Piezoelectric micromachined ultrasonic transducers based on PZT thin films

This paper describes fabrication and characterization results of piezoelectric micromachined ultrasonic transducers (pMUTs) based on 2-microm-thick Pb(Zr0.53Ti0.47O3) (PZT) thin films. The applied structures are circular plates held at four bridges, thus partially unclamped. A simple analytical model for the fully clamped structure is used as a reference to optimize design parameters such as thickness relations and electrodes, and to provide approximate predictions for coupling coefficients related to previously determined thin film properties. The best coupling coefficient was achieved with a 270-microm plate and amounted to kappa2 = 5.3%. This value compares well with the calculated value based on measured small signal dielectric (epsilon = 1050) and piezoelectric (e3l,f = 15 Cm(-2)) properties of the PZT thin film at 100 kV/cm dc bias. The resonances show relatively large Q-factors, which can be partially explained by the small diameters as compared to the sound wavelength in air and in the test liquid (Fluorinert 77). A transmit-receive experiment with two quasi-identical pMUTs was performed showing significant signal transmission up to a distance of 20 cm in air and 2 cm in the test liquid.     

Capacitive micromachined ultrasonic transducers: fabrication technology

Capacitive micromachined ultrasonic transducer (cMUT) technology is a prime candidate for next generation imaging systems. Medical and underwater imaging and the nondestructive evaluation (NDE) societies have expressed growing interest in cMUTs over the years. Capacitive micromachined ultrasonic transducer technology is expected to make a strong impact on imaging technologies, especially volumetric imaging, and to appear in commercial products in the near future. This paper focuses on fabrication technologies for cMUTs and reviews and compares variations in the production processes. We have developed two main approaches to the fabrication of cMUTs: the sacrificial release process and the recently introduced wafer-bonding method. This paper gives a thorough review of the sacrificial release processes, and it describes the new wafer-bonding method in detail. Process variations are compared qualitatively and quantitatively whenever possible. Through these comparisons, it was concluded that wafer-bonded cMUT technology was superior in terms of process control, yield, and uniformity. Because the number of steps and consequent process time were reduced (from six-mask process to four-mask process), turn-around time was improved significantly.     

Deep-collapse operation of capacitive micromachined ultrasonic transducers

Capacitive micromachined ultrasonic transducers (CMUTs) have been introduced as a promising technology for ultrasound imaging and therapeutic ultrasound applications which require high transmitted pressures for increased penetration, high signal-to-noise ratio, and fast heating. However, output power limitation of CMUTs compared with piezoelectrics has been a major drawback. In this work, we show that the output pressure of CMUTs can be significantly increased by deep-collapse operation, which utilizes an electrical pulse excitation much higher than the collapse voltage. We extend the analyses made for CMUTs working in the conventional (uncollapsed) region to the collapsed region and experimentally verify the findings. The static deflection profile of a collapsed membrane is calculated by an analytical approach within 0.6% error when compared with static, electromechanical finite element method (FEM) simulations. The electrical and mechanical restoring forces acting on a collapsed membrane are calculated. It is demonstrated that the stored mechanical energy and the electrical energy increase nonlinearly with increasing pulse amplitude if the membrane has a full-coverage top electrode. Utilizing higher restoring and electrical forces in the deep-collapsed region, we measure 3.5 MPa peak-to-peak pressure centered at 6.8 MHz with a 106% fractional bandwidth at the surface of the transducer with a collapse voltage of 35 V, when the pulse amplitude is 160 V. The experimental results are verified using transient FEM simulations.     

