Study on forced air convection cooling for electronic assemblies

The slotted fin concept was employed to improve the air cooling performance of plate-fin in heat sinks. Numerical simulations of laminar heat transfer and flow pressure drop were conducted for the integral plate fin, discrete plate fin and discrete slotted fin heat sinks. It is found that the performance of the discrete plate fin is better than that of the integral continuum plate fin and the performance of slotted fin is better than that of the discrete plate fin at the same pumping power of the fan. A new type of heat sink characterized by discrete and slotted fin surfaces with thinner fins and smaller spaces between fins is then proposed. Preliminary computation shows that this type of heat sink may be useful for the next generation of higher thermal load CPUs. The limit of cooling capacity for air-cooling techniques was also addressed. __________ Translated from Journal of Xi’an Jiaotong University, 2006, 40(11): 1241–1245 [译自: 西安交通大学学报]     

Effects of shield on thermal-fluid performance of vapor chamber heat sink

This work investigates the effects of a shield on the thermal and hydraulic characteristics of plate-fin vapor chamber heat sinks under cross flow cooling. The surface temperature distributions of the vapor chamber heat sinks are measured using infrared thermography. The thermal-fluid performance of vapor chamber heat sinks with a shield is determined by varying the fin width, the fin height, the fin number and the Reynolds number. The experimental data thus obtained are compared with those without a shield.Experimental results indicate that the maximum surface temperature of the vapor chamber heat sink is effectively reduced by adding the shield, which forces more cooling fluid into the inter-fin channel to exchange heat with the heat sink. However, using the shield increases the pressure drop across the heat sink. The experimental data also show that the enhancement of the heat transfer increases with the Reynolds number, but the improvement declines as the Reynolds number increases. When the pumping power and heat transfer are simultaneously considered, vapor chamber heat sinks with thinner, higher or more fins exhibit better thermal-hydraulic performance.     

Thermal performance of plate-fin vapor chamber heat sinks

Since vapor chambers exhibit excellent thermal performance, they are suited to use as bases of heat sinks. This work experimentally studies the thermal performance of plate-fin vapor chamber heat sinks using infrared thermography. The effects of the width, height and number of fins and of the Reynolds number on the thermal performance are considered. Experimental data are compared with corresponding data for conventional aluminum heat sinks. The results show that generated heat is transferred more uniformly to the base plate by a vapor chamber heat sink than by a similar aluminum heat sink. Therefore, the maximum temperature is effectively reduced. The overall thermal resistance of the vapor chamber heat sink declines as the Reynolds number increases, but the strength of the effect falls. The effect of the fin dimensions on the thermal performance is stronger at a lower Reynolds number. At a low Reynolds number, a suitable number of fins must be chosen to ensure favorable thermal performance of the vapor chamber heat sink. However, at a high Reynolds number, the thermal performance improves as the fin number increases.     

Role of Melt Convection on Optimization of PCM-Based Heat Sink Under Cyclic Heat Load

In this article, we study the thermal performance of phase-change material (PCM)-based heat sinks under cyclic heat load and subjected to melt convection. Plate fin type heat sinks made of aluminum and filled with PCM are considered in this study. The heat sink is heated from the bottom. For a prescribed value of heat flux, design of such a heat sink can be optimized with respect to its geometry, with the objective of minimizing the temperature rise during heating and ensuring complete solidification of PCM at the end of the cooling period for a given cycle. For given length and base plate thickness of a heat sink, a genetic algorithm (GA)-based optimization is carried out with respect to geometrical variables such as fin thickness, fin height, and the number of fins. The thermal performance of the heat sink for a given set of parameters is evaluated using an enthalpy-based heat transfer model, which provides the necessary data for the optimization algorithm. The effect of melt convection is studied by taking two cases, one without melt convection (conduction regime) and the other with convection. The results show that melt convection alters the results of geometrical optimization.     

