Preparation of novel copoly(bis[4‐(3‐aminophenoxy)phenyl]sulfone/ 3,3′,4,4′‐benzophenonetetracarboxyl/ pyromellite)imide derivatives

Copolyimide derivatives were prepared from two carboxylic dianhydrides [3,3′,4,4′‐benzophenone tetracarboxylic dianhydride (BTDA) and pyromellitic anhydride (PMDA)] and a single diamine (bis[4‐(3‐aminophenoxy)phenyl]sulfone [BAPS]) following one‐step polymerization. Copolymers could be arranged in sequence through different molar ratios of dianhydride compounds. These polymers were characterized by viscosity, thermal and mechanical properties, solubility, etc. To understand the behavior of the properties, according to the ratio of the dianhydride compound, a copolymer having various properties could be obtained. Further, it was proved that their properties could be determined from the compositions. The solubility of copolyimides with a large molecular weight was moderately improved. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 88: 853–859, 2003     

Comparative study of silicon‐containing polyimides from different oxydianilines

Silicon‐containing polyimides were synthesized by solution polycondensation of bis(3,4‐dicarboxyphenyl)dimethylsilane dianhydride with 3,4‐oxydianiline and 4,4′‐oxydianiline, respectively. All the poly(amic acid) films could be obtained by solution‐casting from N,N‐dimethylacetamide solutions and thermally converted into transparent and tough polyimide films. The physical properties of thin films of those polyimides were compared by DSC, TGA, UV–visible spectroscopy, and dynamic mechanical analysis. The polyimide from bis(3,4‐dicarboxyphenyl)dimethylsilane dianhydride and 3,4‐oxydianiline exhibited superior energy‐damping characteristic, mechanical properties, and optical transparency, whereas that from bis(3,4‐dicarboxyphenyl)dimethylsilane dianhydride and 4,4′‐oxydianiline possessed higher glass‐transition temperature and thermal stability. Because of the unsymmetric structure of the polyimide from bis(3,4‐dicarboxyphenyl)dimethylsilane dianhydride and 3,4‐oxydianiline, its increasing rate of linear coefficient of thermal expansion with temperature was quicker than that of the polyimide from bis(3,4‐dicarboxyphenyl)dimethylsilane dianhydride and 4,4′‐oxydianiline. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 94: 2363–2367, 2004     

Synthesis and properties of copolypyromellitimides

Copolyamic acids with different proportions of diamine component were prepared by polymerizing different molar ratios of diamines—benzidine (B)/4,4′-diaminodiphenyl ether (E) and p-phenylene diamine (P)/4,4′-diaminodiphenyl methane (M)—with pyromellitic dianhydride (PMDA) in dimethylacetamide (DMAc) at room temperature. Diamine component can be arranged in regular sequence through various reaction processes, such as alternating, block, and partial block copolymers. In addition, it can also be arranged in random sequence to obtain random copolymers. Thermal cyclodehydration of polyamic acids results in the corresponding polyimides. Polymers are characterized by viscosity, thermal stability, crystallinity, and mechanical strength. It was found that an increase in the proportion of more flexible diamine component (such as E and M) incorporated in polymer chain results in copolyimides with better mechanical strength and causes a fall in viscosity of copolyamic acids and a decrease in thermal stability and crystallinity of copolyimides. Within the copolymers of the same composition, the thermal stability, crystallinity, and mechanical strength of ordered polymers are superior to those of random polymers. The results of viscosity measurements imply that the anhydride-terminated prepolymer is easily destroyed by water in the solution, so that the ultimate viscosities of alternating and block copolyamic acids are inferior to those of random ones, but this phenomenon can be improved through the preparation of the partial block copolymers.     

