NH3／H2O2溶液腐蚀下多孔硅光致荧光

用光致荧光谱、傅里叶变换红外光谱（ＦＴＩＲ）和扫描电子显微镜（ＳＥＭ）对用阳极氧化法制成的多孔硅层在１％ＮＨ３／Ｈ２Ｏ２溶液中的腐蚀现象进行了研究。红外分析表明，Ｓｉ－Ｏ键和Ｈ－Ｏ键的强度随ＮＨ３／Ｈ２Ｏ２溶液的腐蚀时间的增加而增加，Ｓｉ－Ｈ键强主匠随腐蚀时间增加而减少。光致荧光谱的峰值在腐蚀开始时先下降后上升，半高宽变窄，谱峰的以边明显蓝移。分析研究表明，１％ＮＨ３／Ｈ２Ｏ２溶液对多孔硅层有腐蚀     

铜掺杂多孔硅的光致发光及其载流子的复合过程

采用浸泡镀敷的方法在多孔硅表面形成了一镀铜层,通过对掺铜前后多孔硅的光致发光(PL)谱和傅里叶变换红外(FTIR)吸收光谱的研究,讨论了铜在多孔硅表面的吸附对其光致发光的影响。实验表明,掺铜多孔硅的光致发光谱出现两个发光带,其中能量较低的发光带随主发光带变化,并使多孔硅的发光峰位蓝移。多孔硅发光峰位的蓝移,是由于在发生金属淀积的同时伴随着多孔硅表面Si的氧化过程(纳米Si氧化为SiO2)的缘故。     

用脉冲腐蚀制备发光多孔硅

采用脉冲腐蚀方法，研究多孔硅的动态腐蚀过程，测定了动态电流和时间的关系，提出并讨论了动态腐蚀机理．用脉冲腐蚀制备得到发光多孔硅，与直流腐蚀相比较，脉冲腐蚀能得到均匀性更好、发光更强的多孔硅，而且ＰＬ峰位有一定的蓝移，我们认为脉冲腐蚀是一种更优秀的制备方法，并对此作了初步的讨论．     

多孔硅秃腔微结构的AFM和SEM研究

多孔硅微腔是采用交替变化脉冲腐蚀电流密度的方法制成的多孔度周期性变化的多孔硅结构。用原子力显微镜（AFM）和扫描电子显微镜（SEM）对多孔硅微腔的侧向解理的截面进行了观测，得到了不同多孔层及其界面处的图像。微腔截面的扫描电镜图像清楚地显示出第Ⅱ型多孔硅微腔的“三明治”结构，即中心发光层被夹在两个Bragg反射镜之间，这些结果表明结合分子束外延技术和电化学腐蚀方法可以很容易得到多孔硅微腔。     

半导体激光器阵列隔离槽的湿法腐蚀

研究了几种腐蚀液对半导体激光器阵列外延材料的腐蚀过程,其中HF(40%)/CrO3(33wt%)腐蚀液比较适合,用扫描电子显微镜(SEM)对其腐蚀情况进行了分析,并给出了利用这种腐蚀液进行腐蚀的半导体激光器阵列隔离槽的图像.通过调节HF/CrO3腐蚀液的体积比(从0.02到0.2),确定了AlxGa1-xAs组分渐变材料的腐蚀条件(室温23℃,腐蚀时间4min)以及最佳配比(体积比为0.1).利用这种腐蚀液得到的腐蚀图形可以满足激光器阵列的要求.     

染色腐蚀多孔硅的光致可见光发光特性

用氯氟酸硝酸水溶液对硅单晶抛光片进行染色腐蚀，制备了多孔硅．本文研究染色腐蚀多孔硅的光致可见光发光特性，特别是激发光强度和波长与发射光强度与波长的关系，多孔硅的稳定性和响应特性．     

半导体激光器阵列隔离槽的湿法腐蚀

研究了几种腐蚀液对半导体激光器阵列外延材料的腐蚀过程,其中HF(40 %) /CrO3 (33wt%)腐蚀液比较适合,用扫描电子显微镜(SEM)对其腐蚀情况进行了分析,并给出了利用这种腐蚀液进行腐蚀的半导体激光器阵列隔离槽的图像.通过调节HF/CrO3 腐蚀液的体积比(从0 0 2到0 2 ) ,确定了AlxGa1-xAs组分渐变材料的腐蚀条件(室温2 3℃,腐蚀时间4min)以及最佳配比(体积比为0 1) .利用这种腐蚀液得到的腐蚀图形可以满足激光器阵列的要求.     