Measurement of performance of plate-fin heat sinks with cross flow cooling

This work assesses the performance of plate-fin heat sinks in a cross flow. The effects of the Reynolds number of the cooling air, the fin height and the fin width on the thermal resistance and the pressure drop of heat sinks are considered. Experimental results indicate that increasing the Reynolds number can reduce the thermal resistance of the heat sink. However, the reduction of the thermal resistance tends to become smaller as the Reynolds number increases. Additionally, enhancement of heat transfer by the heat sink is limited when the Reynolds number reaches a particular value. Therefore, a preferred Reynolds number can be chosen to reduce the pumping power. For a given fin width, the thermal performance of the heat sink with the highest fins exceeds that of the others, because the former has the largest heat transfer area. For a given fin height, the optimal fin width in terms of thermal performance increases with Reynolds number. As the fins become wider, the flow passages in the heat sink become constricted. As the fins become narrower, the heat transfer area of the heat sink declines. Both conditions reduce the heat transfer of the heat sink. Furthermore, different fin widths are required at different Reynolds numbers to minimize the thermal resistance.     

Effects of fin shapes on heat transfer in microchannel heat sinks

In the present study, compact water cooling of high‐density, high‐speed, very‐large‐scale integrated (VLSI) circuits with the help of microchannel heat exchangers were investigated analytically. This study also presents the result of mathematical analysis based on the modified Bessel function of laminar fluid flow and heat transfer through combined conduction and convection in a microchannel heat sink with triangular extensions. The main purpose of this paper is to find the dimensions of a heat sink that give the least thermal resistance between the fluid and the heat sink, and the results are compared with that of rectangular fins. It is seen that the triangular heat sink requires less substrate material as compared to rectangular fins, and the heat transfer rate per unit volume has been almost doubled by using triangular heat sinks. It is also found that the effectiveness of the triangular fin is higher than that of the rectangular fin. Therefore, the triangular heat sink has the ability to dissipate large amounts of heat with relatively less temperature rise for the same fin volume. Alternatively, triangular heat sinks may thus be more cost effective to use for cooling ultra‐high speed VLSI circuits than rectangular heat sinks.     

Heat transfer and pressure loss characteristics of very compact heat sinks with plate fins cooled by jets

High-performance and very compact heat sinks have been developed for effective cooling of VLSIs with high heat-generation densities. Their heat transfer and pressure loss characteristics in air-jet cooling have been experimentally studied. The highly compact heat sinks were plate-fin arrays with a very small fin pitch of 0.4–2.0 mm. The rectangular jet nozzle width that gave the highest cooling performance was 30 to 40% of the streamwise length of the heat sinks. The influence of fin height on heat transfer became weak when the ratio of the height to the thickness of the fin exceeded approximately 35. When the air flow rate was constant, the thermal conductance increased as the fin pitch decreased. For a constant fin pitch, heat sinks with smaller fin thickness showed larger thermal conductance at a given blower power consumption. In our experimental range, the heat dissipation rate per unit heat sink volume increased as the base plate area of the heat sink became small. © 1998 Scripta Technica, Heat Trans Jpn Res, 27(6): 399–414, 1998     

Thermal analysis of CPU with CCC and copper base plate heat sinks using CFD

This paper describes experimental and theoretical investigations of heat sinks with different base plate material mounted on CPUs. The thermal model of the computer system with heat sinks which is created using Gambit (for preprocessing) and the simulation is carried out using Fluent (for solver execution and post processing). The following parameters are considered: fin thickness, fin height, and number of fins. Primarily in this paper different base plate thickness and base plate materials are optimized for maintaining the cost and thermal performance of a heat sink. In this research work, the thermal model of the computer system with a slot parallel plate fin heat sink design has been selected, and the fluid flow and thermal flow characteristics of heat sinks are studied. The slot parallel plate fin heat sinks have been used with copper base plates and carbon carbon composite (CCC) base plates to enhance the heat dissipation. The results and conclusion obtained in this present work are found to be in good agreement with numerical results. A complete computer chassis with slot parallel plate heat sinks is investigated varying the thickness of base plate, and the performances of the heat sinks are compared. © 2011 Wiley Periodicals, Inc. Heat Trans Asian Res; Published online in Wiley Online Library ( wileyonlinelibrary.com/journal/htj ). DOI 10.1002/htj.20342     

数据中心服务器水冷散热器的数值模拟与实验验证

水冷散热器在数据中心服务器CPU芯片冷却技术中发挥着重要的作用。如何获得高性能的散热效率成为了该领域关注的重点。针对一种翅柱式水冷散热器,用数值模拟的方法,通过改变翅柱的结构参数来优化散热器的散热性能以及流动特性。在相同的翅柱间距下,改变翅柱的直径和高度,在不同的入口流量下,研究其温度,努塞尔数,压降,摩擦系数,分析比较其综合系数对散热性能的影响,并对结果进行了实验验证。结果表明翅柱高度3.9mm,直径为0.9mm的散热器其综合系数最大     