Synthesis and thermal,mechanical and gas permeation properties of aromatic polyimides containing different linkage groups

Two series of aromatic polyimides containing various linkage groups based on 2,7‐bis(4‐aminophenoxy)naphthalene or 3,3′‐dimethyl‐4,4′‐diaminodiphenylmethane and different aromatic dianhydrides, namely 4,4′‐(4,4′‐isopropylidenediphenoxy)bis(phthalic anhydride), 4,4′‐(hexafluoroisopropylidene)bis(phthalic anhydride), 3,3′,4,4′ benzophenonetetracarboxylic dianhydride, 9,9‐bis[4‐(3,4‐dicarboxyphenoxy)phenyl]fluorene dianhydride and 4,4′‐(4,4′‐hexafluoroisopropylidenediphenoxy)bis(phthalic anhydride), were synthesized and compared with regard to their thermal, mechanical and gas permeation properties. All these polymers showed high thermal stability with initial decomposition temperature in the range 475–525 °C and glass transition temperature between 208 and 286 °C. Also, the polymer films presented good mechanical characteristics with tensile strength in the range 60–91 MPa and storage modulus in the range 1700–2375 MPa. The macromolecular chain packing induced by dianhydride and diamine segments was investigated by examining gas permeation through the polymer films. The relationships between chain mobility and interchain distance and the obtained values for gas permeability are discussed. © 2014 Society of Chemical Industry     

The effect of the ring opening polymerization and chain spacing on the coefficient of thermal expansion and modulus of polyimide

The features of norbornene (NE) cross‐linked polyimide (PI) were investigated as the ratio of the norbornene monomer was varied. The coefficient of thermal expansion and modulus are important parameters of materials used in the microelectronic industry. Therefore, in this study, 5‐norbornene‐2, 3‐dicarboxylic acid (NE) was introduced as a crosslinking agent to increase the thermal stability at elevated temperatures. 4,4′‐Benzophenonetetracarboxylic dianhydride was utilized as a dianhydride and 4,4′‐diaminodiphenyl ether was introduced as a diamine monomer. By changing the ratio of each monomer, we were able to control the spacing of the chain and ring opening polymerization, which resulted in improved properties. Each sample was thermally cured which led to a ring opening mechanism of the norbornene through the reverse Diels‐Alder reaction. Thermal mechanical analysis was utilized to determine the coefficient of thermal expansion and dynamic mechanical analysis was used to determine the storage modulus (ε′) and loss modulus (ε″) of the PI film. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 42607.     

Bisphenol containing novel polyimides/glass fiber composites

A new diamine was synthesized using bisphenol‐A and p‐amino benzoic acid. Polyimides I and II were prepared with the diamine and pyromellitic dianhydride/3,3′,4,4′ benzophenone tetracarboxylic acid dianhydride. Bismaleimide (BMI) was synthesized using the same diamine and maleic anhydride. The prepared diamine and polyimides were characterized using FTIR. Thermo gravimetric analysis was used to study the thermal properties of synthesized polyimides and BMI. Woven glass fabric/unidirectional glass fiber‐polyimide/BMI composites were made and their properties (fiber volume fraction, density, tensile, flexural, impact, and hardness) were studied and compared with a few representative carbon fiber polyimide, carbon fiber–epoxy, and glass fiber–epoxy composites. The prepared composites were subjected to thermal aging and moisture absorption and their effects on tensile and flexural properties were studied. POLYM. COMPOS., 28: 372–380, 2007. © 2007 Society of Plastics Engineers     

Preparation and properties of organo‐soluble polyimides based on 4,4′‐diamino‐3,3‐dimethyldiphenylmethane and conventional dianhydrides

4,4′‐Diamino‐3,3′‐dimethyldiphenylmethane was used to prepare polyimides in an attempt to achieve good organo‐solubility and light color. Polyimides based on this diamine and three conventional aromatic dianhydrides were prepared by solution polycondensation followed by chemical imidization. They possess good solubility in aprotonic polar organic solvents such as N‐methyl 2‐pyrrolidone, N,N‐dimethyl acetamide, and m‐cresol. Polyimide from 4,4′‐diamino‐3,3′‐dimethyldiphenylmethane and diphenylether‐3,3′,4,4′‐tetracarboxylic acid dianhydride is even soluble in common solvents such as tetrahydrofuran and chloroform. Polyimides exhibit high transmittance at wavelengths above 400 nm. The glass transition temperature of polyimide from 4,4′‐diamino‐3,3′‐dimethyldiphenylmethane and pyromellitic dianhydride is 370°C, while that from 4,4′‐diamino‐3,3′‐dimethyldiphenylmethane and diphenylether‐3,3′,4,4′‐tetracarboxylic acid dianhydride is about 260°C. The initial thermal decomposition temperatures of these polyimides are 520–540°C. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 72: 1299–1304, 1999     

Resistive switching characteristics of polyimides derived from 2,2′‐aryl substituents tetracarboxylic dianhydrides

