Diffusion and absorption of corrosive gases in electronic encapsulants

Plastic encapsulated microcircuits with aluminum triple track structures were exposed to mixed flowing gas conditions to simulate and accelerate possible environments during long-term storage. No increase in resistance was measured and no corrosion products were observed after 800 h of accelerated exposure. Further experimentation indicated that chloride gas reacts with surface moisture in microscale and macroscale voids within the encapsulant, creating chloride ions. These ions become strongly bound to ion getters present in the epoxy molding compound, trapping the chloride ions within the bulk encapsulant and effectively retarding the diffusion process, which could lead to corrosion at the surface of the die.     

The relationship between moisture resistance and epoxy molding compounds in integrated circuits

The influence of epoxy molding compounds on metallized aluminum corrosion in a Pressure Cooker Test (P.C.T.) was investigated by a monitor chip encapsulated in a dual in-line package (D.I.P.). The monitor chip is composed of a leakage current measuring part which has opposite metallized aluminum tracks and an aluminum corrosion measuring part which has metallized fine aluminum tracks. The formulation of the epoxy molding compound was changed for the average particle size of fillers, the internal release agents, and the coupling agents. The relationships between the stress of the epoxy molding compounds and moisture resistance was also investigated by using epoxy molding compounds which had different characteristics of stress.     

The Measurement of Ion Diffusion in Epoxy Molding Compounds by Dynamic Secondary Ion Mass Spectroscopy

The primary focus of this research was the measurement of ion diffusion in a common epoxy molding compound used to encapsulate microelectronic devices. Ion diffusion measurements were made by exposing the encapsulant materials to aqueous solutions of 2M sodium chloride, and making measurements by Dynamic Secondary Ion Mass Spectrometry. The diffusion dependency of temperature exposure of the encapsulants to aqueous salt solutions at 75 $^{circ}$C, 85 $^{circ}$C, 100 $^{circ}$C, 125 $^{circ}$C, 150 $^{circ}$C and 175 $^{circ}$C and post-mold curing for 2, 4, 6, and 8 h at 175 $^{circ}$C was evaluated. The ion diffusion was found to depend on the glass transition temperature of the encapsulant. The rate of ion diffusion above the glass transition temperature of the encapsulant was faster than predicted by an Arrhenius plot of the diffusion coefficient as a function of temperature below the glass transition temperature. Post-mold curing of the encapsulant decreased the diffusion of chloride ions in the encapsulant. Ion diffusion was shown to be slower than moisture diffusion in the encapsulant by approximately nine orders of magnitude.      

Thermal reliability of gold–aluminum bonds encapsulated in bi-phenyl epoxy resin

Bond degradation of Au wire/Al pad has become a major problem, because of the use of molding resin with low thermal stability (e.g. bi-phenyl epoxy resin) and the use of the IC devices under high thermal environments. It is therefore important to insure the thermal reliability at Au/Al bonds. The lifetime to bond failure of bi-phenyl epoxy molding became shorter than that for cresol novolac epoxy. The failures were caused by the corrosion reaction of Au–Al intermetallics with bromine (Br) contained in the resin compounds. It was clarified that the reactive intermetallic was Au₄Al phase formed in the bond interface.The governing factors of the bond corrosion were investigated such as resin compound and gold wire material. Especially some impurities in gold wire could affect the Au–Al intermetallic growing and therefore retard the corrosion. The use of the alloyed wire was effective in improving the bond reliability.     

EMC所用环保阻燃剂介绍及优缺点比较

随着人们健康环保意识的增强,寻求环保化、低毒化、高效化、多功能化的阻燃剂已成为阻燃剂行业的必然趋势。对于环保模塑料来讲,必须有相对应的符合法令要求的产品。用环保阻燃剂替代原先使用的溴锑阻燃剂加入到基础配方中制备了环保塑封料,文章简单介绍了目前市场上主要的有机及无机阻燃剂的种类,并重点讲述了在环氧塑封料中引用各环保阻燃剂...     