Single-Phase Cryogenic Flow and Heat Transfer Through Microscale Pin Fin Heat Sinks

Single-phase heat transfer and pressure drop of liquid nitrogen in microscale heat sinks are studied experimentally in this paper. Effects of geometrical variations are characterized on the thermofluidic performance of staggered microscale pin fin heat sinks. Pitch-to-diameter ratio and aspect ratio of the micro pin fins are varied. The pin fins have square shape with 200 or 400 μm width and are oriented at 45 degrees to the flow direction. Thermal performance of the heat sinks is evaluated for Reynolds numbers (based on pin fin hydraulic diameter) from 108 to 570. Results are presented in a nondimensional form in terms of friction factor, Nusselt number, and Reynolds number and are compared with the predictions of existing correlations in the literature for micro pin fin heat sinks. Comparison of flow and heat transfer performance of the micro pin fin heat sinks reveals that at a particular critical Reynolds number of ～250, pin fin heat sinks with the same aspect ratio but larger pitch ratio show a transition in both friction factor and Nusselt number. In order to better characterize this transition, visualization experiments were performed with the Fluorinert PF5060 using an infrared camera. At the critical Reynolds number, for the larger pitch ratio pin fin heat sink, surface thermal intensity profiles suggest periodic flapping of the flow behind the pin fins at a Strouhal number of 0.227.     

The heat transfer characteristics of liquid cooling heat sink with micro pin fins

This paper numerically and experimentally investigated the liquid cooling efficiency of heat sinks containing micro pin fins. Aluminum prototypes of heat sink with micro pin fin were fabricated to explore the flow and thermal performance. The main geometry parameters included the diameter of micro pin fin and porosity of fin array. The effects of the geometrical parameters and pressure drop on the heat transfer performance of the heat sink were studied. In the experiments, the heat flux from base of heat sink was set as 300 kW/m². The pressure drop between the inlet and the outlet of heat sink was set < 3000 Pa. Numerical simulations with similar flow and thermal conditions were conducted to estimate the flow patterns, the effective thermal resistance. It was found that the effective thermal resistance would reach an optimum value for various pressure drops. It was also noted that the effective thermal resistance was not sensitive to porosity for sparsely packed pin fins.     

Experimental study of impingement cooling by heat sinks with thin longitudinal fins for LSI packages

This paper reports on the impingement cooling characteristics of a heat sink with thin longitudinal fins of 0.2 mm thickness, which are spaced with a fin-pitch in the range 0.5 mm to 2.0 mm. The air cooling of the heat sink comes from a slot-shaped orifice positioned above the heat-sink center. The breadth of the gap between the fin tops and the inlet orifice is in the range 0 mm to 10 mm. The thermal resistance of the thin longitudinal fins used is about 50% to 57% that of the thick longitudinal fins now in commercial use. The cooling performance of the thin-plate fins is almost the same as that of optimally arranged pin-fins with the same total surface area. A maximum value of six times the heat transfer rate of a single flat plate having the same base area was observed for the thin-plate fins. A comparison of cooling performance between impingement and channel flow systems was conducted. The performance of impingement cooling systems is almost unaffected by the breadth of the gap between the fin tops and the inlet orifice (or, for channel cooling, the upper wall). On the other hand, the performance of channel-cooling systems decreases significantly as the gap widens. © 1997 Scripta Technica, Inc. Heat Trans Jpn Res, 25(7): 449–459, 1996     

Natural convection heat transfer from a heat sink with hollow/perforated circular pin fins

