Preparation and electrical properties of inas thin films

Thin films of InAs have been deposited on mica substrates through a vacuum evaporation technique by means of controlling the substrate and source temperatures. The films with large crystal grain were found to have the best electrical properties. The maximum electron mobility of 12, 400 cm²/V·sec at room temperature was obtained in an undoped film of 3 Μm thickness at a donor concentration of 3.5 × 10¹⁶ cm⁻³. The temperature dependence of both electron mobility and resistivity of these films was slightly lower than those reported for bulk crystal type InAs.     

Influence of substrate temperature on the properties of fluorinated silicon-nitride thin films deposited by IC-RPECVD

Fluorinated silicon-nitride films have been prepared from an Ar/SiF₄/NH₃ gas mixture by inductively coupled remote plasma-enhanced chemical vapor deposition (IC-RPECVD) at different substrate temperatures, ranging from 150 to 300°C. All of the resulting deposited silicon-nitride films were free of Si-H bonds, showed high dielectric breakdown fields (≥8 MV cm^?1), and had root mean square (rms) surface roughness values below 3 Å. The films’ refractive indices and the contents of O and F remain constant, but Si/N ratios drop from 5 to 2 and N-H bond concentrations decrease in the range (1.3–0.9) × 10²² cm^?3 as the substrate temperature increases. The density of interface states (D_it) with c-Si was reduced from 2.4 × 10¹² to 8 × 10¹¹ eV^?1 cm^?2 at substrate temperatures ≥250°C.     

Enhanced Thermoelectric Properties of Antimony Telluride Thin Films with Preferred Orientation Prepared by Sputtering a Fan-Shaped Binary Composite Target

p-Type antimony telluride (Sb₂Te₃) thermoelectric thin films were deposited on BK7 glass substrates by ion beam sputter deposition using a fan-shaped binary composite target. The deposition temperature was varied from 100°C to 300°C in increments of 50°C. The influence of the deposition temperature on the microstructure, surface morphology, and thermoelectric properties of the thin films was systematically investigated. x-Ray diffraction results show that various alloy composition phases of the Sb₂Te₃ materials are grown when the deposition temperature is lower than 200°C. Preferred c-axis orientation of the Sb₂Te₃ thin film became obvious when the deposition temperature was above 200°C, and thin film with single-phase Sb₂Te₃ was obtained when the deposition temperature was 250°C. Scanning electron microscopy reveals that the average grain size of the films increases with increasing deposition temperature and that the thin film deposited at 250°C shows rhombohedral shape corresponding to the original Sb₂Te₃ structure. The room-temperature Seebeck coefficient and electrical conductivity range from 101 μV K^?1 to 161 μV K^?1 and 0.81 × 10³ S cm^?1 to 3.91 × 10³ S cm^?1, respectively, as the deposition temperature is increased from 100°C to 300°C. An optimal power factor of 6.12 × 10^?3 W m^?1 K^?2 is obtained for deposition temperature of 250°C. The thermoelectric properties of Sb₂Te₃ thin films have been found to be strongly enhanced when prepared using the fan-shaped binary composite target method with an appropriate substrate temperature.     

Deposition and characterization of molybdenum thin films using dc-plasma magnetron sputtering

Molebdenum (Mo) thin films were deposited on well-cleaned soda-lime glass substrates using DC-plasma magnetron sputtering. In the design of experiment deposition was optimized for maximum beneficial characteristics by monitoring effect of process variables such as deposition power (100–200 W). Their electrical, structural and morphological properties were analyzed to study the effect of these variables. The electrical resistivity of Mo thin films could be reduced by increasing deposition power. Within the range of analyzed deposition power, Mo thin films showed a mono crystalline nature and the crystallites were found to have an orientation along [110] direction. The surface morphology of thin films showed that a highly dense micro structure has been obtained. The surface roughness of films increased with deposition power. The adhesion of Mo thin films could be improved by increasing the deposition power. Atomic force microscopy was used for the topographical study of the films and to determine the roughness of the films. X-ray diffractrometer and scanning electron microscopy analysis were used to investigate the crystallinity and surface morphology of the films. Hall effect measurement system was used to find resistivity, carrier mobility and carrier density of deposited films. The adhesion test was performed using scotch hatch tape adhesion test. Mo thin films prepared at deposition power of 200 W, substrate temperature of 23°C and Ar pressure of 0.0123 mbar exhibited a mono crystalline structure with an orientation along (110) direction, thickness of ～550 nm and electrical resistivity value of 0.57 × 10^?4 Ω cm.     

