Preparation and properties of UV-autocurable BTDA-based polyurethane methacrylates

Syntheses of several UV-autocurable methacrylourethanes and the effects of polyol type on their properties are investigated. Autocurable benzophenone tetracarboxylic dianhydride (BTDA)-based polyurethane methacrylates are prepared by addition reaction from benzophenone tetracarboxylic dianhydride (BTDA), 2,4-toluene diisocyanate (TDI), 2-hydroxyethyl methacrylate (HEMA), and polyol (polyethylene glycol, polydiethylene succinate, polydiethylene maleate, or polydiethylene hexamethylene-dicarbamate). Autocurable oligomers possess good pot life and are cured rapidly when exposed to ultraviolet (UV) radiation without the addition of photoinitiator. The different polyols are used to obtain wide range properties of cured films with a glass transition temperature (T_g) range of -10.5-5.5°C. Increasing the T_g of polyol shifts the dynamic mechanical storage modulus and loss factor of the cured film to high temperature. For practical application, oligomer is mixed with reactive monomers to bring the systems to a workable viscosity at room temperature. Among the monomers, the higher the composition of hydroxyethyl acrylate in the oligomer-monomer system, the higher the curing rate of the system as compared with neat oligomer. Moreover, increasing the chain length of dimethacrylate monomers results in a decrease in breaking strength from 160 to 140 kg/cm², in Young's modulus from 771 to 400 kg/cm², and in glass transition temperature from 18 to 6.5°C, while the elongation at breaking increases from 70 to 130%.     

Study of dielectric relaxation of an epoxide oligomer by a direct current transient method

Dielectric α-relaxation of a bisphenol-A type epoxide oligomer has been investigated in the vicinity of the glass transition temperature (T_g) by the direct current (DC) transient method. The logarithm of the DC transient current for the oligomer was well approximated by the third order function of the logarithm of time. The complex dielectric constant was calculated through the Fourier transformation of that approximation function according to Simpson's integration rule in a frequency range of 10^?5 ? 1 Hz. At the temperature around the T_g (45°C), the dielectric α-relaxation process of the oligomer was found to be governed by the Havriliak-Negami equation. The relationship between the DC conductivity (σ) and the dielectric relaxation time (τ), σ·τ^m = const, is valid near and above the T_g of the oligomer. The DC transient current method combined with the DC conduction and the dielectric bridge measurements is considered to be a practical tool for analyzing the dielectric α-relaxation process of the epoxide oligomer over a wide frequency and temperature range.     

Core–shell particles to toughen epoxy resins. I. Preparation and characterization of core–shell particles

A two-stage, multistep soapless emulsion polymerization was employed to prepare various sizes of reactive core–shell particles (CSPs) with butyl acrylate (BA) as the core and methyl methacrylate (MMA) copolymerizing with various concentrations of glycidyl methacrylate (GMA) as the shell. Ethylene glycol dimethacrylate (EGDMA) was used to crosslink either the core or shell. The number of epoxy groups in a particle of the prepared CSP measured by chemical titration was close to the calculated value based on the assumption that the added GMA participated in the entire polymerization unless it was higher than 29 mol %. Similar results were also found for their solid-state ^13C-NMR spectroscopy. The MMA/GMA copolymerized and EGDMA-crosslinked shell of the CSP had a maximum glass transition temperature (T_g) of 140°C, which was decreased with the content of GMA at a rate of −1°C/mol %. However, the shell without crosslinking had a maximum T_g of 127°C, which decreased at a rate of −0.83°C/mol %. The T_g of the interphasial region between the core and shell was 65°C, which was invariant with the design variables. The T_g of the BA core was −43°C, but it could be increased to −35°C by crosslinking with EGDMA. The T_g values of the core and shell were also invariant with the size of the CSP. © 1998 John Wiley & Sons, Inc. J Appl Polym Sci 69: 2069–2078, 1998     

Improvement of fracture toughness and glass transition temperature of DGEBA‐based epoxy systems using toughening and crosslinking modifiers

