Phase Separation of Poly(ether sulfone imide) Modified Epoxy Resins

Amine terminated poly(ether sulfone imide) (PESI) with various imide and ethersulfone contents but similar polymer molecular weights were blended with diglycidyletherbisphenol-A (DGEBA) and cured with diaminodiphenylsulfone (DDS). The imide group, a tertiary amine, is a catalyst of the curing reaction of DGEBA with DDS, but it is poorly compatible with uncured epoxy resin. The ethersulfone group is not a catalyst of the curing reaction of DGEBA with DDS, but it has a similar chemical structure as DDS and is compatible with epoxy resin while it is at a low degree of curing. Since PESIs used in this study had similar molecular weights, increasing imide content of PESI would reduce ethersulfone content. The influence of imide and ethersulfone contents of PESI on the phase separation and curing reaction of DGEBA/DDS/PESI blend was investigated using differential scanning calorimetry (DSC), time-resolved light scattering (TRLS), and polarized optical microscopy (POM). Though the imide group has a catalysis effect on the curing reaction of DGEBA with DDS, however, its poor compatibility with epoxy resin retards the curing reaction. Our experimental results revealed the morphology of the cured blends and the curing behavior was a compromise result of catalysis and compatibility of PESI with epoxy resin.     

Physical aging of epoxy resin blended with poly(ether sulfone): Effect of poly(ether sulfone) molecular weight

The physical aging process of 4-4′-diaminodiphenylsulfone (DDS) cured diglycidyl ether bisphenol-A (DGEBA) blended with various molecular weights of poly(ether sulfone) (PES; M_n = 28,600, 10,600, and 6,137) was studied by DSC. For DGEBA/DDS system blended with a low MW PES-3 (M_n = 6,137), no phase separation of the polymer blend and only one enthalpic relaxation process due to physical aging was observed. Since the high MW PES-1 (M_n = 28,600) had a T_g close to that of fully cured DGEBA/DDS, the fully cured DGEBA/DDS/PES-1 blend had a broader glass transition than a neat DGEBA/DDS system. However, the DSC results showed two enthalpic relaxation processes due to the physical aging of PES-rich and cured epoxy-rich phases as the material was aged at 155 °C (30 °C below T_g). Since the T_gs of PES-1-rich and epoxy-rich phases overlapped with each other, the enthalpic relaxation processes corresponding to each phase coupled to each other in the earlier stage of physical aging. The medium MW PES-2 (M_n = 10,600) has a much lower T_g than that of fully cured DGEBA/DDS, two well separated T_gs were observed for the cured DGEBA/DDS/PES-2 blend, indicating the cured epoxy was immiscible with PES. Aging the polymer blend at 155 °C (24 °C below T_g1 of the PES-2-rich phase and 53 °C below T_g2 of the epoxy-rich phase) produced two well separated relaxation processes due to PES-2-rich and epoxy-rich phases. The experimental results suggested that aging the polymer blend at a suitable temperature would improve the phase separation between PES-1-rich and epoxy-rich phases.     

PHASE-SEPARATION BEHAVIOR IN POLY(ETHER IMIDE)-MODIFIED EPOXY BLENDS

Phase-separation behavior of aromatic amine-cured diglycidyl ether of bisphenol-A (DGEBA) epoxy oligomer and poly(ether imide) (PEI) engineering thermoplastic-modifier mixtures was investigated by means of small-angle light scattering (SALS) and optical microscopy. The starting reactant mixtures comprising epoxy, PEI, and the curing agents, namely diamino diphenyl sulfone (DDS) and methylene dianiline (MDA), were found to be single phase. During curing, phase separation occurred in the epoxy/PEI/DDS system, whereas no phase separation took place in MDA-cured epoxy/PEI blends. The difference between the two systems has been attributed to thermodynamic and kinetic aspects of cure reaction in thermoplastic-modified thermosetting (TMT) polymeric blends. Spinodal decomposition as characterized by an increase of scattered intensity, shift of the peak angle to a smaller scattering angle, and development of a regularly phase-separated structure followed by coarsening was found to be the dominant mechanism of reaction-induced phase separation in DDS-cured epoxy/PEI blend compositions.     

