SiCp/Al基复合材料的高压扭转试验

采用高压扭转(high-pressure torsion,HPT)工艺制备SiCp/Al基复合材料,试验发现随着扭转半径的增加,剪切应变增大,SiC颗粒分布逐渐均匀;升高温度,SiC颗粒分布的均匀性好;随着扭转半径的增加材料的硬度先增加后减小,且材料越致密,SiC含量越多,分布越均匀,材料硬度越高。     

无压浸渗法制备不同体积分数及梯度SiCp/Al复合材料

选用不同粒径大小的SiC颗粒,并通过对颗粒分布的有效控制,采用无压浸渗工艺制备了不同体积分数(15%～65%)的SiCp/Al复合材料,并在此基础上试制了梯度SiCp/Al复合材料.运用OM,XRD等手段对所制备的复合材料进行了显微组织观察与成分分析,并对选定体积分数的复合材料进行了密度以及力学测试.研究结果表明,无压浸渗工艺下不同体积分数的SiCp/Al复合材料组织均匀、致密,力学性能良好;具有梯度结构的SiCp/Al复合材料层间结合良好,没有层间剥离现象.     

占空比对SiCp/Al基复合材料微弧氧化膜层组织及性能的影响

以NaAlO₂+NaOH为电解液体系，在恒压模式下对SiC体积分数为45%,粒径为5μm的SiCp/Al基复合材料表面进行微弧氧化处理，研究了占空比对SiCp/Al基复合材料微弧氧化膜层组织及性能的影响。用SEM分析微弧氧化膜层的形貌；用X射线衍射仪分析膜层的相组成；采用粗糙度仪、维氏硬度仪、划痕仪对膜层粗糙度、显微硬度及结合力进行了分析；用电化学工作站分析膜层的耐蚀性。结果表明：随着占空比的增大，微弧氧化膜层变得连续，厚度呈现增加趋势，粗糙度逐渐增加，孔隙率逐渐降低。占空比对微弧氧化膜层的物相有一定影响。SiCp/Al基复合材料微弧氧化膜层与基体的结合力随占空比的增加先增大后减小。不同占空比下制备的微弧氧化膜层均能提高SiCp/Al基复合材料的耐蚀性，占空比为70%时制备的微弧氧化膜层耐蚀性最好。     

高压扭转法对SiC_p-Al基复合材料颗粒分布的影响

采用高压扭转(High-Pressure Torsion,HPT)工艺制备SiCp-Al基复合材料。通过显微组织的定性分析及样方法的定量计算,深入研究不同工艺参数对SiC颗粒分布的影响规律,结果表明:采用高压扭转法可以直接将8.75%(体积分数)SiC-Al混合粉末制备成金属基复合材料。通过金相分析得出:SiC颗粒在试样不同扭转半径处分布情况具有差异:工艺参数(温度、压力、圈数)对SiC颗粒分布有重要影响,结合样方法对颗粒分布情况的定量分析得出:随着扭转圈数、压力、扭转半径的增大,剪切作用增强,SiC颗粒分布均匀性提高;变形温度升高,基体流动性提高,颗粒分布均匀性得到改善。     

碳化硅颗粒增强Al基复合材料的新型制备工艺

综述了碳化硅增强铝基复合材料的几种主要制备工艺,重点阐述了高能超声半固态复合法制备SiCp/Al复合材料.首先用渗流法制备SiC体积分数高的SiCp/Al预制块,进行SiC预分散,然后将预制块加入处于半固态温度条件下的铝合金熔体中,最后导入超声波进行搅拌.此法很好地改善了增强颗粒与基体之间的润湿性,使SiC在基体中均匀...     

