A Polymer/Carbon‐Nanotube Ink as a Boron‐Dopant/Inorganic‐Passivation Free Carrier Selective Contact for Silicon Solar Cells with over 21% Efficiency

Traditional silicon solar cells extract holes and achieve interface passivation with the use of a boron dopant and dielectric thin films such as silicon oxide or hydrogenated amorphous silicon. Without these two key components, few technologies have realized power conversion efficiencies above 20%. Here, a carbon nanotube ink is spin coated directly onto a silicon wafer to serve simultaneously as a hole extraction layer, but also to passivate interfacial defects. This enables a low‐cost fabrication process that is absent of vacuum equipment and high‐temperatures. Power conversion efficiencies of 21.4% on an device area of 4.8 cm² and 20% on an industrial size (245.71 cm²) wafer are obtained. Additionally, the high quality of this passivated carrier selective contact affords a fill factor of 82%, which is a record for silicon solar cells with dopant‐free contacts. The combination of low‐dimensional materials with an organic passivation is a new strategy to high performance photovoltaics.     

Enhanced lateral current transport via the front N+ diffused layer of n‐type high‐efficiency back‐junction back‐contact silicon solar cells

N‐type back‐contact back‐junction solar cells were processed with the use of industrially relevant structuring technologies such as screen‐printing and laser processing. Application of the low‐cost structuring technologies in the processing of the high‐efficiency back‐contact back‐junction silicon solar cells results in a drastic increase of the pitch on the rear cell side. The pitch in the range of millimetres leads to a significant increase of the lateral base resistance. The application of a phosphorus doped front surface field (FSF) significantly reduces the lateral base resistance losses. This additional function of the phosphorus doped FSF in reducing the lateral resistance losses was investigated experimentally and by two‐dimensional device simulations. Enhanced lateral majority carrier's current transport in the front n⁺ diffused layer is a function of the pitch and the base resistivity. Experimental data show that the application of a FSF reduces the total series resistance of the measured cells with 3.5 mm pitch by 0.1 Ω cm² for the 1 Ω cm base resistivity and 1.3 Ω cm² for the 8 Ω cm base resistivity. Two‐dimensional simulations of the electron current transport show that the electron current density in the front n⁺ diffused layer is around two orders of magnitude higher than in the base of the solar cell. The best efficiency of 21.3% was obtained for the solar cell with a 1 Ω cm specific base resistivity and a front surface field with sheet resistance of 148 Ω/sq. Copyright © 2008 John Wiley & Sons, Ltd.     

19% efficient n‐type Czochralski silicon solar cells with screen‐printed aluminium‐alloyed rear emitter

High and stable lifetimes recently reported for n‐type silicon materials are an important and promising prerequisite for innovative solar cells. To exploit the advantages of the excellent electrical properties of n‐type Si wafers for manufacturing simple and industrially feasible high‐efficiency solar cells, we focus on back junction n⁺np⁺ solar cells featuring an easy‐to‐fabricate full‐area screen‐printed aluminium‐alloyed rear p⁺ emitter. Independently confirmed record‐high efficiencies have been achieved on n‐type phosphorus‐doped Czochralski‐grown silicon material: 18·9% for laboratory‐type n⁺np⁺ solar cells (4 cm²) with shadow‐mask evaporated front contact grid and 17·0% for front and rear screen‐printed industrial‐type cells (100 cm²). The electrical cell parameters were found to be perfectly stable under illumination. Copyright © 2006 John Wiley & Sons, Ltd.     

