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1.
The shortcomings of the available electroless processes, such as scarcity of information on the controlling parameters, bath
instability, poor film adhesivity and film contamination are reported. The process described in this paper differs from the
conventional process not only in the raw materials used but also in the operational details. The criteria of choice of such
materials are discussed. Further, the parameters affecting the quality of electroless copper films are defined and some of
them, viz., concentration of bath ingredients and the number of sensitisation-activation treatments needed, are optimised for coating
on glass substrates. It has been found that the bath decomposition, a hazard peculiar to an electroless bath can be avoided
by maintaining the bath pH below 10.86. The substrate should undergo three sensitisation-activation treatments to receive
complete coating. The adhesivity of copper film on glass substrate achieved by this improved process is more than 21.6 kg/cm 2 as compared to 7 kg/cm 3, which is the adhesivity of evaporated copper film on the same substrate. 相似文献
2.
采用稀土盐Ce(NO3)3与氧化剂KMnO4作为无铬化学转化液的主要成分,在6063铝合金表面制备了耐腐蚀稀土转化膜,利用正交试验法与单因素实验法对转化膜处理溶液浓度、溶液温度与pH值以及时间等工艺参数进行了优化,利用SEM微观分析法,并对稀土转化膜的表面形貌进行了研究,并分析了处理工艺参数对转化膜微现形貌与耐腐蚀性能的影响。 相似文献
3.
The present work developed a two-step thermal cycling technique for processing of fine-grained pure copper for improved properties. This included initial annealing of specimens followed by heavy cold rolling and a series of heating and cooling cycles. The study investigated the important microstructural changes occurring in the cold deformed grains in the absence of phase transformations. A major interest of the present research was to closely describe the effect of thermal cycling parameters on the recrystallization and grain growth kinetics for processing of fine-grained structure. The study determined the optimum values of process parameters for the developed thermal cycling route including the extent of cold deformation, annealing temperatures, holding periods, and the number of thermal cycles. The thermal cycling process produced closely distributed fine grains with bi-modal microstructure leading to increased hardness and strength without any significant loss in electrical conductivity. 相似文献
4.
采用水相分离法制备出了粒径在2~10μm之间的液体憎水剂微胶囊,研究了含憎水剂微胶囊复合镀铜层的制备工艺,讨论了试样放置方式、电流密度、阴阳极距离、镀液中微胶囊溶液含量、电镀时间等电沉积参数对复合镀铜层中微胶囊含量的影响.研究表明,当试样水平放置时,复合镀铜层中微胶囊的含量明显增加;镀铜层中微胶囊含量随阴极电流密度、阴阳极距离、镀液中微胶囊溶液含量的增加呈现出先增加后减小的趋势;并且随着电沉积时间的增加,复合镀铜层中憎水剂微胶囊的数量增加. 相似文献
5.
A molecular dynamics analysis scheme is proposed to study nanoimprint processes by considering the following effects: temperature, punch velocity, spring back, etc. The nanoimprint process being studied in the proposed paper is similar to nanoimprint lithography, except that the material under investigation is metal. The nanoimprint process being simulated in the proposed paper is comprised of one punch and one specimen. By varying the environment temperature and the punch velocity, useful information has been obtained. If the environment temperature is higher, then the needed punching force becomes smaller. When increasing punch velocity, the needed punching force also increases. The internal energy of specimen under high temperature is smaller than that of low temperature. When increasing punch velocity, due to shorter relaxation time in the specimen, the absorbed energy will increase rapidly, and finally if it reaches the marginal value the specimen collapses. The spring back effect is an important factor to discuss. Since the imprinting energy is absorbed mainly by those atoms close to the punch, especially at both sides of punch, if as the punch leaves the specimen, the spring back phenomena of deformed-atomic structures in horizontal direction are more serious than in vertical direction. 相似文献
6.
制冷系统铜管弯管制备过程存在反复试弯带来的材料、人工浪费和弯管作业效率低下等问题,为保证在弯管前的下料制备中获得准确的下料尺寸和起弯点,通过理论计算和试验验证的方法对弯曲角度、铜管直径、壁厚、中轴线弯曲半径等变量对铜管弯曲拉伸变形量的影响进行研究,确定下料尺寸、起弯点位置、拉伸变形量等弯管工艺参数理论计算模型,实际作业效率提高30%~40%,材料利用率提高10%。 相似文献
7.
An investigation was successfully made in the present work to obtain the solid-state coating of AISI316 stainless steel over EN24 medium carbon steel by friction surfacing process. Spindle speed, axial force, and table traverse speed were perceived to be the supreme aspects for bonding integrity. It was observed that the depth of the coating ( Ct) lessened as the coating width ( Cw) increased. The impact of process parameters on physical geometry of the coating was explored by experimentation based on desirability approach. The coefficients of correlation for coating width (0.94) and thickness (0.99) are extremely high. The coatings exhibited martensitic microstructure with fine grain size and without carbide particles which substantiates the effectiveness of good bonding. The optimal process parameters were identified by response surface methodology as 2.26?mm/s of Ts, 7.20?kN of AL, and 1447.17?rpm of RoS and also the output values are observed as Ct?=?2.10?mm and CW?=?17.21?mm. 相似文献
8.