Curing of epoxy resin using imide‐amines

The curing behavior of diglycidyl ether of bisphenol‐A (DGEBA) was investigated by differential scanning calorimetry, using varying molar ratios of imide‐amines and 4,4′‐diaminodiphenyl sulfone (DDS). The imide‐amines were prepared by reacting 1 mol of pyromellitic dianhydride (P) with excess (2.5 mol) of 4,4′‐diaminodiphenyl ether (E), 4,4′‐diaminodiphenyl methane (M), or 4,4′‐diaminodiphenyl sulfone (S) and designated as PE, PM, PS. Structural characterization was done using FTIR, ¹H NMR, ¹³C NMR spectroscopic techniques and elemental analysis. The mixture of imide‐amines and DDS at ratio of 0 : 1, 0.25 : 0.75, 0.5 : 0.5, 0.75 : 0.25, and 1 : 0 were used to investigate the curing behavior of DGEBA. The multiple heating rate method (5, 10, 15, and 20°C/min) was used to study the curing kinetics of epoxy resins. The peak exotherm temperature was found to be dependent on the heating rate, structure of imide‐amine, and also on the ratio of imide‐amine : DDS used. Activation energy was highest in case of epoxy cured using a mixture of DDS : imide‐amine of a ratio of 0.75 : 0.25. Thermal stability of the isothermally cured resins was also evaluated in a nitrogen atmosphere using dynamic thermogravimetry. The char yield was highest in case of resins cured using mixture of DDS : PS (0.25 : 0.75; EPS‐3), DDS : PM (0.25 : 0.75; EPM‐3), and DDS : PE (0.75 : 0.25; EPE‐1). © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 101: 3502–3510, 2006     

Different parameters controlling the initial solubility of two thermoplastics in epoxy reactive solvents

The influence of different factors on the miscibility of diglycidyl ether of bisphenol A (DGEBA)/thermoplastic blends was studied. DGEBA/poly(ether imide) (PEI) blends exhibited upper critical solution temperature behavior. The addition of a trifunctional epoxy [triglycidyl para‐amino phenol (TGpAP)] increased the miscibility window. The addition of diamines as hardeners could also increase [4,4′‐methylene‐bis(3‐chloro‐2,6‐diethylaniline) (MCDEA)] or decrease (4,4′‐diaminodiphenylsulfone) the miscibility window. DGEBA/poly(ether sulfone) (PES) blends showed lower critical solution temperature behavior. The addition of TGpAP had an effect similar to that for PEI blends, but the presence of MCDEA as a hardener decreased the miscibility of epoxy/PES blends. The modeling of the cloud‐point curves was performed with the Flory–Huggins equation (Flory, P. J. Principles of Polymer Chemistry; Cornell University Press: Ithaca, NY, 1953; p 672) according to the procedure developed by K. Kamide, S. Matsuada, and H. Shirataki (Eur Polym J 1990, 26, 379), with the interaction parameter used as the fitting parameter. A phenomenological model that takes into account the molar mass of DGEBA and the amount of TGpAP is proposed and is found to predict the cloud‐point temperature of any TGpAP/DGEBA/PEI blend. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 83: 1385–1396, 2002     

Comparison of microwave and thermal cure of epoxy resins

Stoichiometric mixtures of DGEBA (diglycidyl ether of bisphenol A)/DDS (diaminodiphenyl sulfone) and DGEBA/mPDA (meta phenylene diamine) have been isothermally cured by electromagnetic radiation and conventional heating using thin film sample configurations. Fourier transform infrared spectroscopy (FTIR) was used to measure the extent of cure. Thermal mechanical analysis (TMA) was used to determine the glass transition temperatures directly from the cured thin film samples. Well-defined glass transitions were observed in the TMA thermograph for both thermal and microwave cured samples. Significant increases in the reaction rates have been observed in the microwave cured DGEBA/DDS samples. Only slight increases in the reaction rates have been observed in the microwave cured DGEBA/mPDA samples. Higher glass transition temperatures were obtained in microwave cured samples compared to those of thermally cured ones after gelation. The magnitude of increases of glass transition temperature is much larger for the DGEBA/DDS system than DGEBA/mPDA system. The microwave radiation effect was much more significant in DGEBA/DDS system than in DGEBA/mPDA system. DiBenedetto's model was used to fit the experimental T_g data of both thermal and microwave cured epoxy resins.     