Diffusion‐free high efficiency silicon solar cells

Traditional POCl₃ diffusion is performed in large diffusion furnaces heated to ~850 C and takes an hour long. This may be replaced by an implant and subsequent 90‐s rapid thermal annealing step (in a firing furnace) for the fabrication of p‐type passivated emitter rear contacted silicon solar cells. Implantation has long been deemed a technology too expensive for fabrication of silicon solar cells, but if coupled with innovative process flows as that which is mentioned in this paper, implantation has a fighting chance. An SiOx/SiN_y rear side passivated p‐type wafer is implanted at the front with phosphorus. The implantation creates an inactive amorphous layer and a region of silicon full of interstitials and vacancies. The front side is then passivated using a plasma‐enhanced chemical vapor deposited SiN_xH_y. The wafer is placed in a firing furnace to achieve dopant activation. The hydrogen‐rich silicon nitride releases hydrogen that is diffused into the Si, the defect rich amorphous front side is immediately passivated by the readily available hydrogen; all the while, the amorphous silicon recrystallizes and dopants become electrically active. It is shown in this paper that the combination of this particular process flow leads to an efficient Si solar cell. Cell results on 160‐µm thick, 148.25‐cm² Cz Si wafers with the use of the proposed traditional diffusion‐free process flow are up to 18.8% with a V_oc of 638 mV, J_sc of 38.5 mA/cm², and a fill factor of 76.6%. Copyright © 2012 John Wiley & Sons, Ltd.     

>16% thin‐film epitaxial silicon solar cells on 70‐cm2 area with 30‐µm active layer,porous silicon back reflector,and Cu‐based top‐contact metallization

We demonstrate the use of a copper‐based metallization scheme for the specific application of thin‐film epitaxial silicon wafer equivalent (EpiWE) solar cells with rear chemical vapor deposition emitter and conventional POCl₃ emitter. Thin‐film epitaxial silicon wafer equivalent cells are consisting of high‐quality epitaxial active layer of only 30 µm, beneath which a highly reflective porous silicon multilayer stack is embedded. By combining Cu‐plating metallization and narrow finger lines with an epitaxial cell architecture including the porous silicon reflector, a J_sc exceeding 32 mA/cm² was achieved. We report on reproducible cell efficiencies of >16% on >70‐cm² cells with rear epitaxial chemical vapor deposition emitters and Cu contacts. Copyright © 2011 John Wiley & Sons, Ltd.     

Experimental and simulated analysis of front versus all‐back‐contact silicon heterojunction solar cells: effect of interface and doped a‐Si:H layer defects

Front silicon heterojunction and interdigitated all‐back‐contact silicon heterojunction (IBC‐SHJ) solar cells have the potential for high efficiency and low cost because of their good surface passivation, heterojunction contacts, and low temperature fabrication processes. The performance of both heterojunction device structures depends on the interface between the crystalline silicon (c‐Si) and intrinsic amorphous silicon [(i)a‐Si:H] layer, and the defects in doped a‐Si:H emitter or base contact layers. In this paper, effective minority carrier lifetimes of c‐Si using symmetric passivation structures were measured and analyzed using an extended Shockley–Read–Hall formalism to determine the input interface parameters needed for a successful 2D simulation of fabricated baseline solar cells. Subsequently, the performance of front silicon heterojunction and IBC‐SHJ devices was simulated to determine the influence of defects at the (i)a‐Si:H/c‐Si interface and in the doped a‐Si:H layers. For the baseline device parameters, the difference between the two device configurations is caused by the emitter/base contact gap recombination and the back surface geometry of IBC‐SHJ solar cell. This work provides a guide to the optimization of both types of SHJ device performance, predicting an IBC‐SHJ solar cell efficiency of 25% for realistic material parameters. Copyright © 2013 John Wiley & Sons, Ltd.     

High efficiency arrays of polymer solar cells fabricated by spray‐coating in air

We present bulk heterojunction organic solar cells fabricated by spray‐casting both the PEDOT:PSS hole‐transport layer (HTL) and active PBDTTT‐EFT:PC₇₁BM layers in air. Devices were fabricated in a (6 × 6) array across a large‐area substrate (25 cm²) with each pixel having an active area of 6.45 mm². We show that the film uniformity and operational homogeneity of the devices are excellent. The champion device with spray cast active layer on spin cast PEDOT:PSS had an power conversion efficiency (PCE) of 8.75%, and the best device with spray cast active layer and PEDOT:PSS had a PCE of 8.06%. The impacts of air and light exposure of the active layer on device performance are investigated and found to be detrimental. Copyright © 2015 John Wiley & Sons, Ltd.     

