Temperature Performance of Doping‐Free Top‐Gate CNT Field‐Effect Transistors: Potential for Low‐ and High‐Temperature Electronics

High‐performance top‐gate carbon nanotube (CNT) field‐effect transistors (FETs) have been fabricated via a doping‐free fabrication process in which the polarity of the CNT FET is controlled by the injection of carriers from the electrodes, instead of using dopants. The performance of the doping‐free CNT FETs is systemically investigated over a wide temperature range, from very low temperatures of down to 4.3 K up to 573 K, and analyzed using several temperature‐dependent key device parameters including the ON/OFF state current and ratio, carrier mobility, and subthreshold swing. It is demonstrated that for ballistic and quasi‐ballistic CNT FETs, the operation of the CNT FETs is largely independent of the presence of dopant, thus avoiding detrimental effects due to dopant freeze‐out at low temperature and dopant diffusion at high temperature, and making it possible to use doping‐free CNT FETs in both low‐ and high‐temperature electronics. A new method is also proposed for extracting the band‐gap and diameter of a semiconducting CNT from the temperature dependent OFF‐state current and shown to yield results that are consistent with AFM measurements.     

High‐Speed Organic Single‐Crystal Transistor Responding to Very High Frequency Band

Although high carrier mobility organic field‐effect transistors (OFETs) are required for high‐speed device applications, improving the carrier mobility alone does not lead to high‐speed operation. Because the cut‐off frequency is determined predominantly by the total resistance and parasitic capacitance of a transistor, it is necessary to miniaturize OFETs while reducing these factors. Depositing a dopant layer only at the metal/semiconductor interface is an effective technique to reduce the contact resistance. However, fine‐patterning techniques for a dopant layer are still challenging especially for a top‐contact solution‐processed OFET geometry because organic semiconductors are vulnerable to chemical damage by solvents. In this work, high‐resolution, damage‐free patterning of a dopant layer is developed to fabricate short‐channel OFETs with a dopant interlayer inserted at the contacts. The fabricated OFETs exhibit high mobility exceeding 10 cm² V^?1 s^?1 together with a reasonably low contact resistance, allowing for high frequency operation at 38 MHz. In addition, a diode‐connected OFET shows a rectifying capability of up to 78 MHz at an applied voltage of 5 V. This shows that an OFET can respond to the very high frequency band, which is beneficial for long‐distance wireless communication.     

Control of Ambipolar and Unipolar Transport in Organic Transistors by Selective Inkjet‐Printed Chemical Doping for High Performance Complementary Circuits

The selective tuning of the operational mode from ambipolar to unipolar transport in organic field‐effect transistors (OFETs) by printing molecular dopants is reported. The field‐effect mobility (μ_FET) and onset voltage (V_on) of both for electrons and holes in initially ambipolar methanofullerene [6,6]‐phenyl‐C61‐butyric acid methyl ester (PCBM) OFETs are precisely modulated by incorporating a small amount of cesium fluoride (CsF) n‐type dopant or tetrafluoro‐tetracyanoquinodimethane (F4‐TCNQ) p‐type dopant for n‐channel or p‐channel OFETs either by blending or inkjet printing of the dopant on the pre‐deposited semiconductor. Excess carriers introduced by the chemical doping compensate traps by shifting the Fermi level (E_F) toward respective transport energy levels and therefore increase the number of mobile charges electrostatically accumulated in channel at the same gate bias voltage. In particular, n‐doped OFETs with CsF show gate‐voltage independent Ohmic injection. Interestingly, n‐ or p‐doped OFETs show a lower sensitivity to gate‐bias stress and an improved ambient stability with respect to pristine devices. Finally, complementary inverters composed of n‐ and p‐type PCBM OFETs are demonstrated by selective doping of the pre‐deposited semiconductor via inkjet printing of the dopants.     