Finite-element analysis of capacitive micromachined ultrasonic transducers

In this paper, we present the results of finite-element analysis performed to investigate capacitive micromachined ultrasonic transducers (CMUTs). Both three-dimensional (3-D) and 2-D models were developed using a commercially available finite-element modeling (FEM) software. Depending on the dimensionality of the model, the membranes were constructed using plane or shell elements. The electrostatic gap was modeled using many parallel plate transducers. An axisymmetric model for a single membrane was built; the electrical input impedance of the device then was calculated in vacuum to investigate series and parallel resonant frequencies, where the input impedance has a minimum and a maximum, respectively. A method for decomposing the membrane capacitance into parasitic and active parts was demonstrated, and it was shown that the parallel resonant frequency shifted down with increased biased voltage. Calculations then were performed for immersion transducers. Acoustic wave propagation was simulated in the immersion medium, using appropriate elements in a 3-D model. Absorbing boundaries were implemented to avoid the reflections at the end of the medium mesh. One row of an array element, modeled with appropriate boundary conditions, was used to calculate the output pressure. The results were compared with a simpler model: a single membrane in immersion, with symmetry boundary conditions on the sidewalls that cause the calculations to reflect the properties of an infinitely large array. A 2-D model then was developed to demonstrate the effect of membrane dimensions on the output pressure and bandwidth. Our calculations revealed that the small signal transmit pressure was inversely proportional to the square root of gap height. We also compared FEM results with analytical and experimental results.     

Dynamic analysis of capacitive micromachined ultrasonic transducers

Electrostatic transducers are usually operated under a DC bias below their collapse voltage. The same scheme has been adopted for capacitive micromachined ultrasonic transducers (cMUTs). DC bias deflects the cMUT membranes toward the substrate, so that their centers are free to move during both receive and transmit operations. In this paper, we present time-domain, finite element calculations for cMUTs using LS-DYNA, a commercially available finite element package. In addition to this DC bias mode, other new cMUT operations (collapse and collapse-snapback) have recently been demonstrated. Because cMUT membranes make contact with the substrate in these new operations, modeling of these cMUTs should include contact analysis. Our model was a cMUT transducer consisting of many hexagonal membranes; because it was symmetrical, we modeled only one-sixth of a hexagonal cell loaded with a fluid medium. The finite element results for both conventional and collapse modes were compared to measurements made by an optical interferometer; a good match was observed. Thus, the model is useful for designing cMUTs that operate in regimes where membranes make contact with the substrate.     

Radiation impedance of collapsed capacitive micromachined ultrasonic transducers

The radiation impedance of a capacitive micromachined ultrasonic transducer (CMUT) array is a critical parameter to achieve high performance. In this paper, we present a calculation of the radiation impedance of collapsed, clamped, circular CMUTs both analytically and using finite element method (FEM) simulations. First, we model the radiation impedance of a single collapsed CMUT cell analytically by expressing its velocity profile as a linear combination of special functions for which the generated pressures are known. For an array of collapsed CMUT cells, the mutual impedance between the cells is also taken into account. The radiation impedances for arrays of 7, 19, 37, and 61 circular collapsed CMUT cells for different contact radii are calculated both analytically and by FEM simulations. The radiation resistance of an array reaches a plateau and maintains this level for a wide frequency range. The variation of radiation reactance with respect to frequency indicates an inductance-like behavior in the same frequency range. We find that the peak radiation resistance value is reached at higher kd values in the collapsed case as compared with the uncollapsed case, where k is the wavenumber and d is the center-to-center distance between two neighboring CMUT cells.     

Optimization of the gain-bandwidth product of capacitive micromachined ultrasonic transducers

Capacitive micromachined ultrasonic transducers (cMUT) have large bandwidths, but they typically have low conversion efficiencies. This paper defines a performance measure in the form of a gain-bandwidth product and investigates the conditions in which this performance measure is maximized. A Mason model corrected with finite-element simulations is used for the purpose of optimizing parameters. There are different performance measures for transducers operating in transmit, receive, or pulse-echo modes. Basic parameters of the transducer are optimized for those operating modes. Optimized values for a cMUT with silicon nitride membrane and immersed in water are given. The effect of including an electrical matching network is considered. In particular, the effect of a shunt inductor in the gain-bandwidth product is investigated. Design tools are introduced, which are used to determine optimal dimensions of cMUTs with the specified frequency or gain response.     