SiC颗粒尺寸及含量对SiCp／2024Al复合材料性能的影响

本文对粉末冶金法制备的SiCp/2024Al复合材料的性能进行了研究。随SiC颗粒尺寸的增大,复合材料的强度降低,而塑性和磨损抗力则增加。SiC颗粒尺寸对复合材料的物理性能没有什么影响。增加SiC颗粒含量,复合材料的强度、模量均增大,磨损抗力亦明显增加,而塑性和热膨胀系数则降低。     

数值模拟SiCp/Al复合材料的微观结构对力学性能的影响

本文运用有限元法模拟了SiC颗粒体积分数和颗粒尺寸对SiCp/Al复合材料弹性模量、屈服强度、延伸率的影响。为了建立与真实显微结构相似的复合材料模型,假定任意尺寸的SiC颗粒随机地分布在SiCp/Al复合材料中。计算结果表明:SiC颗粒体积分数对复合材料的力学性能的影响更加显著。随着体积分数的增加,SiCp/Al复合材料的弹性模量和屈服强度逐渐增加;而其延伸率会相应降低。其应力应变曲线由韧性材料的特性向脆性材料的特性逐渐过渡。相反,当平均颗粒尺寸在一定的范围内变化时,颗粒尺寸对其应力-应变曲线的影响并不显著。     

高阻尼铝基复合材料的研究

采用包套挤压法制备了高阻尼6061Al/SiCp/ 石墨混杂金属基复合材料,并对所制备的复合材料的金相组织、力学和阻尼特性进行了初步分析。包套挤压法制备的6061Al/SiCp/石墨混杂金属基复合中增强增阻颗粒分布均匀,其体积分数可精确控制。SiC颗粒作为增强剂能够增大复合材料的强度和刚度,而石墨粉作为增阻剂可以提高复合材料的阻尼特性。试验结果表明,能够应用包套挤压法制备力学性能和阻尼特性符合定要求的新型结构－功能材料－6061Al/SiCp/石墨混杂金属基复合材料。     

高体积分数SiCp/7075Al复合材料的时效析出行为

高体积分数SiC颗粒增强7系铝基复合材料(SiCp/7XXXAl)具有高比强度比刚度等特点,因此适宜作为结构件在航空航天、汽车等领域应用。本文采用压力浸渗法制备了45vol.%的SiCp/7075Al复合材料,并对复合材料和基体合金的时效行为进行了系统的研究。DSC分析结果发现复合材料的η′相和η相的放热峰分别比基体7075合金降低了4.4℃和0.5℃。复合材料与7075铝合金达到峰时效的时间均为9h,峰时效时复合材料与基体7075铝合金的硬度分别提高了38.7%(从213.4到296HB)和107.6%(从98.2到203.9HB)。颗粒的加入使得基体中的位错密度显著增加,这有利于析出相的形核。但另一方面,合金元素在界面的偏聚会抑制析出相的析出。因此,SiCp/7075Al复合材料的析出行为是两方面共同作用的结果。     

高导热金属基复合材料的热物理性能

分别采用无压浸渗、气压浸渗、内氧化技术制备了高导热Al/SiC、Al/C、Cu/Al2O3复合材料.研究了增强相和界面对这三种复合材料的热导率和热膨胀系数的影响,并对这些性能进行了理论分析和数值模拟.当颗粒尺寸与界面层厚度之比固定时,颗粒尺寸对Al/SiC复合材料热导率影响很小,但界面热导率对其影响很大;Al/SiC复合材料的CTE随温度的升高而增加,随SiO2层厚度的增加而减小;碳纤维中混杂3%SiC颗粒有利于改善纤维的分布,降低Al/C复合材料的缺陷,并提高其热导率;压力加工增加了Cu/Al2O3的致密度,也提高了其热导率;可用Schapery和Kerner模型计算复合材料的热膨胀系数,用Hasselman-Johnson模型计算热导率.     

The thermal expansion and mechanical properties of high reinforcement content SiCp/Al composites fabricated by squeeze casting technology

With mixing different sized SiC particles, high reinforcement content SiCp/Al composites (V_p=50, 60 and 70%) for electronic packaging applications were fabricated by squeeze casting technology. The composites were free of porosity and SiC particles distributed uniformly in the composite. The mean linear coefficients of thermal expansion (20–100 °C) of SiCp/Al composites ranged from 8.3 to 10.8×10⁻⁶/°C and decreased with an increase in volume fraction of SiC content. The experimental coefficients of thermal expansion agreed well with predicted values based on Kerner's model. The Brinell hardness increased from 188.6 to 258.0, and the modulus increased from 148 to 204 GPa for the corresponding composites. The bending strengths were larger than 370 MPa, but no obvious trend between bending strength and SiC content was observed.     

