Electrical and photoelectric properties of <Emphasis Type="Italic">n</Emphasis>-TiN/<Emphasis Type="Italic">p</Emphasis>-Hg<Subscript>3</Subscript>In<Subscript>2</Subscript>Te<Subscript>6</Subscript> heterostructures

n-TiN/p-Hg₃In₂Te₆ heterostructures are fabricated by depositing a thin n-type titanium nitride (TiN) film onto prepared p-type Hg₃In₂Te₆ plates using reactive magnetron sputtering. Their electrical and photoelectric properties are studied. Dominant charge-transport mechanisms under forward bias are analyzed within tunneling-recombination and tunneling models. The fabricated n-TiN/p-Hg₃In₂Te₆ structures have the following photoelectric parameters at an illumination intensity of 80 mW/cm²: the open-circuit voltage is V_OC = 0.52 V, the short-circuit current is I_SC = 0.265 mA/cm², and the fill factor is FF = 0.39.     

Graphite/<Emphasis Type="Italic">p</Emphasis>-SiC Schottky Diodes Prepared by Transferring Drawn Graphite Films onto SiC

Graphite/p-SiC Schottky diodes are fabricated using the recently suggested technique of transferring drawn graphite films onto p-SiC single-crystal substrates. The current–voltage and capacitance–voltage characteristics are measured at different temperatures and at different frequencies of a small-signal AC signal, respectively. The temperature dependences of the potential-barrier height and of the series resistance of the graphite/p-SiC junctions are measured and analyzed. The dominant mechanisms of the charge–carrier transport through the diodes are determined. It is shown that the dominant mechanisms of the transport of charge carriers through the graphite/p-Si Schottky diodes at a forward bias are multi-step tunneling recombination and tunneling described by the Newman formula (at high bias voltages). At reverse biases, the dominant mechanisms of charge transport are the Frenkel–Poole emission and tunneling. It is shown that the graphite/p-SiC Schottky diodes can be used as detectors of ultraviolet radiation since they have the open-circuit voltage V_oc = 1.84 V and the short-circuit current density I_sc = 2.9 mA/cm² under illumination from a DRL 250-3 mercury–quartz lamp located 3 cm from the sample.     

CdHgTe heterostructures for new-generation IR photodetectors operating at elevated temperatures

The parameters of multilayer Cd_xHg_1–xTe heterostructures for photodetectors operating at wavelengths of up to 5 μm, grown by molecular-beam epitaxy (MBE) on silicon substrates, are studied. The passivating properties of thin CdTe layers on the surface of these structures are analyzed by measuring the C–V characteristics. The temperature dependences of the minority carrier lifetime in the photoabsorption layer after growth and thermal annealing are investigated. Samples of p ⁺–n-type photodiodes are fabricated by the implantation of arsenic ions into n-type layers, doped with In to a concentration of (1–5) × 10¹⁵ cm^–3. The temperature dependences of the reverse currents are measured at several bias voltages; these currents turn out to be almost two orders of magnitude lower than those for n ⁺–p-type diodes.     

Effect of Dislocation-related Deep Levels in Heteroepitaxial InGaAs/GaAs and GaAsSb/GaAs <Emphasis Type="Italic">p</Emphasis>–<Emphasis Type="Italic">i</Emphasis>–<Emphasis Type="Italic">n</Emphasis> Structures on the Relaxation time of Nonequilibrium Carriers

The results of an experimental study of the capacitance–voltage (C–V) characteristics and deep-level transient spectroscopy (DLTS) spectra of p⁺–p⁰–i–n⁰ homostructures based on undoped dislocationfree GaAs layers and InGaAs/GaAs and GaAsSb/GaAs heterostructures with homogeneous networks of misfit dislocations, all grown by liquid-phase epitaxy (LPE), are presented. Deep-level acceptor defects identified as HL2 and HL5 are found in the epitaxial p⁰ and n⁰ layers of the GaAs-based structure. The electron and hole dislocation-related deep levels, designated as, respectively, ED1 and HD3, are detected in InGaAs/GaAs and GaAsSb/GaAs heterostructures. The following hole trap parameters: thermal activation energies (E _t ), capture cross sections (σ _p ), and concentrations (N _t ) are calculated from the Arrhenius dependences to be E _t = 845 meV, σ _p = 1.33 × 10^–12 cm², N _t = 3.80 × 10¹⁴ cm^–3 for InGaAs/GaAs and E _t = 848 meV, σ _p = 2.73 × 10^–12 cm², N _t = 2.40 × 10¹⁴ cm^–3 for GaAsSb/GaAs heterostructures. The concentration relaxation times of nonequilibrium carriers are estimated for the case in which dislocation-related deep acceptor traps are involved in this process. These are 2 × 10^–10 s and 1.5 × 10^–10 s for, respectively, the InGaAs/GaAs and GaAsSb/GaAs heterostructures and 1.6 × 10^–6 s for the GaAs homostructures.     