Preparation and properties of high performance phthalide‐containing bismaleimide modified epoxy matrices

A series of intercrosslinked networks formed by diglycidyl ether of bisphenol A epoxy resin (DGEBA) and novel bismaleimide containing phthalide cardo structure (BMIPP), with 4,4′‐diamino diphenyl sulfone (DDS) as hardener, have been investigated in detail. The curing behavior, thermal, mechanical and physical properties and compatibility of the blends were characterized using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), dynamic mechanical analysis (DMA), notched Izod impact test, scanning electron microscopy (SEM) and water absorption test. DSC investigations showed that the exothermic transition temperature (T_p) of the blend systems shifted slightly to the higher temperature with increasing BMIPP content and there appeared a shoulder on the high‐temperature side of the exothermic peak when BMIPP content was above 15 wt %. TGA and DMA results indicated that the introduction of BMIPP into epoxy resin improved the thermal stability and the storage modulus (G′) in the glassy region while glass transition temperature (T_g) decreased. Compared with the unmodified epoxy resin, there was a moderate increase in the fracture toughness for modified resins and the blend containing 5 wt % of BMIPP had the maximum of impact strength. SEM suggested the formation of homogeneous networks and rougher fracture surface with an increase in BMIPP content. In addition, the equilibrium water uptake of the modified resins was reduced as BMIPP content increased. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Macroporous bead modification with polyethylenimines of different molecular weights as polycationic ligands

Polyethylenimines (PEIs) with different molecular weights [number‐average molecular weights (M_n′s) = 60,000, 1200, and 423] were coupled onto macroporous beads. These rigid and spherical beads were prepared by the crosslinking of 2‐hydroxyethyl methacrylate and ethylene glycol dimethacrylate. The PEI attachment was carried out through epoxy groups yielded in a previous activation step with epichlorohydrin on matrix hydroxyl groups. Different initial concentrations of PEI were assayed. The supports so obtained were characterized by several techniques (Fourier transform infrared spectroscopy, scanning electron microscopy, thermogravimetric analysis, and mercury intrusion porosimetry). All of the PEI‐containing beads were used to analyze the influence that the molecular weight, the shape of the polycationic ligand (PEI), and the degree of coupling onto the matrices may have had on the efficiency of the retention of the bovine serum albumin protein used as a model biomolecule. In these assays, the PEI‐modified beads with M_n = 60,000 showed better results than those modified with PEIs with M_n's of 1200 and 423. The presence of sparse and long chains of PEI 60,000 onto the matrix, by reason of their highest accessibility toward the large protein, may have resulted in a better disposition of functional groups, whereas more short chains in the other PEIs (M_n's = 1200 and 423) used as ligands would not have. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

Poly(Amide‐Imide)s Based on Amino‐Terminated Oligoimides

Abstract

An amino‐terminated oligoimide was prepared by the Michael addition reaction of ethylene bis‐maleimide (EBM) and 4,4′‐diamnio diphenyl‐sulfone (DDS) at an EBM:DDS molar ratio of 1:2. The poly(amide‐imide)s (PAI)s were prepared by condensation of this EBMDDS oligoimide with various aliphatic bisesters. The resultant PAIs were characterized by elemental analysis, IR spectral studies, and the number average molecular weight estimated by non‐aqueous conductometric titration and thermogravimetry. The curing reaction of an epoxy resin [a diglycidyl ether of bis‐phenol‐A (DGEBA)] with PAIs was monitored by differential scanning calorimetry (DSC). Glass‐ and carbon‐reinforced laminates of PAI‐epoxy resin were also prepared and characterized.     

Synthesis, characterization, and properties of novel novolac epoxy resin containing naphthalene moiety

A series of novel novolac epoxy resins containing naphthalene moiety with different molecular weights were synthesized via condensation of bisphenol A and 1-naphthaldehyde, followed by epoxidation with epichlorohydrin. The chemical structure of the naphthalene epoxy thus obtained was characterized using FTIR, ¹H NMR spectra and GPC analyses. The naphthalene epoxy was cured with 4,4′-diaminodiphenyl sulfone (DDS) and the cured products were characterized with thermogravimetric analysis, dynamic mechanical analysis, and X-ray diffraction. Compared with the diglycidyl ether of bisphenol A (DGEBA), the cured naphthalene epoxy resin showed remarkably higher glass transition temperatures (T_gs), enhanced thermal stability and better moisture resistance. When the molar ratio of 1-naphthaldehyde to bisphenol A was 0.67, the optimal thermal resistance was observed.     