快速致密化制备SiCp/Fe复合材料及其性能研究

研究了一种电流直加热动态热压快速致密化工艺,采用此工艺克服了粉末冶金法和铸造法的局限性,快速制备了10vol%SiCp/Fe复合材料,考察了材料在不同烧结电压和不同烧结时间情况下的致密化行为及其力学性能,结果表明此工艺制备的10vol%SiCp/Fe复合材料,相对密度达到99.6%,布氏硬度为477HB,抗拉强度为912MPa,显微组织细小均匀.     

Fabrication of SiC particles-reinforced magnesium matrix composite by ultrasonic vibration

Magnesium matrix composites reinforced with two volume fractions (1 and 3%) of SiC particles (1 μm) were successfully fabricated by ultrasonic vibration. Compared with as-cast AZ91 alloy, with the addition of the SiC particles grain size of matrix decreased, while most of the phase Mg₁₇Al₁₂ varied from coarse plates to lamellar precipitates in the SiCp/AZ91 composites. With increasing volume fraction of the SiC particles, grains of matrix in the SiCp/AZ91 composites were gradually refined. The SiC particles were located mainly at grain boundaries in both 1 vol% SiCp/AZ91 composite and 3 vol% SiCp/AZ91 composite. SiC particles inside the particle clusters may be still separated by magnesium. The study of the interface between the SiC particle and the alloy matrix suggested that SiC particles bonded well with the alloy matrix without interfacial reaction. The ultimate tensile strength, yield strength, and elongation to fracture of the SiCp/AZ91 composites were simultaneously improved compared with that of the as-cast AZ91 alloy.     

Effect of submicron size SiC particles on microstructure and mechanical properties of AZ31B magnesium matrix composites

The magnesium matrix composites reinforced with three volume fractions (3, 5 and 10 vol.%) of submicron-SiC particles (∼0.5 μm) were fabricated by semisolid stirring assisted ultrasonic vibration method. With increasing the volume fraction of the submicron SiC particles (SiCp), the grain size of matrix in the SiCp/AZ31B composites was gradually decreased. Most of the submicron SiC particles exhibited homogeneous distribution in the SiCp/AZ31B composites. The ultimate tensile strength and yield strength of the 10 vol.% SiCp/AZ31B composites were simultaneously improved. The study of interface between the submicron SiCp and the matrix in the SiCp/AZ31B composite suggested that submicron SiCp bonded well with the matrix without interfacial activity.     

Effect of Hot Extrusion on Interfacial Microstructure and Tensile Properties of SiC_p/2009Al Composites Fabricated at Different Hot Pressing Temperatures

The effects of hot extrusion on the interfacial microstructures and tensile properties of 15 vol.SiCp/2009Al composites fabricated at different hot pressing temperatures were investigated.After hot extrusion,the relative density of the composites increased,the SiC particle distribution became more uniform,and the SiC particles tended to align along the extrusion direction.Furthermore,the interface bonding was improved after hot extrusion;however,the extrusion exerted no obvious effect on the interfacial reaction products formed during sintering process.Tensile tests indicated that the mechanical properties of the composites were improved significantly after extrusion.Fractography revealed that the fracture mechanism of the extruded composites fabricated at the hot pressing temperatures below 540℃ was mainly the interfacial debonding.For the extruded composites fabricated at 560-600℃,the fracture was the matrix ductile fracture and the SiC particle fracture.When the composites were hot pressed at or above 620℃,after extrusion,the fracture mechanism of the composites was the matrix ductile fracture,the interface cracking and the SiC particle fracture.     