Development of back‐junction back‐contact silicon solar cells based on industrial processes

We have presented simplified industrial processes to fabricate high performance back‐junction back‐contact (BJBC) silicon solar cells. Good optical surface structures (solar averaged reflectance 2.5%) and high implied open‐circuit voltage (0.695 V) have been realized in the BJBC cell precursors through wet chemical processing, co‐diffusion, P ion implantation and annealing oxidation, as well as laser patterning and plasma enhanced chemical vapour deposition passivation processes. We have achieved a certified high efficiency of close to 22% on BJBC silicon solar cells with the size of 4.04 cm² by using screen printing and co‐firing technologies. The manufacturing process flow further successfully yields efficiency of around 21% BJBC silicon solar cells with enlarged sizes of 6 × 6 cm². The present work has demonstrated that the commercialization of low‐cost and high‐efficiency BJBC solar cells is possible because we have used processes compatible with existing production lines. Copyright © 2017 John Wiley & Sons, Ltd.     

Large area tunnel oxide passivated rear contact n‐type Si solar cells with 21.2% efficiency

This paper reports on the implementation of carrier‐selective tunnel oxide passivated rear contact for high‐efficiency screen‐printed large area n‐type front junction crystalline Si solar cells. It is shown that the tunnel oxide grown in nitric acid at room temperature (25°C) and capped with n⁺ polysilicon layer provides excellent rear contact passivation with implied open‐circuit voltage iV_oc of 714 mV and saturation current density J_0b′ of 10.3 fA/cm² for the back surface field region. The durability of this passivation scheme is also investigated for a back‐end high temperature process. In combination with an ion‐implanted Al₂O₃‐passivated boron emitter and screen‐printed front metal grids, this passivated rear contact enabled 21.2% efficient front junction Si solar cells on 239 cm² commercial grade n‐type Czochralski wafers. Copyright © 2016 John Wiley & Sons, Ltd.     

Silicon solar cells based on all‐laser‐transferred contacts

Crystalline silicon solar cells based on all‐laser‐transferred contacts (ALTC) have been fabricated with both front and rear metallization achieved through laser induced forward transferring. Both the front and rear contacts were laser‐transferred from a glass slide coated with a metal layer to the silicon substrate already processed with emitter formation, surface passivation, and antireflection coating. Ohmic contacts were achieved after this laser transferring. The ALTC solar cells were fabricated on chemically textured p‐type Cz silicon wafers. An initial conversion efficiency of over 15% was achieved on a simple cell structure with full‐area emitter. Further improvements are expected with optimized laser transferring conditions, front grid pattern design, and surface passivation. The ALTC process demonstrates the advantage of laser processing in simplifying the solar cell fabrication by a one‐step metal transferring and firing process. Copyright © 2013 John Wiley & Sons, Ltd.     

Performance enhancement of multicrystalline silicon solar cells and modules using double‐layered SiNx:H antireflection coatings

Silicon nitride coating deposited by the plasma‐enhanced chemical vapor deposition method is the most widely used antireflection coating for crystalline silicon solar cells. In this work, we employed double‐layered silicon nitride coating consisting of a top layer with a lower refractive index and a bottom layer (contacting the silicon wafer) with a higher refractive index for multicrystalline silicon solar cells. An optimization procedure was presented for maximizing the photovoltaic performance of the encapsulated solar cells or modules. The dependence of their photovoltaic properties on the thickness of silicon nitride coatings was carefully analyzed. Desirable thicknesses of the individual silicon nitride layers for the double‐layered coatings were calculated. In order to get statistical conclusions, we fabricated a large number of multicrystalline silicon solar cells using the standard production line for both the double‐layered and single‐layered antireflection coating types. On the cell level, the double‐layered silicon nitride antireflection coating resulted in an increase of 0.21%, absolute for the average conversion efficiency, and 1.8 mV and 0.11 mA/cm² for the average open‐circuit voltage and short‐circuit current density, respectively. On the module level, the cell to module power transfer factor was analyzed, and it was demonstrated that the double‐layered silicon nitride antireflection coating provided a consistent enhancement in the photovoltaic performance for multicrystalline silicon solar cell modules than the single‐layered silicon nitride coating. Copyright © 2015 John Wiley & Sons, Ltd.     