Novel adamantane‐containing epoxy resin

A novel adamantane‐containing epoxy resin diglycidyl ether of bisphenol‐adamantane (DGEBAda) was successfully synthesized from 1,3‐bis(4‐hydroxyphenyl)adamantane by a one‐step method. The proposed structure of the epoxy resin was confirmed with Fourier transform infrared, ¹H‐NMR, gel permeation chromatography, and epoxy equivalent weight titration. The synthesized adamantane‐containing epoxy resin was cured with 4,4′‐diaminodiphenyl sulfone (DDS) and dicyandiamide (DICY). The thermal properties of the DDS‐cured epoxy were investigated with differential scanning calorimetry and thermogravimetric analysis (TGA). The dielectric properties of the DICY‐cured epoxy were determined from its dielectric spectrum. The obtained results were compared with those of commercially available diglycidyl ether of bisphenol A (DGEBA), a tetramethyl biphenol (TMBP)/epoxy system, and some other associated epoxy resins. According to the measured values, the glass‐transition temperature of the DGEBAda/DDS system (223°C) was higher than that of the DGEBA/DDS system and close to that of the TMBP/DDS system. TGA results showed that the DGEBAda/DDS system had a higher char yield (25.02%) and integral procedure decomposition temperature (850.7°C); however, the 5 wt % degradation temperature was lower than that of DDS‐cured DGEBA and TMBP. Moreover, DGEBAda/DDS had reduced moisture absorption and lower dielectric properties. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007     

Disecondary amine synthesis and its reaction kinetics with epoxy prepolymers

3,3′‐Diaminodiphenyl sulfone (3,3′‐DDS) was reacted with acetaldehyde in the presence of sodium triacetoxy borohydride via reductive amination to yield a 3,3′‐DDS based secondary diamine, N,N′‐diethyl‐3,3′‐diaminodiphenyl sulfone. Near IR analysis indicated that the 5060 cm^?1 peak for primary amine (? NH₂) in 3,3′‐DDS was absent in the reaction product spectrum. The ? NH₂ proton peak at δ 5.66 ppm shifted to δ 6.16 ppm in the product. Methyl and methylene protons of CH₃? CH₂? NH? Ph? group were observed at δ 3.01 and 1.12 ppm, respectively, in the product. The carbon NMR spectrum of the reaction product showed new peaks at δ 37.46 and 14.47 ppm that further confirmed secondary amine formation. The liquid chromatography coupled mass spectra peaks at 248–250 for 3,3′‐DDS and 304 for the reaction product further supported the formation of N,N′‐diethyl‐3,3′‐diaminodiphenyl sulfone. A blend of N,N′‐diethyl‐3,3′‐diaminodiphenyl sulfone with diglycidyl ether of bisphenol‐A (DGEBA) epoxy prepolymer started reacting at about 110–125°C surpassing an energy barrier of ～ 66 kJ/mol as determined via differential scanning calorimetry analysis. Reaction kinetics were characterized via near IR spectroscopy specific to the reaction between secondary amine and DGEBA epoxy prepolymer. The results confirmed >97% conversion at a cure protocol of 5 h at 80°C, 5 h at 100°C, 11 h at 125°C, and 6 h at 185°C. N,N′‐diethyl‐3,3′‐diaminodiphenyl sulfone‐DGEBA thermoplastics displayed tensile and flexural modulii of 3.08 and 2.86 GPa, respectively, and glass transition temperature (T_g) of 120.77°C. © 2012 Wiley Periodicals, Inc. J Appl Polym Sci, 2012     

Cure kinetics of ternary blends of epoxy resins studied by nonisothermal DSC data

The curing kinetics of blends of diglycidyl ether of bisphenol A (DGEBA), cycloaliphatic epoxy resins, and carboxyl‐terminated butadiene‐acrylonitrile random copolymer (CTBN) in presence of 4,4′‐diamino diphenyl sulfone (DDS) as the curing agent was studied by nonisothermal differential scanning calorimetry (DSC) technique at different heating rates. The kinetic parameters of the curing process were determined by isoconversional method given by Malek for the kinetic analysis of the data obtained by the thermal treatment. A two‐parameter (m, n) autocatalytic model (Sestak‐Berggren equation) was found to be the most adequate selected to describe the cure kinetics of the studied epoxy resins. The values of E_a were found to be 88.6 kJ mol^?1 and 61.6 kJ mol^?1, respectively, for the studied two sample series. Nonisothermal DSC curves obtained using the experimental data show a good agreement with that theoretically calculated. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Effect of SiO2 on rheology,morphology, thermal,and mechanical properties of high thermal stable epoxy foam