Chip corrosion in plastic packages

The corrosion performance of both unencapsulated and plastic encapsulated parts has been studied under temperature-humidity-bias (THB) stresses using a patterned test chip with aluminum metallization. The effect of encapsulation materials and ionic contaminants purposely introduced on the chip surface has been determined for both accelerated THB and severe, real life conditions.Unencapsulated test chips exhibited very different THB performance characteristics from encapsulated parts including a near-zero induction time and a shallow post-induction slope on the % failures vs time curve. The induction time and mean-time-to-failure (MTF) for encapsulated devices were strong functions of both the polymeric class of encapsulant and the particular compound employed. At least part of the difference in performance between molding compounds has been attributed to impurities inherent in the compounds. Impurities contributed from conductive epoxies used for die attach also adversely affect the device's MTF, as do normal contaminants present on as-plated leadframes.The environmental factors of temperature, relative humidity and bias greatly affect the performance of encapsulated devices. In this study, the MTF decreased dramatically with bias between 5 and 30 volts, the range over which most devices operate. The acceleration factors relating device performance in an 85°C/85%RH environment to severe, real life conditions were surprisingly small and somewhat dependent on the encapsulant.     

A comparison of the theory of moisture diffusion in plasticencapsulated microelectronics with moisture sensor chip and weight-gainmeasurements

In this paper, the issues pertaining to moisture diffusion in PEMs are explored and discussed. The existing models of moisture diffusion in plastic molding compounds and PEMS are reviewed. Results, modeling and analysis of moisture sorption experiments performed in this study are presented. The moisture sorption experiments were conducted on a set of PEM samples with a common type of encapsulant material to 1) characterize sorption behavior; 2) compare weight gain measurement to the measurement of moisture concentration using a moisture sensor device at the die surface; 3) assess the moisture sensor measurement method. In the case of PEM samples tested in this study, simple Fickian diffusion was shown to agree closely with the experimental results. In one case, a relatively small anomaly from Fickian diffusion was observed and was attributed to swelling and relaxation phenomena at later stages of moisture sorption in the molding compound. The calibration constants determined for the sensors in this study were found to be significantly different from those collected by the manufacturer prior to the encapsulation of the devices. This problem is believed to be degradation in sensitivity of the moisture sensor due to exposure to high temperatures and storage conditions     

Investigation of delamination control in plastic package

Interfacial delamination control is important for the mechanical reliability of plastic package, especially facing the challenge of lead-free requirement. Efforts of delamination performance improvement including structure, material and process for plastic package were made. It was demonstrated that the improvement of packaging material mechanical properties should depend on the package and purpose and should be the comprehensive consideration of advantage and disadvantage. The fracture mechanics was introduced to explain the mechanism of bumpy interface as the delamination retardant. The moisture absorption experiments of three kinds of molding compound were carried out to confirm that large difference of delamination performance among different molding compounds for the same device in our project was induced by moisture absorption difference, and the relation between the moisture weight absorbed and weight ratio of resin was obtained, given compounds of the same resin. It was substantiated that the moisture absorption of molding compound observes the Fick’s law at (Moisture Sensitivity Level 3) MSL3. Quantitative analyses of the moisture influence at the risk location were conducted to evaluate the risk of delamination with the consideration of vapor pressure during solder reflow, moisture and thermal expansion.     

塑封胶吸湿对器件分层影响的研究

进行3种塑封胶的吸湿试验来证实其在相同器件中的不同可靠性表现由吸湿量的差异造成,得到了树脂相同的塑封胶的吸湿量与二氧化硅填充量之间的关系。证实了MSL3条件下塑封胶吸湿遵循Fick定律,并且得到了MSL3条件下3种塑封胶中湿气的扩散系数。综合考虑回流过程中蒸汽压、塑封胶吸湿膨胀和热膨胀,进行了界面分层风险的定量分析。     

塑封电子器件负极端变色原因分析

利用X—RAY光电子能谱仪对125°下,通电15kV,96h后负极一端出现白色物质的塑封电容器进行分析。对比分析性氧化铝结发现,负极一端白色物质为氧化铝富集所致。造成该现象的原因是,环氧塑封料中含有活性氧化铝,由于固化不完全或吸潮导致环氧塑封料中残留水分,残留的水分与活合,在电应力的作用下,有向电源负极迁移的趋势;同时,由于温度效应的存在,塑封树脂软化,加速了水分与活性氧化铝向电源负极迁移的速度,形成了氧化铝在负极端富聚现象,使电容器负极端呈现白色。     

