Structural and electrical properties of high-quality 0.41 μm-thick InSb films grown on GaAs (1 0 0) substrate with InxAl1−xSb continuously graded buffer

High-quality InSb was grown on a GaAs (1 0 0) substrate with an InAlSb continuously graded buffer (CGB). The temperatures of In, Al K-cells and substrate were modified during the growth of InAlSb CGB. The cross-section TEM image reveals that the defects due to lattice-mismatch disappear near lateral structures in CGB. The measured electron mobility of 0.41 μm-thick InSb was 46,300 cm²/Vs at 300 K. These data surpass the electron mobility of state-of-the-art InSb grown by other methods with similar thickness of InSb.     

Effect of thin intermediate-layer of InAs quantum dots on the physical properties of InSb films grown on (001) GaAs

In this study the formation of a semiconducting InSb layer, preceded by the growth of an intermediate layer of InAs quantum dots, is attempted on (001) GaAs substrate. From the analysis of atomic-force-microscopy and transmission-electron-microscopy images together with Raman spectra of the InSb films, it is found that there exists a particular layer-thickness of ~ 0.5 μm above which the structural and transport qualities of the film are considerably enhanced. The resultant 2.60-μm-thick InSb layer, grown at the substrate temperature of 400 °C and under the Sb flux of 1.5 × 10^− 6 Torr, shows the electron mobility as high as 67,890 cm²/Vs.     

Spin Dynamics in Narrow-Gap Semiconductor Epitaxial Layers

We report on investigation of the spin dynamics in InAs and InSb films grown on GaAs at a temperature range from 77 K to 290 K. For both materials, the large lattice mismatch with the GaAs substrate results in the formation of an interface accumulation layer with a large defect concentration, which strongly affects the spin relaxation in these areas. Moreover, the native surface defect in the InAs films resulted in an additional charge accumulation layer with high conductivity, but very short spin lifetime. In contrast, in InSb layers, the surface states introduce a depletion region. We have correlated the spin relaxation with a multi-layer analysis of the transport properties, and find that in a 1 μm thick InAs film, approximately 70% of the total current flows through the interface and surface accumulation layers, which have sub-picosecond lifetimes, whereas in InSb films of the same thickness, the semiconducting layer carries more than 90% of the total current, and the spin lifetime in the accumulation layer is only slightly less than that of the central semiconducting layer. We suggest that InSb could be a more attractive candidate for spintronic applications than InAs.     

Interaction of InAs and InSb with aqueous solutions of nitric acid

InSb dissolution in 7.8–15.6 N HNO₃ is controlled by the oxidizer diffusion to the surface. InAs dissolution in 15.6 N HNO₃ is controlled by diffusion in solution; at low acid concentrations, the dissolution rate is limited by diffusion through the loose oxide layer forming on the sample surface. The different dissolution kinetics of InAs and InSb in HNO₃ can be explained by the different properties of the surface layers of hydrous arsenic and antimony oxides.     

Microstructure control of (Pb,Sr)TiO3 films on Pt/Ti/SiO2/Si substrates by a TiO2 buffer layer

A thin TiO₂ buffer layer was used to control the microstructure and electrical properties of the polycrystalline (Pb,Sr)TiO₃ (PST) films produced by a Sol-Gel method on Pt(111)/Ti/SiO₂/Si(100) substrates. The PST films included (Pb_0.6Sr_0.4)TiO₃ (PST40) and (Pb_0.4Sr_0.6)TiO₃ (PST60). It was found that a crystallized TiO₂ buffer layer with a thickness of nearly 5 nm was critical for improving the crystallinity and surface morphology of both the thinner (about 40 nm) and thicker (about 330 nm) PST films, which exhibited a (l00) preferred orientation and much smoother surface comparing with those without the buffer layer. The electrical properties of the PST films having TiO₂ buffer layer were also improved. For 330-nm-thick PST40 films, the dielectric constant and its tunability by dc voltage were increased from 482 and 26.8% at 10 kHz to 590 and 51.2%, while the loss and leakage current density were reduced from 0.04 and 4.26 × 10⁻⁴ A/cm² at 100 kV/cm to 0.034 and 7.63 × 10⁻⁶ A/cm², respectively. Similar results were also found in the PST60 films.     