深硅杯湿法腐蚀中金属保护工艺研究

提出了一种新的采用聚酯胶膜保护金属图形的硅湿法腐蚀工艺,解决了深硅杯湿法腐蚀中金属保护难题,允许在器件完成所有IC工艺后再进行深硅杯湿法腐蚀。通过工艺试验研究,增加贴膜前的预处理和贴膜后的热压等工艺,能够有效延长掩膜的保护时间,在TMAH湿法腐蚀工艺条件下掩膜能够坚持6h,且成功实现了对硅280μm的深刻蚀。新工艺与IC工艺兼容,简单可靠,也能进行圆片级批量腐蚀。     

多孔硅的形成与光致发光谱

介绍了用阳极氧化腐蚀形成多孔硅的工艺，并分析了它的微结构，实验测定了多孔硅光致发光谱（ＰＬ），由ＰＬ谱的峰值位于可见光区，不同于Ｓｉ的带隙能量；用纳米量子限制效应（Ｑ－ＣＥ），解释了多孔硅中进入量子线中电子和空穴能量增量为ΔＥｃ和ΔＥｖ，于是多了孔硅有效带宽成为Ｅ＝Ｅ。＋ΔＥ。而Ｅ。是Ｓｉ的带宽为ｌ．０８ｅＶ，ΔＥｃ和上ΔＥｖ分别为ｈ２／４ｍｅｑ２和ｈ２／４ｍｈｑ２，由此计算与实验结果一致。     

Formation and characterization of porous silicon films obtained by catalyzed vapor-chemical etching

Porous silicon films obtained by the metal-assisted vapor-chemical etching technique have been characterized. For the film formation, epitaxial (100) N/P⁺, 1–5 Ω cm monocrystalline silicon wafers were used. The vapors of an alcoholic solution of H₂O₂/HF were drawn towards the silicon surface, which was previously covered with a thin layer of gold (~8 nm) for the catalytic etching. For the optical and morphological characterization of porous films, Raman spectroscopy, Ellipsometry, FTIR spectroscopy and SEM images were used. The films thickness kept a linear relationship with etching time. A porosity gradient from the surface towards the interface (65% to 12%) was observed in the films. A large amount of Si–H bonds as related to O–Si–O bonds were observed and the pore size depends on the HF concentration. Irregular morphology was found in films formed with 50% HF.     

通过脉冲腐蚀形成的多孔硅薄膜的径向微结构和光学特性研究

使用反射光谱、光致发光光谱和SEM研究了通过脉冲腐蚀形成的多孔硅薄膜的径向折射率、光学和物理厚度。详细分析了沿径向方向多孔硅薄膜的径向折射率(n)和光学厚度(nd)与腐蚀中心之间的关系。实验结果表明：随着远离腐蚀中心,SEM图像表明：多孔硅样品的物理厚度缓慢变小,在腐蚀边缘,在径向58μm距离里,薄膜的物理厚度从2.48μm减少到1.72μm;此外,径向折射率n增加,即多孔度变小,同时,反射光谱强度显示出干涉振荡减弱,这意味着多孔硅薄膜的均匀性和界面的平整度变坏。光致发光谱的包络线显示蓝移的趋势,显示纳米微粒的尺寸减少。多孔硅微腔被制备用来研究多孔硅膜的径向光学特性,结果证实：在腐蚀中心,多孔硅膜的均匀性比边缘好。     

Radial microstructure and optical properties of a porous silicon layer by pulse anodic etching

This paper investigates the radial refractive index and optical and physical thicknesses of porous silicon (PS) layers prepared by pulse etching by means of reflectance spectroscopy,photoluminescence spectroscopy and scanning electron microscopy(SEM).The relationship between the radial refractive index and optical thickness of the PS sample and the position away from the etched centre along the radial direction has been analyzed in detail. With the position farther away from the etched centre,the SEM image shows that the physical thickness of the PS sample decreases slowly,whereas intensely decreases from 2.48 to 1.72μm near the edge at a distance of 58μm.Moreover,the radial refractive index increases,indicating that the porosity becomes smaller.Meanwhile,the reflectance spectra exhibit the less intense interference oscillations,which mean that the uniformity and interface smoothness of the PS layers become worse,and the envelope curves of photoluminescence spectra exhibit a trend of blue-shift,indicating a reduction in nanocrystal dimensions.The PS micro-cavity is prepared to study the radial optical properties of the PS layer,and the results verify that the uniformity and smoothness of the PS layer in the centre are better than those at the edge.     

Isolation of silicon film grown on porous silicon layer

We have investigated a new technology for dielectric isolation of a Si film grown epitaxially on a porous silicon layer. After oxidation of the porous silicon layer, a Si on Ohcidized Porous Silicon(SOPS) structure can be obtained. It is proposed that micropores pinch off quickly in the interfacial region between the porous silicon layer and the epitaxial film. A minimum yield calculated from Rutherford backscattering spectra of the epitaxial silicon film is 5.3%, and an electron Hall mobility of 600cm²/V.s is obtained in the film with a carrier concentration of 1 x 10¹⁷ /cm³. MOSFETs were fabricated on the SOPS structure.     

