消失模铸造涂料性能测试新方法

针对消失模铸造涂料性能测试方法上存在的问题,提出了用同一装置和试样连续测试多项性能的新方法,开发研究出了消失模铸造涂料多性能综合测定装置。运用该装置初步研究表明,这种方法便于综合分析涂料的性能,具有较高的可靠性和灵敏度。     

码垛机械手的手部装置设计与选用

码垛机械手是一种常见的自动化搬运设备,其终端是手部装置。码垛和拆垛的部分动作都需要通过手部装置来实现。配置一套合适的手部装置能有效提升码垛机械手的工作性能和效率。研究了多种常用的手部装置,分析并研究了其设计方案、性能和适用领域。介绍了在实际工程应用中,选择码垛机械手以及机械手手部的考虑因素和方法。     

4极横向磁场再约束等离子弧切割

研究了４极横向再约束磁场的装置设计原则，通过不锈钢切割试验考察了磁场对等离子弧特性、切割质量和无渣切速的影响规律，并分析了磁装置性能和磁约束方法的局限性，指出了进一步研究全向束磁场装置的必要性。     

4极横向磁场再约束等离子弧切割

研究了４极横向再约束磁场的装置设计原则，通过不锈钢切割试验考察了磁场对等离子弧特性、切割质量和无渣切速的影响规律，并分析了磁装置性能和磁约束方法的局限性，指出了进一步研究全向约束磁场装置的必要性。     

多维振动平面静压解耦设计

多维振动试验系统在航天、航空领域有着广泛应用,可以为航空、航天产品提供3个方向的激振力,能够更加真实地模拟试件振动环境,系统中解耦装置的性能对整体系统性能有着重要影响。基于静压技术指标要求对平面静压解耦装置结构展开了设计与研究,通过理论计算方法设计了一套平面静压解耦装置,并对该装置进行了油膜性能测试以及动态性能测试,测试结果达到技术指标要求,为多维振动试验系统的液压解耦装置结构设计提供了理论依据。     

基于Flowmaster液环真空泵系统运行性能的研究（英文）

目前液环真空泵系统的研究主要侧重于实际应用方面,有关系统性能的基础研究非常有限。本文采用流动系统模拟软件Flowmaster对液环真空泵系统进行建模计算,探讨了系统运行工况与液环泵性能和装置性能的相互关系,得到了液环泵参数(转速、叶轮尺寸)和装置参数(管路长度、管路内径、阀门开度、被抽容器压力)对液环真空泵系统运行工况及性能的影响规律,为工程设计及应用提供理论依据。     

基于Flowmaster液环真空泵系统运行性能的研究

目前液环真空泵系统的研究主要侧重于实际应用方面，有关系统性能的基础研究非常有限。本文采用流动系统模拟软件Flowmaster对液环真空泵系统进行建模计算，探讨了系统运行工况与液环泵性能和装置性能的相互关系，得到了液环泵参数（转速、叶轮尺寸）和装置参数（管路长度、管路内径、阀门开度、被抽容器压力）对液环真空泵系统运行工况及性能的影响规律，为工程设计及应用提供理论依据。     

浮力调节装置实验研究

设计并构建了浮力调节装置实验测试系统,并对其在不同工作条件下的性能进行了实验研究.研究结果表明,所设计的浮力调节装置工作可靠,系统密封性能良好,在外部环境压力变化时,浮力调节装置泵油时间变化较小,系统效率高,整体功耗小,最大功耗不超过117 W.该实验研究为浮力调节装置的研制奠定了基础.     

新型高温磨粒磨损测试装置及方法

为研究涂层等表面工程零件的磨损性能,介绍了一种新型的高温磨粒磨损测试装置和方法,可以模拟研究高温氧化腐蚀和磨粒磨损交互作用,并研究了测试温度、测试载荷、测试时间和三种磨料对涂层磨粒磨损测试结果的影响.结果表明,这种高温磨粒磨损测试方法可以评价不同温度和载荷条件下涂层的耐磨粒磨损性能;高温磨粒磨损测试装置结构简单,运行稳定,所测试的数据准确、重现性好;当温度和载荷变化时,涂层的耐磨粒磨损性能也会变化.     

基于AMESim的取样装置动态仿真与试验研究

以新型物料粒度在线检测系统中的取样装置为研究对象,介绍了该装置的结构和工作原理.利用AMESim软件和试验相结合的方法,分析了该装置的速度-负载特性,分析结果表明,该装置性能良好,能够满足取样要求.     

Materials issues in microelectromechanical systems (MEMS)

Microelectromechanical systems (MEMS) have recently become an important area of technology, building on the success of the microelectronics industry over the past 50 years. MEMS combine mechanical and electrical function in devices at very small scales. Examples include pressure sensors, accelerometers, gyroscopes and optical devices, as well as chemical, biomedical and fluidic applications. The status of MEMS technology is reviewed with particular emphasis on materials issues therein. The materials issues in MEMS are divided into three categories, the MEMS material set, microfabrication processes, and material characterization and design. Each of these areas is addressed, with particular emphasis on the potential impact of materials solutions. A discussion of the future of MEMS and the role of materials in that future is given.     