Effect of Temperature Cycling on Conduction Mechanisms in CdTe Thin Films

CdTe thin films of 500 Å thickness prepared by thermal evaporation technique were analyzed for leakage current and conduction mechanisms. Metal–insulator–metal (MIM) capacitors were fabricated using these films as a dielectric. These films have many possible applications, such as passivation for infrared diodes that operate at low temperatures (80 K). Direct-current (DC) current–voltage (I–V) and capacitance–voltage (C–V) measurements were performed on these films. Furthermore, the films were subjected to thermal cycling from 300 K to 80 K and back to 300 K. Typical minimum leakage currents near zero bias at room temperature varied between 0.9 nA and 0.1 μA, while low-temperature leakage currents were in the range of 9.5 pA to 0.5 nA, corresponding to resistivity values on the order of 10⁸ Ω-cm and 10¹⁰ Ω-cm, respectively. Well-known conduction mechanisms from the literature were utilized for fitting of measured I–V data. Our analysis indicates that the conduction mechanism in general is Ohmic for low fields <5 × 10⁴ V cm^?1, while the conduction mechanism for fields >6 × 10⁴ V cm^?1 is modified Poole–Frenkel (MPF) and Fowler–Nordheim (FN) tunneling at room temperature. At 80 K, Schottky-type conduction dominates. A significant observation is that the film did not show any appreciable degradation in leakage current characteristics due to the thermal cycling.     

Electrical and Photoelectric Properties of the TiN/<Emphasis Type="Italic">p</Emphasis>-InSe Heterojunction

The conditions for fabricating photosensitive TiN/p-InSe heterojunctions by the reactive-magnetron sputtering of thin titanium-nitride films onto freshly cleaved p-InSe single-crystal substrates is investigated. The presence of a tunnel-transparent high-resistivity In₂Se₃ layer at the heterojunction is revealed from analysis of the I–V characteristics, and the effect of this layer on the electrical properties and photosensitivity spectra of the heterostructures is analyzed. The dominant current transport mechanisms through the TiN/p-InSe energy barrier under forward and reverse bias are determined.     

<Emphasis Type="Italic">C-V</Emphasis> and <Emphasis Type="Italic">I-V</Emphasis> characteristics of ultrathin-oxide MOS structures: Identification and analysis

For an NMOS structure with 3.7-nm-thick oxide, dynamic I-V characteristics are digitally measured by applying an upward and a downward gate-voltage ramp. An averaging procedure is employed to deduce the tunneling (active) current component and the quasi-static C-V characteristic (CVC). Analyzing the depletion segment of the CVC provides reliable values of the semiconductor doping level, the oxide capacitance and thickness, and the sign and density of oxide-fixed charge, as well as estimates of the dopant concentration in the poly-Si region. These data are used to identify the Ψ_s(V _g), V _i(V _g), and I _t(V _i) characteristics, where Ψ_s is the n-Si surface potential, V _i is the voltage drop across the oxide, V _g is the gate voltage, and I _t is the tunneling current; the gate-voltage range explored extends to prebreakdown fields (～13 MV cm^?1). The results are obtained without recourse to fitting parameters and without making any assumptions as to the energy spectrum of electrons tunneling from the n-Si deep-accumulation region through the oxide. It is believed that experimental I _t-V _i and Ψ_s-V _g characteristics will provide a basis for developing a theory of tunneling covering not only the degeneracy and size quantization of the electron gas in the semiconductor but also the nonclassical profile of the potential barrier to electron tunneling associated with the oxide-fixed charge.     

