters of the AlGaN HFET devices were measured before and after irradiation. In parallel, a thick GaN reference layer was also irradiated with the same ions and was characterized by X-ray diffraction, photoluminescence, Hall measurements before and after irradiation. Small changes in the device performance were observed after irradiation with carbon and oxygen at a fluence of 5 × 10¹⁰ cm^?2. Remarkable changes in device characteristics were seen at a fluence of 1 × 10¹² cm^?2 for carbon, oxygen, iron and krypton irradiation. Similarly, remarkable changes were also observed in the GaN layer for irradiations with fluence of 1 × 10¹² cm^?2. The results found on devices and on the GaN layer were compared and correlated.     

Contact resistance between pentacene and indium–tin oxide (ITO) electrode with surface treatment

Contact resistance between indium–tin oxide (ITO) electrode and pentacene was studied by transmission line method (TLM). Organic solvent cleaned, inorganic alkali cleaned, and self-assembled monolayer (with OTS: octadecyltrichlorosilane) modified ITO electrode structures were compared. Pentacene layer of 300 Å thickness was vacuum deposited on patterned ITO layer at 70 °C with a deposition rate of 0.3 Å/s. Alkali cleaned and SAM modified ITO gave a lower contact resistance of about 6.34 × 10⁴ Ω cm² and 1.88 × 10³ Ω cm², respectively than organic solvent cleaned ITO of about 6.58 × 10⁵ Ω cm². Especially with the SAM treatment, the work function of ITO increased closer to the highest occupied molecular orbital (HOMO) level of pentacene, which lowers the injection barrier between ITO and pentacene. It was also believed that pentacene morphology was improved on SAM modified ITO surface due to the lowering of the surface energy. We could obtain the low contact resistance with SAM treatment which is comparable to the measured value of gold–pentacene contact, 1.86 × 10³ Ω cm². This specific contact resistance is still much higher than that of amorphous silicon thin film transistor (0.1–30 Ω cm²).     

Charge transport studies in fluorene – Dithieno[3,2-b:2′,3′-d]pyrrole oligomer using time-of-flight photoconductivity method

Charge mobility characteristics of a newly synthesised 2,6-bis[2-(9,9-dihexyl-9H-fluorene)]-N-(4-hexylphenyl)-dithieno[3,2-b:2′,3′-d]pyrrole oligomer (DTP-FLU) was studied as a function of electric field and temperature using time-of-flight photoconductivity measurement. It is found that the DTP-FLU oligomer is a hole transporting material with a hole mobility of 7.7 × 10^?6 cm²/Vs at an applied electric field of 2.9 × 10⁵ V/cm at 298 K. The dependence of hole mobility with applied electric field and temperature is studied in detail by analyzing the experimental results using the Bassler’s Gaussian disorder model and Correlated disorder model. The energetic disorder parameter (σ) = 100 meV, mobility pre-factor (μ_∞) = 6.1 × 10^?4 cm²/Vs and positional disorder parameter (Σ) = 2.4 were extracted using Gaussian disorder model. The film morphology and photophysical properties of this new oligomer are also studied in detail.     

Gap states density measurement in copper oxide thin films

The density of gap states near the Fermi level have been measured in copper oxide (CuO) thin films deposited by spray pyrolysis technique. The measurement method is based on the exploitation of the current–voltage characteristics of the space charge limited current (SCLC) measured in a sandwich Au/CuO/Au structure. The measured gap states density is equal to 1.5×10¹⁴ cm⁻³ and 2.0×10¹⁴ eV⁻¹ respectively in films prepared at 300 and 400 °C substrate temperature, while the defect position are located at 16 and 20 meV above Fermi level. The carriers mobility and concentration are also determined from SCLC, the obtained results are in good agreement with Hall effect measurement ones.     

Region-dependent behavior of I–V characteristics in n-ZnO:Al/p-Si contacts

The discrepancy of rectifying characteristics in n-ZnO:Al/p-Si heterojunctions from diode to diode was demonstrated by region dependent dark I–V characteristics, where the junction is laterally cut to sequentially decrease the area. Further investigation shows that the junction (2.1×2.1 cm²) with the barrier height Φ=0.693 eV consists of one part (2.1×1.4 cm²) with Φ=0.695 eV and the other part (2.1×0.7 cm²) with Φ=0.686 eV. It is found that reverse currents saturate with different values of 3.6×10^?3, 2.5×10^?3 and 1.58×10^?3 A for the light I–V curves of the three junctions with the same areas. To explain this peculiarity, the probable reason is discussed in terms of carrier transportation through the spatially fluctuating barrier.     