增强颗粒含量和尺寸对SiCp/Fe复合材料性能的影响

利用电流直加热动态热压烧结工艺,分别制备了增强颗粒体积含量从5%到15%,尺寸从3 μm到45 μm的SiCp/Fe复合材料,研究了粒子含量与尺寸对复合材料硬度、强度、延伸率和耐磨性能的影响.研究表明:增强颗粒的体积含量从5%提高到10%,可以明显提高材料的性能;随着增强颗粒含量进一步提高,颗粒团聚将导致材料性能降低;...     

Mechanical properties of hot pressed SiCp and B4Cp/Alumix 123 composites alloyed with minor Zr

In the present study, effect of Zr addition on the microstructure and wear behavior of aluminum alloy composites (AMCs) reinforced with B4Cp and SiCp particles fabricated via hot pressing were investigated. The samples for the study composed of unreinforced aluminum alloy (Alumix 123) and the composites reinforced with 10% B4Cp and % SiCp were prepared by hot isostatic pressing (HIP) method. Similarly, all the samples alloyed with 0.2% Zr were also produced in order to make a comparison. The produced samples were evaluated for microstructural properties and mechanical tests for hardness, tensile and bending strength were performed. Wear test was carried out at 5 mm/s sliding speed under 3.0 N load for the all kind of hot pressed produced samples. The hot pressed composite microstructures have a more uniform distribution of the reinforcements. After HIP process, the composites were successfully produced with high density (>99%). The addition of Zr increased the yield and tensile strength of the samples. The highest strength value was found for the sample Al 123 matrix alloy with Zr. Evaluation of microstructures showed that copper and zirconium dispersed equally within the matrix microstructure without agglomeration. For the composite samples, Al3Zr, appeared as white precipitate, were inspected around B4C and SiC particles. The composite containing SiC particles and Zr had wear resistance value superior to those of the other counterparts.     

微波烧结SiC颗粒增强铝基复合材料

采用微波烧结的方法,在烧结温度分别为680℃,710℃,740℃,770℃,800℃制备了15％的SiCp／Al复合材料。探讨温度对材料的致密度和力学性能的影响。结果表明：致密度和材料硬度及冲击韧性随温度变化呈马鞍形,在770℃样品的密度和硬度及冲击韧性达到最佳值,分别为2．62g／cm3,42．6MPa,40J／cm2。结论：用微波烧结SiCp／Al复合材料可在短时间内使样品达到烧结致密化,缩短烧结时间,节约能源。     

Interfacial microstructure and its effect on thermal conductivity of SiCp/Cu composites

Thermal conductivity of SiCp/Cu composites was usually far below the expectation, which is usually attributed to the low real thermal conductivity of matrix. In the present work, highly pure Cu matrix composites reinforced with acid washed SiC particles were prepared by the pressure infiltration method. The interfacial microstructure of SiCp/Cu composites was characterized by layered interfacial products, including un-reacted SiC particles, a Cu–Si layer, a polycrystalline C layer and Cu–Si matrix. However, no Cu₃Si was found in the present work, which is evidence for the hypothesis that the formation of Cu₃Si phase in SiC/Cu system might be related to the alloying elements in Cu matrix and residual Si in SiC particles. The thermal conductivity of SiCp/Cu composites was slightly increased with the particle size from 69.9 to 78.6 W/(m K). Due to high density defects, the real thermal conductivity of Cu matrix calculated by H–J model was only about 70 W/(m K). The significant decrease in thermal conductivity of Cu matrix is an important factor for the low thermal conductivity of SiCp/Cu composites. However, even considered the significant decrease of thermal conductivity of Cu matrix, theoretical values of SiCp/Cu composites calculated by H–J model were still higher than the experimental results. Therefore, an ideal particle was introduced in the present work to evaluate the effect of interfacial thermal resistance. The reverse-deduced effective thermal conductivities of ideal particles according to H–J model was about 80 W/(m K). Therefore, severe interfacial reaction in SiCp/Cu composites also leads to the low thermal conductivity of SiCp/Cu composites.