Conductivity of Ga<Subscript>2</Subscript>O<Subscript>3</Subscript>–GaAs Heterojunctions

The effect of annealing in argon at temperatures of T_an = 700–900°C on the I–V characteristics of metal–Ga₂O₃–GaAs structures is investigated. Samples are prepared by the thermal deposition of Ga₂O₃ powder onto GaAs wafers with a donor concentration of N _d = 2 × 10¹⁶ cm^–3. To measure theI–V characteristics, V/Ni metal electrodes are deposited: the upper electrode (gate) is formed on the Ga₂O₃ film through masks with an area of S _k = 1.04 × 10^–2 cm² and the lower electrode in the form of a continuous metallic film is deposited onto GaAs. After annealing in argon at T_an ≥ 700°C, the Ga₂O₃-n-GaAs structures acquire the properties of isotype n-heterojunctions. It is demonstrated that the conductivity of the structures at positive gate potentials is determined by the thermionic emission from GaAs to Ga₂O₃. Under negative biases, current growth with an increase in the voltage and temperature is caused by field-assisted thermal emission in gallium arsenide. In the range of high electric fields, electron phonon-assisted tunneling through the top of the potential barrier is dominant. High-temperature annealing does not change the electron density in the oxide film, but affects the energy density of surface states at the GaAs–Ga₂O₃ interface.     

Mechanism of dislocation-governed charge transport in schottky diodes based on gallium nitride

A mechanism of charge transport in Au-TiB _x -n-GaN Schottky diodes with a space charge region considerably exceeding the de Broglie wavelength in GaN is studied. Analysis of temperature dependences of current-voltage (I–V) characteristics of forward-biased Schottky barriers showed that, in the temperature range 80–380 K, the charge transport is performed by tunneling along dislocations intersecting the space charge region. Estimation of dislocation density ρ by the I–V characteristics, in accordance with a model of tunneling along the dislocation line, gives the value ρ ≈ 1.7 × 10⁷ cm^?2, which is close in magnitude to the dislocation density measured by X-ray diffractometry.     

Tunneling Current in Oppositely Connected Schottky Diodes Formed by Contacts between Degenerate <Emphasis Type="Italic">n</Emphasis>-GaN and a Metal

The nonlinear behavior of the I–V characteristics of symmetric contacts between a metal and degenerate n-GaN, which form oppositely connected Schottky diodes, is investigated at free-carrier densities from 1.5 × 10¹⁹ to 2.0 × 10²⁰ cm^–3 in GaN. It is demonstrated that, at an electron density of 2.0 × 10²⁰ cm^–3, the conductivity between metal (chromium) and GaN is implemented via electron tunneling and the resistivity of the Cr–GaN contact is 0.05 Ω mm. A method for determining the parameters of potential barriers from the I–V characteristics of symmetric opposite contacts is developed. The effect of pronounced nonuniformity of the current density and voltage distributions over the contact area at low contact resistivity is taken into account. The potential-barrier height for Cr–n⁺-GaN contacts is found to be 0.47 ± 0.04 eV.     

<Emphasis Type="Italic">p</Emphasis><Superscript>+</Superscript>-Si-<Emphasis Type="Italic">n</Emphasis>-CdF<Subscript>2</Subscript> heterojunctions

Boron diffusion and the vapor-phase deposition of silicon layers are used to prepare ultrashallow p⁺-n junctions and p⁺-Si-n-CdF₂ heterostructures on an n-CdF₂ crystal surface. Forward portions of the I–V characteristics of the p⁺-n junctions and p⁺-Si-n-CdF₂ heterojunctions reveal the CdF₂ band gap (7.8 eV), as well as allow the identification of the valence-band structure of cadmium fluoride crystals. Under conditions in which forward bias is applied to the p⁺-Si-n-CdF₂ heterojunctions, electroluminescence spectra are measured for the first time in the visible spectral region.     

