导电纤维填充型导电塑料在电磁屏蔽中的应用研究进展

简要阐述了电磁屏蔽的途径和机理,并对导电纤维填充型导电塑料的研究进展作了简单的介绍。     

导电电磁屏蔽塑料研究新进展

介绍了电磁屏蔽的基本理论,重点综述了3类主要的导电塑料即:表层导电型复合塑料、填充型复合塑料和本征导电高分子材料的研究应用现状,介绍了各类导电高分子电磁屏蔽材料的特点,并对其发展趋势做了展望。     

导电纤维在屏蔽塑料中应用的研究进展

导电屏蔽塑料是防止静电危害、电磁波污染的一种有广泛前景的功能高分子材料。本文综述了碳纤维、碳纳米管、不锈钢纤维、钢纤维和各种镀金属纤维填充导电屏蔽塑料的国内外研究进展。     

掺杂型电磁屏蔽导电涂料研究进展

电磁屏蔽导电涂料是应用广泛的防电磁辐射材料之一,本文概述了电磁屏蔽导电涂料的屏蔽原理及类型,分析了掺杂型电磁屏蔽导电涂料国内外研究现状以及存在的主要问题,对电磁屏蔽导电涂料的发展趋势及研究开发的重点进行了展望.     

电磁屏蔽与导电胶粘剂研制

介绍了导电胶粘剂的导电机理,讨论了导电载体(填料)的类型、形状以及粘料(树脂)等对导电胶粘剂性能的影响。根据电磁屏蔽产品的性能要求和成型工艺条件,研制出一种能满足电磁屏蔽要求的环氧-银粉型导电胶粘剂。     

导电纤维对树脂基复合材料电磁屏蔽效能的影响

本文采用几种不同的导电纤维，通过改变它们的种类、配比和含量，来研究不同的纤维含量、不同的纤维搭配对树脂基复合材料电磁屏蔽效能的影响。     

导电高分子复合材料的电磁屏蔽效能分析

本文分析了电磁屏蔽的基本原理,着重探讨了导电填料、高分子基体以及复合工艺等因素对导电高分子复合材料电磁屏蔽效能的影响。     

导电纤维对填充型复合导电塑料导电性能的影响

聚苯胺（PANI）是最重要的导电聚合物之一,近年来,其复合材料的研究和应用越来越受到重视。导电填料含量在渗滤阈值时,导电填料含量再稍微增加,导电粒子就互相接近而形成导电网络,电子在导电网络中传递而形成电流。本文介绍了导电纤维对填充型复合导电塑料导电性能的影响。     

复合型导电塑料中导电填料的开发现状与发展

综述了复合型导电塑料中导电填料的种类及其特性,介绍了导电填料的选择原则,并探讨了导电填料的发展方向。     

电磁屏蔽涂料用复合型导电填料研究进展

回顾了电磁屏蔽涂料用复合导电填料的现状和应用,并对比了各种类型复合导电填料的优缺点,重点阐述了复合碳纤维用作导电填料的优缺点及其应用。针对目前该类型填料高反射低吸收、分散性和亲和性等方面的不足,提出了解决方案。最后分析了复合型导电填料设计的影响因素。     

Facile preparation of light-weight biodegradable and electrically conductive polymer based nanocomposites for superior electromagnetic interference shielding effectiveness

Harmful electromagnetic radiations that are generated from different electronic devices could be absorbed by a light weight and mechanically flexible good electromagnetic interference (EMI) shielding polymer nanocomposite. On the other hand, different electronic wastes (“e-wastes”) which are generally polymer building materials generated from wastes of dysfunctional electronic devices are not naturally biodegradable. Our recent effort has been employed to produce bio-degradable EMI shielding polymer nanocomposite. For that purpose, we had prepared a 50:50 ratio polylactic acid/thermoplastic polyurethane polymer nanocomposite by mixing the conducting carbon black with the blend following the facile and industrially feasible solution mixing method. Morphological characterizations by scanning electron microscopy and transmission electron microscopy analysis revealed the co-continuous morphology of the neat blend as well as polymer nanocomposites with the preferential distribution of conductive filler on a particular polymer phase. The polymer nanocomposites gave good mechanically with improved thermal properties. We got EMI shielding effectiveness around −27 dB with a low percolation threshold at around 30 wt% filler loading in the polymer nanocomposite at the X-band frequency domain (8.2–12.4 GHz). Later we had studied the biodegradability of the PLA/TPU along with their composites (T_XP_XC_X) by employing the respirometry method and got a satisfactory result to ensure their biodegradability.     

