共查询到19条相似文献,搜索用时 127 毫秒
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室温固化环氧胶粘剂的研究现状与发展趋势 总被引:18,自引:1,他引:17
本文综述了双组分室温固化环氧树脂胶粘剂的发展过程与研究现状,介绍了近年来国内外几种性能优异的室温固化环氧胶粘剂,指出双组分室温固化型环氧胶的发展趋势是耐高温、高强度、高耐久性及快速固化。 相似文献
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双马来酸亚胶树脂基体耐热性好,具有优异的使用性能;但固化温度往往高于200℃。引发剂可有效地降低固化温度,但所得树脂基体脆性很大。本文在二元胺扩链、烯丙基双酚A共聚后的双马来酰亚胺树脂锄中加入引发剂,制得一种软化点低、韧性适中、耐热性好、贮存稳定的低温固化双马来酰亚胺树脂BDDD体系。为今后该树脂在复合材料构件上的应用奠定了良好的基础。 相似文献
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室温固化厚胶层高强度环氧胶粘剂 总被引:1,自引:0,他引:1
采用环氧树脂予先与端羧基液体丁腈橡胶接枝以及合成子主链上带有多个醚键的二胺作固化剂,使调制的双组份糊状室温固化型环氧胶粘剂的甲、乙两组份均具有内增韬机制的双组份糊状室温固化型环氧胶粘剂的甲使得到的室温固化环氧胶具有极高剪切和剥离强度,并展现了厚胶层条件下仍具有高强度的特点。 相似文献
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Recently developed epoxy paste adhesives, reactive hot melts, adhesive film tape and polyurethane adhesives are presented for structural bonding in the automotive industry. Paste adhesives usually require a precure stage to obtain handling strength of the joints and to guarantee wash-out resistance of the adhesive in the paint baths. This step can be omitted with reactive hot melts and adhesive film tape, which are solid before and after their application. In addition they allow an improved working hygiene. Some mechanical properties of the adhesives are shown such as lap shear strength and peel strength as well as lap shear strength as a function of the bondline thickness. Results of the excellent durability of epoxy one-component pastes, reactive hot melts and adhesive film tape are given from cyclic environmental and salt spray tests. 相似文献
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Sara R. Halper Elizabeth W. Coir 《International Journal of Adhesion and Adhesives》2011,31(6):473-477
A ninhydrin-coated, pressure-sensitive adhesive tape has been developed for the purpose of detecting specific chemical substances in various materials. Ninhydrin undergoes a visible color change in the presence of amines, isocyanates, and other chemical compounds. The tape was prepared by dissolving ninhydrin and applying it to an adhesive tape with an airbrush. The tape was allowed to dry and then applied to the surface of various cured and uncured materials to test for reactivity. It was then used successfully to detect unreacted components present in uncured or partially cured epoxy adhesives and coatings. 相似文献
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J.D. EngererE. Sancaktar 《International Journal of Adhesion and Adhesives》2011,31(5):373-379
The effects of the presence and size of gaps in the band single lap joint geometry were studied. Two types of adhesives: a deformable, acrylic tape and epoxy putty were used as model adhesives. When using the epoxy putty, the substrate overlap end conditions were also varied by machining 10° end tapers in some joints. For both adhesive types, the introduction of the gap had a moderate negative effect on the load carrying characteristics of the joint, but joints utilizing the epoxy putty maintained joint strength as the gap size was increased to 9.53 mm (38% gap), while the highly deformable acrylic tape case displayed a constant decline and maintaining constant ultimate shear stress values. We suspect that this variation is due to a combination of the different failure modes of each adhesive and their differing moduli, as well as how these relate to the peeling stresses at the ends of the bond length. In the epoxy putty series, the samples with tapered substrates consistently carried higher loads than those with unmodified substrates. This improvement is a manifestation of the ability of the tapered joint geometry to reduce peeling stresses experienced within the adhesive layer. 相似文献
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V. V. Arslanov
W. Funke
《Progress in Organic Coatings》1988,15(4):355-363Water normally decreases the strength of adhesive joints. In the case of epoxy coatings on aluminium, however, after an initial decrease the adhesive strength increased with the time of exposure to water. It is suggested that this increase is caused by the hydration of aluminium oxide adjacent to the adhesive joint, thus enabling additional hydrogen bonding between the organic coating and its support.
Results obtained by measuring adhesion with peel and tape tests on aluminium foil and an alloy with different surface pretreatments and different curing conditions have been compared. It is shown that the tape test is useful for the semi-quantitative determination of the stability towards water of an adhesive joint. 相似文献
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Phenyl glycidyl ether was used to react with solid metaphenylene diamine (MPDA) to produce N-(3-phenoxy-2-hydroxypropyl)-1,3-benzenediamine (NPHB). MPDA was intentionally formulated to have an excessive amount to obtain a new liquid MPDA–NPHB mixture. The mixed curing agent was indicated to have a few advantages over MPDA. The mixed curing agent was then used to cure diglycidyl ether of bisphenol A as cryogenic epoxy adhesive. The effects of the MPDA–NPHB content were systematically studied on the impact strength and shear strength at both room temperature and cryogenic nitrogen temperature of the epoxy adhesive. Moreover, two coupling agents with various contents were used to further enhance the shear strength of the optimal cryogenic epoxy adhesive. Finally, differential scanning calorimetry analysis showed that the modified adhesive showed a higher glass transition temperature than the unmodified adhesive. 相似文献
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A. Bernasconi S. Cardamone M. Giglio 《Journal of Adhesion Science and Technology》2018,32(15):1687-1699
In many industrial assemblies with structural adhesives, the handling time, i.e. the time to safely move adhesively bonded parts, may slow down manufacturing process and result into additional costs. For that reason, in some cases, the traditional mechanical connections (rivets, bolts, welds) are still preferable when the structure must be completed in a short time. In this work a new type of hybrid joint, characterized by the combined use of an epoxy adhesive and a double-sided pressure-sensitive tape, is proposed and characterized by experimental tests on single-lap joints with a large overlap. The results showed that these hybrid joints allow for reducing the handling time of the joint, preserving approximately the same strength. The proposed solution exploits the non-uniform stress distribution in the bondline of a single-lap joint, resulting in a low stress area at the centre of the overlap. The presence of an adhesive tape in this region produced either a negligible or minor drop (~20%) in strength depending on the epoxy used, while provided the joint with sufficient strength for being handled before the full cure of the epoxy. 相似文献
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The failure behavior of reinforced-adhesively single-lap joints was investigated experimentally and numerically. The reinforced adhesive was produced by mixing waste composite particles and an epoxy-based commercial adhesive. The single-lap joint was prepared with an adhesive and unidirectional fiber glass/epoxy composite plates with a (0°/90°)3 stacking sequence. Three types of adhesive were used: an un-reinforced adhesive (ADH), an adhesive mixed with glass fiber-reinforced epoxy resin composite plate particles (GFRC), and an adhesive mixed with carbon fiber-reinforced epoxy resin composite plate particles (CFRC). The adhesive thickness (ta) and overlap length (lap) were 0.4, 0.8, 1.2, and 1.6 mm and 10, 20, 30, and 40 mm, respectively. Progressive failure analysis was performed with the ANSYS? 11.0 finite element program using ANSYS? parametric design language (APDL) code. In the numerical study, the failure loads of the composite and the adhesive were determined with the Hashin failure criteria and the Tresca failure criteria, respectively. The difference between the experimental and numerical studies ranged from 2% to 10%. The failure load of reinforced-adhesively single-lap joints was 1.3–22.8% higher than that of the un-reinforced adhesive. 相似文献