A series of highly thermostable epoxy foams with diglycidyl ether of bisphenol‐A and bisphenol‐S epoxy resin (DGEBA/DGEBS), 4,4′‐diaminodiphenyl sulfone (DDS) as curing agent have been successfully prepared through a two‐step process. Dynamic and steady shear rheological measurements of the DGEBA/DGEBS/DDS reacting mixture are performed. The results indicate all samples present an extremely rapid increase in viscosities after a critical time. The gel time measured by the crossover of tan δ is independent of frequency. The influence of SiO₂ content on morphology, thermal, and mechanical properties of epoxy foams has also been investigated. Due to the heterogeneous nucleation of SiO₂, the pore morphology with a bimodal size distribution is observed when the content of SiO₂ is above 5 wt %. Dynamic mechanical analysis (DMA) reveals that pure epoxy foam possesses a high glass transition temperature (206°C). The maximum of specific compressive strength can be up to 0.0253 MPa m³ kg^?1 at around 1.0 wt % SiO₂. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 40068.     

Torsional braid analysis of the aromatic amine cure of epoxy resins

The cure behavior of diglycidyl ether of bisphenol A (DGEBA) type of epoxy resins with three aromatic diamines, 4,4′-diaminodiphenyl methane (DDM), 4,4′-diaminodiphenyl sulfone (44DDS), and 3,3′-diaminodiphenyl sulfone (33DDS) was studied by torsional braid analysis. For each curing agent the stoichiometry of the resin mixtures was varied from a two to one excess of amino hydrogens per epoxy group to a two to one excess of epoxy groups per amino hydrogen. Isothermal cures of the resin mixtures were carried out from 70 to 210°C (range depending on epoxy—amine mixture), followed by a temperature scan to determine the glass transition temperature (T_g). The times to the isothermal liquid-to-rubber transition were shortest for the DDM mixtures and longest for the 44DDS mixtures. The liquid-to-rubber transition times were also shortest for the amine excess mixtures when stoichiometry was varied. A relatively rapid reaction to the liquid-to-rubber transition was observed for the epoxy excess mixtures, followed by an exceedingly slow reaction process at cure temperatures well above the T_g. This slow process was only observed for epoxy excess mixtures and eventually led to significant increases in T_g. Using time—temperature shifts of the glass transition temperature vs. logarithm of time, activation energies approximately 50% higher were derived for this process compared to those derived from the liquid-to-rubber transition. The rate of this reaction was virtually independent of curing agent and was attributed to etherification taking place in the epoxy excess mixtures. © 1994 John Wiley & Sons, Inc.     

Modification and compatibility of epoxy resin with hydroxyl-terminated or amine-terminated polyurethanes

Phenolic hydroxyl-terminated (HTPU) and aromatic amine-terminated (ATPU) PU modifiers were prepared by reacting two different macroglycols (PTMG, polytetramethylene glycol, M_n = 2000, and PBA, Polybutylene adpate, M_n = 2000) with 4,4′-diphenylmethane diisocyanate (MDI), then further coupling with two different coupling agents, bisphenol A or 4,4′-diaminodiphenyl sulfone (DDS). These four types of PU prepolymers were used to modify the epoxy resin with 4,4′-diamino-diphenyl sulfone as a curing agent. From the experimental results, it was shown that the values of fracture energy, G_IC, for PU-modified epoxy were dependent on the macroglycols and the coupling agents. Scanning electron microscopy (SEM) revealed that the ether type (PTMG) of PU-modified epoxy showed the presence of an aggregated separated phase, which varied between 0.5 μm and 4 μm in the ATPU (PTMG) and between 1 μm and 1.5 μm in HTPU (PTMG) modified system. On the contrary, the ester type (PBA) PU-modified epoxy resin showed a homogeneous morphology and consequently a much smaller effect on toughening for its good compatibility with the epoxy network. In addition, it was found that the hydroxyl-terminated bisphenol A as a coupling agent improved fracture toughness more than the amine-terminated DDS because of effective molecular weight buildup by a chain extension reaction. The glass transition temperature (T_g) of modified epoxy resin as measured by dynamic mechanical analysis (DMA) was lower in PTMG-based PU than in a PBA-based PU series with the same weight of modifier.     