Finite element analysis of underwater capacitor micromachined ultrasonic transducers

A simple electromechanical equivalent circuit model is used to predict the behavior of capacitive micromachined ultrasonic transducers (cMUT). The equivalent circuit model of the cMUT lacks important features such as coupling to the substrate and the ability to predict crosstalk between elements of an array of transducers. To overcome these deficiencies, a finite element model of the cMUT is constructed using the commercial code ANSYS(R). Calculation results of the complex load impedance seen by single capacitor cells are presented, then followed by a calculation of the plane wave real load impedance seen by a parallel combination of many cells that are used to make a transducer. Crosstalk between 1-D array elements is found to be due to two main sources: coupling through a Stoneley wave propagating at the transducer-water interface and coupling through Lamb waves propagating in the substrate. To reduce the crosstalk level, the effect of structural variations of the substrate are investigated, which includes a change of its thickness and etched trenches or polymer walls between array elements     

Characterization of micromachined ultrasonic transducers using light diffraction tomography

This paper demonstrates that light diffraction tomography can be used to measure the acoustic field of micromachined ultrasonic transducers (MUT) in cases in which standard methods like hydrophone and microphone measurements fail. Two types of MUTs have been characterized with the method, one air-coupled capacitive MUT (cMUT) and one waterloaded continuous wave (CW) miniature multilayer lead zirconate titanate (PZT) transducer. Light diffraction tomography is an ultrasound measurement method with some special characteristics. Based on the interaction of light and ultrasound, it combines light intensity measurements with tomography algorithms to produce a measurement system. The method offers nonperturbing pressure measurements with high spatial resolution. It has been shown that, under certain circumstances, light diffraction tomography can be used as an absolute pressure measurement method with accuracy in the order of 10% in water and 13% in air. The results show that air-coupled cMUTs in the frequency range of about 1 MHz as well as the extreme near field of a miniaturized CW 10 MHz water-loaded transducer were successfully characterized with light diffraction tomography.     

Vibration maps of capacitive micromachined ultrasonic transducers by laser interferometry

A 1.8-mm × 1.8-mm capacitive micromachined ultrasonic transducer (CMUT) element is experimentally characterized by means of optical measurements. Optical displacement measurements provide information on the resonant behavior of the single membranes and also allow us to investigate the dispersion in the frequency spectrum of adjacent membranes. In addition, higher order mode shapes are observed, showing that either symmetrical or asymmetrical modes are excited in CMUT membranes. Laser interferometry vibration maps, combined with quantitative displacement measurements, provide information about the quality and repeatability of the fabrication process, which is a basic requirement for 2D array fabrication for ultrasound imaging     

A solution to the charging problems in capacitive micromachined ultrasonic transducers

We report on a capacitive micromachined ultrasonic transducer (CMUT) featuring isolation posts (PostCMUT) as a solution to the charging problems caused by device fabrication and operation. This design improves the device reliability. The PostCMUTs were fabricated using a newly developed process based on the wafer-bonding technique. Paired tests showed the superior reliability characteristics of the PostCMUT design compared to those of conventional CMUT designs. No deleterious effect of the new design was seen in preliminary ultrasonic tests or in process yield. PostCMUTs, a design that serves as a solution to the aforementioned reliability problem, constitutes a major contribution to CMUT commercialization.     

Capacitive micromachined ultrasonic transducers with piston-shaped membranes: fabrication and experimental characterization

