Front and Back‐Junction Carbon Nanotube‐Silicon Solar Cells with an Industrial Architecture

In the past, the application of carbon nanotube‐silicon solar cell technology to industry has been limited by the use of a metallic frame to define an active area in the middle of a silicon wafer. Here, industry standard device geometries are fabricated with a front and back‐junction design which allow for the entire wafer to be used as the active area. These are enabled by the use of an intermixed Nafion layer which simultaneously acts as a passivation, antireflective, and physical blocking layer as well as a nanotube dopant. This leads to the formation of a hybrid nanotube/Nafion passivated charge selective contact, and solar cells with active areas of 1–16 cm² are fabricated. Record maximum power conversion efficiencies of 15.2% and 18.9% are reported for front and back‐junction devices for 1 and 3 cm² active areas, respectively. By placing the nanotube film on the rear of the device in a back‐junction architecture, many of the design‐related challenges for carbon nanotube silicon solar cells are addressed and their future applications to industrialized processes are discussed.     

High‐quality surface passivation of silicon solar cells in an industrial‐type inline plasma silicon nitride deposition system

We have studied the surface passivation of silicon by deposition of silicon nitride (SiN) in an industrial‐type inline plasma‐enhanced chemical vapor deposition (PECVD) reactor designed for the continuous coating of silicon solar cells with high throughput. An optimization study for the passivation of low‐resistivity p‐type silicon has been performed exploring the dependence of the film quality on key deposition parameters of the system. With the optimized films, excellent passivation properties have been obtained, both on undiffused p‐type silicon and on phosphorus‐diffused n⁺ emitters. Using a simple design, solar cells with conversion efficiencies above 20% have been fabricated to prove the efficacy of the inline PECVD SiN. The passivation properties of the films are on a par with those of high‐quality films prepared in small‐area laboratory PECVD reactors. Copyright © 2004 John Wiley & Sons, Ltd.     

High‐efficiency black silicon interdigitated back contacted solar cells on p‐type and n‐type c‐Si substrates

This work demonstrates the high potential of Al₂O₃ passivated black silicon in high‐efficiency interdigitated back contacted (IBC) solar cells by reducing surface reflectance without jeopardizing surface passivation. Very low reflectance values, below 0.7% in the 300–1000 nm wavelength range, together with striking surface recombination velocities values of 17 and 5 cm/s on p‐type and n‐type crystalline silicon substrates, respectively, are reached. The simultaneous fulfillment of requirements, low reflectance and low surface recombination, paves the way for the fabrication of high‐efficiency IBC Si solar cells using black silicon at their front surface. Outstanding photovoltaic efficiencies over 22% have been achieved both in p‐type and n‐type 9‐cm² cells. 3D simulations suggest that efficiencies of up to 24% can be obtained in the future with minor modifications in the baseline fabrication process. Copyright © 2015 John Wiley & Sons, Ltd.     

High‐efficiency solar cells on phosphorus gettered multicrystalline silicon substrates

Measurements of the dislocation density are compared with locally resolved measurements of carrier lifetime for p‐type multicrystalline silicon. A correlation between dislocation density and carrier recombination was found: high carrier lifetimes (>100 µs) were only measured in areas with low dislocation density (<10⁵ cm⁻²), in areas of high dislocation density (>10⁶ cm⁻²) relatively low lifetimes (<20 µs) were observed. In order to remove mobile impurities from the silicon, a phosphorus diffusion gettering process was applied. An increase of the carrier lifetime by about a factor of three was observed in lowly dislocated regions whereas in highly dislocated areas no gettering efficiency was observed. To test the effectiveness of the gettering in a solar cell manufacturing process, five different multicrystalline silicon materials from four manufacturers were phosphorus gettered. Base resistivity varied between 0·5 and 5 Ω cm for the boron‐ and gallium‐doped p‐type wafers which were used in this study. The high‐efficiency solar cell structure, which has led to the highest conversion efficiencies of multicrystalline silicon solar cells to date, was used to fabricate numerous solar cells with aperture areas of 1 and 4 cm². Efficiencies in the 20% range were achieved for all materials with an average value of 18%. Best efficiencies for 1 cm² (20·3%) and 4 cm² (19·8%) cells were achieved on 0·6 and 1·5 Ω cm, respectively. This proves that multicrystalline silicon of very different material specification can yield very high efficiencies if an appropriate cell process is applied. Copyright © 2006 John Wiley & Sons, Ltd.     