Toughening of Epoxy Resins with Thermoplastics: 3. An Investigation into the Effects of Composition on the Properties of Epoxy Resin Blends

Three different epoxy resins, based on the diglycidylether of bisphenol A (DGEBA), triglycidyl-p-aminophenol (TGPAP) and tetra-glycidyldiaminodiphenylmethane (TGDDM), which are di-, tri- and tetrafunctional, respectively, were mixed in varying proportions and cured with both 3,3′-diaminodiphenylsulphone and 4,4′-[1,4-phenylene(1-methylethylidene)]bis(2,6-dimethylbenzenamine) (EPON 1062-M from Shell). All the blends could be satisfactorily cured and gave homogeneous materials. The dynamic mechanical and fracture properties of the cured materials were measured. It was found that the glass transition temperature varied with composition systematically, whereas values of the strain energy release rate (G_1c) and the stress intensity factor (K_1c) showed relatively small variations with the blend composition. Toughened epoxy resins were prepared by adding a polyetherimide (PEI), in varying proportions, to the resin mixture. The ‘toughenabilities’ of different resins, or resin mixtures, were compared. This showed that the 75/25 TGPAP/DGEBA resin mixture was the most toughenable. Adding 20% of PEI led to a more than three-fold increase of the G_1c value. © of SCI.     

Synthesis and properties of a novel bismaleimide resin containing 1,3,4‐oxadiazole moiety and the blend systems thereof with epoxy resin

A new bismaleimide monomer, 2‐((4‐maleimidophenoxy)methyl)‐5‐(4‐maleimidophenyl)‐1,3,4‐oxadiazole (Mioxd), was designed and synthesized. The chemical structure of the monomer was confirmed by means of Fourier transform infrared (FTIR) spectroscopy, proton nuclear magnetic resonance (¹H NMR) spectroscopy and elemental analysis, and its thermal properties were characterized using differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA). Mioxd as a reactive modifier was blended with epoxy resin based on bisphenol A diglycidyl ether (DGEBA) in weight ratio of 5, 10, and 15%, using 4,4′‐diaminodiphenyl sulfone (DDS) as hardener. The effect of Mioxd addition on the cure behavior and thermal properties of the blend resins was studied by DSC, TGA, and dynamic mechanical analysis (DMA). DSC investigations showed that the main exothermic peak temperature (T_p) of the blend systems did not obviously shift with increasing Mioxd content whereas a new shoulder appeared and gradually grew on the high temperature side of the exothermic peak. The results of DMA measurements exhibited the glassy storage modulus (G') and glass transition temperatures (T_g) increased as the Mioxd content was increased, the cured blends investigated were miscible and no phase separation occurred. Further, the thermal decomposition temperature first decreased and then increased, but the char yield at 600°C increased with an increase in Mioxd content. POLYM. ENG. SCI., 2011. © 2011 Society of Plastics Engineers     

Epoxy resin based on 4,4′-dihydroxydiphenysulfone. I. Synthesis and reaction kinetics with 4,4′-diaminodiphenylmethane and 4,4′-diaminodiphenylsulfone

Epoxy resins based on 4,4′-dihydroxydiphenylsulfone (DGEBS) and diglycidyl ether of bisphenol A (DGEBA) were prepared by alkaline condensation of 4,4′-dihydroxydiphenylsulfone (bisphenol S) with epichlorohydrin and by recrystallization of liquid, commercial bisphenol A-type epoxy resin, respectively. Curing kinetics of the two epoxy compounds with 4,4′-diaminodiphenylmethane (DDM) and with 4,4′-diaminodiphenylsulfone (DDS) as well as T_g values of the cured materials were determined by the DSC method. It was found that the ? SO₂? group both in the epoxy resin and in the harener increases T_g values of the cured materials. DGEBS reacts with the used hardeners faster than does DGEBA and the curing reaction of DGEBS begins at lower temperature than does the curing reaction of DGEBA when the same amine is used. © 1994 John Wiley & Sons, Inc.     

Cure behavior of an interpenetrating diglycidyl ether of bisphenol A/poly(ethylene oxide) miscible system

Differential scanning calorimetry (DSC) was performed to investigate the cure behavior of epoxy networks of diglycidyl ether of bisphenol A/poly(ethylene oxide) (DGEBA/PEO) cured with 4,4'-diaminodiphenyl sulfone (DDS). An interesting miscibility has been recently reported for DGEBA/PEO networks of a semi-interpenetrating structure cured with aromatic amine. This study focused on the cure behavior and effects of miscible polymer diluents on cure kinetics. The physical miscible state between the polymer and epoxy was found to exert no alteration on the cure mechanism, which remained to be autocatalytic for DDS amine-curing of all DGEBA/PEO mixtures as well as the pure DGEBA. The PEO component, being in a miscible state with the epoxy/DDS throughout the cure, acted as a diluent for the reactive DGEBA epoxy and DDS components. The dilution effect could be partially compensated by raising the DDS/epoxy ratio in proportion to increased PEO fraction in DGEBA/PEO/DDS mixtures.