Tuning Contact Resistance in Top‐Contact p‐Type and n‐Type Organic Field Effect Transistors by Self‐Generated Interlayers

Contact resistance significantly limits the performance of organic field‐effect transistors (OFETs). Positioning interlayers at the metal/organic interface can tune the effective work‐function and reduce contact resistance. Myriad techniques offer interlayer processing onto the metal pads in bottom‐contact OFETs. However, most methods are not suitable for deposition on organic films and incompatible with top‐contact OFET architectures. Here, a simple and versatile methodology is demonstrated for interlayer processing in both p‐ and n‐type devices that is also suitable for top‐contact OFETs. In this approach, judiciously selected interlayer molecules are co‐deposited as additives in the semiconducting polymer active layer. During top contact deposition, the additive molecules migrate from within the bulk film to the organic/metal interface due to additive‐metal interactions. Migration continues until a thin continuous interlayer is completed. Formation of the interlayer is confirmed by X‐ray photoelectron spectroscopy (XPS) and cross‐section scanning transmission electron microscopy (STEM), and its effect on contact resistance by device measurements and transfer line method (TLM) analysis. It is shown that self‐generated interlayers that reduce contact resistance in p‐type devices, increase that of n‐type devices, and vice versa, confirming the role of additives as interlayer materials that modulate the effective work‐function of the organic/metal interface.     

Enhancement of n‐Type Organic Field‐Effect Transistor Performances through Surface Doping with Aminosilanes

Dopants, i.e., electronically active impurities, are added to organic semiconductor materials to control the material's Fermi level and conductivity, to improve injection at the device contacts, or to fill trap states in the active device layers and interfaces. In contrast to bulk doping as achieved by blending or co‐deposition of dopant and semiconductor, surface doping has a lower propensity to introduce additional traps or scattering centers or to even alter the layer morphology relative to the undoped active material layers. In this study, the electrical effects of a very simple, post‐device‐fabrication surface doping process involving various amine group–containing alkoxysilanes on the performance of organic field‐effect transistors (OFETs) made from the well‐known n‐type materials PTCDI‐C8 and N2200 are researched. It is demonstrated that OFETs doped in such a way generally show enhanced characteristics (up to 10 times mobility increase and a significant reduction in threshold voltage) without any adverse effects on the devices' on/off ratio. It is also shown that the efficiency of the doping process is linked to the number of amine groups.     

Emission Color Tuning in Ambipolar Organic Single‐Crystal Field‐Effect Transistors by Dye‐Doping

The effect of dye‐doping in ambipolar light‐emitting organic field‐effect transistors (LE‐OFETs) is investigated from the standpoint of the carrier mobilities and the electroluminescence (EL) characteristics under ambipolar operation. Dye‐doping of organic crystals permits not only tuning of the emission color but also significantly increases the efficiency of ambipolar LE‐OFETs. A rather high external EL quantum efficiency (～0.64%) of one order of magnitude higher than that of a pure p‐distyrylbenzene (P3V2) single crystal is obtained by tetracene doping. The doping of tetracene molecules into a host P3V2 crystal has almost no effect on the electron mobility and the dominant carrier recombination process in the tetracene‐doped P3V2 crystal involves direct carrier recombination on the tetracene molecules.     

Preparation and Memory Performance of a Nanoaggregated Dispersed Red 1‐Functionalized Poly (N‐vinylcarbazole) Film via Solution‐Phase Self‐Assembly

A nanoaggregated dispersed red 1‐grafted poly(N‐vinylcarbazole) (abbreviated PVDR) is self‐assembled via π–π stacking interactions of the carbazole groups in the polymer system after adding a solution of PVDR in N,N‐dimethylformamide to dichloromethane. Upon self‐assembly, the nanoaggregated PVDR film displays helical columnar stacks with large grain sizes, whereas a non‐aggregated PVDR film exhibits an amorphous morphology with smaller grain size. A write‐once read‐many‐times (WORM) memory device is shown whereby a pre‐assembled solution of PVDR is spin‐coated as the active layer and is sandwiched between an aluminum electrode and an indium‐tin‐oxide (ITO) electrode. This device shows very good memory performance, with an ON/OFF current ratio of more than 10⁵ and a low misreading rate through the precise control of the ON and OFF states. The stability of the nanoaggregated PVDR device is much higher than that of the non‐nanoaggregated PVDR device. This difference in device stability under constant voltage stress can be mainly attributed to the difference in the film crystallinity and surface morphology. No degradation in current density was observed for the ON‐ and OFF‐states after more than one hundred million (10⁸) continuous read cycles indicating that both states were insensitive to the read cycles. These results render the nanoaggregated PVDR polymer as promising components for high‐performance polymer memory devices.     