2,2′‐Position aryl‐substituted tetracarboxylic dianhydrides including 2,2′‐bis(biphenyl)‐4,4′,5,5′‐biphenyl tetracarboxylic dianhydride and 2,2′‐bis[4‐(naphthalen‐1‐yl)phenyl)]‐4,4′,5,5′‐biphenyl tetracarboxylic dianhydride were synthesized. A new series of aromatic polyimides (PIs) were synthesized via a two‐step procedure from 3,3′,4,4′‐biphenyl tetracarboxylic dianhydride and the newly synthesized tetracarboxylic dianhydrides monomers reacting with 2,2′‐bis[4′‐(3″,4″,5″‐trifluorophenyl)phenyl]‐4,4′‐biphenyl diamine. The resulting polymers exhibited excellent organosolubility and thermal properties associated with T_g at 264 °C and high initial thermal decomposition temperatures (T_5%) exceeding 500 °C in argon. Moreover, the fabricated sandwich structured memory devices of Al/PI‐a/ITO was determined to present a flash‐type memory behaviour, while Al/PI‐b/ITO and Al/PI‐c/ITO exhibited write‐once read‐many‐times memory capability with different threshold voltages. In addition, Al/polymer/ITO devices showed high stability under a constant stress or continuous read pulse voltage of ? 1.0 V. Copyright © 2011 Society of Chemical Industry     

Synthesis and characterization of calix[4]arene‐containing polyimides

Three types of amino‐functionalized calixarenes, i.e. the diaminocalix[4]arenes 5,17‐diaminomethyl‐25,26,27,28‐tetrapropoxycalix[4]arene, 25,27‐diaminoethoxy‐26,28‐dihydroxycalix[4]arene and 5,11,17,23‐tetra‐tert‐butyl‐25,27‐diaminoethoxy‐26,28‐dihydroxycalix[4]arene, were synthesized and incorporated as comonomers into the backbones of aromatic polyimides. As a first step, polyimide precursors (poly(amic acid)s) were prepared by condensation reaction of diamine with dianhydride at the stoichiometric ratio. The diamine component was composed of synthesized diaminocalix[4]arene and commercial 4,4′‐oxydianiline combined in various molar ratios. The dianhydride used was 4,4′‐oxydiphthalic anhydride. The poly(amic acid)s were characterized using intrinsic viscosity measurements and their chemical composition was determined using ¹H NMR spectroscopy. The precursors were then transformed into the polyimides using a thermal treatment. Thermal and dynamic mechanical behaviour, wide‐angle X‐ray diffraction and solubility of the resulting polyimide films in selected solvents were evaluated. The structure–property relationship of the novel types of synthesized polyimides is discussed in terms of the calixarene monomer used and the fraction of it incorporated into the polymer backbone. Copyright © 2010 Society of Chemical Industry     

Synthesis and characterization of benzimidazole‐based low CTE block copolyimides

A series of block and random copolyimide films were synthesized from various molar ratios of two diamines, rigid 2‐(4‐aminophenyl)‐5‐aminobenzimidazole (APBI) and flexible 4,4′‐oxydianiline (ODA) by polycondensation with dianhydride 3,3′,4,4′‐biphenyltetracarboxylic dianhydride. The contents of APBI ranged from 10 to 60 mol % in copolyimides. The copolyimide films obtained by thermal imidization of poly(amic acid) solutions, were characterized by TMA, DMA, TGA, DSC, wide‐angle X‐ray diffraction, FTIR, tensile testing, water uptake (WU), and dielectric constant measurements. Rigid heterocyclic diamine APBI with interchain hydrogen bonding capability, led to low coefficient of thermal expansion (CTE), high T_g, high thermal stability and better mechanical properties. Increasing the APBI mol % caused a gradual decrease in the CTE and increase in T_g, thermal stability and tensile strength properties of the copolyimides films. Moreover, significantly enhanced thermal and mechanical properties of the block copolyimides were also found as compared to random copolyimides. The block copolyimide with APBI content of 60 mol %, achieved excellent properties, that is, a low CTE (4.7 ppm/K), a high T_g at 377°C, 5% weight loss at 562°C and a tensile strength at 198 MPa. This can be interpreted because of comparatively higher degree of molecular orientation in block copolyimides. These copolyimides also exhibited better dielectric constant and WU. This combination of properties makes them attractive candidates for base film materials in future microelectronics. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013     

