Anhydride‐Assisted Spontaneous Room Temperature Sintering of Printed Bioresorbable Electronics

Bioresorbable electronic devices are promising replacements for conventional build‐to‐last electronics in implantable biomedical systems and consumer electronics. However, bioresorbable devices are typically achieved by complex complementary metal oxide semiconductor fabrication processes that minimize exposure to humidity. Emerging printable techniques for bioresorbable electronics demand further improvement in electrical conductivity and mechanical robustness. This paper presents a room‐temperature spontaneous sintering method of bioresorbable inks that contain zinc nanoparticles and anhydride. The entire process can be conducted in atmosphere environment under 90% humidity within 300 min. It has minimum requirement for external heating and special ambient conditions, allowing humidity to trigger the surface chemistry of zinc nanoparticles and spontaneous welding between neighboring nanoparticles. The resulting bioresorbable patterns are highly conductive (σ = 72 400 S m^?1) and mechanically robust (>1500 bending cycles) to enable practical applications. A radio circuit achieved through the above method can operate stably over 14 days in air and disappear in water for less than 30 min. The spontaneous room‐temperature sintering represents a rapid and energy‐efficient approach to achieve high‐performance bioresorbable electronics with improved mechanical robustness and electrical performance, leading to broader impacts in the areas of healthcare, information security, and consumer electronics.     

Liquid Metal based Stretchable Room Temperature Soldering Sticker Patch for Stretchable Electronics Integration (Adv. Funct. Mater. 36/2023)

Researchers are eagerly developing various stretchable conductors to fabricate devices for next-generation electronics. Most of the major problems in stretchable electronics happen at the connection between rigid and soft parts and the development of reliable soldering material is a major hurdle in stretchable electronics. Though there are attempts to devise new soldering processes for integrating chips and stretchable conductors, they still possess limitations such as mechanical stability, mass production, sophisticated processes, and restricted candidates for conductors and substrates. Here, this study presents a room-temperature universal stretchable sticker-like soldering process that can stretchably solder multiple spots at once and directly fabricates a stretchable device in an in situ manner while a target conductor is installed on one's body. The solder developed in this research possesses high conductivity with a unique freestanding feature enabling the process. It can be elongated when directly positioned between a rigid chip and a rigid conductor, demonstrating its extraordinary stretchability. It is expected that this simple but unique stretchable soldering technique utilizing the invented solder will allow the integration of functional stretchable conductors with highly advanced rigid chips for next-generation stretchable electronics.     

Edible Electronics: Biocompatible and Biodegradable Materials for Organic Field‐Effect Transistors (Adv. Funct. Mater. 23/2010)

Biocompatible‐ingestible electronic circuits and capsules for medical diagnosis and monitoring are currently based on traditional silicon technology. Organic electronics has huge potential for developing biodegradable, biocompatible, bioresorbable, or even metabolizable products. An ideal pathway for such electronic devices involves fabrication with materials from nature, or materials found in common commodity products. Transistors with an operational voltage as low as 4–5 V, a source drain current of up to 0.5 μA and an on‐off ratio of 3–5 orders of magnitude have been fabricated with such materials. This work comprises steps towards environmentally safe devices in low‐cost, large volume, disposable or throwaway electronic applications, such as in food packaging, plastic bags, and disposable dishware. In addition, there is significant potential to use such electronic items in biomedical implants.