导电电磁屏蔽塑料研究新进展

介绍了电磁屏蔽的基本理论,重点综述了3类主要的导电塑料即:表层导电型复合塑料、填充型复合塑料和本征导电高分子材料的研究应用现状,介绍了各类导电高分子电磁屏蔽材料的特点,并对其发展趋势做了展望。     

导电纤维填充型导电塑料在电磁屏蔽中的应用研究进展

简要阐述了电磁屏蔽的途径和机理,并对导电纤维填充型导电塑料的研究进展作了简单的介绍。     

导电纤维在屏蔽塑料中应用的研究进展

导电屏蔽塑料是防止静电危害、电磁波污染的一种有广泛前景的功能高分子材料。本文综述了碳纤维、碳纳米管、不锈钢纤维、钢纤维和各种镀金属纤维填充导电屏蔽塑料的国内外研究进展。     

导电塑料的国内外发展概况

导电塑料可用作防爆产品的外壳及结构件,在电子领域中可起到屏蔽电磁波、防除静电的作用。本文介绍了抗静电剂填充型、碳系填充型和金属填充型导电塑料的国内外发展概况,并指出高分子导电材料目前存在的问题及今后的研究方向。     

地雷壳体电磁屏蔽吸收材料应用研究

采用不锈钢纤维(SSF)填充丙烯腈-丁二烯-苯乙烯塑料制备导电工程塑料,并测试材料的物理和电磁屏蔽吸收性能。结果表明,SSF质量分数为15%时,能较好地兼顾材料的物理性能与加工难度,且在强电磁源主要频段有20 dB以上的屏蔽效能。低频磁场屏蔽效能测试结果表明,材料对低频磁场影响甚微,不影响地雷磁引信正常工作。该材料有助于提高磁引信地雷在高功率电磁环境下的生存能力。     

电磁屏蔽塑料的研究进展

介绍了电磁屏蔽的原理,综述了电磁屏蔽塑料的种类及研究应用现状,重点介绍了填充型复合塑料的性能及加工工艺,并对电磁屏蔽塑料的研究方向和发展趋势进行了展望.     

屏蔽电磁波干扰塑料及其开发动向

本文在分析电磁波干扰及其屏蔽作用原理的基础上，重点讨论了表层导电型屏蔽塑料和填充复合型屏蔽塑料的种类、特性、应用以及最新发展动向，为我国屏蔽电磁波干扰塑料的研究和开发提供参考     

金属化碳纤维对PC/ABS电磁屏蔽塑料性能的影响

使用自行研发的碳纤维连续电镀镍生产设备生产镀镍碳纤维(NCF),并用不同用量NCF填充聚碳酸酯/丙烯腈-丁二烯-苯乙烯塑料(PC/ABS)合金基材,采用包覆工艺制备PC/ABS电磁屏蔽塑料。研究了NCF用量对电磁屏蔽塑料力学性能、热性能、电性能和电磁屏蔽效能的影响。结果表明,NCF能够在PC/ABS中均匀分散,且两者很好地结合在一起,形成完善的导电网络结构;NCF可以提高电磁屏蔽塑料的力学性能、热性能、导电性能;在NCF质量分数为18%时,电磁屏蔽塑料的综合性能最优,拉伸强度为108.18 MPa,拉伸弹性模量为15 GPa,缺口冲击强度为6.82 kJ/m~2,热变形温度为120℃,体积电阻率为7.10×10~(–3) Ω·cm,屏蔽效能可达到52～72 dB。     

黄铜纤维／PVC复合导电塑料研制

本文概述了用黄铜纤维填充聚氯乙烯树脂制造导电塑料的方法,并对影响其导电性的主要因素进行了讨论。指出填充导电材料的形态因子、表面化学处理、纤维含量、加工工艺条件是影响聚氯乙烯复合物导电塑料导电性的主要因素。并对影响其机械性能的纤维含量、纤维长径比和加工助剂等因素进行了讨论。     

电磁屏蔽橡胶复合材料研究进展

介绍了电磁屏蔽橡胶的屏蔽原理。综述了金属填充橡胶、碳材料填充橡胶、金属/非金属复合填料填充橡胶、本征导电聚合物填充橡胶、碳材料/四氧化三铁复合填料填充橡胶、新型纳米导电填料填充橡胶六类电磁屏蔽复合材料的研究进展以及优缺点。总结了电磁屏蔽橡胶的制备方法与特点。对电磁屏蔽橡胶的应用状况进行了简要介绍,并展望了其发展方向。     