Optical and electrical properties of porous silicon layer formed on the textured surface by electrochemical etching

Porous silicon (PS) layers were formed on textured crystalline silicon by electrochemical etching in HF-based electrolyte. Optical and electrical properties of the TMAH textured surfaces with PS formation are studied. Moreover, the influences of the initial structures and the anodizing time on the optical and electrical properties of the surfaces after PS formation are investigated. The results show that the TMAH textured surfaces with PS formation present a dramatic decrease of reflectance. The longer is the anodizing time, the lower is the reflectance. Moreover, an initial surface with bigger pyramids achieved lower reflectance in short wavelength range. A minimum reflectance of 3.86 % at 460 nm is achieved for a short anodizing time of 2 min. Furthermore, the reflectance spectrum of the sample, which was etched in 3 vol.% TMAH for 25 min and then anodized for 20 min, is extremely flat and lies between 3.67% and 6.15% in the wavelength range from 400 to 1040 nm. In addition, for a short anodizing time, a slight increase in the effective carrier lifetime is observed. Our results indicate that PS layers formed on a TMAH textured surface for a short anodization treatment can be used as both broadband antireflection coatings and passivation layers for the application in solar cells.     

Optical and electrical properties of porous silicon layer formed on the textured surface by electrochemical etching

Porous silicon(PS) layers were formed on textured crystalline silicon by electrochemical etching in HF-based electrolyte.Optical and electrical properties of the TMAH textured surfaces with PS formation are studied. Moreover,the influences of the initial structures and the anodizing time on the optical and electrical properties of the surfaces after PS formation are investigated.The results show that the TMAH textured surfaces with PS formation present a dramatic decrease in reflectance.The longer the anodizing time is,the lower the reflectance.Moreover,an initial surface with bigger pyramids achieved lower reflectance in a short wavelength range.A minimum reflectance of 3.86%at 460 nm is achieved for a short anodizing time of 2 min.Furthermore,the reflectance spectrum of the sample,which was etched in 3 vol.%TMAH for 25 min and then anodized for 20 min,is extremely flat and lies between 3.67%and 6.15%in the wavelength range from 400 to 1040 nm.In addition,for a short anodizing time,a slight increase in the effective carrier lifetime is observed.Our results indicate that PS layers formed on a TMAH textured surface for a short anodization treatment can be used as both broadband antireflection coatings and passivation layers for the application in solar cells.     

铜辅助化学腐蚀条件对多孔硅的影响

以铜(Cu)作为催化剂,采用两步化学腐蚀法成功制 备了微纳米多孔硅(PS)。本文方法成本低廉、操 作简易。系统研究了腐蚀液中H₂O₂浓度、Si衬底掺杂浓度、腐蚀液温度和腐 蚀时间对PS表 面形貌和腐蚀深度的影响,并得到最佳制备参数。高、低掺Si衬底所采用的最佳配比腐蚀液 中的H₂O₂浓度分 别达到0.70mol/L和0.24mol/L。在 25℃腐蚀液中,腐蚀2h得到约200nm深的纳米级孔洞 ,其表面反射率在 宽波段内降低到5%以下;而在50℃腐蚀液中,经过2～ 4h的腐蚀,可得到14～41μm深的结构稳定的微纳 米级孔洞。文中还对Cu辅助腐蚀与其他金属辅助腐蚀(MACE)作了对比,分析了Cu辅助腐蚀获 得锥状孔洞的原因和机理。     

碲镉汞p型接触孔湿法腐蚀工艺研究

针对碲镉汞芯片p型接触孔湿法腐蚀工艺进行研究,采用不同条件的湿法腐蚀工艺完成碲镉汞p型接触孔制备,通过扫描电子显微镜和激光扫描显微镜分析腐蚀后的接触孔表面形貌,电学接触性能通过伏安特性曲线表征。实验结果表明,传统湿法腐蚀工艺在碲镉汞芯片接触孔制备过程中存在钻蚀严重和均匀性不好等问题,针对以上问题提出了一种超声辅助湿法腐蚀工艺,制备出形貌及均匀性较好的p型接触孔。     

Cr薄膜电阻桥的湿法腐蚀工艺参数研究

采用直流磁控溅射法在Al2O3陶瓷基片上沉积了Cr薄膜,采用光刻–湿法腐蚀工艺对Cr薄膜图形化得到电阻桥。通过实验,详细研究了腐蚀液温度、pH值和硝酸铈铵[(NH4)2Ce(NO3)6]浓度对Cr薄膜电阻桥腐蚀效果的影响。实验结果表明,Cr薄膜电阻桥的最优腐蚀参数为:硝酸铈铵浓度1.16 mol/L,pH值4,30℃水浴恒温。采用该最佳工艺制备的Cr薄膜电阻桥的腐蚀速率为180 nm/min,侧蚀为400 nm,桥区边缘线条整齐,其在5A恒流作用下点火效果良好,点火时间约为27.4 ms。     

激光诱导湿刻在微结构加工中的应用

介绍了激光诱导湿刻技术在各种材料微加工中的应用,同时对其作用机理和刻蚀特性进行了简单探讨,并对其发展进行了展望。