Several toughening and crosslinking modifiers were tested in two epoxy resin systems based on the diglycidyl ether of bisphenol A (DGEBA) with the objective to improve the critical stress intensity factor K_IC and the glass transition temperature (T_g) simultaneously. An amine hardener (isophorone diamine (IPD)) and a homopolymerization initiator (1‐ethyl‐3‐methylimidazolium acetate (EMIM Ac)) were used as curing agents. The highest effect on the K_IC value of the resin system DGEBA/IPD (K_IC = 0.72 MPa^1/2; T_g = 164°C) was achieved with the dendric polymer Boltorn P501 (10 wt%), but it decreased the T_g (K_IC = 1.39 MPa^1/2; T_g = 136°C). A high toughening effect with a low decrease of T_g was achieved with a combination of a self‐organized block copolymer (Nanostrength M22N) and silica nanoparticles (Nanopox F400) (K_IC =1.15 MPa^1/2; T_g =157°C). The K_IC value of the resin system DGEBA/EMIM Ac was improved from 0.44 to 0.66 MPa^1/2. An improvement of both, the thermal and mechanical properties was established for a combination of a poly(tetrahydrofuran) as toughening modifier (PolyTHF2000) with the post‐crosslinking modifier diethylphosphite (DEP) in the resin system DGEBA/IPD (K_IC = 0.86 MPa^1/2; T_g = 180°C). A system with chemical linkages between both modifiers was investigated for comparison but yielded inferior results. POLYM. ENG. SCI., 59:86–95, 2019. © 2018 Society of Plastics Engineers     

Straining phenomena of POY revealed by thermal retraction and other techniques

Partially oriented polyesters yarns (POY) were strained at different strain rates (0.03–12.00 min^?1) and temperatures above and below T_g (3–92°C). Thermal retraction, density, DSC, and WAXS techniques show that strain-induced crystallization takes place by straining at temperatures above as well as below T_g. Above T_g, depending upon the strain rate, two regimes are observed: Below the strain rate of 1.5 min^?1, the flow regime; the degree of crystallinity is reduced as the strain rate increases. Above the strain rate of 1.5 min^?1, the strain-induced crystallization regime; the degree of crystallinity increases as the strain rate increases. Thermal retraction, stress–relaxation, and sonic modulus techniques indicate that, upon cold straining, instead of the original T_g at 65–69°C, two glass transitions occur: an upper T_g (u) and a lower T_g (l). For POY strained at 3°C and at a strain rate of 10 min^?1, the values are 78°C and 37°C, respectively. The higher the strain rate and the lower the straining temperature, the large the difference between T_g (u) and T_g (l).     

Synthesis and thermally stimulated current study of molecular relaxations of the grafted polymethylphenylsiloxane segment in thiodiphenol-modified epoxy resin

A series of grafted polymethylphenylsiloxane (PMPS) segments in thiodiphenyl-containing epoxy resin (ESTP) was prepared. The structure was evaluated by IR, ¹H-NMR, and ¹³C-NMR measurements. DSC measurements on the grafted ESTP epoxy resins showed a decreasing trend for T_g with increasing content of PMPS siloxane. The TSC measurements further confirmed this trend. This result suggests that the matrix of ESTP copolymer was less rigid with grafting of PMPS oligomer, due to the Si—O—C linkage at the opened glycidyl ether chain located approximately between the BPA and 4,4′-thiodiphenoxyl chains in the epoxy backbone. A new and broad sub-T_g transition appeared at −60°C in the TSC spectrum was observed for the cooperative motion of this siloxane moiety. All copolymers showed sub-T_g relaxations of γ- and δ-modes, observed at −100 and −130°C, respectively. These two relaxations may be attributed to the motions of BPA and the terminal groups in the epoxy matrix. © 1998 John Wiley & Sons, Inc. J Appl Polym Sci 69: 1523–1530, 1998     

Development of high Tg epoxy resin and mechanical properties of its fiber‐reinforced composites