Effect of growth temperature on properties of transparent conducting gallium-doped ZnO films

Transparent conducting gallium-doped ZnO films are deposited on glass substrates by magnetron sputtering of conducting ceramic targets. The dependences of structural, electric, and optical characteristics of ZnO:Ga films on the substrate temperature are investigated during the deposition. Stability of resistivity of films is considered during annealing in air. It is found that the films deposited at the substrate temperature of 250°C have the lowest resistivity of 3.8 × 10⁻⁴ Ω cm, while those deposited at 200°C have the highest thermal stability.     

Properties of antimony doped ZnO thin films deposited by spray pyrolysis technique

Antimony (Sb) doped zinc oxide (ZnO) thin films were deposited on the glass substrate at 450°C using spray pyrolysis technique. Effect of Sb doping on surface morphology structural, optical and electrical properties were studied. X-ray diffraction (XRD) analysis showed that both the undoped and doped ZnO thin films are polycrystalline in nature with (101) preferred orientation. SEM analysis showed a change in surface morphology of Sb doped ZnO thin films. Doping results in a marked increase in conductivity without affecting the transmittance of the films. ZnO films prepared with 3 at % Sb shows the lowest resistivity of 0.185 Ohm cm with a Hall mobility of 54.05 cm² V^–1 s^–1, and a hole concentration of 6.25 × 10¹⁷ cm^–3.     

Resistivity changes of heavily-boron-doped CVD-prepared polycrystalline silicon caused by thermal annealing

Heavily-boron-doped polycrystalline Si films were deposited at 600°C on thermally grown SiO₂ by the thermal decomposition of SiH₄-BCl₃-H₂ mixture. Resistivity changes with isochronal or sequential annealing were systematically examined. Temperature dependence of equilibrium saturation carrier concentration was determined at 800 ～ 1100°C. Since as-deposited polycrystalline Si is in the super-saturated state, carrier concentration decreases from the super-saturated to equilibrium saturation value by annealings over 700°C for poly Si doped with over 2 × 10²⁰ cm^?3 resulting in anomalous resistivity change. Carrier concentration changes reversibly between saturation values with sequential annealing and is determined by the last annealing temperature when the annealing time is long enough. Mobility increases with annealing temperature, however, less increase is found for heavily doped poly Si, which is attributed to the suppression of grain growth caused by electrically inactive Si-B compounds.     

Structural and Electrical Characterization of ZnO Films Grown by Spray Pyrolysis and Their Application in Thin‐Film Transistors

The role of the substrate temperature on the structural, optical, and electronic properties of ZnO thin films deposited by spray pyrolysis using a zinc acetate precursor solution is reported. Analysis of the precursor compound using thermogravimentry and differential scanning calorimetry indicates complete decomposition of the precursor at around 350 °C. Film characterization using Fourier Transform Infrared Spectroscopy (FTIR), photoluminescence spectroscopy (PL), and ultraviolet–visible (UV–Vis) optical transmission spectroscopy suggests the onset of ZnO growth at temperatures as low as 100 °C as well as the transformation to a polycrystalline phase at deposition temperatures >200 °C. Atomic force microscopy (AFM) and X‐ray diffraction (XRD) reveal that as‐deposited films exhibit low surface roughness (rms ≈ 2.9 nm at 500 °C) and a crystal size that is monotonously increasing from 8 to 32 nm for deposition temperatures in the range of 200–500 °C. The latter appears to have a direct impact on the field‐effect electron mobility, which is found to increase with increasing ZnO crystal size. The maximum mobility and current on/off ratio is obtained from thin‐film transistors fabricated using ZnO films deposited at >400 °C yielding values on the order of 25 cm² V^?1s^?1 and 10⁶, respectively.     

