Response of aluminium/graphite composite to deformation in the semi-solid state

Semi-solid deformation of Al/graphite (Gr) composites was studied. The effects of deformation temperatures and deformation rates on the macrostructures, morphologies, the deformation force, and the formability of the composites were studied. For Al-10 wt% Gr composites, the semi-solid deformation stress increases as strain increases at lower strain rate. At higher strain rate, the stress first increases to a local maximum, then decreases before it starts to increase again as strain increases. For Al-30 wt% Gr composites, the stress decreases as strain increases. For both the Al-10 wt% Gr composites and Al-30 wt% Gr composites, the higher the deformation strain rate is, the more severe is the degree of cracking. The higher the deformation strain rate, the larger is the deformation stress, not counting the effects of fracturing. The deformation stresses required to semi-solid-deform Al-30 wt% Gr composites are larger than those for Al-10 wt% Gr composites, which is contrary to the normal solid-state deformation behaviours of Al-Gr composites. Composites deformed at 620 °C tend to require a higher deformation stress than at 630 °C for the same deformation strain, due to smaller liquid fraction and lower ductility at 620 °C. The effects of deformation temperatures on the ductility of the compacts are not significant at lower deformation strain rate. However, at the highest deformation strain rate, the ductility is better for higher deformation temperature.     

A2017合金半固态压缩的变形机制和成形性能

利用Gleeble-1500热学-力学模拟机,对A2017半固态合金进行半固态压缩变形实验,分析了应力-应变曲线和组织变化,研究了压缩变形机制及成形性能结果表明,用单辊搅拌冷却(SCR)技术制备的A2017半固态合金的组织为细小均匀的非枝晶等轴晶,二次加热后可转化为均匀的球形晶和共晶液相组成的半固态组织;A2017合金半固态压缩变形的塑性好、变形抗力低;随着变形温度的升高或者变形速率的降低,变形的抗力降低.在稳定的流动变形阶段,A2017合金的半固态变形机制主要由液相流动和固相颗粒的转动与滑动组成,触变性能稳定,最大半固态加工变形范围为60%左右.     

Deformation behavior of spray-formed hypereutectic Al–Si alloys

The deformation behavior of spray-formed hypereutectic aluminum–silicon alloys—AlSix (x = 18, 25, and 35 wt%)—has been studied by means of compression test at various temperatures and strain rates. The flow stress of the spray-formed Al–Si alloys increases with decreasing compression temperature and increasing strain rate. Higher silicon content in the alloys also leads to higher flow stress during deformation. The flow curves determined from the compression tests exhibit that the deformation of the materials is controlled by two competing mechanisms: strain hardening, and flow softening. Particle damage during the deformation may have an influence on the flow curves of the alloys with large silicon particles. Based on the flow curves obtained from the compression tests and knowledge of aluminum extrusion, the spray-formed hypereutectic Al–Si alloy billets have been hot extruded into wires with a high area reduction ratio around 189. Since primary silicon particles were greatly refined and uniformly distributed in the spray-formed materials, the heavy deformations of the spray-formed Al–Si alloys containing high amount of silicon were successfully performed.     

Prediction of hot deformation behavior of Al–5.9%Cu–0.5%Mg alloys with trace additions of Sn

High temperature deformation behavior of Al–5.9wt%Cu–0.5wt%Mg alloys containing trace amounts (from 0 to 0.1 wt%) of Sn was studied by hot compression tests conducted at various temperatures and strain rates. The peak flow stress of the alloys increased with increase in strain rate and decrease in deformation temperature. The peak stress could be correlated with temperature and strain rate by a suitable hyperbolic-sine constitutive equation. The activation energy for hot deformation of the alloy without Sn content was observed to be 183.4 kJ mol⁻¹ which increased to 225.5 kJ mol⁻¹ due to 0.08 wt% of Sn addition. The Zener-Hollomon parameter (Z) was determined at various deforming conditions. The tendency of dynamic recrystallization increased with low Z values, corresponding to low strain rate and high temperature. The peak flow stresses at various processing conditions have been predicted by the constitutive modeling and correlated with the experimental results with fairly good accuracy. It was possible to predict 80, 75, 100, 100, 90, and 85% of the peak stress values within an error less than ±13%, for the investigated alloys. With addition of Sn content >0.04 wt%, peak flow stress increased significantly for all strain rate and temperature combinations. Scanning electron microscope revealed two types of second phases at the grain boundary of the undeformed alloy matrix, one being an Al–Cu–Si–Fe–Mn phase while the other identified as CuAl₂. The high strength and flow stress value of the alloy with 0.06 wt% of Sn content, may be attributed to the variation in amount, composition, and morphology of the Al–Cu–Si–Fe–Mn phase, as well as to the lower value of activation energy for precipitation reaction, as revealed from differential scanning calorimetric studies.     