Polymer‐Based Organic Field‐Effect Transistors with Active Layers Aligned by Highly Hydrophobic Nanogrooved Surfaces

In this study, polymer‐based organic field‐effect transistors (OFETs) that exhibit alignment‐induced mobility enhancement, very small device‐to‐device variation, and high operational stability are successfully fabricated by a simple coating method of semiconductor solutions on highly hydrophobic nanogrooved surfaces. The highly hydrophobic nanogrooved surfaces (water contact angle >110°) are effective at inducing unidirectional alignment of polymer backbone structures with edge‐on orientation and are advantageous for realizing high operational stability because of their water‐repellent nature. The dewetting of the semiconductor solution is a critical problem in the thin film formation on highly hydrophobic surfaces. Dewetting during spin coating is suppressed by surrounding the hydrophobic regions with hydrophilic ones under appropriate designs. For the OFET array with an aligned terrace‐phase active layer of poly(2,5‐bis(3‐hexadecylthiophene‐2‐yl)thieno[3,2‐b]thiophene), the hole mobility in the saturation regime of 30 OFETs with channel current direction parallel to the nanogrooves is 0.513 ± 0.018 cm² V^?1 s^?1, which is approximately double that of the OFETs without nanogrooves, and the intrinsic operational stability is comparable to the operational stability of amorphous‐silicon field‐effect transistors. In other words, alignment‐induced mobility enhancement and high operational stability are successfully achieved with very small device‐to‐device variation. This coating method should be a promising means of fabricating high‐performance OFETs.     

Optimal Structure for High‐Performance and Low‐Contact‐Resistance Organic Field‐Effect Transistors Using Contact‐Doped Coplanar and Pseudo‐Staggered Device Architectures

A low contact resistance achieved on top‐gated organic field‐effect transistors by using coplanar and pseudo‐staggered device architectures, as well as the introduction of a dopant layer, is reported. The top‐gated structure effectively minimizes the access resistance from the contact to the channel region and the charge‐injection barrier is suppressed by doping of iron(III)trichloride at the metal/organic semiconductor interface. Compared with conventional bottom‐gated staggered devices, a remarkably low contact resistance of 0.1–0.2 kΩ cm is extracted from the top‐gated devices by the modified transfer line method. The top‐gated devices using thienoacene compound as a semiconductor exhibit a high average field‐effect mobility of 5.5–5.7 cm² V^?1 s^?1 and an acceptable subthreshold swing of 0.23–0.24 V dec^?1 without degradation in the on/off ratio of ≈10⁹. Based on these experimental achievements, an optimal device structure for a high‐performance organic transistor is proposed.     

Tuning Interfacial Properties by Spontaneously Generated Organic Interlayers in Top‐Contact‐Structured Organic Transistors

Controlling the interfacial properties between the electrode and active layer in organic field‐effect transistors (OFETs) can significantly affect their contact properties, resulting in improvements in device performance. However, it is difficult to apply to top‐contact‐structured OFETs (one of the most useful device structures) because of serious damage to the organic active layer by exposing solvent. Here, a spontaneously controlled approach is explored for optimizing the interface between the top‐contacted source/drain electrode and the polymer active layer to improve the contact resistance (R_C). To achieve this goal, a small amount of interface‐functionalizing species is blended with the p‐type polymer semiconductor and functionalized at the interface region at once through a thermal process. The R_C values dramatically decrease after introduction of the interfacial functionalization to 15.9 kΩ cm, compared to the 113.4 kΩ cm for the pristine case. In addition, the average field‐effect mobilities of the OFET devices increase more than three times, to a maximum value of 0.25 cm² V^?1 s^?1 compared to the pristine case (0.041 cm² V^?1 s^?1), and the threshold voltages also converge to zero. This study overcomes all the shortcomings observed in the existing results related to controlling the interface of top‐contact OFETs by solving the discomfort of the interface optimization process.     

