Fabrication and thermal conductivity of copper matrix composites reinforced with Mo2C or TiC coated graphite fibers

Graphite fiber reinforced Cu-based composites have good thermal conductivity, low coefficient of thermal expansion for heat sink applications. In these composites, the quality of interfacial bonding between the copper matrix and the graphite fibers has significant influence on the thermal properties of composites. In this study, two different carbide coatings (Mo₂C or TiC) were synthesized on graphite fiber to promote the interfacial bonding in composites. Fibers/Cu composites had been produced by spark plasma sintering process. The results showed that the densification, interfacial bonding and thermal conductivity of coated composites were improved distinctly compared to that of uncoated ones. The enhanced composites present 16–44% increase of thermal conductivity in X–Y plane. An original theoretical model was proposed to estimate the interface thermal resistance. The result showed that the interfacial thermal resistance was largely reduced by one order of magnitude with the introduction of carbide interlayer.     

Synergetic effect of hybrid boron nitride and multi-walled carbon nanotubes on the thermal conductivity of epoxy composites

This study investigates the synergistic effect of combining multi-walled carbon nanotubes (MWCNTs) and boron nitride (BN) flakes on thermally conductive epoxy composite. The surface of the two fillers was functionalized to form covalent bonds between the epoxy and filler, thereby reducing thermal interfacial resistance. The hybrid filler provided significant enhancement of thermal conductivity, adding 30 vol% modified BN and 1 vol% functionalized MWCNTs achieving a 743% increase in thermal conductivity (1.913 W mK⁻¹, compared to 0.2267 W mK⁻¹ of neat epoxy).     

Effect of carbon nanofibers on the infiltration and thermal conductivity of carbon/carbon composites

Preforms containing 0, 5, 10, 15 and 20 wt.% carbon nanofibers (CNFs) were fabricated by spreading layers of carbon cloth, and infiltrated using the electrified preform heating chemical vapor infiltration method (ECVI) under atmospheric pressure. Initial thermal gradients were determined. Resistivity and density evolutions with infiltration time have been recorded. Scanning electron microscopy, polarized light micrograph and X-ray diffraction technique were used to analyze the experiment results. The results showed that the infiltration rate increased with the rising of CNF content, and after 120 h of infiltration, the density was the highest when the CNF content was 5 wt.%, but the composite could not be densified efficiently as the CNF content ranged from 10 wt.% to 20 wt.%. CNF-reinforced C/C composites have enhanced thermal conductivity, the values at 5 wt.% were increased by nearly 5.5-24.1% in the X-Y direction and 153.8-251.3% in the Z direction compared to those with no CNFs. When the additive content was increased to 20 wt.%, due to the holes and cavities in the CNF web and between carbon cloth and matrix, the thermal conductivities in the X-Y and Z directions decreased from their maximum values at 5 wt.%.     

Preparation and characterization of morph-genetic aluminum nitride/carbon composites from filter paper

Morph-genetic aluminum nitride/carbon composites with cablelike structure were prepared from filter paper template through the surface sol-gel process and carbothermal nitridation reaction. The resulting materials have a hierarchical structure originating from the morphology of cellulose paper. The aluminum nitride/carbon composites have the core-shell microstructure, the core is graphitic carbon, and the shell is aluminum nitride nanocoating formed by carbothermal nitridation reduction of alumina with the interfacial carbon in nitrogen atmosphere. Scanning electron microscopy, energy dispersive X-ray spectroscopy, X-ray diffraction, and transmission electron microscope were employed to characterize the structural morphology and phase compositions of the final products.     

Processing and mechanical properties of carbon nanotube-alumina hybrid reinforced high density polyethylene composites

Carbon nanotube-alumina hybrid reinforced high density polyethylene (HDPE) matrix composites were prepared by melt processing technique. Microstructure studies verified that the nanotubes consisting of well-crystallized graphite formed a network structure with Al₂O₃ in the hybrid, which was homogeneously dispersed in the HDPE matrix composites. Mechanical measurements revealed that 5% addition of nanotube-alumina hybrid results in 100.8% and 65.7% simultaneous increases in Young's modulus and tensile strength, respectively. Fracture surface showed homogenous dispersion of nanotubes and Al₂O₃ in the HDPE matrix and presence of interlocking like phenomena between hybrid and HDPE matrix, which might contribute to the effective reinforcement of the HDPE composites.     