半固态AZ91D镁合金的压缩变形和显微组织

利用平行板触变压缩仪研究了电磁搅拌的半固态AZ91D合金试样的压缩变形和组织.结果表明:随着半固态压缩变形温度的升高,AZ91D镁合金试样变形的速度加快,即变形应变速度增大,但压缩应力不断下降;在某一载荷下,AZ91D镁合金试样压缩变形应力和应变呈明显的线性关系,与压缩温度的高低无关.随着半固态压缩载荷的提高,AZ91D镁合金试样变形的速度增加,应变速度增大,应力下降速度加快;在不同的压缩载荷下,AZ91D镁合金试样的压缩变形应力和应变都呈明显的线性关系.在实验中的各种半固态压缩变形条件下,初生α-Mg在压缩后AZ91D镁合金试样组织中的分布很均匀,几乎不存在组织偏析.当初生固相的形态呈球状结构,在相同的变形条件下,不同种类合金的半固态压缩变形规律非常相似.     

A STUDY OF FATIGUE AND CREEP BEHAVIOUR OF FOUR HIGH TEMPERATURE SOLDERS

Creep and cyclic deformation behavior of two lead-free high temperature solder alloys, 95Sn-5Ag and 99Sn-1.0Cu, a high lead alloy 97.SPb-1.SAg-1.0Sn, and an Ag-modified eutectic alloy 62.SSn-36.1Pb-1.4Ag, were studied. Room temperature and high (100°C and 150°C) temperature fatigue tests (with cyclic strain amplitude up to 6.0%) for the four solders were conducted, with the fatigue lives ranging from a few cycles to more than 100,000 cycles. It is shown that among the alloys studied, 62.SSn-36.1Pb-1.4Ag (the modified Sn-Pb eutectic alloy) has the lowest fatigue resistance in term of low cycle fatigue life (strain controlled). The high lead alloy, 97.SPb-1.5Ag-1.0Sn, has the highest strain fatigue resistance in the large strain region (Δ > 2.0%). Temperature has a significant effect on alloys 95Sn-5Ag and 99Sn-1.0Cu, but has a negligible effect on the Ag modified Sn-Pb eutectic alloy 62.5Sn-36.1Pb-1.4Ag and 97.5Pb-1.5Ag-1.0Sn. Creep studies show that these alloys generally have a very significant primary creep regime (up to 20%); thus, any realistic constitutive relation has to take such a primary creep phase into consideration. Cyclic deformation of alloy 95Sn-SAg was simulated by using a constitutive relation built upon a 2-cell model, which covers both primary and secondary creep. This model provides a good estimate of the peak stresses (the minimum stress and the maximum stress in each cycle); it agrees with experimental results when the applied cyclic strain is small and/or the applied strain rate is very low.     

Dynamic strain-rate effect on uniaxial tension deformation of Ti5Al2.5Sn α-titanium alloy at various temperatures

The uniaxial tensile experiments for Ti5Al2.5Sn alloy were performed at strain rates ranging from 10^?3–10⁺³ s^?1 and test temperatures of 153–873 K. Experimentally measured stress-strain responses indicate the yield strength exhibits positive strain-rate dependency, while the yield strength increases as the test temperature is decreased. To understand the thermomechanical coupling of dynamic plastic deformation, a specially developed single-tensile-pulse loading technique was used, and the isothermal stress-strain curves for the rates of 180 and 450 s^?1 were obtained at temperatures of 203, 298 and 573 K. The plastic strain hardening measurements obtained here are essentially athermal and largely independent of strain rate, consistent with titanium and its alloys being bcc-structure-like in mechanical behaviour. Based on the experimentally obtained plastic deformation features of the alloy, the physically based Voyiadjis-Abed constitutive relationship was modified to model the dynamic tensile deformation of the Ti5Al2.5Sn alloy at low and high temperatures.     