A Nonvolatile Organic Memory Device Using ITO Surfaces Modified by Ag‐Nanodots

We report on a single‐layer organic memory device made of poly(N‐vinylcarbazole) embedded between an Al electrode and ITO modified with Ag nanodots (Ag‐NDs). Devices exhibit high ON/OFF switching ratios of 10⁴. This level of performance could be achieved by modifying the ITO electrodes with some Ag‐NDs that act as trapping sites, reducing the current in the OFF state. Temperature dependence of the electrical characteristics suggest that the current of the low‐resistance state can be attributed to Schottky charge tunnelling through low‐resistance pathways of Al particles in the polymer layer and that the high‐resistance state can be controlled by charge trapping by the Al particles and Ag‐NDs.     

Air Effect on the Ideality of p‐Type Organic Field‐Effect Transistors: A Double‐Edged Sword

Organic field‐effect transistors (OFETs) often deviate from ideal behaviors in air, which masks their intrinsic properties and thus significantly impedes their practical applications. A key issue of how the presence of air affects the ideality of OFETs has not yet been fully understood. It is revealed that air atmosphere may exert a double‐edged sword effect on the active semiconductor layer when determining the ideality of OFETs fabricated from p‐type crystalline organic semiconductors. Upon exposing the as‐fabricated device to air, water and oxygen mainly function as efficient p‐type dopants for the active layer in the contact regions, enhancing charge carrier injection and consequently improving device ideality. Nevertheless, as the exposure time increases, the trapping centers for the injected minority charge carriers appear in the channel region, leading to degradation of device ideality. Inspired by the double‐edged sword behavior of air, a near‐ideal OFET is achieved by ingeniously utilizing the doping/positive effect and eliminating the trapping/negative effect. The effect of air on the ideality of p‐type OFETs is clarified, which not only illuminates some common observations of OFETs in air but also offers useful guidance for the construction of high‐performance ideal OFETs.     

Controlling Electron and Hole Charge Injection in Ambipolar Organic Field‐Effect Transistors by Self‐Assembled Monolayers

Controlling contact resistance in organic field‐effect transistors (OFETs) is one of the major hurdles to achieve transistor scaling and dimensional reduction. In particular in the context of ambipolar and/or light‐emitting OFETs it is a difficult challenge to obtain efficient injection of both electrons and holes from one injecting electrode such as gold since organic semiconductors have intrinsically large band gaps resulting in significant injection barrier heights for at least one type of carrier. Here, systematic control of electron and hole contact resistance in poly(9,9‐di‐n‐octylfluorene‐alt‐benzothiadiazole) ambipolar OFETs using thiol‐based self‐assembled monolayers (SAMs) is demonstrated. In contrast to common believe, it is found that for a certain SAM the injection of both electrons and holes can be improved. This simultaneous enhancement of electron and hole injection cannot be explained by SAM‐induced work‐function modifications because the surface dipole induced by the SAM on the metal surface lowers the injection barrier only for one type of carrier, but increases it for the other. These investigations reveal that other key factors also affect contact resistance, including i) interfacial tunneling through the SAM, ii) SAM‐induced modifications of interface morphology, and iii) the interface electronic structure. Of particular importance for top‐gate OFET geometry is iv) the active polymer layer thickness that dominates the electrode/polymer contact resistance. Therefore, a consistent explanation of how SAM electrode modification is able to improve both electron and hole injection in ambipolar OFETs requires considering all mentioned factors.     