Characterization of an AlN buffer layer and a thick-GaN layer grown on sapphire substrate by MOCVD

An AlN buffer layer and a thick-GaN layer for high-electron-mobility transistors (HEMTs) were grown on sapphire substrate by metal–organic chemical vapor deposition (MOCVD). The structural and morphological properties of the layers were investigated by high resolution X-ray diffraction (HRXRD) and atomic force microscopy (AFM) techniques. The optical quality of the thick-GaN layer was also evaluated in detail by a photoluminescence (PL) measurement. It was found that the AlN buffer layer possesses high crystal quality and an atomically flat surface with a root-mean-square (rms) roughness of 0.16 nm. The screw- and edge-type dislocation densities of the thick-GaN layer were determined as 5.4 × 10⁷ and 5.0 × 10⁹ cm⁻² by means of the mosaic crystal model, respectively. It was observed that the GaN layer has a smooth surface with an rms of 0.84 nm. Furthermore, the dark spot density of the GaN surface was estimated as 6.5 × 10⁸ cm⁻² over a scan area of 4 μm².     

Effects of substrate on the structural, electrical and optical properties of Al-doped ZnO films prepared by radio frequency magnetron sputtering

Transparent and conductive Al-doped ZnO (AZO) thin films were deposited on substrates including alkali-free glass, quartz glass, Si, and SiO₂ buffer layer on alkali-free glass by using radio frequency magnetron sputtering. The effects of different substrates on the structural, electrical and optical properties of the AZO films were investigated. It was found that the crystal structures were remarkably influenced by the type of the substrates due to their different thermal expansion coefficients, lattice mismatch and flatness. The AZO film (100 nm in thickness) deposited on the quartz glass exhibited the best crystallinity, followed sequentially by those deposited on the Si, the SiO₂ buffer layer, and the alkali-free glass. The film deposited on the quartz glass showed the lowest resistivity of 5.14 × 10^− 4 Ω cm among all the films, a carrier concentration of 1.97 × 10²¹ cm^− 3 and a Hall mobility of 6.14 cm²/v·s. The average transmittance of this film was above 90% in the visible light spectrum range. Investigation into the thickness-dependence of the AZO films revealed that the crystallinity was improved with increasing thickness and decreasing surface roughness, accompanied with a decrease in the film resistivity.     

The effect of LaNiO3 buffer layer thickness on the electric properties of Pb(Zr0.53Ti0.47)O3 thin films deposited on titanium foils

Sol-gel derived Pb(Zr_0.53Ti_0.47)O₃ (PZT) thin films were prepared on LaNiO₃ (LNO) buffered titanium foils. The effect of LNO buffer layer thickness on the electric properties of PZT thin films was investigated. The room temperature dielectric constant of PZT thin films increased with increasing LNO thickness. The remnant polarization of PZT thin films on 150 and 250 nm LNO was about 20 uC/cm². Curie temperatures of PZT thin films were 310, 330 and 340 °C for LNO of 250, 150 and 50 nm respectively. The current-voltage characteristics of PZT thin films were examined for different LNO buffer layer thicknesses, and the space charge limited conduction model was followed in PZT thin films on 50 nm LNO.     