碳纳米管填充聚合物基电磁屏蔽复合材料的研究进展

对碳纳米管填充聚合物基电磁屏蔽复合材料的研究进展进行了综述。在阐述研究电磁屏蔽材料必要性的基础上,介绍了复合材料的电磁屏蔽机理,重点论述了碳纳米管填充量、长径比及管径、屏蔽体的厚度、复合材料的加工方式等对复合材料电磁屏蔽性能的影响。最后对碳纳米管填充聚合物基复合电磁屏蔽材料的研究进行了展望,指出低成本填料与碳纳米管协同作用、可提高碳纳米管分散性的制备工艺的研究以及复合材料电磁屏蔽机理的研究等为未来的研究方向。     

Improving the electrical and electromagnetic shielding properties of conductive silicon rubber filled with Ni-coated carbon fibre by magnetic field

In this work, the effects of magnetic field induction on electrical and electromagnetic shielding properties of conductive silicon rubbers (CSRs) filled with Ni-coated carbon fibres (Ni/CFs) have been investigated. When the magnetic field intensity is above the threshold value of 0.10?T during the vulcanisation, it is beneficial to their electrical property that the volume resistivity decreases from 48.7?Ω·cm to 1.57?Ω·cm, owing to the orientation alignment of Ni/CFs in CSRs filled with Ni/CFs (40?phr). Moreover, with the aids of magnetic field induction, the prepared CSRs with lower amount of Ni-CF filler can receive better electromagnetic shielding of 65?dB in 500?MHz–3?GHz, which reduce cost effectively. This vulcanisation process shows promises for various applications in power transmission and transformation industries.     

导电性塑料的研究进展

本文介绍了导电性塑料的发现、分类、品种、应用、研究重点和发展前景。对导电性高聚物的一般合成方法如链聚合法和分步聚合法、特殊的合成方法如光化学聚合进行了总结，并对共轭高聚物的导电机理作了简单的评述。     

641125电磁屏蔽复合导电无酸PSA胶带的研制

以无酸丙烯酸酯系压敏胶为导电胶基体,苯二亚甲基二异氰酸酯（XDI）为交联剂,镍／银混合粉体为导电填料,制备了铜箔导电胶带。讨论了导电粒子的种类及其添加量、交联剂的用量、老化存放时间等对导电胶带的粘接性能、导电性能及电磁屏蔽性能的影响。结果表明,当镍银混合粉添加15％,交联剂用量25％,干胶厚度45μm时,制备的胶带综合性能良好。其粘接强度大于19N／25mm,体积电阻率为6×10^-3Ω·cm,电磁屏蔽效能大于90dB（频率从30-1500MHz）,且耐高温性能稳定。     

Electrical conductivity and electromagnetic interference shielding effectiveness of polyaniline–ethylene vinyl acetate composites

Electrical conductivity and electromagnetic interference (EMI) shielding effectiveness at microwave (200–2000 MHz) and X‐band (8–12 GHz) frequency range of polyaniline (PAni) composites were studied. It has been observed that EMI shielding of conductive polyaniline (PAni)–ethylene vinyl acetate composites increases with the increase in the loading levels of the conductive polymer doped with dodecylbenzene sulfonic acid. The result indicates that the composites having higher PAni loading (>23%) can be used for EMI shielding materials and those with lower PAni loading can be used for the dissipation of electrostatic charge. Copyright © 2004 Society of Chemical Industry     

镀银铝粉填充型电磁屏蔽硅橡胶的制备与性能

研究了镀银铝粉填充量和环境试验对电磁屏蔽硅橡胶电学和力学性能的影响。结果发现,镀银铝粉填充量为210份(质量)是电磁屏蔽硅橡胶的逾渗阈值;最佳的镀银铝粉填充量为230份(质量),此时电磁屏蔽硅橡胶的体积电阻率为6.75×10-3Ω.cm,拉伸强度为2.3MPa,扯断伸长率为571%,邵尔A硬度为65;镀银铝粉填充型电磁屏蔽硅橡胶具有较好的耐高低温和热空气老化性能,而耐盐雾性能较差。     

MXene fillers and silver flakes filled epoxy resin for new hybrid conductive adhesives

The addition of V₂CT_x two-dimensional materials as auxiliary fillers in conductive adhesives can increase the contact area between conductive particles inside the matrix effectively reducing the resistivity of epoxy resin conductive adhesives. The V₂CT_x/Ag/rGO/MWCNTs fillers inside the epoxy resin will connect more Ag-clad Cu particles to form a conductive pathway, but its excessive content will be aggregated inside and thus increase the resistivity of the conductive adhesive. The volume resistivity of ECAs increases from 4.4 × 10⁻⁶ Ω m to 1.15 × 10⁻⁵ Ω m when the V₂CT_x/Ag/rGO/MWCNTs content of 0.1% increases to 0.34%. The Ag-clad Cu particles are interconnected inside the epoxy resin to form an electron transfer network. Inside the epoxy resin substrate Ag-clad Cu particles and V₂CT_x/Ag/rGO/MWCNTs interconnects to form a larger conductive network, so that the conductive adhesive shows good conductive properties.