Predicting non-Fickian moisture diffusion in EMCs for application in micro-electronic devices

This study made an attempt to predict the temperature-dependent moisture diffusion of an epoxy molding compound with 3 different diffusion models: Fickian, dual stage and Langmuir diffusion. The Langmuir model provided the best prediction of the moisture diffusion when simulating the input experiments. Beyond the temperature range of the input experiments, the Langmuir model was still able to provide a fair prediction. Hence, the Langmuir model also provides better predictions for the moisture distribution in general. This allows for building on existing prediction models and enabling simulations of reliability tests like UHST.     

湿热环境下吸潮对QFN器件可靠性的影响研究

由吸潮引起的微电子塑封器件失效已经越来越多地引起人们的关注.选用QFN器件作为研究对象,首先进行QFN器件在高温高湿环境下吸潮17 h、50 h、96 h试验;然后利用有限元软件分析和模拟潮湿在QFN器件中的扩散行为,并建立湿气预处理阶段应力计算模型;最后,通过试验与仿真相结合,分析潮湿对封装可靠性的影响.研究表明:微电子塑封器件的潮湿扩散速度与位置有着重要的关系;在高温高湿环境下,微电子器件吸潮产生的湿热应力在模塑封装材料(EMC)、硅芯片(DIE)和芯下材料(DA)的交界处最大;QFN器件在高温高湿环境下吸潮产生的裂纹主要出现在硅芯片与DA材料交界面的边界.     

Interface delamination analysis of TQFP package during solder reflow

Interface delamination during solder reflow is a critical reliability problem for the plastic IC packages. The main objective of this study is to apply modified virtual crack closure method (MVCCM) for the analysis of interface delamination between the leadframe pad and the encapsulant during a lead-free solder reflow after the level 1 moisture preconditioning. In this study, the moisture diffusion parameters and the coefficient of moisture expansion (CME) of two different epoxy molding compounds (EMC) are characterized for moisture diffusion analysis and the deformation analysis due to hygroscopic swelling. At the same time, the entire thermal and moisture history of Thin Quad Flat Pack (TQFP) package is simulated from the start of level 1 moisture preconditioning (85 °C/85%RH for 168 h) to subsequent exposure to a lead-free solder reflow process. Finally, the transient development of the stress intensity factors due to thermal stress only K_t, hygrostress only K_h, vapor pressure only K_p and combined energy release rate G_tot are computed and studied by using MVCCM. Based on the calculated stress intensity factors and energy release rates, it seems that for the EMC, the Young’s modulus, moisture diffusion coefficient, CME and adhesion strength with leadframe at high temperature appear to be the most significant variables for the MSL performance of TQFP package and this matches well with the experimental finding.     

A method of the measurement of moisture in IC packages using microwaves

A new method to measure the moisture content of integrated circuit (IC) packages is demonstrated. The moisture contained in the encapsulant resin was determined by using microwaves. The microwave signal was transmitted into the encapsulant resin and reflected at the surface of the chip pad. The amplitude and phase of the reflection coefficient of the microwave signal, which varied with the moisture content of the encapsulant resin, were measured in order to determine the moisture content. A preliminary experiment was carried out, and the calibration equation was developed. The present technique indicates the possibility of determining the moisture content directly without drying and weighing IC packages.     

Evaluation of moisture ingress from the perimeter of photovoltaic modules

Many thin film photovoltaic (PV) technologies can be sensitive to corrosion induced by the presence of water vapor in the packaging materials. Typically impermeable front and backsheets are used in conjunction with an edge‐seal around the perimeter to prevent water vapor ingress. These edge‐seal materials are often made of a polyisobutylene resin filled with desiccant, which dramatically increases the time for moisture to reach sensitive module components. While edge‐seals can prevent moisture ingress, even the lowest diffusivity transparent encapsulant materials are insufficient for the lifetime of a module. To evaluate the performance of edge‐seal and encapsulant materials in a manner that simulates their function in a PV module, an optical method was devised where ingress is detected by reaction of a Ca film with water. Using this method, we have exposed test samples to heat and humidity allowing quantitative comparison of different edge‐seal and encapsulant materials. Next, we use measurements of polymer diffusivity and solubility to evaluate the ability to model this moisture ingress. Here, we find good agreement between these two methods highlighting the much greater ability of polyisobutylene materials to keep moisture out as compared with typical encapsulant materials used in the PV industry. Copyright © 2013 John Wiley & Sons, Ltd.     