Thermal conductivity and thermal diffusivity analyses of low-density polyethylene composites reinforced with sisal, glass and intimately mixed sisal/glass fibres

The thermal conductivity and thermal diffusivity of sisal-reinforced polyethylene (SRP), glass-reinforced polyethylene (GRP) and sisal/glass hybrid fibre-reinforced polyethylene (GSRP) has been evaluated at cryogenic to high temperature (120–350 K). It has been observed that the variation of thermal conductivity with temperature is almost the same for LDPE and SRP containing perpendicularly oriented sisal fibres. The difference between the values of thermal conductivity shown by LDPE and GRP is greater than that of SRP and LDPE. The enhanced thermal conductivity of glass fibre is due to the presence of Fe²⁺ ions in the glass fibres. The linear variation in thermal conductivity with fibre loading is explained with the help of a model suggested by Agari. The difference between the thermal conductivity properties in directions parallel and perpendicular to the applied flux is a maximum for SRP owing to the anisotropic nature of sisal fibre. The difference is marginal for GRP on account of its isotropic nature. The position of GSRP is found to be intermediate. It can been observed that the variation of thermal diffusivity with temperature is just opposite to that of thermal conductivity. This may be due to a reduction in the mean free path of phonons. An empirical equation is derived to explain the variation in thermal conductivity and thermal diffusivity with temperature.     

Morphology of in situ poly(ethylene terephthalate)/polyethylene microfiber reinforced composite formed via slit-die extrusion and hot-stretching

This article introduced the morphologies of in situ microfiber reinforced composite (MRC) based on poly(ethylene terephthalate) (PET) and polyethylene (PE). The PET/PE MRC was prepared through slit-die extrusion and hot-stretching, followed injection molding at the processing temperature of PE matrix, far below the melting temperature of PET in order to maintain the microfibers. Morphological observation indicated that the PET microfibers could be achieved by the way used in this study, and the microfiber characteristics, such as diameter, diameter distribution, were mainly dominated by PET content at a fixed hot-stretching ratio (HSR) of 19.17. Increasing the PET content the fiber diameter became bigger and the diameter distribution wider, but the minimum fiber diameter always remained constant.     

Thermal conductivity of epoxy composites with a binary-particle system of aluminum oxide and aluminum nitride fillers

Aluminum oxide and aluminum nitride with different sizes were used alone or in combination to prepare thermally conductive polymer composites. The composites were categorized into two systems, one including composites filled with large-sized aluminum nitride and small-sized aluminum oxide particles, and the other including composites filled with large-sized aluminum oxide and small-sized aluminum nitride. The use of these hybrid fillers was found to be effective for increasing the thermal conductivity of the composite, which was probably due to the enhanced connectivity offered by the structuring filler. At a total filler content of 58.4 vol.%, the maximum values of both thermal conductivities in the two systems were 3.402 W/mK and 2.842 W/mK, respectively, when the volume ratio of large particles to small particles was 7:3. This result was represented when the composite was filled with the maximum packing density and the minimum surface area at the same volume content. As such, the proposed thermal model predicted thermal conductivity in good agreement with experimental values.     

Thermal conductivity and dielectric properties of Al/PVDF composites

Polymeric composites with relatively high thermal conductivity, high dielectric permittivity, and a low dissipation factor are obtained in the present study. Three types of core-shell-structured aluminum (Al) particles are incorporated in poly(vinylidene fluoride) (PVDF) by melt-mixing and hot-pressing processes. The morphological, thermal, and dielectric properties of the composites are characterized using thermal analysis, a scanning electron microscope, and a dielectric analyzer. The results indicate that the Al particles decrease the degree of crystallinity of PVDF, and that the particle size and shape of the filler affect the thermal conductivity and dielectric properties of Al/PVDF. No variation in the dissipation factor is observed up to 60 wt.% Al. Thermal conductivity and dielectric permittivity values as high as 1.65 W/m K and 230, respectively, as well as a low dissipation factor of 0.25 at 0.1 Hz, are realized for the composites with 80 wt.% spherical Al.     

Microstructural evolution of reinforcements in the remelting in situ TiC/Al-12Si composites treated by ultrasonic vibration

Clusters of reinforced particles and long rod-like Al₃Ti particles are usually present in the matrix of in situ TiC/Al alloy composites fabricated via SHS reaction of the Al-Ti-C system in the molten aluminum alloys. In order to improve the properties of the composites, the above issues should be solved effectively. In our research, high-intensity ultrasonic vibration was introduced into the remelting TiC/Al-12Si composites containing clusters of TiC particles and long rod-like Al₃Ti phase to optimize the microstructure of the composites. The results of SEM showed that long rod-like Al₃Ti particles were turned into small blocky ones and large clusters were broken up into small ones. In the meantime, individual TiC particles could be peeled off from the clusters and distributed uniformly in the matrix. An in situ TiC/Al-12Si composite with a homogeneous microstructure was attained successfully. The evolution of the morphology of Al₃Ti phase and the clusters in the ultrasonic field was also discussed.     