>16% thin‐film epitaxial silicon solar cells on 70‐cm2 area with 30‐µm active layer,porous silicon back reflector,and Cu‐based top‐contact metallization

We demonstrate the use of a copper‐based metallization scheme for the specific application of thin‐film epitaxial silicon wafer equivalent (EpiWE) solar cells with rear chemical vapor deposition emitter and conventional POCl₃ emitter. Thin‐film epitaxial silicon wafer equivalent cells are consisting of high‐quality epitaxial active layer of only 30 µm, beneath which a highly reflective porous silicon multilayer stack is embedded. By combining Cu‐plating metallization and narrow finger lines with an epitaxial cell architecture including the porous silicon reflector, a J_sc exceeding 32 mA/cm² was achieved. We report on reproducible cell efficiencies of >16% on >70‐cm² cells with rear epitaxial chemical vapor deposition emitters and Cu contacts. Copyright © 2011 John Wiley & Sons, Ltd.     

Dithieno[3,2‐b:2′,3′‐d]pyrrol‐Cored Hole Transport Material Enabling Over 21% Efficiency Dopant‐Free Perovskite Solar Cells

Dopant‐free hole transport materials (HTMs) are essential for commercialization of perovskite solar cells (PSCs). However, power conversion efficiencies (PCEs) of the state‐of‐the‐art PSCs with small molecule dopant‐free HTMs are below 20%. Herein, a simple dithieno[3,2‐b:2′,3′‐d]pyrrol‐cored small molecule, DTP‐C6Th, is reported as a promising dopant‐free HTM. Compared with commonly used spiro‐OMeTAD, DTP‐C6Th exhibits a similar energy level, a better hole mobility of 4.18 × 10^?4 cm² V^?1 s^?1, and more efficient hole extraction, enabling efficient and stable PSCs with a dopant‐free HTM. With the addition of an ultrathin poly(methyl methacrylate) passivation layer and properly tuning the composition of the perovskite absorber layer, a champion PCE of 21.04% is achieved, which is the highest value for small molecule dopant‐free HTM based PSCs to date. Additionally, PSCs using the DTP‐C6Th HTM exhibit significantly improved long‐term stability compared with the conventional cells with the metal additive doped spiro‐OMeTAD HTM. Therefore, this work provides a new candidate and effective device engineering strategy for achieving high PCEs with dopant‐free HTMs.     

19%‐efficient and 43 µm‐thick crystalline Si solar cell from layer transfer using porous silicon

We present a both‐sides‐contacted thin‐film crystalline silicon (c‐Si) solar cell with a confirmed AM1.5 efficiency of 19.1% using the porous silicon layer transfer process. The aperture area of the cell is 3.98 cm². This is the highest efficiency ever reported for transferred Si cells. The efficiency improvement over the prior state of the art (16.9%) is achieved by implementing recent developments for Si wafer cells such as surface passivation with aluminum oxide and laser ablation for contacting. The cell has a short‐circuit current density of 37.8 mA cm⁻², an open‐circuit voltage of 650 mV, and a fill factor of 77.6%. Copyright © 2011 John Wiley & Sons, Ltd.     

20.1%‐efficient crystalline silicon solar cell with amorphous silicon rear‐surface passivation

We have developed a crystalline silicon solar cell with amorphous silicon (a‐Si:H) rear‐surface passivation based on a simple process. The a‐Si:H layer is deposited at 225°C by plasma‐enhanced chemical vapor deposition. An aluminum grid is evaporated onto the a‐Si:H‐passivated rear. The base contacts are formed by COSIMA (contact formation to a‐Si:H passivated wafers by means of annealing) when subsequently depositing the front silicon nitride layer at 325°C. The a‐Si:H underneath the aluminum fingers dissolves completely within the aluminum and an ohmic contact to the base is formed. This contacting scheme results in a very low contact resistance of 3.5 ±0.2 mΩ cm² on low‐resistivity (0.5 Ω cm) p‐type silicon, which is below that obtained for conventional Al/Si contacts. We achieve an independently confirmed energy conversion efficiency of 20.1% under one‐sun standard testing conditions for a 4 cm² large cell. Measurements of the internal quantum efficiency show an improved rear surface passivation compared with reference cells with a silicon nitride rear passivation. Copyright © 2005 John Wiley & Sons, Ltd.     