Hybrid solar cells based on CuInS2 and organic buffer-sensitizer layers

Hybrid solar cells on the basis of CuInS₂ (CIS) photoabsorber on Cu-tape (CISCuT) in combination with organic buffer layers of Zn-phthalocyanine (ZnPc), ZnPc:fullerene (ZnPc:C₆₀) composite and conductive polymer buffer layers of poly(3,4-ethylenedioxythiophene) (PEDOT) doped with polystyrenesulfonate (PSS) were prepared using vacuum evaporation and spin-casting techniques. To prepare solar cells with an active area of 2 cm², the appropriate deposition parameters and thickness of ZnPc, ZnPc:C₆₀ and PEDOT-PSS layers were selected experimentally. For preparation of semitransparent contact-window layers, chromium and gold were evaporated on the surface of ZnPc, ZnPc:C₆₀ and PEDOT-PSS films. It was found that an intermediate chromium layer improves PV properties of the structures with organic buffer layers. The photosensitivity at small illumination intensities of complete structures with ZnPc and ZnPc:C₆₀ layers increased more than one order of magnitude in comparison with the structures where the PEDOT-PSS buffer layer was deposited. The presence of C₆₀ in the composite-buffer layer results in increased photoconductivity. The best structure with composite ZnPc:C₆₀ buffer layer showed an open-circuit voltage of 560 mV, a short-circuit current density of around 10 mA/cm² and a photoconversion efficiency of around 3.3% under the light illumination with an intensity of 100 mW/cm² from a tungsten-halogen lamp. The low transmission of the semitransparent chromium-gold window layer is the reason for relatively low current density.     

Characterization of ITO/CdO/glass thin films evaporated by electron beam technique

A thin buffer layer of cadmium oxide (CdO) was used to enhance the optical and electrical properties of indium tin oxide (ITO) films prepared by an electron-beam evaporation technique. The effects of the thickness and heat treatment of the CdO layer on the structural, optical and electrical properties of ITO films were carried out. It was found that the CdO layer with a thickness of 25 nm results in an optimum transmittance of 70% in the visible region and an optimum resistivity of 5.1×10⁻³ Ω cm at room temperature. The effect of heat treatment on the CdO buffer layer with a thickness of 25 nm was considered to improve the optoelectronic properties of the formed ITO films. With increasing annealing temperature, the crystallinity of ITO films seemed to improve, enhancing some physical properties, such as film transmittance and conductivity. ITO films deposited onto a CdO buffer layer heated at 450 °C showed a maximum transmittance of 91% in the visible and near-infrared regions of the spectrum associated with the highest optical energy gap of 3.61 eV and electrical resistivity of 4.45×10⁻⁴ Ω cm at room temperature. Other optical parameters, such as refractive index, extinction coefficient, dielectric constant, dispersion energy, single effective oscillator energy, packing density and free carrier concentration, were also studied.     

The electronic band structure of InN,InAs and InSb compounds

The electronic band structure of InN, InAs and InSb has been investigated by ETB. The ETB method has been formulated for sp³d² basis and nearest neighbor interactions of the compounds and its energy parameters have been derived from the results of the present first principles calculations carried on InN, InAs and InSb. It has been found that the present ETB parameters can produce the band structure of the compounds successfully.     

GaN epilayer on separately deposited buffer layer by hot wall epitaxy

High quality GaN epilayers were grown on a sapphire substrate using a hot wall epitaxy method. We have investigated the crystal, optical, and electrical properties of GaN epilayers grown as functions of the nitridation condition of the substrate and the growth condition of GaN buffer layer. In order to study an effective method to grow a buffer layer for the growth of high quality GaN epilayer, the buffer layers were formed on the nitridated substrate using two different methods. One is separately deposited buffer layer (SDBL), and the other is co-deposited buffer layer (CDBL). It was observed that the growth condition of the buffer layer had a strong influence on the crystal and optical properties of GaN epilayer. A strong band edge emission peak at 3.474 eV was observed from the photoluminescence spectrum measured at 5 K for GaN epilayer grown at the optimum condition of the buffer layer. The carrier concentration and mobility of undoped GaN epilayer grown with a growth rate of 0.5 μm h⁻¹ were 2 × 10¹⁸ cm⁻³ and >50 cm³ V⁻¹ s⁻¹ at room temperature, respectively.     