In situ preparation of titanium matrix composites reinforced with TiB whiskers and Y2O3 particles

Titanium matrix composites reinforced with TiB and Y₂O₃ were prepared by a non-consumable arc-melting technology. X-ray diffraction (XRD) was used to identify the phases in the composites. Microstructures of the composites were observed by means of optical microscope (OM), scanning electron microscope (SEM), and transmission electron microscope (TEM). The results show that there are two kinds of reinforcements formed in the titanium matrix, needle-shaped TiB and Y₂O₃ with near-equiaxed and dendritic shape. The interfaces between reinforcements and titanium are clear and there is no evidence of interfacial reaction. The hardness of the composites decreases with the increasing contents of yttrium in the composite.     

Thermal conductivity of liquid crystalline epoxy/BN filler composites having ordered network structure

BN filler was added to a liquid crystalline (LC) epoxy resin to obtain a high thermal conductive material. The LC epoxy/BN composites, which were cured at different temperatures, formed an isotropic or LC polydomain phase structure. The relationship between the network orientation containing mesogenic groups and the dispersibility of the BN filler was discussed. As a result, the thermal conductivity of the LC polydomain system was drastically enhanced even at a relatively low volume fraction of BN (30 vol%), regardless of the fact that both the LC and isotropic phase systems consisted of the same resin and filler content combination. This result is due to the formation of thermal conductive paths by the BN filler by exclusion of the BN filler from the LC domain formed during the curing process in the composite having the LC polydomain matrix.     

Thermal conductivity of polymer composites based on the length of multi-walled carbon nanotubes

The anisotropic development of thermal conductivity in polymer composites was evaluated by measuring the isotropic, in-plane and through-plane thermal conductivities of composites containing length-adjusted short and long multi-walled CNTs (MWCNTs). The thermal conductivities of the composites were relatively low irrespective of the MWCNT length due to their high contact resistance and high interfacial resistance to polymer resins, considering the high thermal conductivity of MWCNTs. The isotropic and in-plane thermal conductivities of long-MWCNT-based composites were higher than those of short-MWCNT-based ones and the trend can accurately be calculated using the modified Mori-Tanaka theory. The in-plane thermal conductivity of composites with 2 wt% long MWCNTs was increased to 1.27 W/m·K. The length of MWCNTs in polymer composites is an important physical factor in determining the anisotropic thermal conductivity and must be considered for theoretical simulations. The thermal conductivity of MWCNT polymer composites can be effectively controlled in the processing direction by adjusting the length of the MWCNT filler.     

Preparation and properties of unidirectional boron nitride fibre reinforced boron nitride matrix composites via precursor infiltration and pyrolysis route

The unidirectional boron nitride fibre reinforced boron nitride matrix (BN_f/BN) composites were prepared via the precursor infiltration and pyrolysis (PIP) route, and the structure, composition, mechanical and dielectric properties were studied. The composites have a high content and fine crystallinity of BN. The density is 1.60 g cm⁻³ with a low open porosity of 4.66%. The composites display good mechanical properties with the average flexural strength, elastic modulus and fracture toughness being 53.8 MPa, 20.8 GPa and 6.88 MPa m^1/2, respectively. Lots of long fibres pull-out from the fracture surface, suggesting a good fibre/matrix interface. As temperature increases, both of the flexural strength and elastic modulus exhibit a decreasing trend, with the lowest values being 36.2 MPa and 8.6 GPa at 1000 °C, respectively. The desirable residual ratios of the flexural strength and elastic modulus at 1000 °C are 67.3% and 41.3%, respectively. The composites have excellent dielectric properties, with the average dielectric constant and loss tangent being 3.07 and 0.0044 at 2-18 GHz, respectively.     

Thermal conductivity of carbon-phenolic 8-harness satin weave composites

In this paper, thermal conductivities of carbon-phenolic 8-harness satin weave composite were measured and predicted. In the analysis, the satin weave unit cell was identified and modeled discretely by 3-dimensional finite elements, considering the interlaced fiber tow architecture microscopically. At the unit cell boundary, the corresponding periodic boundary conditions were applied. The results were analyzed to investigate the effect of microstructural parameters and boundary conditions. The conductivities were also obtained by experiments and both results were compared.     