工作气压对Y掺杂HfO2结构及电学性能的影响

目的 基于Y掺杂高纯铪靶和钛靶的反应磁控溅射方法,在Si(100)基底上沉积掺杂Y氧化铪薄膜,以及TiN/X-HfO2/TiN三层异质结构,探究Y掺杂对氧化铪基异质结构铁电性的影响。方法 针对反应磁控溅射制备的Y掺杂HfO2薄膜和异质结构,分别采用白光干涉仪、掠入射X射线衍射(GIXRD)、X 光电子能谱仪(XPS)和铁电分析仪,对薄膜的沉积速率、退火后薄膜的晶体结构、掺杂元素组分及含量,以及HfO2基异质结薄膜P-E电滞回线和I-V曲线进行测量。结果 在相同工艺条件下,薄膜的沉积速率随着工作气压的增大呈先增大后减小的趋势,在工作气压为1.1 Pa时沉积速率达到最高值。XRD结果表明,薄膜经过退火后存在正交相(o相)和单斜相(m相)。当工作气压为0.7 Pa时,所制备HYO薄膜在28°~30°内代表o(111)相的衍射峰最强,具有最佳的铁电性。随着工作气压的增大,代表m(111)相的衍射峰强度逐渐下降。采用XPS分析了薄膜中各元素的化学状态和含量,在工作气压为0.7 Pa时,Y的掺杂浓度(物质的量分数)为5.6%,铁电分析结果表明,在工作气压从0.7 Pa增至1.3 Pa的过程中,Y掺杂的HfO2基异质结的电滞回线逐渐收缩。在工作气压为0.7 Pa时,剩余极化强度Pr的最大值为14.11 µC/cm²,矫顽场Ec约为1 MV/cm。结论 利用Y掺杂高纯铪靶反应磁控溅射制备的掺杂铁电薄膜,在工作气压0.7 Pa下得到的薄膜经过700 ℃退火后具备良好的铁电性能。     

Coat spraying with use of the cold spray method

In this article, physical phenomena accompanying the process of cold spraying as well as principles of bonding particles with a surface were analysed. Moreover, the basic process parameters as well as the construction of actual spraying devices were shown. Numerous advantages of the method and its applications in the industry were presented.     

石油化工设备基本腐蚀系统分析

对我国石油化工设备腐蚀特点进行了归纳,对炼油、化工、化纤和化肥设备的基本腐蚀系统进行了分析并提出了相应的防护对策。     

Materials issues in microelectromechanical devices: science,engineering, manufacturability and reliability

MicroElectroMechanical Systems (MEMS) technology offers considerable potential throughout the manufacturing sector, because of certain intrinsic advantages in terms of low cost, reliability, and small size. Relatively simple MEMS are used in applications ranging from automobile air bag sensors to electronic games. Considerably more complex devices have been designed for defense applications, for which government funding is available; however, the fledgling industry suffers from insufficient knowledge of materials physics at micrometer size and from the fact that currently commercialized MEMS devices are designed for specialized and rather disparate purposes, do not have a broad user base, and therefore have not generated industry standards or the design and process software that would be built upon those industry standards. In addition to industry standards, further advances in MEMS technology require a more complete understanding of the physics underlying performance and reliability. The first half of this paper reviews general issues related to fabrication and commercialization; the second half addresses the technical materials issues that relate to MEMS performance and reliability.     

一步晶化法制备微米级4A沸石的工业应用

用ICP、化学分析等技术研究了焙烧煤矸石与碱液一步晶化法制备微米级A型分子筛的反应过程,得到了一步晶化法制备A型分子筛的工业参数。工业实验证明一步晶化法制备4A型分子筛过程中凝胶化和晶化同时进行,合成过程中没有真正的纯胶体状态存在,凝胶化速度控制着整个晶化过程。一步晶化法制备A型沸石分子筛,不需成胶、老化阶段,工艺简单,生产周期短,节约能耗。一步晶化转化机理在沸石合成领域的实验佐证为大宗工业废渣的深层次开发利用提供了基础。     

做好防腐蚀工作是石油化工企业最大的经济效益

腐蚀给国民经济造成了很大的损失,尤其是化工行业,腐蚀危害更加严重。文章阐述了化工行业的腐蚀现状,分析了腐蚀形成的各种原因,并对化工企业如何做好防腐蚀工作进行详细的论述,最终给出了合理的建议。     

我国不锈钢管的市场供需情况及其特点

介绍了我国不锈钢管的消耗量、生产量及进口量情况。详细分析了化工、石化、电力等行业用不锈钢管的品种、规格、数量 ;分析了我国不锈钢管的生产能力与市场需求情况 ,指出无缝管开发“新品” ,焊管开发“精品”是今后市场需求之趋向。     

Investigation of Wear and Corrosion Behaviour of AISI 316 L Stainless Steel Coated By ESD Surface Modification

Protection of Metals and Physical Chemistry of Surfaces - AISI 316 L austenitic stainless steel is widely used in various sectors of the industry (chemical, petro-chemical industry, paper industry,...     

The Chemical Modeling of Electronic Materials and Interconnections

Thermodynamic and kinetic modeling, together with careful experimental work, is of great help for developing new electronic materials such as lead-free solders, their compatible metallizations and diffusion-barrier layers, as well as joining and bonding processes for advanced electronics manufacturing. When combined, these modeling techniques lead to a rationalization of the trial-and-error methods employed in the electronics industry, limiting experimentation and, thus, reducing significantly time-to-market of new products. This modeling provides useful information on the stabilities of phases (microstructures), driving forces for chemical reactions, and growth rates of reaction products occurring in interconnections or thin-film structures during processing, testing, and in longterm use of electronic devices. This is especially important when manufacturing advanced lead-free electronics where solder joint volumes are decreasing while the number of dissimilar reactive materials is increasing markedly. Therefore, a new concept of local nominal composition was introduced and applied together with the relevant ternary and multicomponent phase diagrams to some solder/conductor systems.