A Solution‐Processed UV‐Sensitive Photodiode Produced Using a New Silicon Nanocrystal Ink

This article presents a simple and effective method of functionalizing hydrogen‐terminated silicon (Si) nanocrystals (NCs) to form a high‐quality colloidal Si NC ink with short ligands that allow charge transport in nanocrystal solid films. Si NCs fabricated by laser‐pyrolysis and acid etching are passivated with allyl disulfide via ultraviolet (UV)‐initiated hydrosilylation to form a stable colloidal Si NC ink. Then a Si NC‐based photodiode is directly fabricated in air from this ink. Only a solution‐processed poly(3,4‐ethylenedioxy‐thiophene):poly(styrene sulfonate) (PEDOT: PSS) electron blocking layer and top‐ and bottom‐contacts are needed along with the Si NC layer to construct the device. A Schottky‐junction at the interface between the Si NC absorber layer and aluminum (Al) back electrode drives charge separation in the device under illumination. The unpackaged Si NC‐based photodiode exhibites a peak photoresponse of 0.02 A W^?1 to UV light in air, within an order of magnitude of the response of commercially available gallium phosphide (GaP), gallium nitride (GaN), and silicon carbide (SiC) based photodetectors. This provides a new pathway to large‐area, low‐cost solution‐processed UV photodetectors on flexible substrates and demonstrates the potential of this new silicon nanocrystal ink for broader applications in solution‐processed optoelectronics.     

Recent progress in MIS solar cells

Metal–insulator–semiconductor (MIS)-type solar cells have an inherent cost advantage compared to p-n junction solar cells. First-generation MIS–inversion layer (MIS–IL) solar cells, already successfully produced in an industrial pilot line, are restricted to efficiencies of 15–16%. With the second-generation MIS–IL silicon solar cells, based on drastically improved surface passivation by plasma-enhanced chemical vapour-deposited silicon nitride, simple technology can be combined with very high efficiencies. The novel inversion layer emitters have the potential to outperform conventional phosphorus-diffused emitters of Si solar cells. A 17.1% efficiency could already be achieved with the novel point-contacted ‘truncated pyramid’ MIS–IL cell. A new surface-grooved line-contact MIS–IL device presently under development using unconventional processing steps applicable for large-scale fabrication is discussed. By the mechanical grooving technique, contact widths down to 2 μm can be achieved homogeneously over large wafer areas. Bifacial sensitivity is included in most of the MIS-type solar cells. For a bifacial 98 cm² Czochralski (Cz) Si MIS-contacted p-n junction solar cell with a random pyramid surface texture and Al as grid metal, efficiencies of 16.5% for front and 13.8% for rear side illumination are reported. A 19.5% efficiency has been obtained with a mechanically grooved MIS n⁺p solar cell. The MIS-type silicon solar cells are able to significantly lower the costs for solar electricity due to the simple technology and the potential for efficiencies well above 20%.©1997 John Wiley & Sons, Ltd.     