Synthesis and properties of polyimides derived from diamine monomer containing bi-benzimidazole unit

A new aromatic heterocyclic diamine monomer containing bi-benzimidazole unit, 2,2-bis(4′-aminophenyl)-5,5-bi-1H-benzimidazole, was synthesized from 2,2-bis(4′-nitrophenyl)-5,5-bi-1H-benzimidazole (BNPBBI) prepared via the reaction of 3,3′,4,4′-biphenyltetramine and p-nitrobenzaldehyde with a high yield. Their compositions and chemical structures containing polybenzimidazole backbone were characterized by FTIR, ¹H NMR and elemental analysis. A series of aromatic polyimides containing the heterocyclic moiety in the main chain were prepared by the reaction of BAPBBI with various aromatic dianhydrides of 3,3′,4,4′-biphenyltetracarboxylic dianhydride, 4,4′-oxydiphthalic anhydride or pyromellitic dianhydride. The polymers possess a high glass transition temperature of >415 °C and a good thermal stability up to 566 °C with a 5 % weight loss. The combination of polybenzimidazole and polyimide via introducing BAPBBI into the main chains provides the rigid structure, and macromolecular interactions are thus enhanced, resulting in the outstanding mechanical properties. These polyimides exhibit the strong tensile strength of 201 to 327 MPa, and the ultrahigh tensile moduli of 10.7 to 15.5 GPa without post stretching.     

Chemical modification of 3,3′,4,4′‐biphenyltetracarboxylic dianhydride polyimides by a catechol‐derived bis(ether amine)

Having previously demonstrated that the polyimide derived from 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA) and 1,2‐bis(4‐aminophenoxy)benzene [termed triphenyl ether catechol diamine (TPEC)] exhibited superior tensile properties in addition to good thermal properties, we now provide a preliminary assessment of the properties of the copolyimides prepared from BPDA, TPEC, and another aromatic diamine. The homopolyimides derived from BPDA and many aromatic diamines generally possessed good mechanical properties and thermal properties; however, they were insoluble in available organic solvents. In several cases, organosoluble BPDA copolyimides could be prepared from BPDA and equimolar mixtures of TPEC and another aromatic diamine. All the copolyimides could be formed into tough films with high moduli and strengths and, in most cases, high extensions to break. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 84: 351–358, 2002; DOI 10.1002/app.10342     

一种三元共聚型聚酰亚胺的制备与表征

以3,3'-二甲基-4,4'-二氨基二苯甲烷、1,3-双(4-氨基苯氧基)苯(1,3-APB)与3,3',4,4'-二苯醚四羧酸二酐(ODPA)进行缩聚反应,制得一种新型的三元共缩聚型聚酰亚胺。将此聚合物与两种二元共缩聚型聚酰亚胺的性能进行对此,发现三元共聚型聚酰亚胺的溶解性能、力学性能和热性能皆较好,且使用范围扩大。     

Properties,morphology and structure of BPDA/PPD/ODA polyimide fibres

Abstract

A family of random co-poly(amic acid)s containing 4,4′-oxydianiline (ODA) moiety were synthesised in N,N′-dimethylacetamide. The co-poly(amic acid) solutions were used as spinning dope for dry jet wet spinning process into as spun poly(amic acid) (PAA) fibres. The polyimide (PI) fibres were obtained from PAA fibres after being imidised and drawn in furnace. The processability and mechanical properties of the fibres were notably improved by incorporating ODA into 3,3′,4,4′-biphenyltetracarboxylic dianhydride/p-phenylenediamine (BPDA/PPD) backbone. The best strength and modulus of BPDA/PPD/ODA PI fibre (diamine mole ratio of PPD/ODA?=?85∶15) attained 2·25 and 96·5 GPa respectively, which were approximately three times the tenacity of the BPDA/PPD PI fibre. The SEM image showed that the cross-section of each stage fibres was round and void free. In addition, ‘skin–core’ and microfibrillar structure were not observed. The thermal properties of PI fibres were also investigated. The results showed that the PI fibres have excellent thermal stability; moreover, the dimensional stability and structural homogeneity of the fibres were significantly improved by heat drawn stage. T_g was found to be ～290°C by thermomechanical and dynamic mechanical analyses. The X-ray (wide angle X-ray diffraction and small angle X-ray scattering) experiments indicated that the ordering degree of longitudinal and lateral stacks, as well as the molecular orientation of PI fibre, was improved in the preparation process of fibres. Furthermore, the mechanical properties of fibres are profoundly affected by the heat drawn conditions.     