A new epoxy resin with high glass transition temperature (T_g) (～ 180°C) and a viscosity low enough for infiltration into dry reinforcements at 40°C was developed for the vacuum‐assisted resin transfer molding process. To study the curing behavior and viscosity, several blends were formulated using multifunctional resin, aromatic hardener, and reactive diluents. Effects of these components on the viscosity and T_g were investigated by thermomechanical analysis, dynamic scanning calorimetry, and rheometer. Experimental results showed that a liquid aromatic hardener and multifunctional epoxy resin should be used to decrease the viscosity to <1 Pa·s at 40°C. Moreover, the addition of a proper reactive diluent decreased the viscosity and simultaneously minimized the deterioration of T_g. Mechanical properties of the composite produced with the optimized blend were evaluated at both room‐temperature and high‐temperature conditions. According to the results, the composite showed comparable mechanical properties with that of the current commercial resin. © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013     

Influence of Codiluent on the Properties of Radiation-Cured Films

A number of formulations were developed using urethane diacrylate oligomer in combination with a series of monofunctional and multifunctional reactive diluents possessing diverse glass transition temperatures from ?50°C to 250°C. Films prepared with these formulations were cured under ultraviolet (UV) radiation; their properties, such as hardness, gel content, tensile characteristics, etc., were determined and compared with those of the films cured by electron beam (EB) radiation. Effect of comonomer diluents was investigated in these cases. A good correlation was observed between these properties and the glass transition temperature (T _g) of the copolymer (cured film), prepared under radiation with urethane acrylate, monomer, and comonomer.     

Vanillin-based polymers: IV. Hydrovanilloin epoxy resins

In this study, hydrovanilloin synthesized by electrochemical dimerization of vanillin has been used as a renewable substitute for bisphenol A for the preparation of epoxy resins. The reaction of the disodium salt of hydrovanilloin:epichlorohydrin 1:2 mol ratio at 80°C for 30 min in water gave a hydrovanilloin – diglycidyl ether phenoxy resin. This hard thermoplastic resin showed T_g of 135°C and stable up to 255°C in air. On the other hand, the disodium salt of hydrovanilloin:epichlorohydrin 1:4 mol ratio at 80°C for 30 min in water gives a curable oligomer of hydrovanilloin – diglycidyl ether with 2.1 repeating units. This oligomer could be cured with aliphatic diamines: 1,2-diaminoethane, 1,4-diaminobutane, 1,6-diaminohexane, and isophorone diamine to give hard epoxy resins with T_g values of 116, 118, 149 and 146°C, respectively. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019 , 136, 47000.     

Isothermal Cure of an Epoxy System Containing Tetraglycidyl-4,4′-diaminodiphenylmethane (TGDDM), a Multifunctional Novolac Glycidyl Ether and 4,4′-Diaminodiphenylsulphone (DDS): Vitrification and Gelation

Times to gelation and vitrification have been determined at different isothermal curing temperatures between 200 and 240°C for an epoxy/amine system containing both tetraglycidyl-4,4′-diaminodiphenylmethane (TGDDM) and a multifunctional Novolac glycidyl ether with 4,4′-diaminodiphenylsulphone (DDS). The mixture was rich in epoxy, with an amine/epoxide ratio of 0·64. Gelation occurred around 44% conversion. Vitrification was determined from data curves of glass transition temperature, T_g, versus curing time obtained from differential scanning calorimetry experiments. The minimum and maximum values T_g determined for this epoxy system were T_g0=12°C and T_gmax=242°C. Values of activation energy for the cure reaction were obtained from T_g versus time shift factors, a_T, and gel time measurements. These values were, respectively, 76·2kJmol^-1 and 61·0kJmol^-1. The isothermal time–temperature–transformation (TTT) diagram for this system has been established. Vitrification and gelation curves cross at a cure temperature of 102°C, which corresponds to glass transition temperature of the gel. © of SCI.     

Additive group contributions to density and glass transition temperature in polyurethanes

The method of additive properties was applied to the density and glass transition temperature, T_g, of linear amorphous polyurethanes. This method assumes that certain polymer properties result from the additive effects of unique constituent group properties and that these group properties are independent of their environment. To determine the component properties, 14 model polyurethanes were synthesized. The polymers contained only the following four groups: urethane, phenylene, methylene, and ether oxygen. The densities and T_g's of these polymers were measured. Using these measured values, the known composition of each polymer, and an appropriate additive from, the molar component properties were calculated using a matrix least-squares simultaneous fit algorithm. An error analysis confirmed that the component values were determined with greater accuracy than literature results. The densities ranged from 1.0 to 1.2 g/cm³ and measured versus predicted densities agreed to within 0.3% on the average. T_g's ranged from ?70°C to 70°C and measured versus predicted T_g's agreed to within 1.3% on the average.     