Deformation behavior and microstructural evolution during the semi-solid compression of Al–4Cu–Mg alloy

The effects of the process parameters, including deformation temperature and strain rate, on the deformation behavior and microstructure of an Al–4Cu–Mg alloy, have been investigated through isothermal compression. Experiments were conducted at deformation temperatures of 540 °C, 560 °C, and 580 °C, strain rates of 1 s⁻¹, 1×10⁻¹ s⁻¹, 1×10⁻² s⁻¹, and 1×10⁻³ s⁻¹, and height reductions of 20%, 40%, and 60%. The experimental results show that deformation temperature and strain rate have significant effect on the peak flow stress. The flow stress decreases with an increase of deformation temperature and/or a decrease of the strain rate. Above a critical value of the deformation temperature, the flow stress quickly reaches a steady value. Experimental materials A and B have equiaxed and irregular grains, respectively, prior to deformation. The microstructures vary with the process parameters in the semi-solid state. For material B, the irregular grains transform to equiaxed grains in the process of semi-solid deformation, which improves the deformation behavior.     

Steady State Rheological Characteristic of Semisolid Magnesium Alloy

Isothermal compressive experiments at different temperatures, strain rates and holding time for semisolid AZ91D, Zr modified AZ91D and MB15 alloy with higher solid volume fraction were carried out by using Gleeble-1500D simulator and the true stress-strain curves were given directly. The relationship of apparent viscosity vs temperature, shear rate and holding time of the three kinds of semi-solid magnesium alloys, as well as isothermal steady state rheological characteristic and mechanical behavior were studied. The results show that the three magnesium alloys had the characteristic of shear-thinning. The rheological characteristic of the semi-solid MB15 is different from that of semi-solid AZ91D. The semi-solid MB15 has higher apparent viscosity and deformation resistance.     

Microstructure and mechanical properties of directionally solidified high-Nb containing Ti–Al alloys

Two high-Nb containing Ti–Al alloys, Ti–16Al–8Nb and Ti–16Al–8Nb–1Sn were fabricated using directional solidification. Their microstructures and mechanical properties at both room and high temperatures were studied. Results showed that the addition of 1% Sn promoted the formation of laths and contributed remarkably to the enhancement in room-temperature strength and high temperature ductility of Ti–Al alloy. The alloys exhibited the feature of quasi-cleavage fracture at room temperature and they experienced significant plastic deformation at high temperatures.     

Tensile properties and wettability of SAC0307 and SAC105 low Ag lead-free solder alloys

In this article, the tensile properties of low Ag lead-free solder alloys, SAC0307 and SAC105, are examined under various strain rates and temperatures. The wettability of these solders on Cu pad is also characterized by using different fluxes. The SAC305 and Sn37Pb solder alloys are also studied for comparison. Our results show that the properties of all solder alloys are dependent on the strain rate and temperature. The ultimate tensile strength increases monotonously with the increment of strain rate. Both SAC0307 and SAC105 alloys possess lower strength and higher elongation ratio than SAC305 and Sn37Pb alloys. For all the fluxes used in this study, the SAC0307 and SAC105 alloys show the similar wettability to SAC305, whereas worse than that of Sn37Pb alloy. Increasing the activity of the flux does not improve the wettability of the SAC solder alloys on Cu pad effectively.     