The effects of carrier gas and substrate temperature on ZnO films prepared by ultrasonic spray pyrolysis

ZnO films were deposited on glass substrates in the temperature range of 350–470 °C under an atmosphere of compressed air or nitrogen (N₂) by using ultrasonic spray pyrolysis technique. Structural, electrical and optical properties of the ZnO films were investigated using X-ray diffraction (XRD), scanning electron microscopy (SEM), electrical two-probe and optical transmittance measurements. The ZnO films deposited in the range of 350–430 °C were polycrystalline with the wurtzite hexagonal structure having preferred orientation depending on the substrate temperature. The ZnO films deposited below 400 °C had a preferred (100) orientation while those deposited above 400 °C mostly had a preferred (002) orientation. The resistivity values of ZnO films depended on the types of carrier gas. The ZnO thin films deposited under N₂ atmosphere in the range of 370–410 °C showed dense surface morphologies and resistivity values of 0.6–1.1 Ω-cm, a few orders of magnitude lower than those deposited under compressed air. Hydrogen substition in ZnO possibly contributed to decreasing resistivity in ZnO thin films deposited under N₂ gas. The Hall measurements showed that the behavior of ZnO films deposited at 410 °C under the N₂ atmosphere was n-type with a carrier density of 8.9–9.2×10¹⁶ cm^-3 and mobility of ～70 cm²/Vs. ZnO thin films showed transmission values at 550 nm wavelength in a range of 70–80%. The values of band gaps extrapolated from the transmission results showed bandgap shrinkage in an order of milli electron volts in ZnO films deposited under N₂ compared to those deposited under compressed air. The calculation showed that the bandgap reduction was possibly a result of carrier–carrier interactions.     

Growth of tin-doped indium antimonide for magnetoresistors

Magnetoresistors made from n-type indium antimonide are of interest for magnetic position sensing applications. In this study, tin-doped indium antimonide was grown by the metalorganic chemical vapor deposition technique using trimethylindium, trisdimethylaminoantimony, and tetraethyltin in a hydrogen ambient. Using a growth temperature of 370°C and a pressure of 200 Torr, it was found that the electron density in tin-doped films varied from 3.3×10¹⁶ cm⁻³ to 4.0×10¹⁷ cm⁻³ as the 5/3 ratio was varied from 4.8 to 6.8. From secondary ion mass spectroscopy (SIMS) studies, it was found that this variation is not caused by a change in site occupancy of the tin atoms from antimony to indium lattice sites, but rather to a change in the total tin concentration incorporated into the films. This dependence of tin incorporation on stoichiometry could be used to rapidly vary the doping level during growth. Undoped films grown under similar conditions had electron densities of about 2×10¹⁶ cm⁻³ and electron mobilities near 50,000 cm²V⁻¹s⁻¹ at room temperature for films that were only 1.5 μm thick on a gallium arsenide substrate. Attempts to grow indium antimonide at 280°C resulted in p-type material caused by carbon incorporation. The carbon concentration as measured with SIMS increased rapidly with increasing growth rate, to above 10¹⁹ cm⁻³ at 0.25 μm/h. This is apparently caused by incomplete pyrolysis of a reactant at this low growth temperature. Growth at 420°C resulted in rough surface morphologies. Finally, it was demonstrated that films with excellent electron mobility and an optimized doping profile for magnetoresistors can be grown.     

Effects of Rapid Thermal Annealing on Electrical Transport in Heavily Doped ZnO Thin Films Deposited at Different Substrate Temperatures