Capacitive micromachined ultrasonic transducers (CMUTs) featuring piston-shaped membranes (piston CMUTs) were developed to improve device performance in terms of transmission efficiency, reception sensitivity, and fractional bandwidth (FBW). A piston CMUT has a relatively flat active moving surface whose membrane motion is closer to ideal piston-type motion compared with a CMUT with uniformly thick membranes (classical CMUT). Piston CMUTs with a more uniform surface displacement profile can achieve high output pressure with a relatively small electrode separation. The improved device capacitance and gap uniformity also enhance detection sensitivity. By adding a center mass to the membrane, a large ratio of second-order resonant frequency to first-order resonant frequency was achieved. This improved the FBW. Piston CMUTs featuring membranes of different geometric shapes were designed and fabricated using wafer bonding. Fabricating piston CMUTs is a more complex process than fabricating CMUTs with uniformly thick membranes. However, no yield loss was observed. These devices achieved ~100% improvement in transduction performance (transmission and reception) over classical CMUTs. For CMUTs with square and rectangular membranes, the FBW increased from ~110% to ~150% and from ~140% to ~175%, respectively, compared with classical CMUTs. The new devices produced a maximum output pressure exceeding 1 MPa at the transducer surface. Performance optimization using geometric membrane shape configurations was the same in both piston CMUTs and classical CMUTs.     

Electrostatic airborne ultrasonic transducers: modeling and characterization

An a priori theoretical model for electrostatic airborne ultrasonic transducers has been developed. The historical development of transducer modeling is briefly reviewed. This paper applies the plate-on-air-spring model to establish a mathematical formulation for the transducer behavior in terms of the characterized impedance parameters. It is clarified that such an electrostatic transducer is a capacitive-type device and obeys the reciprocity principle in the same way as a piezoelectric device. The accurate prediction of multiple resonant frequencies and transmitting responses for a typical V-grooved backplate transducer serve to substantiate the theoretical model.     

Comparison of conventional and collapsed region operation of capacitive micromachined ultrasonic transducers

We report experimental results from a comparative study on collapsed region and conventional region operation of capacitive micromachined ultrasonic transducers (CMUTs) fabricated with a wafer bonding technique. Using ultrasonic pulse-echo and pitch-catch measurements, we characterized single elements of 1-D CMUT arrays operating in oil. The experimental results from this study agreed with the simulation results: a CMUT operating in the collapsed region produced a higher maximum output pressure than a CMUT operated in the conventional region at 90% of its collapse voltage (3 kPa/V vs. 16.1 kPa/V at 2.3 MHz). While the pulse-echo fractional bandwidth (126%) was higher in the collapsed region operation than in the conventional operation (117%), the pulse-echo amplitude in collapsed region operation was 11 dB higher than in conventional region operation. Furthermore, within the range of tested bias voltages, the output pressure monotonously increased with increased bias during collapsed region operation. It was also found that in the conventional mode, short AC pulses (larger than the collapse voltage) could be applied without collapsing the membranes. Finally, while no significant difference was observed in reflectivity of the CMUT face between the two regions of operation, hysteretic behavior of the devices was identified in the collapsed region operation.     

Calculation and measurement of electromechanical coupling coefficient of capacitive micromachined ultrasonic transducers

The electromechanical coupling coefficient is an important figure of merit of ultrasonic transducers. The transducer bandwidth is determined by the electromechanical coupling efficiency. The coupling coefficient is, by definition, the ratio of delivered mechanical energy to the stored total energy in the transducer. In this paper, we present the calculation and measurement of coupling coefficient for capacitive micromachined ultrasonic transducers (CMUTs). The finite element method (FEM) is used for our calculations, and the FEM results are compared with the analytical results obtained with parallel plate approximation. The effect of series and parallel capacitances in the CMUT also is investigated. The FEM calculations of the CMUT indicate that the electromechanical coupling coefficient is independent of any series capacitance that may exist in the structure. The series capacitance, however, alters the collapse voltage of the membrane. The parallel parasitic capacitance that may exist in a CMUT or is external to the transducer reduces the coupling coefficient at a given bias voltage. At the collapse, regardless of the parasitics, the coupling coefficient reaches unity. Our experimental measurements confirm a coupling coefficient of 0.85 before collapse, and measurements are in agreement with theory.     