Power switching transistors based on gallium nitride epitaxial heterostructures

The results of the development of power switching transistors based on epitaxial gallium nitride heterostructures to create an energy-efficient conversion technique are presented. The developed powerful GaN transistor operates in enrichment mode with unlocking threshold voltage V _th = +1.2 V and a maximum drain-source current I _ds = 0.15 A/mm at the drain-source voltage V _ds = +8 V. The drain-source breakdown voltage in the closed state is V _b = 300 V at the drain-source distance L _ds = 8.5 μm and drain-source voltage V _ds = 0 V.     

Electrical properties of Si:H/<Emphasis Type="Italic">p</Emphasis>-Si structures fabricated by hydrogen implantation

Hydrogenated silicon (Si:H) layers and Si:H/p-Si heterostructures were produced by multiple-energy (3–24 keV) high-dose (5×10¹⁶–3×10¹⁷ cm^?2) hydrogen implantation into p-Si wafers. After implantation, current transport across the structures is controlled by the Poole-Frenkel mechanism, with the energy of the dominating emission center equal to E _c ?0.89 eV. The maximum photosensitivity is observed for structures implanted with 3.2×10¹⁷ cm^?2 of hydrogen and annealed in the temperature range of 250–300°C. The band gap of the Si:H layer E _g ≈2.4 eV, and the dielectric constant ?≈3.2. The density of states near the Fermi level is (1–2)×10¹⁷ cm^?3 eV^?1.     

Special features of spontaneous and coherent emission of IR lasers based on a single type-II broken-gap heterojunction

The electroluminescence characteristics of a single type-II p-Ga_0.84In_0.16As_0.22Sb_0.78/n-In_0.83Ga_0.17As_0.80Sb_0.20 heterostructure have been studied in the temperature range 77–300 K. A new advanced laser structure based on a type-II broken-gap p-GaInAsSb/n-InGaAsSb heterojunction as the active region has been suggested and fabricated. Single-mode lasing at wavelength λ=3.14 µm under a threshold current density j_th=400 A/cm² (T=77 K) was obtained. The domination of TM-over TE-polarization, observed both in the spontaneous and coherent modes of operation of the novel laser structure, can be accounted for by involvement of light holes, tunneling across the heterointerface, in radiative recombination.     

Special features of annealing of radiation defects in irradiated <Emphasis Type="Italic">p</Emphasis>-Si crystals

p-Si single crystals grown by the Czochralski method were studied; the hole concentration in these crystals was p = 6 × 10¹³ cm^?3. The samples were irradiated with 8-MeV electrons at 300 K and were then annealed isochronously in the temperature range T _ann = 100–500°C. The studies were carried out using the Hall method in the temperature range of 77–300 K. It is shown that annealing of divacancies occurs via their transformation into the B _s V ₂ complexes. This complex introduces the energy level located at E _v + 0.22 eV into the band gap and is annealed out in the temperature range of 360–440°C. It is assumed that defects with the level E _v + 0.2 eV that anneal out in the temperature range T _ann = 340–450°C are multicomponent complexes and contain the atoms of the doping and background impurities.     

Electrical properties and luminescence spectra of light-emitting diodes based on InGaN/GaN heterostructures with modulation-doped quantum wells

The distribution of charged centers N(w), quantum efficiency, and electroluminescence spectra of blue and green light-emitting diodes (LED) based on InGaN/AlGaN/GaN p-n heterostructures were investigated. Multiple InGaN/GaN quantum wells (QW) were modulation-doped with Si donors in GaN barriers. Acceptor and donor concentrations near the p-n junction were determined by the heterodyne method of dynamic capacitance to be about N _A ≥ 1 × 10¹⁹ cm^?3 ? N _D ≥ 1 × 10¹⁸ cm^?3. The N(w) functions exhibited maxima and minima with a period of 11–18 (±2–3 nm) nm. The energy diagram of the structures has been constructed. The shifts of spectral peaks with variation of current (J=10^?6–3×10^?2 A) are smaller (13–12 meV for blue and 20–50 meV for green LEDs) than the corresponding values for the diodes with undoped barriers (up to 150 meV). This effect is due to the screening of piezoelectric fields in QWs by electrons. The dependence of quantum efficiency on current correlates with the charge distribution and specific features in the current-voltage characteristics.     

