高调制度光致相变特性氧化钒薄膜太赫兹时域频谱研究

基于太赫兹(THz)时域频谱技术研究了飞秒激光激发下氧化钒纳米薄膜的光致绝缘体-金属相变特性。利用直流磁控溅射法在不同条件下制备了一系列蓝宝石基底上的氧化钒薄膜,通过测量薄膜发生光致相变后太赫兹波的透射率来评估成膜质量,得出在溅射时间60min不变的情况下,退火时间和退火温度分别为60s和560℃时可以得到性能非常良好的氧化钒薄膜。在上述最佳条件下制备的氧化钒薄膜的相变深度可达80%。利用薄膜近似计算了太赫兹波段氧化钒薄膜在光致相变过程中电导率的变化,计算结果表明电导率实部在103Ω-1·cm-1量级,并基于Drude模型得到了金属态氧化钒薄膜的复介电常数以及复折射率。在绝缘衬底上制备的具有明显阈值激发功率且相变深度大的氧化钒薄膜将在太赫兹调制器件中有重要应用。     

在柔性衬底上制备透明导电薄膜ZnO:Zr(英文)

采用射频磁控溅射法在室温柔性衬底PET上制备了掺锆氧化锌(ZZO)透明导电薄膜.利用不同方法提高了ZZO薄膜的电阻率而未使其可见光透过率降低.X射线衍射(XRD)和扫描电子显微镜(SEM)表明,ZZO薄膜为六角纤锌矿结构的多晶薄膜.在有机衬底和玻璃衬底上制备ZZO薄膜的择优取向不同,前者为(100)晶面,而后者为(002)晶面.在有ZnO缓冲层的PET衬底上制备的ZZO薄膜电阻率比直接生长在玻璃衬底样品上的小.通过优化参数,在PET衬底上制备出了最小电阻率为1.7×10-3Ω·cm、可见光透过率超过93%的ZZO薄膜.实验表明,镀膜之前在柔性衬底上沉积ZnO缓冲层能有效地提高ZZO薄膜的质量.     

VO2/Al2O3复合膜系制备及其相变特性

钒的氧化物具有对温度敏感的半导体-金属可逆相变特性.在多种钒氧化合物中,VO2的相变温度点约为68℃,适用于很多应用领域.VO2长期暴露在空气中时,会被氧化.研究了通过制备VO2/Al2O3复合膜系来保持氧化钒薄膜的稳定性的方法.采用TFCalc薄膜设计软件,设计了VO2/Al2O3复合膜系.依据材料的折射率和消光系数,优化了膜系各膜层的厚度,分析了复合膜系的相变特性.采用磁控溅射方式制备了氧化钒薄膜,再通过氧氩混合气氛热处理得到VO2占主要成分的氧化钒薄膜.在氧化钒薄膜上采用射频磁控溅射方法封装了120 nm厚的Al2O3膜.利用分光光度计测量分析了膜系的相变特性,Al2O3膜对VO2膜的相变性能影响很小.Al2O3膜适于VO2薄膜的封装.     

改善玻璃衬底上ZnO薄膜特性的方法

利用磁控溅射法在玻璃衬底上淀积铝掺杂氧化锌(AZO)薄膜作为缓冲层,在其上制备了ZnO薄膜。重点研究了AZO薄膜作为缓冲层对玻璃衬底上ZnO薄膜特性的影响。扫描电子显微镜(SEM)图像和X射线衍射(XRD)图谱分析结果表明,玻璃衬底上加入厚度为1μm的AZO缓冲层后,提高了衬底材料和ZnO薄膜之间的晶格匹配程度,有助于增大ZnO薄膜晶粒尺寸,提高其(002)取向择优生长特性、薄膜结晶特性及晶格结构完整性。室温下的透射光谱结果表明玻璃/AZO和玻璃衬底上ZnO薄膜的透光特性没有显著不同。光致发光(PL)谱研究结果表明AZO缓冲层可以有效阻止衬底表面硅原子从ZnO薄膜中"俘获"氧原子,减少ZnO薄膜中的缺陷,改善ZnO薄膜的结晶质量。     