Bimodal and monomodal diamond particle effect on the thermal properties of diamond-particle-dispersed Al–matrix composite fabricated by SPS

Diamond-particle-dispersed aluminum (Al) matrix composites consisting of monomodal and bimodal diamond particles were fabricated in spark plasma sintering process, where the mixture of diamond, pure Al and Al–5 mass% Si alloy powders were consolidated in liquid and solid co-existent state. Microstructures and thermal properties of the composites fabricated in such a way were investigated and the monomodal and bimodal diamond particle effect was evaluated on the thermal properties of the composites. The composites can be well consolidated in a temperature range between 773 K and 878 K and scanning electron microscopy detects no reaction product at the interface between the diamond particle and the Al matrix. Relative packing density of the composite containing monomodal diamond particles decreased from 99.1% to 87.4% with increasing volume fraction of diamond between 50% and 60%, whereas that of the composite containing bimodal diamond particles was higher than 99% in a volume fraction of diamond up to 65%. The thermal conductivity of the composite containing bimodal diamond particles was higher than that of the composite containing monomodal diamond particles in a volume fraction of diamond higher than 60%. The coefficients of thermal expansion (CTEs) of the diamond-particle-dispersed Al–matrix composites fall in the upper line of Kerner model, indicating good bonding between the diamond particle and the Al matrix in the composite. The thermal conductivity of the composite containing 70 vol.% bimodal diamond particles was 578 W/m K and its CTE was 6.72 × 10⁻⁶ at R.T.     

High electron mobility triazine for lower driving voltage and higher efficiency organic light emitting devices

The triazine compound 4,4′-bis-[2-(4,6-diphenyl-1,3,5-triazinyl)]-1,1′-biphenyl (BTB) was developed for use as an electron transport material in organic light emitting devices (OLEDs). The material demonstrates an electron mobility of ∼7.2 × 10⁻⁴ cm² V⁻¹ s⁻¹ at a field of 8.00 × 10⁵ V cm⁻¹, which is 10-fold greater than that of the widely used material tris(8-hydroxyquinoline) aluminum (AlQ₃). OLEDs with a BTB electron transport layer showed a ∼1.7–2.5 V lower driving voltage and a significantly increased efficiency, compared to those with AlQ₃. These results suggest that BTB has a strong potential for use as an OLED electron transport layer material.     

Characterization of MIS structures and thin film transistors using RF-sputtered HfO2/HIZO layers

MIS structures using HfO₂ and HIZO layers, both deposited by room temperature RF magnetron sputtering are fabricated for TFTs application and characterized using capacitance-voltage. The relative dielectric constant obtained at 1 kHz was 11, the charge carrier concentration of the HIZO was in the range of (2–3) × 10¹⁸ cm^− 3 and the interface trap density at flat band was smaller than 2 × 10¹² cm^− 2. The critical electric field of the HfO₂ layer was higher than 5 × 10⁵ V/cm, with a current density in the operating voltage range below 4 × 10^− 8 A/cm². The hysteresis and bias stress behavior of RF-sputtered HfO₂/HIZO MIS structures is presented. Fabricated HfO₂/HIZO TFTs worked in the operation voltage range below 8 V.     

Investigation of TiO2 on AlGaAs prepared by liquid phase deposition and its application

The study explored titanium dioxide (TiO₂) on aluminum gallium arsenide (AlGaAs) prepared by liquid phase deposition (LPD) at 40 °C. The leakage current density was about 8.4 × 10^?6 A/cm² at 1 MV/cm. The interface trap density (D_it) and the flat-band voltage shift (ΔV_FB) were 2.3 × 10¹² cm^?2 eV^?1 and 1.2 V, respectively. After rapid thermal annealing (RTA) in the ambient N₂ at 350 °C for 1 min, the leakage current density, D_it, and ΔV_FB were improved to 2.4 × 10^?6 A/cm² at 1 MV/cm, 7.3 × 10¹¹ cm^?2 eV^?1, and 1.0 V, respectively. Finally, the study demonstrates the application to the AlGaAs/InGaAs metal–oxide–semiconductor pseudomorphic high-electron-mobility transistor (MOS-PHEMT). The results indicate the potential of the proposed device with a LPD-TiO₂ gate oxide for power application.     