Boron-containing UV-curable oligomer-based linseed oil as flame-retardant coatings: synthesis and characterization

A boron-containing UV-curable oligomer was derived from linseed oil, phenylboronic acid and glycidyl methacrylate to use in flame-retardant coating applications. The synthesized UV-curable oligomer was characterized for its structural and physicochemical properties by means of Fourier transform infrared (FTIR), ¹H and ¹¹B-nuclear magnetic resonance (NMR) spectroscopy techniques. The boron-containing UV-curable oligomer (BELO) was added to a conventional polyurethane acrylate (PUA) at varying concentrations ranging from 10 to 40 wt% in the presence of a photoinitiator and a reactive diluent. LOI and UL-94 tests were performed to understand the flame-retardancy behavior of the synthesized BELO oligomer, and the results revealed that the flame retardancy of UV-curable coatings enhanced as the percentage of BELO oligomer in the coating formulations increased. The glass transition temperature (T_g) and thermal stability of cured coatings were analyzed by differential scanning calorimetry and thermogravimetric analysis, respectively. The TGA analysis showed that char yield at 600 °C increased by increasing the BELO oligomer content. The mechanical properties, and stain, solvent, and chemical resistance and thermal behavior of the coatings were investigated. Incorporation of BELO into the PUA coating formulations and the comparison of the properties of BELO-incorporated PUA coatings with those of the conventional PUA coating exhibited interesting results.     

Preparation,analysis, and isothermal crystallization behavior of poly[1,3‐bis(aminomethyl)cyclohexamethylene oxamide]

Poly[1,3‐bis(aminomethyl)cyclohexaneoxamide] (PBAC2) was synthesized using 1,3‐bis(aminomethyl)cyclohexane (BAC) and dibutyl oxalate (DO) via spray/solid‐state polycondensation (SSP). The structure of the synthesized polyoxamide was confirmed by ¹H‐nuclear magnetic resonance (NMR) and Fourier transform infrared spectroscopy. The weight average molecular weight (M_w) of the polyoxamides prepared was 1.35 × 10⁵. The polyoxamides showed excellent thermal properties with glass transition temperature (T_g) of 150 °C, melting temperature (T_m) of 318 °C, crystallization temperature(T_c) of 253 °C, and initial degradation temperature (T_d) of 417 °C suggesting higher thermal stability than commercial polyamide 6 (T_d = 378 °C). Kinetic studies of PBAC2 predicted a two‐dimensional crystal growth. X‐ray diffraction powder diffraction suggested that the polymer has high crystallinity. A saturated water absorption of 2.8 wt % was recorded for the new polyoxamide, giving it a competitive edge for applications in civil aviation, reinforced plastics, and electronics industry where precise dimensional stability and high thermal resistance properties are a priority. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018 , 135, 46345.     

Preparation and properties of ester or cyano group substituted ring-opening polymers and their hydrogenated derivatives

Ester or cyano substituted tetracyclo [4.4.0.1^2,5.1^7,10]dodec-3-enes (1) were synthesized and their metathesis ring-opening polymerization was examined. The tungsten-based ternary catalyst system polymerized them very well. The polymers showed high glass transition temperatures (T_g) and no evidence of crystallization (e.g., the T_g of the polymer derived from 8-methyl-8-methoxycarbonyl substituted monomer (1a) was 207°C, and colorless transparent films could be casted from the solution of the polymer). The stability of these high T_g polymers were too unstable, so practical thermal molding methods could not be applied to them. The hydrogenation of these polymers with a palladium catalyst decreased T_g and greatly increased thermal stability. The physical and thermal properties of the hydrogenated polymers were thoroughly investigated. Monomer 1 was successfully copolymerized with other cyclic olefins. The resultant copolymers were hydrogenated, giving thermally stable polymers. In all cases examined in this study, a decrease of T_g by hydrogenation was about 35°C, regardless of the monomer structure. These results indicate that the main-chain mobility is the major contribution to the decrease of T_g. © 1997 John Wiley & Sons, Inc. J Appl Polym Sci 66: 367–375, 1997     

