RHEED振荡精确测量AlGaAs生长速率研究

采用分子束外延技术，在GaAs衬底上生长GaAs，AlAs和AlGaAs时，实现RHEED图像和RHEED强度振荡的实时监测已被证明是一种有效工具。通过RHEED可讨论GaAs表面结构和生长机制，并可以估算衬底温度，更重要的是能计算出材料的生长速率。RHEED强度振荡周期决定生长速率，每一个周期对应一个单层。实验测量GaAs的生长周期为0．82s，每秒沉积1．22单分子层，AlAs的生长周期为2．35s，每秒沉积0．43单分子层。     

RHEED优化MBE生长中波MCT薄膜工艺

在分子束外延(MBE)中波HgCdTe薄膜过程中,利用反射式高能电子衍射(RHEED)对衬底表面脱氧和生长过程中生长参数对材料特性的影响进行研究.通过观察RHEED图样的变化,确定了衬底的脱氧状况,获得了生长中衬底温度等生长参数变化引起材料结晶的变化规律,为MBE生长HgCdTe薄膜实验的可控生长提供有效帮助;生长结束后,通过SEM、Hall等手段对HgCdTe的表面缺陷、电学参数等性能进行了初步研究,证明实验说成长的材料基本满足器件制备的要求.     

GaAs同质外延生长过程的RHEED分析

采用激光分子束外延方法(L-MBE),在GaAs(001)衬底上同质外延GaAs薄膜。利用反射式高能电子衍射(RHEED)研究了材料沉积过程中的各级条纹及其强度的变化,进而得出GaAs薄膜外延生长的适宜激光能量和沉积温度分别为500 mJ和570℃。RHEED强度随时间的变化曲线表明,GaAs为良好的层状外延生长模式,并随着沉积时间延长,层状生长模式逐渐向岛状模式转变。实验研究还表明层状生长的GaAs薄膜经表面弛豫后,可以得到更好的平整表面,并出现GaAs(001)-(2×4)的表面重构。原位X射线光电子能谱仪(XPS)研究表明沿(001)面外延的GaAs薄膜表面Ga∶As化学计量比约为52∶48,出现Ga的聚集。     

RHEED优化MBE异质材料生长工艺

利用高能电子衍射振荡研究MBE异质材料生长工艺。优化了AlGaAs/InGaAs/GaAs材料生长工艺。通过霍耳测量、X射线双晶衍射及二次离子质谱研究了利用该工艺生长的AlGaAs/InGaAs/GaAs双δ掺杂PHEMT结构材料,获得了较好的材料参数。利用该材料研制器件也有较好的结果。     

分子束外延InAs量子点的RHEED实时原位分析

介绍了利用反射式高能电子衍射(RHEED)方法在自组装InAs量子点制备过程中进行结构分析的理论研究与实验工作的最新进展。从反射式高能电子衍射在InAs量子点临界转变状态测定、量子点表面取向、量子点应力分布测定、量子点形核长大动力学过程研究等方面的应用,可以看出RHEED在InAs量子点形成过程中对多种结构特征的原位分析具有突出优势。反射式高能电子衍射仪作为分子束外延系统中的标准配置,已成为一种对InAs量子点微观结构进行分析的简易而理想的分析测试工具。随着反射式高能电子衍射以及衍射理论的进一步发展,必将促进InAs量子点结构的精确表征水平的提高,进而实现更加理想结构的InAs量子点的制备及其应用。     

RHEED在计算Al2O3晶面间距中的应用

反射式高能电子衍射仪(RHEED)是一种表面分析工具,以往都是用来对晶体进行定性观察,以研究晶体的结晶状况,很少用来进行晶体结构的定量计算.在分析RHEED的工作原理的基础上,研究了A1203衍射条纹宽度、电子束入射方向和晶面方向之间的关系,并尝试利用RHEED来分析和计算Al2O3(0001)面上两个重要方向上的晶面间距,得到了理想的结果.由于RHEED是一种原位监测仪器,所以可对薄膜的生长进行实时原位监测.在测晶面间距等常数时,与对样品要求极高的透射电子显微镜相比,RHEED更方便.     