Hybrides Walzen am Beispiel von Titan‐Aluminium‐Verbunden

Hybrid rolling as exemplified by titanium‐aluminium laminates Triple layered titanium‐aluminium laminates composed of titanium alloys TiAl6V4 (ASTM grade 5) and Ti 99.8 ASTM grade 1) together with the aluminium alloys AlMgSi 0.5 (EN‐AW 6060) and AlCuMg 1 (EN‐AW 2017) are manufactured by hot rolling and the deformation behaviour is investigated subject to alternating deformation parameters. The focus is the investigation of the differences between stepwise and continuous increases in true strain. True strains of 20 … 60 % are tested at temperatures from 400 … 500 °C. The contact zone of the manufactured laminates is then metallographically examined and the interlayer bond strength is mechanically tested. Torsion tests are presented for qualitatively determining the bond strength of the laminate. Bond forming already initiates at true strains of 35 % and temperatures of 350 °C within the rolling gap.     

Plastic deformation of Zr-Sn polycrystals at intermediate temperatures

The yield stress and the activation volume for Zr-Sn alloys with 0.74, 2.85, 4.27 and 6.19 wt% Sn have been measured at temperatures between 400 and 750 K. The temperature dependence of the yield stress exhibits a plateau except for the alloy with the highest content of tin. The yield stress increases with increasing content of tin atoms. A non-monotonic variation of the activation volume with temperature has been observed for pure zirconium and for Zr-Sn alloys with 0.74 and 2.85 wt% Sn. The maximum value of the activation volume (at about 600 K) decreases with increasing content of tin. Dynamic strain ageing is considered to be responsible for the maximum in the temperature dependence of the activation volume. The dislocation structure has been observed. The experimental results are interpreted in terms of a simple model which considers that the flow stress is determined by thermally activated glide of dislocations through obstacles, dynamic strain ageing and a strengthening effect of tin atoms.     

Compressive creep behavior of as-cast and aging-treated Mg–5 wt% Sn alloys

The microstructure and compressive creep behaviors of as-cast and aging-treated Mg–5 wt% Sn alloys are investigated in this paper. The compressive creep resistance of aging-treated Mg–5 wt% Sn alloy is much better than that of as-cast alloy at the applied stresses from 25 MPa to 35 MPa and the temperatures from 423 K to 473 K, which is mainly due to the dispersive distribution of Mg₂Sn phase in the aging-treated Mg–5 wt% Sn alloy. The calculated average values of stress exponent n and activation energy Q_c suggest that dislocation cross slip and dislocation climb happen respectively in as-cast and aging-treated Mg–5 wt% Sn alloys during creep.     

Effect of alloying elements on the creep behavior of high Pb-based solders

This study examines the high temperature creep behavior of several Pb-based alloys. All compositions tested were found to follow power-law dislocation creep in the strain rate range of 10⁻⁹-10⁻³ s⁻¹. Both the stress exponent and activation energy were measured from 298 to 473 K to identify the rate controlling mechanism for creep deformation. Creep of 95Pb-5In, 92.5Pb-5Sn-2.5Ag, 93Pb-3Sn-2Ag-2In was rate limited by dislocation climb from the observed stress exponent. A transition in the controlling climb mechanism from pipe diffusion to lattice diffusion was observed around 0.7T_m. Creep of 90Pb-10Sn was, however, rate limited by viscous solute drag rather than dislocation climb due to the greater concentration of Sn in Pb. The enhancement in self-diffusion of Pb was dependent on the degree of solid solution with solute atoms. The outcome of this work identifies variables related to the alloy elements that control creep behavior of Pb-based alloys used in high temperature applications where traditional solders cannot be used.     

Strain-dependent constitutive analysis of three wrought Mg–Al–Zn alloys

The commonly used hyperbolic sine constitutive equation for metal forming at elevated temperatures, with no strain incorporated, is in principle applicable only to deformation in the steady state. However, the actual deformation processes applied to magnesium alloys are mostly in the non-steady state. In the present research, the results of hot uniaxial compression tests of three wrought magnesium alloys covering wide ranges of temperatures and strain rates were used for a strain-dependent constitutive analysis. A strain-dependent constitutive relationship for these alloys was established. It appeared that the apparent activation energy for deformation decreased with increasing the alloying content in these alloys. The constitutive parameters obtained were used to predict flow stresses at given strains and the results were in good agreement with experimental measurements.     