采用超声-脉冲电沉积法制备了Ni-TiN-CeO2二元纳米复合镀层,研究了工艺参数对镀层中CeO2及TiN粒子复合量的影响,并对镀层的表面形貌及成分进行了测试和分析。结果表明,超声-脉冲电沉积Ni-TiN-CeO2纳米复合镀层的最佳工艺参数为阴极电流密度4A/dm2,TiN粒子添加量15g/L,CeO2粒子添加量40g/L,正向脉冲占空比20%,超声波功率180W。在该工艺条件下,可获得CeO2质量分数为3.3%、TiN质量分数为4.4%的Ni-TiN-CeO2二元纳米复合镀层。同时,TiN与CeO2二元纳米粒子的加入,充分发挥了两种纳米粒子复合的协同效应,优化了粒子与基质金属的共沉积方式,大大改善了镀层质量。 相似文献
9.
超薄铜箔是锂离子电池的重要基础材料,为了实现超薄铜箔从基底上顺利剥离,电沉积Cr纳米离散晶核作为剥离层,成功实现了厚度为1.34μm超薄铜箔的制备。Cr纳米离散晶核密度、Cl -质量浓度、电流密度、CuSO 4质量浓度以及温度等工艺参数对超薄铜箔的性能(粗糙度、电阻率和拉伸强度等)有重要影响,通过建立L16(4 5)正交试验分析,得出对粗糙度、电阻率和拉伸强度影响程度最大的因素分别是:Cr纳米离散晶核密度、Cr纳米离散晶核密度和电流密度。采用矩阵分析法得出最优的正交试验方案为:CuSO 4质量浓度为100 g/L,电流密度为5 A/dm 2,温度为25℃,Cr纳米离散晶核密度为15.7×10 9/cm 2,Cl -质量浓度为60 mg/L;各个因素对正交试验的指标(粗糙度、电阻率和拉伸强度等)影响的主次顺序依次为:Cr纳米离散晶核密度>电流密度>Cl -质量浓度>温度>CuSO 相似文献
10.
In this article, slurry spray technique (SST) has been adopted for depositing mullite–nickel based environmental barrier coatings (EBCs) on some ASTM 1018 low-carbon steel. Considerable value of adhesion strength of a deposited cermet is critical for the coating to comply with service condition. The effect of identified process parameters like stamping pressure, fly ash content, sintering additive, sintering time, and sintering temperature on optimizing adhesion strength is evaluated. Parametric assessment of the developed coatings is done utilizing Taguchi L 18 orthogonal array and analysis of variance (ANOVA). Based on the analytical study of the experimentation, the dependence of adhesion strength of slurry sprayed coatings on the process parameters has been studied. Maximum adhesion strength value of 18.15?MPa was attained during experimentation within the range of the selected control parameters. The enhanced adhesion strength was found for increased sintering temperature up to 950°C which may be attributed to the improved sintering of mullite mixed fly ash due to lowering of secondary mullitization temperature. Furthermore, it has been proven experimentally that the quality of coatings achieved in this work is acceptable and approaching to the quality of thermal coatings manufactured with commercially available fabrication methods. 相似文献
11.
Translated from Izmeritel'naya Tekhnika, No. 11, pp. 26–27, November, 1991. 相似文献
12.
真空冷冻干燥技术是将含水物料在低温状态下冻结,然后在真空条件下,使冰直接升华成水蒸气并排掉脱水物料中的水分使物料干燥.因此真空冷冻干燥产品可以最大限度的保持新鲜物料的原有色、香、味.形和营养成分.本文通过对玫瑰花的真空冷冻干燥实验的分析,对影响真空冻干的过程参数进行了试验研究.试验表明隔板温度、干燥室真空度是很重要的两个参数;冻结速率对总冻干时间没影响. 相似文献
13.
为了提高铜线性能及其键合质量,采用拉力-剪切力测试仪、扫描电镜等研究了不同力学性能铜线及相应的键合参数对其键合质量的影响,分析了不同伸长率和拉断力、铜线表面缺陷、超声功率和键合压力对铜线键合质量的作用机制.结果表明:伸长率过小和拉断力过大会造成焊点颈部产生微裂纹,从而导致焊点的拉力和球剪切力偏低;表面存在缺陷的铜线其颈部经过反复塑性大变形会造成铜线表面晶粒和污染物脱落而出现短路和球颈部断裂;键合过程中键合压力过大能够引起的焊盘变形,同时较大的接触应力引起铝层溢出;过大的超声功率使键合区域变形严重产生明显的裂纹和引起键合附近区域严重的应力集中,致使器件使用过程中产生微裂纹而降低器件的使用寿命. 相似文献
14.
采用平面探针测试了衬底附近的电流密度,弧电流和衬底偏压的增加均有助于增加到达衬底附近的离子的数量。弧电流增加引起村底的温升,衬底偏压对衬底温度影响较小。采用多弧离子镀技术沉积Cr-N薄膜,衬底偏压对薄膜的硬度影响较小;弧电流增大,薄膜的硬度随之降低。XRD分析表明,弧电流较高时,不利于Cr—N相的形成,薄膜中以Cr的宏观液滴为主,薄膜硬度较低。 相似文献
16.