Structure–stability correlation of copolyimide membranes derived from aliphatic/alicyclic/aromatic diamine and aromatic dianhydrides

New polyamic acids with ‐A‐B‐A‐C‐ type periodic sequence of monomeric units (A derived from a diamine, B from benzophenone‐3,3′,4,4′‐tetracarboxylic dianhydride, and C from benzene‐1,2,4,5‐tetracarboxylic dianhydride) are prepared and transformed into polyimide membranes that are examined by various methods in order to investigate the influence of diamine units (aliphatic, alicyclic, or aromatic) on the morphology, thermal stability, and mechanical properties of membranes. Small‐ and wide‐angle X‐ray scattering and Atomic force microscopy show amorphous character of all membranes except for those containing hexane‐1,6‐diamine units. Thermogravimetric analysis reveals a decrease in the initial decomposition temperature from 551/501 °C to 437/395 °C (for N₂/O₂ atmosphere) when going from membranes with aromatic to those with aliphatic diamine units. Dynamic mechanical analysis shows quite high initial storage modulus (2100–3300 MPa) for all membranes at frequencies of 1, 10, and 20 Hz. The properties of prepared copolymeric polyimide are promising for a wide range of their potential technological applications. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134 , 45227.     

Synthesis and characterization of bisimide amines and bisimide amine-cured epoxy resins

A series of novel bisimide amines were synthesized and characterized and then utilized as curing agents with a standard epoxy resin, N,N′- tetraglycidyl-methylenedianiline (TGMDA), known commercially as MY720. The bisimide amines (BIA's) were synthesized by reaction of 4,4′-hexa-ffuoroisopropylidine (biphthalic acid dianhydride) (6F anhydride) with aromatic and aliphatic diamines in dimethyl formamide at reflux temperatures in yields ranging 24 to 99 percent. The diamines used were 3,3′-diaminodiphenylsulfone (3,3′-DDS), 4,4′-diaminodiphenylsulfone (4,4′-DDS), 1,12-dodecanediamine (1,12-DDA), alone and as mixtures to produce the BIA's 6F-3,3′- DDS, 6F-4,4′-DDS, 6F-3,3′-DDS-4,4′-DDS, 6F-3,3′-DDS-1, 12-DDA with various compositions, depending on the mode of addition and stoichiometry. The BIA's are isolated as mixtures containing monomer, oligomer, and polymeric species. They were characterized by elemental analysis, and high pressure liquid chromatography (HPLC). Epoxy resin specimens were fabricated by reaction of the standard epoxy (MY720) with the BIA and in some cases, mixtures of BIA and aromatic diamine, such as 3,3′-DDS. The bisimide amine cured epoxies (IME's) were characterized for moisture absorption, thermal properties, physical and mechanical properties. The bisimide amine epoxy (IME) resins were also characterized as matrices in Celion 6000/bisimide amine cured epoxy (IME) composites. The relative toughness characteristics of each IME formulation was measured by the 10° offaxis tensile test by measuring the uniaxial tensile, shear strengths and shear-strain-to-failure of the composite systems.     

Highly Thermal Stable Polyimides Applied in Flexible Resistive Memory

Flexible memory devices are one of the most crucial elements in the wearable electronics. In this work, polyimides (PIs)-based flexible resistive memory devices with an excellent thermal and mechanical durability are demonstrated. Four kinds of functional PIs are derived from the heterocyclic diamines including 2,6-diaminodibenzo-p-dioxin (OODA) and 2,6-diaminothianthrene, and dianhydrides including 4,4′-(hexafluoroisopropylidene)diphthalic anhydride (6FDA) and 3,3′,4,4′-biphenyltetracarboxylic dianhydride. PI with diamine of OODA and dianhydride of 6FDA (PI(OODA_6FDA)) possesses outstanding thermal and mechanical properties with a high glass transition temperature of 352 °C, a low coefficient of thermal expansion of 28.1 ppm K⁻¹, and a high elongation at break of 10%. In addition, PI(OODA_6FDA)-based memory shows write-once-read-many behavior with a high on/off current ratio of 10⁶ and a stable data retention, attributed to the donor–acceptor charge transfer between the polymer chains. The retained current levels at a low resistive state can be observed even with thermal treatment at 200 °C for 24 h or 1000 times cyclic bending at a bending radius of 5 mm. These results demonstrate the potential of heterocyclic PIs for flexible resistive memory.     