Experiments were performed on natural convection heat transfer from circular pin fin heat sinks subject to the influence of its geometry, heat flux and orientation. The geometric dependence of heat dissipation from heat sinks of widely spaced solid and hollow/perforated circular pin fins with staggered combination, fitted into a heated base of fixed area is discussed. Over the tested range of Rayleigh number, 3.8 × 10⁶ ≤ Ra ≤ 1.65 × 10⁷, it was found that the solid pin fin heat sink performance for upward and sideward orientations shows a competitive nature, depending on Rayleigh number and generally shows higher heat transfer coefficients than those of the perforated/hollow pin fin ones in both arrangement. For all tested hollow/perforated pin fin heat sinks, however, the performance for sideward facing orientation was better than that for upward facing orientation. This argument is supported by observing that the augmentation factor was around 1.05–1.11, depending on the hollow pin diameter ratio, D_i/D_o. Meanwhile, the heat sink of larger hollow pin diameter ratio, D_i/D_o offered higher heat transfer coefficient than that of smaller D_i/D_o for upward orientation, and the situation was reversed for sideward orientation. The heat transfer performance for heat sinks with hollow/perforated pin fins was better than that of solid pins. The temperature difference between the base plate and surrounding air of these heat sinks was less than that of solid pin one and improved with increasing D_i/D_o.     

Thermal performance measurement of heat sinks with confined impinging jet by infrared thermography

In this paper, the thermal performance of heat sinks with confined impingement cooling is measured by infrared thermography. The effects of the impinging Reynolds number, the width and the height of the fins, the distance between the nozzle and the tip of the fins, and the type of the heat sinks on the thermal resistance are investigated. The results show that increasing the Reynolds number of the impinging jet reduces the thermal resistance of the heat sinks consistently. However, the reduction of the thermal resistance decreases gradually with the increase of the Reynolds number. The thermal resistance can be decreased by increasing the fin width combined with an appropriate Reynolds number. Increasing the fin height to enlarge the area of heat transfer also decreases the thermal resistance, but the effects are less conspicuous than those on altering the fin width. An appropriate impinging distance with minimum thermal resistance can be found at a specific Reynolds number, and the optimal impinging distance increases as the Reynolds number increases. Generally speaking, the thermal performance of the pin–fin heat sinks is superior to that of the plate–fin heat sinks because the pin–fin heat sinks consist of smaller volumes but greater exposure surfaces.     

Numerical Study of Thermal and Hydraulic Performance of Compound Heat Sink

The present study demonstrates the numerical simulation of the compound heat sink and provides physical insight into the flow and heat transfer characteristics. The governing equations are discretized by using a control-volume-based finite-difference method with a power-law scheme on an orthogonal nonuniform staggered grid. The coupling of the velocity and the pressure terms of momentum equations are solved by the SIMPLEC algorithm. The well-known RNG k ? ε two-equations turbulence model is employed to describe the turbulent structure and behavior. The compound heat sink is composed of a plate fin heat sink and some pins between plate fins. The objective of this investigation is to examine the effects of the types and the arrangements of the pins. It is found that the compound heat sink has better synthetical performance than the plate fin heat sink. Moreover, the compound heat sink which is composed of a plate fin heat sink and circular pins performs better than the square ones.     

Modeling and optimization of designing parameters for a parallel-plain fin heat sink with confined impinging jet using the response surface methodology

The parallel-plain fin (PPF) array structure is widely applied in convective heat sinks in order to create extended surface for the enhancement of heat transfer. In the present study, for investigating the influences of designing parameters of PPF heat sink with an axial-flow cooling fan on the thermal performance, a systematic experimental design based on the response surface methodology (RSM) is used. The thermal resistance and pressure drop are adopted as the thermal performance characteristics. Various designing parameters, such as height and thickness of fin, width of passage between fins, and distance between the cooling fan and the tip of fins, are explored by experiment. Those parameters affect the structure arrangement, geometry of fins and the status of impinging jet from an axial-flow cooling fan installed over the heat sink. A standard RSM design called a central composite design is selected as experimental plan for the four parameters mentioned above. An effective procedure of response surface methodology (RSM) has been proposed for modeling and optimizing the thermal performance characteristics of PPF heat sink with the design constrains. The most significant influential factors for minimizing thermal resistance and pressure drop have been identified from the analysis of variance. The confirmation experimental results indicate that the proposed model is reasonably accurate and can be used for describing the thermal resistance and pressure drop with the limits of the factors studied. The optimum designing parameters of PPF heat sink with an axial-flow cooling fan under constrains of mass and space limitation, which are based on the quadratic model of RSM and the sequential approximation optimization method, are found to be fin height of 60 mm, fin thickness of 1.07 mm, passage width between fins of 3.32 mm, and distance between the cooling fan and the tip of fins of 2.03 mm.     