Low temperature fabrication of immersion capacitive micromachined ultrasonic transducers on silicon and dielectric substrates

A maximum processing temperature of 250/spl deg/C is used to fabricate capacitive micromachined ultrasonic transducers (CMUTs) on silicon and quartz substrates for immersion applications. Fabrication on silicon provides a means for electronics integration via post-complementary metal oxide semiconductor (CMOS) processing without sacrificing device performance. Fabrication on quartz reduces parasitic capacitance and allows the use of optical displacement detection methods for CMUTs. The simple, low-temperature process uses metals both as the sacrificial layer for improved dimensional control, and as the bottom electrode for good electrical conductivity and optical reflectivity. This, combined with local sealing of the vacuum cavity by plasma-enhanced chemical-vapor deposition of silicon nitride, provides excellent control of lateral and vertical dimensions of the CMUTs for optimal device performance. In this paper, the fabrication process is described in detail, including process recipes and material characterization results. The CMUTs fabricated for intravascular ultrasound (IVUS) imaging in the 10-20 MHz range and interdigital CMUTs for microfluidic applications in the 5-20 MHz range are presented as device examples. Intra-array and wafer-to-wafer process uniformity is evaluated via electrical impedance measurements on 64-element ring annular IVUS imaging arrays fabricated on silicon and quartz wafers. The resonance frequency in air and collapse voltage variations are measured to be within 1% and 5%, respectively, for both cases. Acoustic pressure and pulse echo measurements also have been performed on 128 /spl mu/m/spl times/32 /spl mu/m IVUS array elements in water, which reveal a performance suitable for forward-looking IVUS imaging at about 16 MHz.     

Fabrication and characterization of piezoelectric micromachined ultrasonic transducers with thick composite PZT films

Ferroelectric microelectromechanical systems (MEMS) has been a growing area of research in past decades, in which ferroelectric films are combined with silicon technology for a variety of applications, such as piezo-electric micromachined ultrasonic transducers (pMUTs), which represent a new approach to ultrasound detection and generation. For ultrasound-radiating applications, thicker PZT films are preferred because generative force and response speed of the diaphragm-type transducers increase with increasing film thickness. However, integration of 4- to 20-microm thick PZT films on silicon wafer, either the deposition or the patterning, is still a bottleneck in the micromachining process. This paper reports on a diaphragm-type pMUT. A composite coating technique based on chemical solution deposition and high-energy ball milled powder has been used to fabricate thick PZT films. Micromachining of the pMUTs using such thick films has been investigated. The fabricated pMUT with crack-free PZT films up to 7-microm thick was evaluated as an ultrasonic transmitter. The generated sound pressure level of up to 120 dB indicates that the fabricated pMUT has very good ultrasound-radiating performance and, therefore, can be used to compose pMUT arrays for generating ultrasound beam with high directivity in numerous applications. The pMUT arrays also have been demonstrated.     

Acoustic coupling in capacitive microfabricated ultrasonic transducers: modeling and experiments

In the design of low-frequency transducer arrays for active sonar systems, the acoustic interactions that occur between the transducer elements have received much attention. Because of these interactions, the acoustic loading on each transducer depends on its position in the array, and the radiated acoustic power may vary considerably from one element to another. Capacitive microfabricated ultrasonic transducers (CMUT) are made of a two-dimensional array of metallized micromembranes, all electrically connected in parallel, and driven into flexural motion by the electrostatic force produced by an applied voltage. The mechanical impedance of these membranes is typically much lower than the acoustic impedance of water. In our investigations of acoustic coupling in CMUTs, interaction effects between the membranes in immersion were observed, similar to those reported in sonar arrays. Because CMUTs have many promising applications in the field of medical ultrasound imaging, understanding of cross-coupling mechanisms and acoustic interaction effects is especially important for reducing cross-talk between array elements, which can produce artifacts and degrade image quality. In this paper, we report a finite-element study of acoustic interactions in CMUTs and experimental results obtained by laser interferometry measurements. The good agreement found between finite element modeling (FEM) results and optical displacement measurements demonstrates that acoustic interactions through the liquid represent a major source of cross coupling in CMUTs.