Thermoplastic character of polyimide blends

Polyimide blends consisting of pyromellitic dianhydride/4,4′-oxydianiline (PMDA/ODA) and biphenyl-tetracarboxylic dianhydride/p-phenylene diamine (BPDA/PDA) show a distinct glass transition behavior at temperatures lower than each component does. Disruption of molecular packing by blending of polymers having dissimilar interaction sites leads to a significant increase in molecular mobility at much lower temperatures. This is examined by laminating two pieces of film cast from the blend and measuring the adhesive strength at the interface. A strong adhesion, 11.5 N/cm (6.6 lbf/in) by 180° peel test, was achieved indicating interpenetration of polyimide molecules. It was also found that the polyimide blends can be converted into highly ordered states by mechanical deformation of the blends above their glass transition temperatures (T_gs).     

Synthesis of a new siloxane‐containing alicyclic dianhydride and the derived polyimides with improved solubility and hydrophobicity

The structural transformation strategy of cis‐5‐norbornene‐endo‐2,3‐dicarboxylic anhydride (NA) was performed by esterification. The double bond on the diester of NA showed adequate hydrosilylation reactivity with Si? H bonds of phenyl‐containing disiloxane. Thereby, a new siloxane‐containing alicyclic dianhydride, 5,5′‐exo‐(1,3‐dimethyl‐1,3‐diphenyl‐disiloxane‐1,5‐diyl)bisbicyclo[2,2,1]heptane‐2,3‐endo‐dicarboxylic anhydride 6 was successfully synthesized starting from NA, 1,3‐dimethyl‐1,3‐diphenyldisiloxane and platinum complex catalyst. The whole synthetic route of dianhydride 6 consisted of esterification, hydrosilylation, saponification, acidification, and dehydration. A series of polyimides (PIs) were prepared from dianhydride comonomers of 6 and 4,4′‐biphenyltetracarboxylic dianhydride (BPDA) in different molar ratio together with the diamine 4,4′‐oxydianiline (ODA). The thermal and mechanical properties of PIs showed somewhat decrease with increasing content of dianhydride 6. The solubility of PIs increased with the increasing content of dianhydride 6, and further calculation from Bragg's equation indicated that average interchain distance (d‐spacing value) increased with increasing content of siloxane and alicyclic segments in the backbone of PIs. It was revealed that the hydrophobicity of PIs increased with the increasing content of dianhydride 6 . Polyimide 7g , which was prepared from 100% 6 and ODA, showed water adsorption of less than 0.7% and contact angle against water of 101.1°. © 2012 Wiley Periodicals, Inc. J Appl Polym Sci., 2013     

Fiber Reinforced Polyimide Aerogel Composites with High Mechanical Strength for High Temperature Insulation

Glass fiber/polyimide aerogel composites are prepared by adding glass fiber mat to a polyimide sol derived from diamine, 4,4′‐oxydianiline, p‐phenylene diamine, and dianhydride, 3,3′,4,4′‐biphenyltetracarboxylic dianhydride. The fiber felt acts as a skeleton for support and shaping, reduces aerogel shrinkage during the preparation process, and improves the mechanical strength and thermal stability of the composite materials. These composites possess a mesoporous structure with densities as low as 0.143–0.177 g cm^?3, with the glass fiber functioning to improve the overall mechanical properties of the polyimide aerogel, which results in its Young's modulus increasing from 42.7 to 113.5 MPa. These composites are found to retain their structure after heating at 500 °C, in contrast to pure aerogels which decompose into shrunken ball‐like structures. These composites maintain their thermal stability in air and N₂ atmospheres, exhibiting a low thermal conductivity range of 0.023 to 0.029 W m^?1 K^?1 at room temperature and 0.057to 0.082 W m^?1 K^?1 at 500 °C. The high mechanical strengths, excellent thermal stabilities, and low thermal conductivities of these aerogel composites should ensure that they are potentially useful materials for insulation applications at high temperature.