Scroll heat sink: A novel heat sink with the moving fins inserted between the cooling fins

In this paper, a new type of a fan-integrated heat sink named a scroll heat sink is proposed and demonstrated. The most striking feature of the scroll heat sink is that heat dissipation and fluid pumping occurs simultaneously in the whole cooling space without requiring any additional space for a fan module. In the scroll heat sink, the moving fins, which rotate with two eccentric shafts, are inserted between the fixed (cooling) fins. By a relative motion between the moving fins and the cooling fins, a coolant is drawn into the space between them, takes heat away from the cooling fins, and the heated coolant is discharged out of the heat sink. In the present study, an experimental investigation is performed in order to demonstrate the concept of the scroll heat sink. Average coolant velocities and thermal resistances of the scroll heat sink are measured for various rotating speeds of the moving fins from 200 rpm to 500 rpm. Experimental results show that measured flow rates of the coolant are almost linearly proportional to the rotating speed of the moving fins. A theoretical model is also developed to estimate the required pumping power and the thermal resistance, and validated using experimental results. The theoretical model shows that optimized scroll heat sinks have lower thermal resistances than optimized plate-fin heat sinks under the fixed pumping power condition.     

Multidisciplinary optimization of a pin-fin radial heat sink for LED lighting applications

In this study, the cooling performance and mass of a pin-fin radial heat sink were optimized. A radial heat sink with pin fins was examined numerically to obtain a lighter heat sink while maintaining a similar cooling performance to that of a plate-fin heat sink investigated in a previous study. Both natural convection and radiation heat transfer were considered. Experiments were performed to validate the numerical model. The average temperature and mass of the heat sink for various types of fin arrays were compared to determine an appropriate reference configuration. The effects of various geometric parameters on the thermal resistance and mass of the heat sink were investigated; these indicated that the system was sensitive to the number of fin arrays, as well as the length of the long and middle fins. Multidisciplinary optimization was carried out using the three design variables to minimize the thermal resistance and mass simultaneously, and Pareto fronts were obtained with various weighting factors. A design for the optimum radial heat sink is proposed, which reduces the mass by more than 30% while maintaining a similar cooling performance to that of a plate-fin heat sink.     

Study of impingement cooling of heat sinks for LSI packages with longitudinal fins

This paper describes an experimental and a semi-empirical study on the impingement cooling characteristics of heat sinks with longitudinal fins of a type suitable for LSI packages. The experiments were performed with a variety of different fins. To enhance impingement cooling, one long rectangular inlet orifice (slit) over the center of the heat sink was found to offer the best structure. The optimum orifice width is about 1/6 of the base width of the heat sink. The thermal resistance at a fixed volumetric flow rate and orifice width varies little with size of the gap between the fin tops and inlet orifice, but gaps near 2 mm slightly lower the resistance. Correlations are proposed between the thermal resistance of the heat sink and the geometry of the longitudinal fins. The accuracy of the predicted thermal resistances was found to be within ±25% of the experimental data. © 1997 Scripta Technica, Inc. Heat Trans Jpn Res, 25(8): 537–553, 1996     

Optimization of heat sink geometries for impingement air-cooling of LSI packages

This paper describes the use of our previous study's prediction procedures for calculating thermal resistance and pressure drop. The procedures are used in the optimization of heat sink geometries for impingement air-cooling of LSI packages. Two types of heat sinks are considered: ones with longitudinal fins and ones with pin fins. We optimized the heat sink geometries by evaluating 16 parameters simultaneously. The parameters included fin thickness, spacing, and height. For the longitudinal fins, the optimal fin thicknesses were found to be between 0.12 and 0.15 mm, depending on which of the four types of fans were used. For pin fins, the optimal pin diameters were between 0.39 and 0.40 mm. Under constant pumping power, the optimal thermal resistance of the longitudinal fins was about 60% that of the pin fins. For both types of heat sinks, the optimal thermal resistance for four off-the-shelf fans was only slightly (maximum about 1%) higher than the theoretical optimum for the same pumping power. When manufacturing cost performance is considered, the most economical fin thickness and diameter are about 5 to 10 times higher than the optimal values calculated without respect for manufacturing costs. These values almost correspond to the actual limits of extrusion and press heat-sink manufacturing processes. © 1999 Scripta Technica, Heat Trans Asian Res, 28(2): 138–151, 1999