Processing to ultrafine grain structures by conventional routes

Abstract

The aim of this project was to achieve grain sizes of the order of 1 µm in Al–Mg–Cr alloys by deformation at elevated temperatures to large strains using conventional rolling or plane strain compression. The ‘processing window’ for generating such ultrafine grain sizes by continuous recrystallisation has also been investigated. The necessary processing conditions for achieving a 1–3 µm grain size in alloys containing 2–3 wt-%Mg, deformed to strains of 3, were found to be strain rates of less than 10 s^-1 and temperatures between 300 and 350°C. The restricted range of conditions under which such fine grain microstructures can be achieved in these alloys by plane strain deformation is seen to be a limiting factor in commercial exploitation of such processing methods.     

High strain rate behavior, transformation-induced plasticity and fracture toughness characterization of cast and additionally tempered Fe85Cr4Mo8V2C1 alloy manufactured using a rapid solidification technique

This study focuses on the characterization of the microstructures of an FeCrMoVC alloy in two states (an as-cast and a heat-treated state) as well as the compressive strain rate-dependent material and fracture toughness behavior. Both microstructures consist of martensite, retained austenite and complex carbides. Tempering results in a transformation of retained austenite into martensite, the precipitation of fine alloy carbides, and diffusion processes. High yield stresses, flow and ultimate compressive strength values at a relatively good deformability were measured. The yield and flow stresses at the onset of deformation are higher for the heat-treated state due to higher martensitic phase fractions and fine precipitations of alloy carbides respectively. Compressive deformation causes a strain-induced transformation of retained austenite to α′-martensite. Hence, both high-strength alloys are TRIP-assisted steels (TRansformation-Induced Plasticity). However, the martensitic transformation is more pronounced in the as-cast state due to higher phase fractions of retained austenite already in the initial state. Examinations of strained microstructures showed decreased crystallite sizes with increasing deformation. It is assumed that, during plastic deformation, the amount of low angle grain boundaries increases while the incremental formation of α′-martensite leads to decreased crystallite size. In general, lower microstrains were determined in the heat-treated state as a consequence of stress relaxation during tempering. In comparison to commercially available tool steels, the determined fracture toughness K _Ic of both variants revealed relatively high fracture toughness values. It was found that the lower shelf of K _Ic is already reached at room temperature. Higher loading rates $ \dot{K} $ resulted in lower dynamic fracture toughness K _Id values. Notch fracture toughness K _A measurements indicate that the critical notch tip radii of the examined materials are slightly smaller than 0.09?mm.     

The effect of Au on the Pb-1.5% Ag-1% Sn solder

During soldering, gold present, for example, as a plating on components is rapidly dissolved by the high melting point Pb-1.5% Ag-1 wt% Sn solder. One major effect is that the solidus temperature is significantly lowered from 311°C at O wt% Au to that of a postulated quaternary eutectic at 211°C, formed by additions of greater than 4.8 wt% Au. The liquidus of the solder is reduced from 311 to 272°C by additions of 10 wt% Au. The dissolved Au also reduces the strength of the solder, and drastically so at elevated temperatures at which the solder would otherwise be expected to possess reasonable strength. The deleterious effects of gold absorption can largely be avoided by controlling the solidus temperatures of the AuPbAgSn alloy formed during the soldering operation. This is accomplished by regulating the proportions of Au and solder able to react within each joint.     

Achieving superplastic properties in a Pb–Sn eutectic alloy processed by equal-channel angular pressing

Experiments were conducted on a Pb-62% Sn eutectic alloy containing 160 ppm of Sb. The alloy was processed by equal-channel angular pressing (ECAP) through 1 to 5 passes at room temperature and then tested in tension at a temperature of 423 K using initial strain rates from 1.0 × 10⁻⁴ to 1.0 × 10⁻¹ s⁻¹. Excellent superplastic elongations were achieved at intermediate strain rates with a maximum elongation to failure of 2,665%. It is shown that, for processing through similar numbers of ECAP passes, these elongations are higher than in an earlier investigation using a Pb-62% Sn alloy of higher purity. The results are presented pictorially in the form of a deformation mechanism map by plotting normalized grain size against normalized stress at a temperature of 423 K.