Resonant Γ-<Emphasis Type="Italic">X</Emphasis> tunneling in single-barrier GaAs/AlAs/GaAs heterostructures

The electron transport through single-barrier GaAs/AlAs/GaAs heterostructures is studied. This transport is caused by resonant tunneling between the two-dimensional states related to the Γ valley of the GaAs conduction band and various two-or zero-dimensional donor states related to the lower X valleys of the AlAs conduction band. The resonant electron tunneling both via various two-dimensional states related to the X_z and X_xy valleys in AlAs (the X_z and X_xy states) and via related states of Si donors X _z ^D and X _xy ^D was observed. This circumstance made it possible to determine the binding energies of these states (E_B(X _z ^D )≈50 meV and E_B(X _xy ^D )≈70 meV, respectively) directly from the results of identification of resonance features in transport characteristics. An analysis of the structure of experimental resonances corresponding to tunneling between the Γ and X Landau levels in a magnetic field made it possible to determine the transverse effective mass in the X valleys of AlAs (m_t=(0.2±0.02)m₀). An additional fine structure of donor resonances is observed in experimental transport characteristics. This fine structure is caused by resonant tunneling of electrons through the states of the donors that are located in various atomic layers of the AlAs barrier (in the growth direction) and therefore have different binding energies.     

Detection of terahertz radiation by resonant tunneling nanoheterostructures

The phenomenon of terahertz radiation detection by resonant tunneling structures (RTSs) has been studied. The calculations of the changes ΔI₀ in the direct current (DC) component I₀ under the action of an alternating electric field were carried out by the solution of a nonstationary Schrodinger equation with a time-periodic electric field based on the Floquet mode expansion of the wave functions. The dependences of the DC component I₀ in resonant tunneling structures on the frequency ν and AC signal amplitude V_ac have been built. It is shown that the ΔI₀ value in triple-barrier RTSs at resonance frequency hv ≈ E_r2–E_r1 (E_r1 and E_r2 are the energies of the size-quantized levels) can exceed a low-frequency value by more than an order of magnitude. The parameters of the structures have been optmized, in order to use them in the terahertz radiation detectors in the anbsence of an external bias. The possibility of tuning the resonance frequency in the terahertz range by changing the DC bias has been shown.     

The physical properties of CdTe doped with V and Ge

CdTe:(V, Ge) single crystals are grown using the Bridgman-Stockbarger method. The impurity concentrations in the melt are N_V = 1 × 10¹⁹ cm^?3 and N_Ge = 5 × 10¹⁸ and 1 × 10¹⁹ cm^?3. Electrical and galvanomagnetic characteristics are studied in the temperature range 300–400 K. It is found that the equilibrium characteristics are governed by deep levels (ΔE = 0.75–0.95 eV) located close to the midgap. Low-temperature optical absorption spectra indicate that the impurity levels of V and Ge ions in the low-energy region are in different charge states. In addition, the samples are annealed in Cd vapor and then rapidly cooled. This annealing causes the decomposition of various complexes formed during the crystal growth and an increase in both electrical conductivity and charge carrier concentration.     

Special features of radiation-defect annealing in silicon <Emphasis Type="Italic">p-n</Emphasis> structures: The role of Fe impurity atoms

Deep-level transient spectroscopy is used to study the formation of complexes that consist of a radiation defect and a residual impurity atom in silicon. It is established that heat treatment of the diffused Si p⁺-n junctions irradiated with fast electrons lead to the activation of a residual Fe impurity and the formation of the FeVO (E_0.36 trap) and FeV₂ (H_0.18 trap) complexes. The formation of these traps is accompanied by the early (100–175°C) stage of annealing of the main vacancy-related radiation defects: the A centers (VO) and divacancies (V₂). The observed complexes are electrically active and introduce new electron (E_0.36: E _t ^e =E _c -0.365 eV, σ _n =6.8×10^?15 cm²) and hole (H_0.18: E _t ^h =E _v +0.184 eV, σ _p =3.0×10^?15 cm²) levels into the silicon band gap and have a high thermal stability. It is believed that the complex FeVO corresponds to the previously observed and unidentified defects that have an ionization energy of E _t ^e =E _c ?(0.34–0.37) eV and appear as a result of heat treatment of irradiated diffused Si p⁺-n junctions.