GaAs MBE生长过程中的RHEED强度振荡

本文报道了用RHEED强度振荡方法来测定GaAs,Al_xGa_(1-x)As生长速度及Al组分,并初步讨论了产生RHEED强度振荡的机制及其与生长条件的关系。     

GaAs和AlGaAs MBE外延生长动力学研究

研究了在ＧａＡｓ（００１）衬底上外延生长ＧａＡｓ、ＡｌＧａＡｓ材料过程中反射高能电子衍射（ＲＨＥＥＤ）的各级条纹及其强度随生长过程的变化。通过对各级条纹强度振荡周期和位相的分析,应用二维成核层状生长模型解释了实验结果：生长表面形貌的周期性变化导致了ＲＨＥＥＤ各级条纹及其强度的周期性变化。     

生长温度对L-MBE制备的ZnO薄膜性能的影响

在蓝宝石C面上利用激光分子束外延(L-MBE)的方法,分别在250、300、350、400和450 ℃下生长了高度C轴取向的ZnO薄膜,并对样品进行了X射线衍射、光致发光谱及反射式高能电子衍射的分析.测试结果表明,较低温度时,随着生长温度的升高,薄膜的结晶及发光性能得到提高;但是当温度进一步升高,却有所变差.这说明利用L-MBE系统制备ZnO薄膜存在一合适的温度范围,并对此机理进行了深入分析.     

Real-time monitoring of the surface stoichiometry during molecular beam epitaxy of cubic GaN on (001) GaAs by RHEED

We study the plasma-assisted molecular beam epitaxy of cubic GaN on GaAs(OOl) substrates by means ofin-situ reflection high-energy electron diffraction. The epilayers are characterized by x-ray diffraction, photoluminescence, and Hall measurements, and it is found that the overall best films are grown under a N/Ga ratio close to one. For anin-situ determination of the N/Ga ratio, the growth kinetics is studied via surface reconstruction transitions. The effective N flux giving rise to growth is measured using the transient behavior of the half-order diffraction streak intensity for various plasma operating conditions.     

MBE growth and properties of ZnO on sapphire and SiC substrates

Molecular beam epitaxy (MBE) of ZnO on both sapphire and SiC substrates has been demonstrated. ZnO was used as a buffer layer for the epitaxial growth of GaN. ZnO is a würtzite crystal with a close lattice match (<2% mismatch) to GaN, an energy gap of 3.3 eV at room temperature, a low predicted conduction band offset to both GaN and SiC, and high electron conductivity. ZnO is relatively soft compared to the nitride semiconductors and is expected to act as a compliant buffer layer. Inductively coupled radio frequency plasma sources were used to generate active beams of nitrogen and oxygen for MBE growth. Characterization of the oxygen plasma by optical emission spectroscopy clearly indicated significant dissociation of O₂ into atomic oxygen. Reflected high energy electron diffraction (RHEED) of the ZnO growth surface showed a two-dimensional growth. ZnO layers had n-type carrier concentration of 9 × 10¹⁸ cm⁻³ with an electron mobility of 260 cm²/V-s. Initial I-V measurements displayed ohmic behavior across the SiC/ZnO and the ZnO/GaN heterointerfaces. RHEED of GaN growth by MBE on the ZnO buffer layers also exhibited a two-dimensional growth. We have demonstrated the viability of using ZnO as a buffer layer for the MBE growth of GaN.     