Bulk resistivity optimization for low‐bulk‐lifetime silicon solar cells

Guidelines are presented which are designed to achieve planar solar cell efficiencies as high as 17.5% using existing fabrication technologies and silicon substrates with lifetimes as low as 20 μs. Device simulations are performed to elucidate the need and impact of base doping optimization for different back‐surface passivation schemes, cell thicknesses, emitter profiles, and degrees of dopant–defect interaction. Results indicate that optimal resistivity is a function of back‐surface passivation, with the aluminum back‐surface field (BSF) requiring the highest resistivity, the oxide/nitride stack passivation excelling at an intermediate resistivity, and the ohmic contact needing the lowest resistivity. A comparison of simulated 300 and 100 μm cells shows that thinner cells magnify the differences in optimal resistivity for the three back‐surface passivation schemes. A lifetime model is used to account for dopant–defect interaction that can lower bulk lifetime at higher doping levels. It is demonstrated that cell efficiency decreases and optimal resistivity increases at higher levels of dopant–defect interaction. Simulated devices with an optimized base doping showed an efficiency improvement of as much as 2% (absolute) compared with identical devices with a typical base doping level (1.6 or 1.8 Ω cm) and bulk lifetime of 20 μs. Copyright © 2001 John Wiley & Sons, Ltd.     

Light‐enhanced surface passivation of TiO2‐coated silicon

Titanium dioxide is shown to afford good passivation to non‐diffused silicon surfaces and boron‐diffused surfaces after a low‐temperature anneal. The passivation most likely owes to the significant levels of negative charge instilled in the films, and passivation is enhanced by illumination—advantageous for solar cells—indicating that a titanium dioxide photoreaction is at least partly responsible for the low surface recombination. We demonstrate a surface recombination velocity of less than 30 cm/s, on a 5‐Ω cm n‐type silicon, and an emitter saturation current density of 90 fA/cm² on a 200‐Ω/sq boron diffusion. If these titanium dioxide passivated boron‐diffused surfaces were employed in a crystalline silicon solar cell, an open‐circuit voltage as high as 685 mV could be achieved. Given that TiO₂ has a high refractive index and was deposited with atmospheric pressure chemical vapour deposition, an inexpensive technique, it has the potential as a passivating antireflection coating for industrial boron‐diffused silicon solar cells. Copyright © 2011 John Wiley & Sons, Ltd.     

Development of back‐junction back‐contact silicon solar cells based on industrial processes

We have presented simplified industrial processes to fabricate high performance back‐junction back‐contact (BJBC) silicon solar cells. Good optical surface structures (solar averaged reflectance 2.5%) and high implied open‐circuit voltage (0.695 V) have been realized in the BJBC cell precursors through wet chemical processing, co‐diffusion, P ion implantation and annealing oxidation, as well as laser patterning and plasma enhanced chemical vapour deposition passivation processes. We have achieved a certified high efficiency of close to 22% on BJBC silicon solar cells with the size of 4.04 cm² by using screen printing and co‐firing technologies. The manufacturing process flow further successfully yields efficiency of around 21% BJBC silicon solar cells with enlarged sizes of 6 × 6 cm². The present work has demonstrated that the commercialization of low‐cost and high‐efficiency BJBC solar cells is possible because we have used processes compatible with existing production lines. Copyright © 2017 John Wiley & Sons, Ltd.     

Back amorphous‐crystalline silicon heterojunction (BACH) photovoltaic device with facile‐grown oxide ‐ PECVD SiNx passivation

This article reports on the integration of facile native oxide‐based passivation of crystalline silicon surfaces within the back amorphous‐crystalline silicon heterojunction solar cell concept. The new passivation scheme consists of 1‐nm thick native oxide and nominally 70‐nm thick PECVD silicon nitride. The low temperature passivation scheme provides uniform high quality surface passivation and low parasitic optical absorption. The interdigitated doped hydrogenated amorphous silicon layers were deposited on the rear side of the silicon wafer using the direct current saddle field PECVD technique. A systematic analysis of a series of back amorphous‐crystalline silicon heterojunction cells is carried out in order to examine the influence of the various cell parameters (interdigital gap, n‐doped region width, ratio of widths of p, and n‐doped regions) on cell performance. A photovoltaic conversion efficiency of 16.7 % is obtained for an untextured cell illuminated under AM 1.5 global spectrum (cell parameters: V_OC of 641 mV, J_SC of 33.7 mA‐cm ^{− 2} and fill factor of 77.3 %). Copyright © 2014 John Wiley & Sons, Ltd.     