Structure-property relationships in heteroepitaxial InAs and InSb thin films

Heteroepitaxial thin films of InSb and InAs were evaporated onto sapphire and onto semi-insulating GaAs substrates. An in-line high vacuum evaporation set-up was used to deposit the semiconductor films by the three-temperature method at an ambient pressure of about 10^-5 mbar. The orientation and structure of the films were investigated as functions of substrate temperature and substrate orientation.The highest carrier mobilities were observed in (100)-oriented InAs and InSb films deposited on GaAs (100) substrates; these films had room temperature mobilities of 20 000 and 40 000 cm² V^-1 s^-1 respectively. InAs films on (0001) sapphire planes always showed (111) orientation with a maximum carrier mobility of 13 000 cm² V^-1 s^-1 at room temperature.     

Thickness and mosaic morphology of InAs films grown by LPE supercooling technique

InAs films with different thicknesses were fabricated on (100)-oriented InAs substrate by liquid phase epitaxy supercooling technique using the sliding graphite boat. The X-ray diffraction measurement shows that films exhibit (100)-preferred crystal orientation. The film thickness dependence on the growth time and cooling rate was investigated by scanning electron microscope and the growth kinetics was analyzed based on one-dimensional diffusion theory. The experimental data were fitted very well by the supercooling equation, and the fitted diffusion coefficient at 520 °C was 6.2 × 10⁻⁵ cm²/s. The newly observed mosaic morphology was probably caused by the shake of the growth solution due to sliding the graphite boat.     

Effects of group-III elements on the growth kinetics of shape-engineered InAs/InAlGaAs quantum dots

We studied the influences of the group-III elements on the shape-engineered InAs/InAlGaAs quantum dots (SEQDs) by photoluminescence (PL) spectroscopy. By alternately depositing a thin InAs layer and a thin InAlGaAs layer on an InAlGaAs buffer layer (so called alternate growth method, AGM), the shape of QDs, especially height, was significantly manipulated. To optically investigate the effect of the introduction of Al and Ga atoms to InAs/InAlGaAs SEQDs (SEQD1), InAs/GaAs (SEQD2) and InAs/AlAs (SEQD3) SEQDs were respectively grown by using the same AGM. The emission peak of the InAs/InAlGaAs SEQDs was 1427 nm with a linewidth broadening of 36 meV at 15 K. The emission peak of the InAs/GaAs SEQDs was red-shifted by 215 nm from the SEQD1 sample. On the other hand, the emission peak for the InAs/AlAs SEQDs was blue-shifted by 111 nm from the SEQD1 sample. From the temperature-dependent PL measurements, the emission peak for the SEQD1, SEQD2, and SEQD3 samples were respectively red-shifted by 18, 5, and 40 nm with increasing temperature. The different behavior in the PL results for the SEQD1, SEQD2, and SEQD3 samples can be attributed to the different atomic distribution of the group-III elements inside the SEQDs.     

Thickness scaling and electric properties of highly (111) oriented Nb-doped Pb(Zr,Ti)O<Subscript>3</Subscript> thin film prepared at low temperature by a sol–gel route

A series of highly (111) oriented Pb(Nb_0.01Zr_0.2Ti_0.8)O₃ (PNZT) thin films of variant thickness were successfully achieved on Pt/Ti/SiO₂/Si substrate by a sol–gel route. By introducing Pb_0.8Ca_0.1La_0.1Ti_0.975O₃ (PLCT) layer between the PNZT film and Pt electrode, the PNZT film could be crystallized at as low as 500 °C. When a maximum applied voltage is 3 V, it was found that the PNZT film with PLCT seed layer possessed higher remnant polarization (22 μC/cm²) as film thickness was scaled down to 50 nm. It was also found that enhanced pyroelectric properties could be observed in 50-nm thickness PNZT thin film due to its relatively low dielectric constant. The results demonstrated that the film thickness could be scaled down for low voltage operations using lattice matched interface between PNZT film and PLCT seed layer on Pt/Ti/SiO₂/Si substrate, and this interface optimization is the key technology for synthesizing thin PNZT films at low temperature with good insulating and electric properties.     