Passivation of Molecular n‐Doping: Exploring the Limits of Air Stability

Molecular doping is a key technique for flexible and low‐cost organic complementary semiconductor technologies that requires both efficient and stable p‐ and n‐type doping. However, in contrast to molecular p‐dopants, highly efficient n‐type dopants are commonly sensitive to rapid degradation in air due to their low ionization energies (IEs) required for electron donation, e.g., IE = 2.4 eV for tetrakis(1,3,4,6,7,8‐hexahydro‐2H‐pyrimido[1,2‐a]pyrimidinato)ditungsten(II) (W₂(hpp)₄). Here, the air stability of various host:W₂(hpp)₄ combinations is compared by conductivity measurements and photoemission spectroscopy. A partial passivation of the n‐doping against degradation is found, with this effect identified to depend on the specific energy levels of the host material. Since host‐W₂(hpp)₄ electronic wavefunction hybridization is unlikely due to confinement of the dopant highest occupied molecular orbital (HOMO) to its molecular center, this finding is explained via stabilization of the dopant by single‐electron transfer to a host material whose energy levels are sufficiently low for avoiding further charge transfer to oxygen–water complexes. Our results show the feasibility of temporarily handling n‐doped organic thin films in air, e.g., during structuring of organic field effect transistors (OFETs) by lithography.     

Influence of oxygen doping on resistive-switching characteristic of a-Si/c-Si device

The influence of oxygen doping on resistive-switching characteristics of Ag/a-Si/p+-c-Si device was investigated.By oxygen doping in the growth process of amorphous silicon,the device resistive-switching performances,such as the ON/OFF resistance ratios,yield and stability were improved,which may be ascribed to the significant reduction of defect density because of oxygen incorporation.The device I-V characteristics are strongly dependent on the oxygen doping concentration.As the oxygen doping concentration increases,the Si-rich device gradually transforms to an oxygen-rich device,and the device yield,switching characteristics,and stability may be improved for silver/oxygen-doped a-Si/p+-c-Si device.Finally,the device resistive-switching mechanism was analyzed.     

High‐Mobility Air‐Stable Naphthalene Diimide‐Based Copolymer Containing Extended π‐Conjugation for n‐Channel Organic Field Effect Transistors

A high‐performance naphthalene diimide (NDI)‐based conjugated polymer for use as the active layer of n‐channel organic field‐effect transistors (OFETs) is reported. The solution‐processable n‐channel polymer is systematically designed and synthesized with an alternating structure of long alkyl substituted‐NDI and thienylene–vinylene–thienylene units (PNDI‐TVT). The material has a well‐controlled molecular structure with an extended π‐conjugated backbone, with no increase in the LUMO level, achieving a high mobility and highly ambient stable n‐type OFET. The top‐gate, bottom‐contact device shows remarkably high electron charge‐carrier mobility of up to 1.8 cm² V^?1 s^?1 (I_on/I_off = 10⁶) with the commonly used polymer dielectric, poly(methyl methacrylate) (PMMA). Moreover, PNDI‐TVT OFETs exhibit excellent air and operation stability. Such high device performance is attributed to improved π–π intermolecular interactions owing to the extended π‐conjugation, apart from the improved crystallinity and highly interdigitated lamellar structure caused by the extended π–π backbone and long alkyl groups.     

Contact Resistance in Organic Field‐Effect Transistors: Conquering the Barrier

Organic semiconductors have sparked interest as flexible, solution processable, and chemically tunable electronic materials. Improvements in charge carrier mobility put organic semiconductors in a competitive position for incorporation in a variety of (opto‐)electronic applications. One example is the organic field‐effect transistor (OFET), which is the fundamental building block of many applications based on organic semiconductors. While the semiconductor performance improvements opened up the possibilities for applying organic materials as active components in fast switching electrical devices, the ability to make good electrical contact hinders further development of deployable electronics. Additionally, inefficient contacts represent serious bottlenecks in identifying new electronic materials by inhibiting access to their intrinsic properties or providing misleading information. Recent work focused on the relationships of contact resistance with device architecture, applied voltage, metal and dielectric interfaces, has led to a steady reduction in contact resistance in OFETs. While impressive progress was made, contact resistance is still above the limits necessary to drive devices at the speed required for many active electronic components. Here, the origins of contact resistance and recent improvement in organic transistors are presented, with emphasis on the electric field and geometric considerations of charge injection in OFETs.     