5% Efficient evaporated solid‐phase crystallised polycrystalline silicon thin‐film solar cells

The first energy conversion efficiencies of over 5% are reported for evaporated solid‐phase crystallised (SPC) polycrystalline silicon thin‐film solar cells. All cells have a size of 2 cm² and are formed on planar glass superstrates. Back surface reflectance is provided by a simple coating with commercial white paint. The best cells have short‐circuit current densities of about 19 mA/cm² and external quantum efficiencies peaking at above 80%. The diffusion length in the base of the solar cells is larger than the base thickness, providing significant room for further efficiency improvements via an increased thickness of the base layer. Additional improvements are expected via the use of textured glass sheets, boosting the light trapping capabilities of the cells. Copyright © 2009 John Wiley & Sons, Ltd.     

SHORT COMMUNICATION: ACCELERATED PUBLICATION: Multicrystalline silicon solar cells exceeding 20% efficiency

This paper presents the first conversion efficiency above 20% for a multicrystalline silicon solar cell. The application of wet oxidation for rear surface passivation significantly reduces the process temperature and therefore prevents the degradation of minority‐carrier lifetime. The excellent optical properties of the dielectrically passivated rear surface in combination with a plasma textured front surface result in a superior light trapping and allow the use of substrates below 100 μm thickness. A simplified process scheme with laser‐fired rear contacts leads to conversion efficiencies of 20·3% for multicrystalline and 21·2% for monocrystalline silicon solar cells on small device areas (1 cm²). Copyright © 2004 John Wiley & Sons, Ltd.     

Textured silicon surface passivation by high‐rate expanding thermal plasma deposited SiN and thermal SiO2/SiN stacks for crystalline silicon solar cells

Expanding thermal plasma (ETP) deposited silicon nitride (SiN) with optical properties suited for the use as antireflection coating (ARC) on silicon solar cells has been used as passivation layer on textured monocrystalline silicon wafers. The surface passivation behavior of these high‐rate (>5 nm/s) deposited SiN films has been investigated for single layer passivation schemes and for thermal SiO₂/SiN stack systems before and after a thermal treatment that is normally used for contact‐firing. It is shown that as‐deposited ETP SiN used as a single passivation layer almost matches the performance of a thermal oxide. Furthermore, the SiN passivation behavior improves after a contact‐firing step, while the thermal oxide passivation degrades which makes ETP SiN a better alternative for single passivation layer schemes in combination with a contact‐firing step. Moreover, using the ETP SiN as a part of a thermal SiO₂/SiN stack proves to be the best alternative by realizing very low dark saturation current densities of <20 fA/cm² on textured solar‐grade FZ silicon wafers and this is further improved to <10 fA/cm² after the anneal step. Optical and electrical film characterizations have also been carried out on these SiN layers in order to study the behavior of the SiN before and after the thermal treatment. Copyright © 2008 John Wiley & Sons, Ltd.     

18.45%‐Efficient Multi‐Crystalline Silicon Solar Cells with Novel Nanoscale Pseudo‐Pyramid Texture

Silicon‐based cells could convert more solar energy to electrical energy if the cells could absorb more light. However, the nanostructured cells have demonstrated relatively low power conversion efficiency even when its reflection is very low; thus, they are still far from becoming real products of the photovoltaic industry. Here, nanoscale pseudo‐pyramid textured multi‐crystalline silicon (Pmc‐Si) solar cells, with the best efficiency of ≈18.45%, are fabricated by using a metal‐catalyzed chemical etching plus a post alkaline etching on an industrial production line. Such Pmc‐Si solar cells have showed similar light trapping ability as single crystalline silicon solar cells of micrometer pyramid texture, and the improved efficiency is mainly ascribed to its enhanced light absorption while the nanostructured surface still keeps acceptable passivation quality, that is, the short‐circuit current density has an increase of ≈300 mA cell^–1, while the open‐circuit voltage has only a slight decrease of ≈1 mV. Further elevations of the efficiency are expected by optimizing both micrometer‐ and nanotextures, and exploring more effective passivation technique. More excitingly, the technique presented here has been verified in the production line for several batches as a real technique of low cost and high efficiency.     

Front and rear silicon‐nitride‐passivated multicrystalline silicon solar cells with an efficiency of 18.1%

A solar cell process designed to utilise low‐temperature plasma‐enhanced chemical vapour deposited (PECVD) silicon nitride (SiN_x) films as front and rear surface passivation was applied to fabricate multicrystalline silicon (mc‐Si) solar cells. Despite the simple photolithography‐free processing sequence, an independently confirmed efficiency of 18.1% (cell area 2 × 2 cm²) was achieved. This excellent efficiency can be predominantly attributed to the superior quality of the rear surface passivation scheme consisting of an SiN_x film in combination with a local aluminium back‐surface field (LBSF). Thus, it is demonstrated that low‐temperature PECVD SiN_x films are well suited to achieve excellent rear surface passivation on mc‐Si. Copyright © 2002 John Wiley & Sons, Ltd.     