In this work, heavily doped ZnO thin films with carrier concentrations of 1.7 × 10²⁰–1.1 × 10²¹ cm^?3 were prepared on glass substrates using direct current magnetron sputtering combined with rapid thermal annealing (RTA). The effects of RTA on the electrical transport properties of the thin films were investigated. Results showed that the resistivities of the thin films deposited at low temperatures were markedly improved due to the increased mobilities and/or carrier concentrations. Temperature-dependent Hall measurements and theoretical calculations suggested that the influence of grain boundary scattering was negligible for all the samples and the mobility was mainly determined by ionized impurity scattering. The influence of crystallographic defects on the mobility could be effectively reduced via RTA when the carrier concentration was above 4.0 × 10²⁰ cm^?3, resulting in a mobility and resistivity close to the ionized impurity scattering theoretical estimation. The highest mobility of 46 cm² V^?1 s^?1 at the resistivity of 2.8 × 10^?4 Ω cm and the lowest resistivity of 2.6 × 10^?4 Ω cm were achieved for the RTA-treated 1 wt.% Al-doped ZnO and 5 wt.% Ga-doped ZnO thin films, respectively.     

Structural,Optical and Electrical Properties of Polycrystalline CuO Thin Films Prepared by Magnetron Sputtering

Cupric oxide thin films were deposited on silicon and sapphire substrates by reactive radio frequency magnetron sputtering at different substrate temperatures. The results showed that the CuO films were composed of different sizes of CuO nano-grains and the CuO films deposited on Si substrates showed a more dense and uniform surface than that deposited on Al₂O₃ substrates. It was noted that both the CuO films deposited on Si and Al₂O₃ substrates revealed only CuO related diffractions and the preferred orientation of the CuO films changed from (002) to (111) as the substrate temperature increased. Moreover, the carrier concentration was 1.141?×?10¹⁸ cm^?3 and the mobility was 0.401 cm²/v s at 450°C substrate temperature. The controllable electrical properties of the films can be achieved by the variation of crystal quality arising from the substrate temperature.     

Carbon-Incorporated Amorphous Indium Zinc Oxide Thin-Film Transistors

We propose the use of amorphous-carbon indium zinc oxide (a-CIZO) as a channel material for thin-film transistor (TFT) fabrication. This study chose a carbon dopant as a carrier suppressor and strong oxygen binder in amorphous-indium zinc oxide (a-IZO) channel material. a-CIZO thin films were deposited using radiofrequency (RF) sputtering and postannealed at 150°C. X-ray diffraction and transmission electron microscopy analysis revealed that the film remained amorphous even after postannealing. The a-CIZO TFT postannealed at 150°C exhibited saturation field-effect mobility of 16.5 cm² V^?1 s^?1 and on–off current ratio of ～4.3 × 10⁷.     

Surface gettering of background impurities and defects in GaAs wafers

The first data on surface gettering of background impurities and defects from the bulk of single-crystal undoped GaAs(111) wafers are reported. The wafers were 1.6 mm thick, with an initial electron density of (1–3)×10¹⁵ cm^?3 and a mobility of 1500–2000 cm²/(V s) at room temperature. The wafers were cut from single crystals grown by the Czochralski method from a nonstoichiometric As-enriched Ga-As melt. Gettering was carried out during thermal treatment of the wafers in hydrogen at 400–850°C, with the preliminary deposited layer of Y or SiO₂ 1000 Å thick. As a result of gettering, the charge carrier density decreased to 10⁸–10¹⁰ cm^?3, while the mobility increased to 7000 cm²/(V s).     

Microstructures and electrical properties of SrRuO3 thin films on LaAIO3 substrates

Conductive SrRuO₃ thin films have been deposited using pulsed laser deposition on LaA10₃ substrates at different substrate temperatures. Structural and microstructural properties of the SrRuO₃/LaAlO₃ system have been studied using x-ray diffraction, scanning electron microscopy, and scanning tunneling microscopy. Electrical properties of SrRuO₃ thin films have been measured. It was found that the film deposited at 250°C is amorphous, showing semiconductor-like temperature dependence of electrical conductivity. The film deposited at 425°C is crystalline with very fine grain size (100∼200?), showing both metallic and semiconductor-like temperature dependence of electrical conductivity in different temperature regions. The film deposited at 775°C shows a resistivity of 280 μΩ.cm at room temperature and a residual resistivity ratio of 8.4. Optimized deposition conditions to grow SrRuO₃ thin films on LaA10₃ substrates have been found. Possible engineering applications of SrRuO₃ thin films deposited at different temperatures are discussed. Bulk and surface electronic structures of SrRuO₃ are calculated using a semi-empirical valence electron linear combination of atomic orbitals approach. The theoretical calculation results are employed to understand the electrical properties of SrRuO₃ thin films.     