一种制备氧化钒薄膜的新工艺

采用两步法工艺,即先在衬底上溅射一层金属钒膜,再对其进行氧化的方法,在硅和氮化硅衬底上制备了高电阻温度系数的混合相VOx多晶薄膜。电学测试结果表明:厚度为50nm的氧化钒薄膜的方块电阻和电阻温度系数(TCR)在室温时分别达到50kΩ和0.021K-1。     

氧化钒薄膜的制备及其光电特性研究

采用一种新工艺在Si和Si3 N4衬底上制备了性能优良的氧化钒薄膜 ,并对其微观结构和光电特性进行了研究。测试结果表明采用新工艺所制备的氧化钒薄膜在相变前后电阻率变化达到 3个数量级 ,红外透过率在相变前后改变达到 6 0 %。     

Pb过量和种子层对PLZT薄膜的影响

采用溶胶-凝胶(Sol-Gel)法在Pt/Ti/SiO_2/Si衬底上制备不同Pb过量(未过量、10%、15%)和引入不同厚度(0、100nm、500nm)锆钛酸铅(PZT)缓冲层的锆钛酸铅镧(PLZT)反铁电薄膜,通过原子力显微镜、X线衍射表征分析薄膜的微观结构。结果表明,过量10%的Pb组分有助于形成钙钛矿结构,获得较大的晶粒尺寸和理想的粗糙度;100nm的PZT缓冲层的引入有利于PLZT薄膜晶化,形成较致密、结晶状况良好的薄膜。     

ScAlN缓冲层厚度对Si(100)衬底上GaN外延层的影响

采用脉冲直流磁控溅射方法在Si(100)衬底上制备了ScAlN薄膜。以溅射的ScAlN作为缓冲层,在Si(100)衬底上用金属有机化学气相沉积(MOCVD)技术外延了GaN薄膜。使用高分辨X射线衍射、原子力显微镜和拉曼光谱研究了ScAlN缓冲层的厚度对ScAlN缓冲层和GaN外延层的影响。研究结果表明,ScAlN缓冲层的厚度是影响GaN薄膜晶体质量的重要因素。随着ScAlN厚度的增加,ScAlN的(002)面X射线衍射摇摆曲线半高宽持续减小,GaN的(002)面X射线衍射摇摆曲线半高宽先减小后增大。当ScAlN缓冲层厚度为500nm时,得到的GaN晶体质量最好,其中GaN(002)面的X射线衍射摇摆曲线半高宽为0.38°,由拉曼光谱计算得到的张应力为398.38MPa。     

热处理时间对氧化钒薄膜相变性能的影响

采用直流磁控溅射的方法在普通玻璃上制备了低价的氧化钒薄膜,在氧气和氩气混合气氛中,对所制备的薄膜进行不同时间的热处理,得到具有相变特性的VO2薄膜。分别利用X射线衍射(XRD)和场发射扫描电镜(SEM)分析了薄膜的组分、结晶结构和表面形貌,利用四探针法测试了薄膜的电阻。结果表明:热处理前的氧化钒薄膜主要成分为V2O3,经过热氧化处理后,低价的氧化钒被氧化,薄膜中VO2含量增加,薄膜发生金属-半导体相变,其中450℃、2h为最佳处理参数,其电阻相变幅度超过2个数量级,薄膜的相变温度仅为30℃。     

分子束外延HgCdTe薄膜的CdTe缓冲层特性研究

CdTe是GaAs衬底上分子束外延(MBE)HgCdTe薄膜时的缓冲层,引入缓冲层的目的是减小失配位错,CdTe缓冲层的生长直接影响到后续HgCdTe薄膜的制备质量,然而目前现有文献鲜有报道CdTe缓冲层的最佳厚度.采用X射线双晶衍射、位错腐蚀坑密度(EPD)、FT-IR和椭圆偏振光谱的方法,从CdTe缓冲层厚度对位错密度的影响入手,分析并确定了理想的CdTe缓冲层厚度.     