Charge transport properties in liquid carbazole

The hole mobility in 9-(2-ethylhexyl)carbazole so-called liquid carbazole, in poly(N-vinylcarbazole) (PVK) and in their blends is determined by time-of-flight experiment using a phthalocyanine charge generation layer. With an applied electric field of 2.5 × 10⁵ V/cm, mobilities of 4 × 10⁻⁶ cm²/Vs and 6 × 10⁻⁷ cm²/Vs are measured in liquid carbazole and PVK, respectively. The enhancement of the charge carrier mobility in liquid carbazole is attributed to both a larger transfer integral and changes in the distribution of the excimer trapping sites. The results show the potential interest of liquid carbazole for electroactive applications in optoelectronics.     

In0.75Ga0.25As channel layers with record mobility exceeding 12,000 cm2/Vs for use in high-κ dielectric NMOSFETs

In_0.75Ga_0.25As channel layers with a record mobility exceeding 12,000 cm²/Vs for use in high-κ dielectric NMOSFETs have been fabricated. The device structures which have been grown by molecular beam epitaxy on 3″ semi-insulating InP substrate comprise a 10 nm strained In_0.75Ga_0.25As channel layer and a high-κ oxide based dielectric layer (κ ≅ 20). Electron mobilities of 12,033 and 7,042 cm²/Vs have been measured for sheet carrier concentrations n_s of 2.5 × 10¹² and 6 × 10¹² cm⁻², respectively.     

The effect of temperature on the growth and properties of green light-emitting In0.5Ga0.5N films prepared by reactive sputtering with single cermet target

We have grown In_0.5Ga_0.5N films on SiO₂/Si (100) substrate at 100–400 °C for 90 min by rf reactive sputtering with single cermet target. The target was made by hot pressing the mixture of metallic indium, gallium and ceramic gallium nitride powder. X-ray diffraction (XRD) measurements indicated that In_0.5Ga_0.5N films had wurtzite structure and showed the preferential (1 0 -1 0) diffraction. Both SEM and AFM showed that In_0.5Ga_0.5N films were smooth and had small roughness of 0.6 nm. Optical properties were measured by photoluminescence (PL) spectra from room temperature to low temperature of 20 K. The 2.28 eV green emission was achieved at room temperature for all our InGaN films. The electrical properties of In_0.5Ga_0.5N films on a SiO₂/Si (100) substrate were measured by the Hall measurement at room temperature. InGaN films showed the electron concentration of 1.51×10²⁰–1.90×10²⁰ cm⁻³ and mobility of 5.94–10.5 cm² V⁻¹ s⁻¹. Alloying of InN and GaN was confirmed for the sputtered InGaN.     

Investigations on the annealing behavior of high-energy carbon irradiated Au/n-GaAs Schottky barrier diodes

Au Schottky barrier diodes (SBDs) have been irradiated using high-energy carbon ion fluences of 1×10¹¹, 1×10¹² and 1×10¹³ cm⁻². Current–voltage characteristics of unirradiated and irradiated diodes have been analyzed. The change in reverse leakage current increases with increasing ion fluence due to the irradiation-induced defects at the interface. The diodes were annealed at 523 and 623 K to study the effect of annealing. The rectifying behavior of the irradiated SBDs improves at 523 K. But at 623 K, the diode behavior deteriorates irrespective of the fluences. Better enhancement in the barrier height and also improvement in the ideality factor of the diodes has been observed at the annealing temperature of 523 K. Scanning Electron Microscopic analysis was carried out on the irradiated samples to delineate the projected range of the defects by high-energy carbon ion irradiation.     