Interface Doping for Ohmic Organic Semiconductor Contacts Using Self‐Aligned Polyelectrolyte Counterion Monolayer

Contact resistance limits the performance of organic field‐effect transistors, especially those based on high‐mobility semiconductors. Despite intensive research, the nature of this phenomenon is not well understood and mitigation strategies are largely limited to complex schemes often involving co‐evaporated doped interlayers. Here, this study shows that solution self‐assembly of a polyelectrolyte monolayer on a metal electrode can induce carrier doping at the contact of an organic semiconductor overlayer, which can be augmented by dopant ion‐exchange in the monolayer, to provide ohmic contacts for both p‐ and n‐type organic field‐effect transistors. The resultant 2D‐doped profile at the semiconductor interface is furthermore self‐aligned to the contact and stabilized against counterion migration. This study shows that Coulomb potential disordering by the polyelectrolyte shifts the semiconductor density‐of‐states into the gap to promote extrinsic doping and cascade carrier injection. Contact resistivities of the order of 0.1–1 Ω cm² or less have been attained. This will likely also provide a platform for ohmic injection into other advanced semiconductors, including 2D and other nanomaterials.     

Solution‐Processable Dithienothiophenoquinoid (DTTQ) Structures for Ambient‐Stable n‐Channel Organic Field Effect Transistors

A series of dialkylated dithienothiophenoquinoids ( DTTQ s), end‐functionalized with dicyanomethylene units and substituted with different alkyl chains, are synthesized and characterized. Facile one‐pot synthesis of the dialkylated DTT core is achieved, which enables the efficient realization of DTTQ s as n‐type active semiconductors for solution‐processable organic field effect transistors (OFETs). The molecular structure of hexyl substituted DTTQ‐6 is determined via single‐crystal X‐ray diffraction, revealing DTTQ is a very planar core. The DTTQ cores form a “zig‐zag” linking layer and the layers stack in a “face‐to‐face” arrangement. The very planar core structure, short core stacking distance (3.30 Å), short intermolecular S? N distance (2.84 Å), and very low lying lowest unoccupied molecular orbital energy level of ?4.2 eV suggest that DTTQ s should be excellent electron transport candidates. The physical and electrochemical properties as well as OFETs performance and thin film morphologies of these new DTTQ s are systematically studied. Using a solution‐shearing method, DTTQ‐11 exhibits n‐channel transport with the highest mobility of up to 0.45 cm² V^?1 s^?1 and a current ON/OFF ratio (I _ON/I _OFF) greater than 10⁵. As such, DTTQ‐11 has the highest electron mobility of any DTT‐based small molecule semiconductors yet discovered combined with excellent ambient stability. Within this family, carrier mobility magnitudes are correlated with the alkyl chain length of the side chain substituents of DTTQ s.     

Identifying orthogonal solvents for solution processed organic transistors

Identification of solvents for dissolving polymer dielectrics and organic semiconductors is necessary for the fabrication of solution-processed organic field effect transistors (OFETs). In addition to solubility and printability of a solvent, orthogonality is particularly important when forming multilayer structure from solutions. Currently, the process of finding orthogonal solvents is empirical, and based on trial-and-error experimental methods. In this paper, we present a methodology for identifying orthogonal solvents for solution-processed organic devices. We study the accuracy of Hildebrand and Hansen solubility theories for building solubility boundaries for organic semiconductor (Poly(2,5-bis(3-hexadecylthiophen-2-yl)thieno[3,2-b]thiophene (PBTTT) and polymer dielectrics (Poly(methyl methacrylate) (PMMA), Polystyrene (PS)). The Hansen solubility sphere for the organic semiconductor and polymer gate dielectrics are analyzed to identify solvents that dissolve PMMA and PS, but are orthogonal to PBTTT. Top gate/bottom contact PBTTT based OFETs are fabricated with PMMA gate dielectric processed with solvents that are orthogonal and non-orthogonal to PBTTT. The non-orthogonal solvents swell the semiconductor layer and increase their surface roughness.