Completely amorphous high thermal resistant copolyesters from bio-based 2,5-furandicarboxylic acid

Polyesters from renewable resources with glass transition temperature (T_g) higher than 100°C are crucial in broadening their application range. In this work, a series of high molecular weight copolyesters, poly(butylene bis[4-(2-hydroxyethoxy) phenyl] sulfone 2,5-furandicarboxylate) (PBSF), was synthesized from bis[4-(2-hydroxyethoxy) phenyl] sulfone (BHEPS), bio-based 1,4-butanediol (BDO), and 2,5-furandicarboxylic acid (FDCA) via transesterification. Nuclear magnetic resonance spectroscopy (¹H-NMR and ¹³C-NMR) was used to confirm their chemical structures, composition, and sequence distribution. Characterizations demonstrated that with the increasing content of BHEPS unit, T_g of synthesized polyesters was increased from 38.2°C for PBF to 122°C for PBSF-95, in which the content of BHEPS unit was 95%. However, the weight average molecular weight (M_w) of PBSF was dramatically decreased after the addition of BHEPS, from 95,300 g/mol for PBF to only 9600 g/mol for PBSF-95, which was too low for practical application. Taking molecular weight, T_g, and mechanical properties into account, PBSF-65 was considered to be a promising polyester with M_w of 28,500 g/mol, T_g of 104.7°C, tensile strength of 82 MPa, and elongation-at-break of 98%. Besides, it was a completely amorphous polyester with a transmittance of 89.9% by cutoff at 700 nm. Summarily, PBSF-65 showed great potential to be used as raw material for the manufacture of baby bottles, children's toys, kitchen appliances, and beverage packaging, especially in the case when high transparency and heat resistance are required.     

Synthesis and properties of methyl hexahydrophthalic anhydride‐cured fluorinated epoxy resin 2,2‐bisphenol hexafluoropropane diglycidyl ether

The fluorinated epoxy resin, 2,2‐bisphenol hexafluoropropane diglycidyl ether (DGEBHF) was synthesized through a two‐step procedure, and the chemical structure was confirmed by ¹H n uclear magnetic resonance (NMR), ¹³C NMR, and Fourier transform infrared (FTIR) spectra. Moreover, DGEBHF was thermally cured with methyl hexahydrophthalic anhydride (MHHPA). The results clearly indicated that the cured DGEBHF/MHHPA exhibited higher glass transition temperature (T_g 147°C) and thermal decomposition temperature at 5% weight loss (T₅ 372°C) than those (T_g 131.2°C; T₅ 362°C) of diglycidyl ether of bisphenol A (DGEBA)/MHHPA. In addition, the incorporation of bis‐trifluoromethyl groups led to enhanced dielectric properties with lower dielectric constant (D_k 2.93) of DGEBHF/MHHPA compared with cured DGEBA resins (D_k 3.25). The cured fluorinated epoxy resin also gave lower water absorption measured in two methods relative to its nonfluorinated counterparts. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 130: 2801–2808, 2013     

Physical aging in graphite/epoxy composites

Matrix-dominated mechanical behavior of a graphite/epoxy composite has been found to be affected by sub-T_g annealing. Postcured (±45°)_4S specimens of Thornel 300 graphite/Narmco 5208 epoxy were quenched from above T_g and given a sub-T_g annealing at 140°C for times up to 10⁵ min. The ultimate tensile strength, strain-to-break, and toughness of the composite material were found to decrease as functions of sub-T_g annealing time. No weight loss was observed during the sub-T_g annealing. The time-dependent change in mechanical behavior is explained on the basis of free-volume changes that are related to the physical aging of the nonequilibrium glassy network-epoxy. The results imply possible changes in composite properties with service time.     