Popcorning: a failure mechanism in plastic-encapsulatedmicrocircuits

Popcorning is a failure mechanism in plastic-encapsulated microcircuits. It occurs when the inherently hygroscopic encapsulant is rapidly exposed to high temperatures during reflow solder assembly of the component to a printed circuit card. At these temperatures the moisture absorbed by the molding compound vaporizes and rapidly expands leading to the development of high stresses. When these stresses exceed both the interfacial adhesion strength and the fracture toughness of the molding compound, delamination and cracking result. Cracking is accompanied by a characteristic pop sound (and thus the name popcorning). Popcorning can: lead to a long-term reliability problem, since the cracks can be a path for ionic contaminants, causing corrosion-induced failures; and result in sheared or cratered ball bonds, causing electrical failures     

塑封IC翘曲问题

为分析封装材料及模塑过程参数对塑封IC翘曲的影响,本文先介绍塑料四边引线扁平封装(PQFP)使用的环氧模塑化合物(EMC)的热特性。并对不同模塑样品的聚合程度(DOC)、热膨胀系数(CTE)、玻璃转变温度Tg、剪切模量G等,运用各种热分析技术进行测量。结合不同封装过程参数,运用三维有限元分析法进行封装翘曲预测。最后对塑料四边引线扁平封装(PQFP)IC翘曲的测量值与预测值进行比较。     

环氧模塑料玻璃化温度(Tg)的测定方法及其影响因素

通过使用动态力学机械分析仪（DMA）、差示扫描量热仪（DSC）、热机械分析仪（TMA）等不同的分析方法来表征环氧模塑料的玻璃化转变温度,讨论了测量方法、材料的化学结构、升温速度、频率以及后固化时间等因素对环氧模塑料玻璃化转变温度（Tg）的影响。实验结果表明,环氧模塑料的玻璃化温度性能不仅取决于环氧树脂的结构与性能、固化剂和添加剂的结构与性能,以及它们之间的配比,而且也取决于它的成型固化历程以及测试方法。     

环氧树脂对环氧模塑料(EMC)的性能影响分析

在环氧模塑料中,环氧树脂是环氧模塑料的基体树脂,也是环氧模塑料的主要原材料,起着将其他组分交联结合到一起的重要作用。环氧树脂作为环氧模塑料的胶粘剂,具有粘合性高、固化收缩率小、耐化学介质稳定性好、电绝缘性优良、工艺性能良好等特点。因此环氧树脂类型的选择及其性能对环氧模塑料的性能都有很大的影响。文章简单介绍了环氧树脂的分类、结构、作用及特点,主要探讨了不同结构环氧树脂对环氧模塑料的粘接性、稳定性、收缩率、电性能及机械性能等的影响。     

Properties of molding compounds to improve package reliability ofSMDs

Package cracking during reflow soldering process is the great problem in the reliability of plastic packages. The technique of lowering the glass transition temperature (Tg) of a molding compound is very effective for improvement of the package cracking resistance because of the properties of low moisture absorption and high adhesion strength for a molding compound. But the package reliability except for the package cracking resistance is also important. In this study, the effects of the Tg for molding compounds on the package reliability was discussed. It was confirmed that decreasing the crosslinking density was an important factor to improve the package cracking resistance. There was no problem in thermal resistance, even if the molding compound has low Tg. However, decreasing the crosslinking density by the lowering of Tg may not satisfy humidity resistance in some cases. It was found to be important to decrease the crosslinking density of molding compounds without lowering Tg in order to improve both the package cracking resistance and the humidity resistance. It was also confirmed that the introduction of rigid structural segments into the matrix resin molecules of the molding compound was a useful technique for achieving excellent package reliability