Investigation of the electrical transport mechanism in VOx thin films

Vanadium oxide VO₂ is a material that transforms from semiconductor to a metal state at a temperature of 67 °C. This phase transformation is accompanied by a dramatic change in its electrical and optical properties. Therefore, vanadium oxide thin films are most attractive for switching applications. Non-stoichiometric thin films of VO_x, including VO₂, also present such thermal response.This paper presents the optical and electrical properties of vanadium oxide thin films deposited by vacuum thermal evaporation of a metal vanadium with follows oxidation. We have studied the electro-physical behavior of these films during their phase transition. It was shown that the electrical transport mechanism of the obtained vanadium oxide films differ in low and high electrical fields. In low electrical fields, conductivity is obtained by the Schottky transport mechanism, whereas in high electrical fields, conductivity ranges from Ohmic, for medium fields, to Poole-Frenkel for higher fields. Also, FTIR and near IR reflectance characteristics of the obtained films are presented.     

Insulator-to-metal phase transformation of VO2 films upon femtosecond laser excitation

Light-induced insulator-to-metal phase transition of vanadium dioxide films was studied by ultrafast optical pump-probe spectroscopy. The transient optical reflection measurement shows that both heating and laser illumination contribute to the phase transition of VO₂. Within 10⁻¹¹–10⁻⁹ sec, these two mechanisms are competitive. Excited-state dynamics were found to be strongly dependent on the concentration of structural defects and the pump laser power as well. Comparison of the transient reflection of VO₂ films deposited on different substrates suggests that the excitonic-controlled light-induced insulator-to-metal phase transition in VO₂ proceeded through an intermediate state. The transient reflection measurement of VO₂ in metallic phase shows a three-stage relaxation process. A polaron excitation model is introduced to describe the dynamical process for metallic VO₂.     

二氧化钒薄膜的退火组分变化及光学特性研究

为得到高纯度的VO2薄膜,对其制备参数进行了探索。VO2薄膜用磁控溅射法制备。对不同条件下制备的VO2薄膜用X射线电子能谱仪(XPS)测试,并通过拟合来得到3,4,5价钒在薄膜中所占的比例。为提高4价钒的含量对薄膜进行了退火处理,分析了退火对氧化钒薄膜中4价钒含量的影响。结果表明,VO2薄膜对10.6μm激光的透过率从60℃时的74%变到78℃时的11.93%,发生了相变。     

Hf-O-N and HfO2 barrier layers for Hf-Ti-O gate dielectric thin films

Hf-O-N and HfO₂ thin films were evaluated as barrier layers for Hf-Ti-O metal oxide semiconductor capacitor structures. The films were processed by sequential pulsed laser deposition at 300 °C and ultra-violet ozone oxidation process at 500 °C. The as-deposited Hf-Ti-O films were polycrystalline in nature after oxidation at 500 °C and a fully crystallized (o)-HfTiO₄ phase was formed upon high temperature annealing at 900 °C. The Hf-Ti-O films deposited on Hf-O-N barrier layer exhibited a higher dielectric constant than the films deposited on the HfO₂ barrier layer. Leakage current densities lower than 5 × 10 A/cm² were achieved with both barrier layers at a sub 20 Å equivalent oxide thickness.     

Analysis of “on” and “off” times for thermally driven VO2 metal-insulator transition nanoscale switching devices

Vanadium oxide undergoes a sharp metal-insulator transition in the vicinity of room temperature and there is considerable interest in exploring novel device applications that utilize this phase transition. Using experimentally determined values of the thermal conductivity across the metal-insulator transition in VO₂ thin films, we estimate the switching characteristics of two-terminal VO₂ devices. The minimum switching time for both heating (“on” state) and cooling (“off” state) processes is explored using a simple resistance-capacitance thermal circuit model. The estimated minimum switching time is on the order of ∼1 ns for 20 nm VO₂ films which is comparable to experimentally observed switching times. Optimal operating temperatures to maximize switching times are estimated. Methods to further enhance the switching kinetics by device thickness, carrier doping/strain, interfacial thermal resistance and input thermal energy are discussed. The simulations are compared with a 3-D model for VO₂ devices on Si substrates utilizing COMSOL. The results are of potential relevance to the emerging field of correlated oxide electronics with fast phase transitions.     