Photoluminescence of phosphorous doped Ge on Si (100)

Photoluminescence (PL) of selectively grown phosphorus (P) doped germanium (Ge) is investigated. 350–600 nm thick P-doped Ge is grown on 100 nm thick P-doped Ge buffer layer, which is annealed at 800 °C before the main part of Ge deposition. In the case of Ge deposited at 325 °C, approximately two times higher PL intensity is observed by P doping of ~3.2×10¹⁹ cm⁻³. Further increase of PL intensity by a factor of 1.5 is observed by increasing the growth temperature from 325 °C to 400 °C due to improved crystal quality. Varying PH₃ partial pressure at 400 °C, red shift of the PL occurred with increasing P concentration due to higher bandgap narrowing. With increasing P concentration up to ~1.4×10¹⁹ cm⁻³ at 400 °C the PL peak intensity increases by filling electrons into the L valley and decreases due to enhanced point defect concentration and degraded crystallinity. By post-annealing at 500–800 °C, the PL intensity is further increased by a factor of 2.5 because of increased active P concentration and improved crystal quality. Reduced direct bandgap energy by introducing tensile strain is also observed.     

Effects of RTA temperatures on conductivity and micro-structures of boron-doped silicon nanocrystals in Si-rich oxide thin films

In this work, the B-doped Si rich oxide (SRO) thin films were deposited and then annealed using rapid thermal annealing (RTA) to form SiO₂-matrix silicon nanocrystals (Si NCs). The effects of the RTA temperatures on the structural properties, conduction mechanisms and electrical properties of B-doped SRO thin films (BSF) were investigated systematically using Hall measurements, Fourier transform infrared spectroscopy and Raman spectroscopy. Results showed that the crystalline fraction of annealed BSF increased from 41.3% to 62.8%, the conductivity was increased from 4.48×10⁻³ S/cm to 0.16 s/cm, the carrier concentration was increased from 8.74×10¹⁷ cm⁻³ to 4.9×10¹⁸ cm⁻³ and the carrier mobility was increased from 0.032 cm² V⁻¹ s⁻¹ to 0.2 cm² V⁻¹ s⁻¹ when the RTA temperatures increased from 1050 °C to 1150 °C. In addition, the fluctuation induced tunneling (FIT) theory was applicable to the conduction mechanisms of SiO₂-matrix boron-doped Si-NC thin films.     

Solution processable organic p–n junction bilayer vertical photodiodes

Organic p–n bilayer photodiodes were produced by solution casting poly(3-hexylthiophene) (P3HT) from chlorobenzene and phenyl-C₆₁-butyric acid methyl ester (PCBM):poly(4-chlorostyrene) (PClS) blends from the nearly orthogonal solvent dichloromethane onto flexible indium tin oxide (ITO)/polyester as a substrate. This is the first demonstration of PCBM–inert polymer blends for such a device. The electron mobility of a 90% PCBM–10% PClS blend was 3.5 × 10^?3 cm²/V s in a field-effect transistor. The diodes showed a rectification ratio of 2.0 × 10³ at ±2.0 V with a forward bias current density as high as 340 μA/cm² at 2.0 V in the dark. Irradiation with various light sources (0.013–291 mW/cm²) under ambient atmosphere generated a linear increase in photocurrent. Photodiodes with thinner active layers showed larger photocurrent and relative photoresponse, probably because of lower series resistance and lower recombination probability. The reverse bias response was less dependent on device area than the forward bias response. Photocurrents from multiple devices in parallel were additive as expected. The results demonstrate a simple fabrication route to light detectors compatible with solution processes and flexible substrates.     

Thickness-dependent optoelectronic properties of CuCr0.93Mg0.07O2 thin films deposited by reactive magnetron sputtering

CuCr_0.93Mg_0.07O₂ thin films were successfully deposited by DC reactive magnetron sputtering at 1123 K from metallic targets. The influence of film thickness on the structural and optoelectronic properties of the films was investigated. X-ray diffraction (XRD) results revealed that all the films had a delafossite structure with no other phases. The optical and electrical properties were investigated by UV–VIS spectrophotometer and Hall measurement, respectively. It was found that the optoelectronic properties exhibited a thickness-dependent behavior. The optical band gap and the average transmittance of the films showed a monotonous decrease with respect to the increase in thickness. The average transmittance in the visible region decreased from 67% to 47% as the thickness increased from ~70 nm to ~280 nm. Simultaneously, the conductivity of the films fell from 1.40 S∙cm⁻¹ to 0.27 S∙cm⁻¹. According to Haacke's figure of merit (FOM), a film with a maximum FOM value of about 1.72×10⁻⁷ Ω⁻¹ can be achieved when the thickness is about 70 nm (σ≈ 1.40 S·cm⁻¹ and T_av. ≈67%).