Thermal conductivity of ME771 glass-epoxy laminate from millikelvin temperatures to 4 K

Permaglas ME771 is a glass-epoxy laminate which is suitable for use at cryogenic temperatures. We have measured the thermal conductivity of a sample of this material between 64 mK and 4.2 K in the direction parallel to the reinforcing fibres, enabling us to make a comparison with the better known material G-10CR. The thermal conductivity follows the form that would be expected for such a material, and is similar to that of G-10CR, which has a similar (room temperature) tensile strength. We comment on some confusion that has arisen over the difference between G-10CR, a material specifically produced for cryogenic use, and G-10, the more common equivalent.     

Thermal conductivity measurements of pitch-bonded graphites at millikelvin temperatures: Finding a replacement for AGOT graphite

Pitch-bonded graphites are among the best known thermal insulators at sub-kelvin temperatures, but are very good conductors at higher temperatures. This makes them ideal for mechanical supports which must provide good thermal isolation at an operating temperature below 1 K, but must have good conductance at higher temperatures to aid in initially cooling down an instrument (a “passive heat switch”). One type of graphite, AGOT, has been known as having the lowest thermal conductivity below 1 K not only among graphites, but also compared with any other material. It is, however, no longer available. We have carried out thermal conductivity measurements at temperatures between 60 mK and 4 K on a proposed replacement, POCO AXM-5Q graphite, as well as a sample of AGOT graphite. Our measurements show that both graphites have a difference of about six orders of magnitude in conductivity between room temperature and 100 mK, but that AGOT graphite is not as good an insulator as previously believed. We conclude that AXM-5Q graphite is not only a suitable replacement for AGOT, but in fact is somewhat superior.     

Reactive and dense sintering of reinforced-toughened B4C matrix composites

Reactive hot-press (1800-1880 °C, 30 MPa, vacuum) is used to fabricate relatively dense B₄C matrix light composites with the sintering additive of (Al₂O₃ +Y₂O₃). Phase composition, microstructure and mechanical properties are determined by methods of XRD, SEM and SENB, etc. These results show that reactions among original powders B₄C, Si₃N₄ and TiC occur during sintering and new phases as SiC, TiB₂ and BN are produced. The sandwich SiC and claviform TiB₂ play an important role in improving the properties. The composites are ultimately and compactly sintered owing to higher temperature, fine grains and liquid phase sintering, with the highest relative density of 95.6%. The composite sintered at 1880 °C possesses the best general properties with bending strength of 540 MPa and fracture toughness of 5.6 MPa m^1/2, 29 and 80% higher than that of monolithic B₄C, respectively. The fracture mode is the combination of transgranular fracture and intergranular fracture. The toughening mechanism is certified to consist of crack deflection, crack bridging and pulling-out effects of the grains.     

Synergistic effect of boron nitride flakes and tetrapod-shaped ZnO whiskers on the thermal conductivity of electrically insulating phenol formaldehyde composites

Tetrapod-shaped zinc oxide (T-ZnO) whiskers and boron nitride (BN) flakes were employed to improve the thermal conductivity of phenolic formaldehyde resin (PF). A striking synergistic effect on thermal conductivity of PF was achieved. The in-plane thermal conductivity of the PF composite is as high as 1.96 W m⁻¹ K⁻¹ with 30 wt.% BN and 30 wt.% T-ZnO, which is 6.8 times higher than that of neat PF, while its electrical insulation is maintained. With 30 wt.% BN and 30 wt.% T-ZnO, the flexural strength of the composite is 312.9% higher than that of neat PF, and 56.2% higher that of the PF composite with 60 wt.% BN. The elongation at break is also improved by 51.8% in comparison with that of the composite with 60 wt.% BN. Such a synergistic effect results from the bridging of T-ZnO whiskers between BN flakes facilitating the formation of effective thermal conductance network within PF matrix.     

Microstructure and mechanical properties of silicon nitride-titanium nitride composites prepared by spark plasma sintering

Si₃N₄-TiN composites were prepared by spark plasma sintering (conventional sintering (SPS1) and in situ reaction sintering (SPS2)). Homogeneous distribution of equiaxed TiN grains in Si₃N₄ matrix results in the highest microhardness (21.7 GPa) and bending strength (621 MPa) of sample SPS1 sintered at 1550 °C. Dispersion of elongated TiN grains in Si₃N₄ matrix results in the highest fracture toughness (8.39 MPa m^1/2) of sample SPS2 sintered at 1300 °C.