Nanotailoring of polyurethane adhesive by polyhedral oligomeric silsesquioxane (POSS)

The development and commercialization of nanoparticles such as nanoclays (NCs), carbon nanotubes (CNTs) and polyhedral oligomeric silsesquioxanes (POSS) offers new possibilities to tailor adhesives at the nanoscale. Four types of POSS, with reactive mono-functional groups of isocyanatopropyl, glycidoxypropyl, aminoethyl and non-reactive octaphenyl, were incorporated in concentrations of 1, 3 and 5 wt% into a polyurethane (PU)-based adhesive. Thermo-mechanical bulk properties were studied using dynamic mechanical analysis (DMA). Adhesive properties were characterized in shear and peel modes. Atomic force microscopy (AFM) was used to study the nanoscale morphology. DMA measurements indicated that the neat PU possessed a glass transition temperature (T _g) of ≈ 30°C. The T _g of PU/POSS-glycidoxypropyl nanocomposite adhesive increased gradually with POSS concentration to 50°C for 5 wt%. PU/POSS-octaphenyl nanocomposite adhesive exhibited an increased T _g by 10°C for 5 wt%. The incorporation of POSS-isocyanatopropyl in the PU had no effect on the T _g. With respect to shear properties of POSS-octaphenyl-, POSS-isocyanatopropyl- and POSS-glycidoxypropyl-based PU nanocomposite adhesives, shear strength improved by 230, 178 and 137%, respectively, compared to neat PU. POSS-aminoethyl exhibited lower shear and peel strengths, while POSS-isocyanatopropyl provided the best balance of both higher shear and peel strengths compared to neat PU. It was concluded that the grafted functional group on the POSS and its reactivity with the PU network components were the decisive factors with respect to the thermo-mechanical, morphological and adhesive properties of the resulting nanocomposite adhesives. Consequently, the POSS/polyurethane based nanocomposite adhesives could be tailored for a large range of applications.     

Thermal and physical properties of allyl PPO and its composite

The thermal behavior of allyl PPO and its cured resin were investigated. In the allyl PPO curing process, the specific temperatures were T_gel = 173.6°C, T_cure = 225.4°C, and T_treat = 237.7°C, and the activation energy (E_a) was 122 kJ/mol. The average number of PPO molecular units between two crosslinking points was about 20. In the degradation process of cured allyl PPO resin, the temperature at which mass loss equaled 1% was much higher than 300°C. The E_a for degradation was calculated as 125 kJ/mol, with a degradation fraction (α) in the range of 0.15–0.65, or 117 kJ/mol with an α of 0.10–0.90. The most probable mechanism function of decomposition of the cured allyl PPO resin was f(α) = 2(1 ? α)^3/2 or g(α) = (1 ? α)^?1/2 ? 1. The thermocompressed laminate of the allyl PPO blending with an additive resin (made from BDM and DP) exhibited the desired properties. ©2006 Wiley Periodicals, Inc. J Appl Polym Sci 102: 4111–4115, 2006     

Determination of glass transition temperature from dielectric analysis for a series of epoxide oligomers

Dielectric properties have been investigated for a bisphenol-A type epoxide oligomer, whose weight average molecular weight (M?_w) was 9454. The dielectric α-relaxation of the oligomer was found to be governed by the Havriliak–Negami equation as well as the same series of oligomers with smaller M?_ws (388≦M?_w ≦ 3903). The dielectric relaxation times (τ)s for the oligomers with different M?_ws (1396 ≦ M?_w ≦ 9454) can be expressed by the Williams–Landel–Ferry (WLF) equation as a function of the glass transition temperature (T_g) at fixed temperatures from 70 to 100°C. The finding indicates that the T_g of the epoxide oligomer is calculated from the τ through the WLF equation, providing the relation between T_g and τ. The same type of WLF equation was also successfully applied to describe the T_g, dependence of the practical dielectric relaxation time (τ_p), which was obtained from the peak of the dielectric loss vs. frequency curve. The τ_p can be calculated more easily than the τ, based on the Havriliak–Negami equation, not only in the measurement of epoxide oligomer, but also in that of the reactive epoxy resin systems during curing. The T_g of an epoxy–aromatic amine system, which was determined from the τ_p nondestructively detected in the dielectric cure monitoring, was consistent with the T_g experimentally measured by differential scanning calorimetry (DSC).