Back‐contacted back‐junction n‐type silicon solar cells featuring an insulating thin film for decoupling charge carrier collection and metallization geometry

In this study, back‐contacted back‐junction n‐type silicon solar cells featuring a large emitter coverage (point‐like base contacts), a small emitter coverage (point‐like base and emitter contacts), and interdigitated metal fingers have been fabricated and analyzed. For both solar cell designs, a significant reduction of electrical shading losses caused by an increased recombination in the non‐collecting base area on the rear side was obtained. Because the solar cell designs are characterized by an overlap of the B‐doped emitter and the P‐doped base with metal fingers of the other polarity, insulating thin films with excellent electrical insulation properties are required to prevent shunting in these overlapping regions. Thus, with insulating thin films, the geometry of the minority charge carrier collecting emitter diffusion and the geometry of the interdigitated metal fingers can be decoupled. In this regard, plasma‐enhanced chemical vapor deposited SiO₂ insulating thin films with various thicknesses and deposited at different temperatures have been investigated in more detail by metal‐insulator‐semiconductor structures. Furthermore, the influence of different metal layers on the insulation properties of the films has been analyzed. It has been found that by applying a SiO₂ insulating thin film with a thickness of more than 1000 nm and deposited at 350 °C to solar cells fabricated on 1 Ω cm and 10 Ω cm n‐type float‐zone grown silicon substrates, electrical shading losses could be reduced considerably, resulting in excellent short‐circuit current densities of more than 41 mA/cm² and conversion efficiencies of up to 23.0%. Copyright © 2012 John Wiley & Sons, Ltd.     

19%‐efficient and 43 µm‐thick crystalline Si solar cell from layer transfer using porous silicon

We present a both‐sides‐contacted thin‐film crystalline silicon (c‐Si) solar cell with a confirmed AM1.5 efficiency of 19.1% using the porous silicon layer transfer process. The aperture area of the cell is 3.98 cm². This is the highest efficiency ever reported for transferred Si cells. The efficiency improvement over the prior state of the art (16.9%) is achieved by implementing recent developments for Si wafer cells such as surface passivation with aluminum oxide and laser ablation for contacting. The cell has a short‐circuit current density of 37.8 mA cm⁻², an open‐circuit voltage of 650 mV, and a fill factor of 77.6%. Copyright © 2011 John Wiley & Sons, Ltd.     

High‐efficiency (19%) screen‐printed textured cells on low‐resistivity float‐zone silicon with high sheet‐resistance emitters

High‐efficiency 4 cm² screen‐printed (SP) textured cells were fabricated on 100 Ω/sq emitters using a rapid single‐step belt furnace firing process. The high contact quality resulted in a low series resistance of 0·79 Ωcm², high shunt resistance of 48 836 Ωcm², a low junction leakage current of 18·5 nA/cm² (n₂ = 2) yielding a high fill factor (FF) of 0·784 on 100 Ω/sq emitter. A low resistivity (0·6 Ωcm) FZ Si was used for the base to enhance the contribution of the high sheet‐resistance emitter without appreciably sacrificing the bulk lifetime. This resulted in a 19% efficient (confirmed at NREL) SP 4 cm² cell on textured FZ silicon with SP contacts and single‐layer antireflection coating. This is apparently higher in performance than any other previously reported cell using standard screen‐printing approaches (i.e., single‐step firing and grid metallization). Detailed cell characterization and device modeling were performed to extract all the important device parameters of this 19% SP Si cell and provide guidelines for achieving 20% SP Si cells. Copyright © 2005 John Wiley & Sons, Ltd.     

Nano‐cones on micro‐pyramids: modulated surface textures for maximal spectral response and high‐efficiency solar cells