采用高速火焰喷涂技术以及等离子喷涂技术制备了Fe-Ni-B涂层.利用扫描电子显微镜(SEM)、X射线荧光光谱仪(EDX)分析了粉末以及涂层的微观结构、涂层到基体的成分分布.利用X射线衍射(XRD)分析了喷涂态的涂层物相.并对涂层的结合强度及抗热震性能进行了试验研究.研究结果认为:等离子喷涂层组织更为致密,但其热喷涂涂层存在的层状结构也更加明显.熔融液滴在涂层表面的平铺效果都比较好.Fe、Ni元素的分布从涂层到基体基本成均匀分布,避免了局部元素偏析所造成的应力集中.热震后,等离子喷涂涂层中的裂纹分布细小且无规律.高速火焰喷涂涂层裂纹主要集中在涂层与基体结合部位.根据材料抗热震性能的能量理论和弹性理论,等离子喷涂涂层的抗热震能力更强.并且涂层的断裂失效主要产生在结合部位. 相似文献
17.
In this paper, an iron coating was designed to fabricate on the surface layer of pure aluminum. The effects of process parameters such as immersion plating method, durations and temperatures on the microstructure of iron coating were studied systematically. The experimental results showed that the quality of the iron coating fabricated on the sample by one-step immersion plating is better than that obtained by two-step immersion plating. The iron coating obtained by one-step immersion plating for 1 min is continuous and without obvious gaps and cavities. With the immersion time increased to 3 min and 5 min, the coating is uneven and easy to fall off from the surface of sample. Additionally, due to that the higher temperature increases the efficiency of displacement reaction, the quality of the coating obtained at 40 °C is better than that obtained at 55 °C and 65 °C. Consequently, the optimal immersion plating parameters were one-step immersion plating, 1 min, and 40 °C. This paper provides a novel method to prepare an iron coating as a pretreatment for electroplating of aluminum. 相似文献
18.
Intermetallic compound (IMC) growth at the interface between a Sn coating and a Cu substrate with or without a Ni underlayer and its related stress state was evaluated by real-time measurements using the flexure beam method. For the Sn coating without a Ni underlayer, pyramid-shaped IMC grains of Cu 6Sn 5 grew along the grain boundaries of Sn from the Cu substrate, especially at the triple grain boundary junctions and the IMC grains rapidly increased their volume during the initial 3 days, During this time, the IMC growth rate was 2.3 ??m 3/day and the compressive stress in the Sn coating rapidly developed and became saturated at about ?11 MPa. In contrast, platelet IMC grains of Ni 3Sn 4 formed at the surface of the Ni underlayer and the IMCs grew at a rate of 1.0 ??m 3/day for the Sn/Ni coating. In addition, the stress in the Sn coating with a Ni underlayer remained low, slightly tensile and no whiskers were formed on the Sn plating. Therefore, the IMC growth rate and shape are key factors that affect the mechanism of Sn whisker growth during room temperature storage. 相似文献
19.
为解决成本低廉的铜基导电油墨在空气中、低温烧结时极易氧化而限制其在柔性电子器件领域广泛应用的问题,探究烧结工艺对其导电性的影响.以微米级片状铜粉溶入混合有机溶剂制备导电油墨,以毛笔直书的方法制备导电图案,并在空气中对导电图案进行操作简便的红外烧结,同时对其表面进行多次喷涂抗坏血酸(Vc)的水溶液并进行热压处理,结果发现... 相似文献
20.
The paper describes the physicochemical processes of concrete carbonation and presents a simple mathematical model for the evolution of carbonation in time, applicable under constant relative humidity higher than 50%. The model is based on fundamental principles of chemical reaction engineering, and uses as parameters the ambient concentration of CO 2, the molar concentratrations of the carbonatable constituents, Ca(OH) 2 and CSH, in the concrete volume, and the effective diffusivity of CO 2 in carbonated concrete. The latter is given by an empirical function of the porosity of hardened cement paste and of relative humidity, derived from laboratory diffusion tests. The validity of the model for OPC or pozzolanic cement concretes and mortars is demonstrated by comparison of its predictions with accelerated carbonation test results obtained in an environment of controlled CO 2 concentration, humidity and temperature. The mathematical model is extended to cover the case of carbonation of the coating-concrete system, for concrete coated with a cement-lime mortar finish, applied either almost immediately after the end of concrete curing or with a delay of a certain time. Parametric studies are performed to show how the evolution of carbonation depth with time is affected by cement and concrete composition (water/cement or aggregate/cement ratio, percentage OPC or aggregate replacement by a pozzolan), environmental factors (relative humidity, ambient concentration of CO 2), the presence and the time of application of a lime-cement mortar coating and its composition (water/cement, aggregate/cement and lime/cement ratios of the mortar, percentage OPC or aggregate replacement by a pozzolan). 相似文献
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