屏蔽电磁波干扰聚合物材料的研究进展

本文研究屏蔽电磁波干扰的方法及其屏蔽效果，着重讨论了导电涂料和导电塑料等屏蔽电磁波干扰聚合物材料的种类、特性、应用和发展。     

电磁屏蔽玻璃研究与发展现状

随着现代科技高速发展,各类通信设备与电子仪器所产生和面临的电磁污染与电磁干扰状况日益复杂,因而电磁屏蔽材料的研究受到了广泛关注。而在军事、航空航天、医疗、精密仪器等诸多领域同时存在着实现光学透明和电磁屏蔽功能的应用需求,因此研发兼具高透过率和高电磁屏蔽效能的电磁屏蔽玻璃具有重要意义。本文对近年来国内外关于电磁屏蔽玻璃的最新研究进展进行了综合评述,并从结构角度将电磁屏蔽玻璃分为膜层类结构、网栅类结构和复合结构三类,对各种结构及材料的优势与缺陷进行了总结和分析,最后对未来该领域的研究方向和发展前景进行了展望。     

导电屏蔽塑料技术研究进展

论述了电磁波干扰(EMI)屏蔽塑料的应用,讨论评价了EMI屏蔽的原理和EMI屏蔽塑料的制备方法,强调了填充型屏蔽塑料的特点以及制备高导电性屏蔽塑料的技术。     

聚丙烯充填黄铜纤维导电性复合材料屏蔽性能的研究

本文就聚丙烯（ＰＰ）充填黄铜纤维导电性复合材料的屏蔽性能及黄铜纤维充填率与体积电阻率变化的关系进行了研究,并对电磁波屏蔽效果进行了测定。证明了塑料导电性复合材料的电磁波屏蔽效果是不能套用金属电磁波屏蔽理论的。两种黄铜纤维中,长径比愈大,电磁波屏蔽效果愈好。充填率体积分数为６％以上,复合材料具有导电性。充填率体积分数为８％以上复合材料可用于电磁波屏蔽。     

Strong and Flexible Carbon Fiber Fabric Reinforced Thermoplastic Polyurethane Composites for High‐Performance EMI Shielding Applications

Electromagnetic shielding materials play a significant role in solving the increasing environmental problem of electromagnetic pollutions. The commonly used metal‐based electromagnetic materials suffer from high density, poor corrosion resistance, and high processing cost. Polymer composites exhibit unique combined properties of lightweight, good shock absorption, and corrosion resistance. In this study, a novel high angle sensitive composite is fabricated by combining carbon fiber (CF) fabric with thermoplastic polyurethane elastomer (TPU). The effect of stacking angle of CF fabric on EMI shielding performance of composite is studied. When the stacking angle of CF fabric changed, the electromagnetic interference (EMI) shielding effectiveness (SE) of CF fabric/TPU composite can reach a maximum of 73 dB, and the tensile strength can reach 168 MPa. In addition, the composite has anisotropic conductivity, which is conductive along the plane direction and nonconductive along the thickness direction. Moreover, the CF fabric/TPU composite manifests exceptional EMI‐SE/density/thickness value of 383 dB cm² g^?1, which is higher than most of current EMI shielding composites reported in literature. In summary, CF fabric/TPU composite is an excellent EMI shielding material that is lightweight, highly flexible, and mechanically robust, which can be applied to the field of aerospace and some intelligent electronic devices.     

电磁屏蔽材料的发展现状及未来发展趋势

介绍了电磁屏蔽原理与导电聚合物复合材料（CPCs）特点,论述了不同应用场合下CPCs的物理特性（柔性、硬质、涂覆）,对近年来国内外电磁屏蔽材料中导电填料种类（金属、碳基、金属碳化物氮化物MXene）及其制备工艺进行了详细汇总分析,并对电磁屏蔽材料未来发展方向进行了展望。     

Conductive polymer composite materials and their utility in electromagnetic shielding applications

Commercial electronic devices require shielding solutions that ensure electromagnetic compatibility (EMC) while accounting for effects of specific enclosure structural features such as seams, vents, and port dimensions. In practice, suitable EMC materials combine with the device operating characteristics to determine an overall shielding response. To optimally couple plastic design practices with EMC requirements, both polymer materials science and electrical engineering concepts, must be considered. Use of extrinsically conductive polymer (ECP) formulations for electronic applications has advantages in that they can be directly molded to a desired shape and serve to provide the necessary shielding while also meeting mechanical integrity requirements. Shielding and mechanical performance can be varied via filler loading or altered through wall thickness changes to satisfy demands associated with a particular device. Injection‐moldable ECP polycarbonate‐based formulations can attain average shielding effectiveness (SE) levels of ～50–60 dB through 2 GHz at 2‐mm thickness as measured using ASTM D 4935 procedures. These values vary with thickness, and SE improvements of ～10–20 dB are observed when increasing from 1 to 2 mm. Additionally, resultant mechanical properties of shielding composites are strong functions of overall fiber content. These interrelated material and shielding characteristics, which form the basis for filled conductive polymer use within practical enclosure shielding designs, are described. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

电子电气行业用塑料的选材

介绍电子电气行业用塑料的选材原则,各类材料如电绝缘、导电、电磁波屏蔽、磁性材料的性能、应用、发展趋势,以及材料的成型加工等,并对实际选材作举例说明。