Diffusion‐free high efficiency silicon solar cells

Traditional POCl₃ diffusion is performed in large diffusion furnaces heated to ~850 C and takes an hour long. This may be replaced by an implant and subsequent 90‐s rapid thermal annealing step (in a firing furnace) for the fabrication of p‐type passivated emitter rear contacted silicon solar cells. Implantation has long been deemed a technology too expensive for fabrication of silicon solar cells, but if coupled with innovative process flows as that which is mentioned in this paper, implantation has a fighting chance. An SiOx/SiN_y rear side passivated p‐type wafer is implanted at the front with phosphorus. The implantation creates an inactive amorphous layer and a region of silicon full of interstitials and vacancies. The front side is then passivated using a plasma‐enhanced chemical vapor deposited SiN_xH_y. The wafer is placed in a firing furnace to achieve dopant activation. The hydrogen‐rich silicon nitride releases hydrogen that is diffused into the Si, the defect rich amorphous front side is immediately passivated by the readily available hydrogen; all the while, the amorphous silicon recrystallizes and dopants become electrically active. It is shown in this paper that the combination of this particular process flow leads to an efficient Si solar cell. Cell results on 160‐µm thick, 148.25‐cm² Cz Si wafers with the use of the proposed traditional diffusion‐free process flow are up to 18.8% with a V_oc of 638 mV, J_sc of 38.5 mA/cm², and a fill factor of 76.6%. Copyright © 2012 John Wiley & Sons, Ltd.     

Evaluation of advanced p‐PERL and n‐PERT large area silicon solar cells with 20.5% energy conversion efficiencies

In this paper, we evaluate p‐type passivated emitter and rear locally diffused (p‐PERL) and n‐type passivated emitter and rear totally diffused (n‐PERT) large area silicon solar cells featuring nickel/copper/silver (Ni/Cu/Ag) plated front side contacts. By using front emitter p‐PERL and rear emitter n‐PERT, both cell structures can be produced with only a few adaptations in the entire process sequence because both feature the same front side design: homogeneous n⁺ diffused region with low surface concentration, SiO₂/SiN_x:H passivation, Ni/Cu/Ag plated contacts. Energy conversion efficiencies up to 20.5% (externally confirmed at FhG‐ISE Callab) are presented for both cell structures on large area cells together with power‐loss analysis and potential efficiency improvements based on PC1D simulations. We demonstrate that the use of a rear emitter n‐PERT cell design with Ni/Cu/Ag plated front side contacts enables to reach open‐circuit voltage values up to 676 mV on 1–2 Ω cm n‐type CZ Si. We show that rear emitter n‐PERT cells present the potential for energy conversion efficiencies above 21.5% together with a strong tolerance to wafer thickness and bulk resistivity. Copyright © 2014 John Wiley & Sons, Ltd.     

Recent progress in MIS solar cells

Metal–insulator–semiconductor (MIS)-type solar cells have an inherent cost advantage compared to p-n junction solar cells. First-generation MIS–inversion layer (MIS–IL) solar cells, already successfully produced in an industrial pilot line, are restricted to efficiencies of 15–16%. With the second-generation MIS–IL silicon solar cells, based on drastically improved surface passivation by plasma-enhanced chemical vapour-deposited silicon nitride, simple technology can be combined with very high efficiencies. The novel inversion layer emitters have the potential to outperform conventional phosphorus-diffused emitters of Si solar cells. A 17.1% efficiency could already be achieved with the novel point-contacted ‘truncated pyramid’ MIS–IL cell. A new surface-grooved line-contact MIS–IL device presently under development using unconventional processing steps applicable for large-scale fabrication is discussed. By the mechanical grooving technique, contact widths down to 2 μm can be achieved homogeneously over large wafer areas. Bifacial sensitivity is included in most of the MIS-type solar cells. For a bifacial 98 cm² Czochralski (Cz) Si MIS-contacted p-n junction solar cell with a random pyramid surface texture and Al as grid metal, efficiencies of 16.5% for front and 13.8% for rear side illumination are reported. A 19.5% efficiency has been obtained with a mechanically grooved MIS n⁺p solar cell. The MIS-type silicon solar cells are able to significantly lower the costs for solar electricity due to the simple technology and the potential for efficiencies well above 20%.©1997 John Wiley & Sons, Ltd.