GaSb(001) Surface Reconstructions Measured at the Growth Front by Surface X-ray Diffraction

Surface x-ray diffraction was employed, in situ, to measure the GaSb(001)-(1 × 5) and (1 × 3) surface phases under technologically relevant growth conditions. We measured a large set of fractional-order in-plane diffraction peaks arising from the superstructure of the surface reconstruction. From the data we calculated two-dimensional (2D) Patterson functions, the peaks of which represent inter-atomic distances weighted by the number of electrons in the individual atoms. For the (1 × 3) phase we obtained good agreement between our data and the β(4 × 3) model proposed in recent experimental and theoretical work. Our measurements on the Sb-rich (1× 5) phase provide evidence that the structure under growth conditions is, in fact, different from that of the models previously suggested on the basis of scanning tunneling microscopy (STM). We discuss reasons for this discrepancy as well as the identified structural elements for these reconstructions, which include surface relaxations and subsurface rearrangement.     

940 nm高功率半导体激光器研究

报道了一种采用大光学腔结构的InGaAs/GaAs/AlGaAs应变量子阱高功率半导体激光器。在量子阱能级本征值方程的数值求解基础上 ,优化了InGaAs阱层材料的In组份含量 ;采用大光学腔结构以有效降低垂直于结平面方向的光束发散角及腔面的光功率密度 ,实现器件的高功率、低发散角光。设计的激光器外延结构采用分子束外延 (MBE)方法生长 ,成功获得具有较低激射阈值的 94 0nm波长激光器外延片。对 10 0 μm条形 ,10 0 0 μm腔长的制备器件测试表明 ,器件的最大连续输出功率达到 2W ,峰值波长为 939.4nm ,远场水平发散角为 10° ,垂直发散角为 30°。器件的阈值电流为 30 0mA。     

Influence of Substrate Orientation on the Growth of HgCdTe by Molecular Beam Epitaxy

An empirical study is reported, wherein HgCdTe was deposited simultaneously on multiple CdZnTe substrates of different orientations by molecular beam epitaxy. These orientations included the following vicinal surfaces: (115)B, (113)B, (112)B, and (552)B. Additionally, growth on (111)B was explored. Growth conditions found to be nearly optimalfor the standard (112)B orientation were selected. Through a series of growth runs, substrate temperature was varied, and the physical properties of the resulting HgCdTe epilayers were measured. These measurements included Nomarski microscopy, infrared transmission, x-ray diffraction, and defect decoration etching. The properties of HgCdTe epilayers as a function of temperature were roughly similar for all vicinal surfaces. Namely, as the temperature increased, the dislocation density decreased. At some critical temperature, the density of void defects increased dramatically. This critical temperature varied with orientation, the (115)B exhibiting the lowest critical temperature and the (112)B and (552)B exhibiting the highest. The (115)B, (113)B, and (112)B orientations exhibited “needlelike” defects on the as-grown HgCdTe surface. The density of these defects decreased with increasing temperature. The (552)B surface exhibited no such defects and growth behavior nearly identical to the (112)B growthsurface.     

The Use of Cathodoluminescence during Molecular Beam Epitaxy Growth of Gallium Nitride to Determine Substrate Temperature

In-situ cathodoluminescence (CL) measurement during growth of gallium nitride (GaN) by molecular beam epitaxy (MBE) was investigated for determining substrate temperature. Cathodoluminescence was easily observed from room temperature up to and beyond typical temperatures used during growth. Determination of the peak energy of the CL spectrum allows unambiguous determination of the substrate temperature. Temperature drift and reproducibility issues during growth of GaN were observed using the in-situ CL measurement.     

Chemical beam etching of InP in GSMBE

Etching of InP using a beam of PC1₃ is demonstrated in a standard gas source molecular beam epitaxy machine. The principle of an atomic layer accurate end-point detection technique usingin-situ reflection high energy electron diffrac-tion is described and used to study the kinetics of PCl₃ etching. The etch rate is found proportional to the PCI₃ fluence and weakly dependent on the substrate temperature. The morphology of etched surfaces and the etch rate uniformity is compatible with the regrowth of high quality InGaAsP active structures and with the realization of etch and regrowth sequences controlled at the nm scale. Etch profiles at mask edges are defined by nearly perfect crystallographic facets with a very limited mask undercut (≈100 nm) due to the beam nature of the etching technique.