Metal‐Insulator Transition in ALD VO2 Ultrathin Films and Nanoparticles: Morphological Control

Nanoscale morphology of vanadium dioxide (VO₂) films can be controlled to realize smooth ultrathin (<10 nm) crystalline films or nanoparticles with atomic layer deposition, opening doors to practical VO₂ metal‐insulator transition (MIT) nanoelectronics. The precursor combination, the valence of V, and the density for as‐deposited VO₂ films, as well as the postdeposition crystallization annealing conditions determine whether a continuous thin film or nanoparticle morphology is obtained. It is demonstrated that the films and particles possess both a structural and an electronic transition. The resistivity of ultrathin films changes by more than two orders of magnitude across the MIT, demonstrating their high quality.     

WO3/SnO2复合薄膜的制备及光电性能

采用水热法和电化学沉积法,成功制备了包覆有SnO₂纳米颗粒的WO₃纳米棒阵列薄膜,退火处理后形成WO₃/SnO₂异质结复合薄膜。通过改变SnO₂的沉积时间得到了复合薄膜的最佳制备条件。采用XRD,FESEM对WO₃/SnO₂复合薄膜的物相和形貌进行了分析,通过电化学工作站对WO₃/SnO₂复合薄膜的光电性能进行了研究,结果表明,电沉积时间为120 s时,WO₃/SnO₂复合薄膜具有最小的阻抗,且在0.6 V的偏压下光电流密度为0.46 mA/cm²,相比于单一WO₃纳米棒薄膜,表现出更好的光电化学性能。     

Ultrathin HfO2 gate dielectrics on partially strain compensated SiGeC/Si heterostructure

Ultrathin HfO₂ gate dielectrics have been deposited on strain-compensated Si_0.69Ge_0.3C_0.01 layers by rf magnetron sputtering. X-ray diffraction spectra show the films to be polycrystalline having both monoclinic and tetragonal phases. The formation of an interfacial layer has been observed by high-resolution transmission electron microscopy. Secondary ion mass spectroscopy and Auger electron spectroscopy analyses show the formation of an amorphous Hf-silicate interfacial layer between the deposited oxide and SiGeC films. The average concentration of Ge at the interfacial layer is found to be 2–3 at%. The leakage current density of HfO₂ gate dielectrics is found to be several orders of magnitude lower than that reported for thermal SiO₂ with the same equivalent thickness.     

Effect of titanium dioxide (TiO2) seed layer on the phase composition of 0.7Pb (Mg1/3Nb2/3)O3-0.3PbTiO3 film prepared by pulsed laser deposition

Lead-magnesium niobate-lead titanate (PMN-PT) thin films with and without the TiO₂ seed layer were deposited on Pt/Ti/SiO₂/Si substrates through pulsed laser deposition. The study aimed to characterize the effect of the TiO₂ seed layer on the phase composition and properties of PMN-PT film. Without the TiO₂ seed layer, the pure perovskite phase could be obtained in the thinner PMN-PT film while with the TiO₂ seed layer, the pure perovskite phase was formed in the thicker PMN-PT film. The ferroelectric properties of PMN-PT films with the TiO₂ seed layer were exhibited. As a result, the maximum amount of remnant polarization reached the amount of 32 μC/cm² for the PMN-PT thin film with the TiO₂ seed layer.     

Influence of oxidation temperature on the microstructure and electrical properties of Ta2O5 on Si

The effect of the oxidation temperature (673-873 K) on the microstructural and electrical properties of thermal Ta₂O₅ thin films on Si has been studied. Auger electron spectroscopy and X-ray photoelectron spectroscopy results revealed that the films are non-stoichiometric in the depth; an interfacial transition layer between tantalum oxide and Si substrate, containing presumably SiO₂ was detected. It has been found by X-ray diffraction that the amorphous state of Ta₂O₅ depends on both the oxidation temperature and the thickness of the films—the combination of high oxidation temperature (>823 K) and thickness smaller than 50 nm is critical for the appearance of a crystal phase. The Ta₂O₅ layers crystallize to the monoclinic phase and the temperature of the phase transition is between 773 and 823 K for the thinner layers (<50 nm) and very close to 873 K for the thicker ones. The electrical characterization (current/voltage; capacitance/voltage) reveals that the optimal oxidation temperature for achieving the highest dielectric constant (∼32) and the lowest leakage current (10⁻⁸ A/cm² at 1 MV/cm applied field) is 873 K. The results imply that the poor oxidation related defects are rather the dominant factor in the leakage current than the crystallization effects.