The front‐side reflection represents a significant optical loss in solar cells. One way to minimize this optical loss is to nano‐texture the front surface. Although nano‐textured surfaces have shown a broad‐band anti‐reflective effect, their light scattering and surface passivation properties are found to be generally worse than those of standard micro‐textured surfaces. To overcome these setbacks in crystalline silicon solar cells, advanced texturing and passivation approaches are here presented. In the first approach, we propose a modulated surface texture by superimposing nano‐cones on micro‐pyramidal surface texture. This advanced texture applied at the front side of crystalline silicon wafers completely suppresses the reflection in a broad wavelength range from 300 nm up to 1000 nm and efficiently scatters light up to 1200 nm. In the second approach, we show a method to minimize recombination at nano‐textured surfaces by using defect‐removal etching followed by dry thermal oxidation. These two approaches are applied here in an interdigitated back‐contacted crystalline silicon solar cell and result in decoupling of the interplay between the mechanisms behind short‐circuit current density and open‐circuit voltage. The device exhibits a conversion efficiency equal to 19.8%, record external quantum efficiency (78%) at short wavelengths (300 nm), and electrical performance equal to the performance of the reference interdigitated back‐contacted device based on front‐side micro‐pyramids. Copyright © 2015 John Wiley & Sons, Ltd.     

Two‐dimensional simulation of thin‐film silicon solar cells with innovative device structures

We investigate the optical and electrical properties of thin‐film silicon solar cells by means of numerical simulations. The optical design under investigation is the encapsulated‐V texture, which is capable of absorbing sunlight corresponding to a maximum short‐circuit current density of 35 mA cm⁻². Because the layer thickness can be restricted to only 4 μm, the encapsulated‐V structure also provides a good collection efficiency for photogenerated charge carriers. The results for our simulations suggest that practical efficiencies above 12% can be expected for Si material with a minority carrier lifetime as low as 10 ns. Increased lifetimes of 100 ns allow for about 14% efficiency. The benefit of multiplejunctions within the device structure strongly depends on surface recombination. The efficiency of a single‐junction cell can be improved by more the 3% absolute with a multi‐junction device if the surface combination velocity is as high as 10⁵ cm s⁻¹. For moderate surface recombination, the gain is only 1%. Copyright © 1999 John Wiley & Sons, Ltd.     

Electrodeposited zinc grid as low‐cost solar cell front contact

This paper presents an innovative low‐cost electrodeposition process to grow metallic zinc grids as a front contact for Cu(In,Ga)(Se,S)₂ (CIGS) and silicon heterojunction solar cells as an alternative to complex and expensive monolithic integration and silver screen printing techniques respectively. Morphological and electrical properties of the grid have been investigated and compared with a reference evaporated one. High quality and conformal zinc grids have been deposited showing very high growth rates up to 3.3 µm min⁻¹. Zinc grid is successfully deposited as front electrode for CIGS solar cells that are fabricated by a variety of deposition processes. Efficiency (16.3%) is achieved without antireflection coating on a 0.5 cm² co‐evaporated absorber and 14.8% on an electrodeposited one. Using electrodeposition for the growth of the doped ZnO film as well, a 14.1% efficiency is demonstrated on an all‐wet solar cell only composed of layers deposited by atmospheric methods—from absorber to metallic grid. The process is then applied to a 4.2 cm² cell as a first step toward large‐scale application. Finally, a zinc grid is deposited on a 0.5 cm² silicon heterojunction showing a promising 17% efficiency. Copyright © 2016 John Wiley & Sons, Ltd.     

Photocurrent enhancement in thin‐film silicon solar cells by combination of anti‐reflective sub‐wavelength structures and light‐trapping textures

Dielectric films with anti‐reflective sub‐wavelength structures are applied to thin‐film silicon solar cells to improve the light incoupling at the front surface. It is verified that modification of the refractive index of the incident medium using dielectric films with sub‐wavelength structures is beneficial to reduce the average reflectivity of Si solar cells with an anti‐reflective coating based on optical interference. It is also shown that the sub‐wavelength structure must be combined with a proper light‐trapping texture to enhance the absorption within thin‐film silicon solar cells. The effectiveness of dielectric films with sub‐wavelength structures is demonstrated by an increase of the short‐circuit current density of a microcrystalline silicon cell from 29.1 to 30.4 mA/cm² in a designated area of 1 cm². The optical interplay between the dielectric films and the light‐trapping textures is also discussed. Copyright © 2015 John Wiley & Sons, Ltd.