Effects of sputtering pressure and Al buffer layer thickness on properties of AZO films grown by rf magnetron sputtering

Transparent and conductive Al-doped (2 wt.%) zinc oxide (AZO) films were deposited on inexpensive soda-lime glass substrates by using rf magnetron sputtering at room temperature. This study analyzed the effects of argon sputtering pressure, which varied in the range from 0.46 to 2.0 Pa, on the morphological, electrical and optical properties of AZO films. The only (0 0 2) diffraction peak of the film were observed at 2θ～34.45°, exhibiting that the AZO films had hexagonal ZnO wurtzite structure, and a preferred orientation with the c-axis perpendicular to the substrate. By applying a very thin aluminum buffer layer with the thickness of 2 nm, findings show that the electrical resistivity was 9.46 × 10⁻⁴ Ω-cm, and the average optical transmittance in the visible part of the spectra was approximately 81%. Furthermore, as for 10 nm thick buffer layer, the electrical resistivity was lower, but the transmittance was decreased.     

Influence of the self-buffer layer on ZnO film grown by atmospheric metal organic chemical vapor deposition

ZnO films with and without a self-buffer layer were grown on c-plane sapphire substrates by atmospheric metal organic chemical vapor deposition. The influence of the buffer layer thickness, annealing temperature and annealing time on ZnO films has been investigated. The full width at half maximum of the ω-rocking curve of the optimized self-buffer layer sample is only 395 arc sec. Its surface is composed of regular columnar hexagons. After the buffer layer was introduced, the A₁ longitudinal mode peak at 576 cm^− 1, related to the defects, disappears in Raman spectra. For the photoluminescence, besides the strong donor binding exciton peak at 3.3564 eV, an ionized donor binding exciton and a free exciton peak is respectively observed at 3.3673 and 3.3756 eV at the high-energy side in the spectrum of the sample with the buffer layer.     

The effects of low temperature buffer layer on the growth of pure Ge on Si(001)

We investigated the effects of low temperature (LT) Ge buffer layers on the two-step Ge growth by varying the thickness of buffer layers. Whereas the two-step Ge layers using thin (< 40 nm) Ge buffer layers were roughened due to the formation of SiGe alloy, pure and flat Ge layers were grown by using thick (> 50 nm) LT Ge buffer layers. The lowest threading dislocation density of 1.2 × 10⁶ cm⁻² was obtained when 80-nm-thick LT Ge buffer layer was used. We concluded that the minimum thickness of buffer layer was required to grow uniform two-step Ge layers on Si and its quality was subject to the thickness of buffer layer.     

Growth and characterization of (Pb,La)TiO3 films with and without a special buffer layer prepared by RF magnetron sputtering

The (Pb, La)TiO₃ (PLT) ferroelectric thin films with and without a special buffer layer of PbO_x have been deposited on Pt/Ti/SiO₂/Si(100) substrates by RF magnetron sputtering technique at room temperature. The microstructure and the surface morphology of the films annealed at 600 °C for 1 h have been investigated by X-ray diffraction (XRD) and atomic force microscope (AFM). The surface roughness of the PLT thin film with a special buffer layer was 4.45 nm (5 μm × 5 μm) in comparison to that of 31.6 nm (5 μm × 5 μm) of the PLT thin film without a special buffer layer. Ferroelectric properties such as polarization hysteresis loop (P–V loop) and capacitance–voltage curve (C–V curve) of the films were investigated. The remanent polarization (P_r) and the coercive field (E_c) are 21 μC/cm² and 130 kV/cm respectively, and the pyroelectric coefficient is 2.75 × 10^− 8 C/cm² K for the PLT film with a special buffer layer. The results indicate that the (Pb, La)TiO₃ ferroelectric thin films with excellent ferroelectric properties can be deposited by RF magnetron sputtering with a special buffer layer.