Pulsed laser deposition of titanium nitride and diamond-like carbon films on polymers

We have investigated the deposition of titanium nitride (TiN) and diamond-like carbon (DLC ) films on polymethylmethacrylate (PMMA) substrates using pulsed laser deposition (PLD) technique. The TiN and diamond-like films were deposited by laser ablation (KrF excimer laser λ = 248 nm, pulse duration τ～25 × 10^?9 s, energy density ～2?15J/cm²) of TiN and graphite targets, respectively, at room temperature. These films were characterized by transmission electron microscopy, scanning electron microscopy, x-ray diffraction, Auger electron spectroscopy, UV-visible absorption spectroscopy, and Raman spectroscopy. The TiN films were smooth and found to be polycrystalline with average grain size of 120Å. The diamond-like carbon films were amorphous with a characteristic Raman peak at 1550 cm^?1. The TiN films are highly adherent to the polymer substrates as compare to DLC films. The adhesion strength of DLC films on polymers was increased by interposing thin TiN layer (200Å) on polymers byin-situ pulsed laser deposition. The DLC films were found to be amorphous with good adhesion to TiN/PMMA substrates.     

Structure and properties of Al-1%Si thin films on Si as a function of gas impurities during DC magnetron-sputtered deposition

Thin films of Al-l%Si were sputter deposited on Si under a variety of pressures of atmospheric impurity gases. The effect of the impurity gases (oxygen, nitrogen, and water), and deposition temperature (15° and 300° C), on the microstructure and properties of the aluminum thin films were studied. The gas pressures introduced during deposition varied from 5 × 10^s−6 Torr (6.7 × 10^s−4 Pa) to 1 × 10^s-10 Torr (1 × 10^s−8 Pa). The thin films were investigated by transmission electron microscopy and were found to have a columnar microstructure with an even distribution of silicon precipitates. Both the grain size and silicon precipitate size increased at the higher deposition temperature. A smaller grain size was found in samples that were deposited under the higher impurity gas pressures tested. The specular reflectance of the films was found to be dependent upon the amount of impurity gases present during deposition, the greater the partial pressure the greater the surface roughness. This study also investigated the possibility of using a Resistivity Ratio (RR) measurement to evaluate the grain size of the Al thin films. It has been previously observed that a small Al grain size has poor electromigration resistance. This study found that the correlation between Al grain size and RR values was good indicating that RR tests may be used as a quick, non-destructive measure of film quality.     

The structural,optical, and electrical properties of vacuum evaporated Cu-doped ZnTe polycrystalline thin films

We have studied the structural, optical, and electrical properties of thermally evaporated, Cu-doped, ZnTe thin films as a function of Cu concentration and post-deposition annealing temperature. X-ray diffraction measurements showed that the ZnTe films evaporated on room temperature substrates were characterized by an average grain size of 300Å with a (111) preferred orientation. Optical absorption measurements yielded a bandgap of 2.21 eV for undoped ZnTe. A bandgap shrinkage was observed for the Cu-doped films. The dark resistivity of the as-deposited ZnTe decreased by more than three orders of magnitude as the Cu concentration was increased from 4 to 8 at.% and decreased to less than 1 ohm-cm after annealing at 260°C. For films doped with 6–7 at.% Cu, an increase of resistivity was also observed during annealing at 150–200°C. The activation energy of the dark conductivity was measured as a function of Cu concentration and annealing temperature. Hall measurements yielded hole mobility values in the range between 0.1 and 1 cm²/V·s for both as-deposited and annealed films. Solar cells with a CdS/CdTe/ZnTe/metal structure were fabricated using Cudoped ZnTe as a back contact layer on electrodeposited CdTe. Fill factors approaching 0.75 and energy conversion efficiencies as high as 12.1% were obtained.     

Study of amorphous Ta2O5 thin films by DC magnetron reactive sputtering

The dc magnetron reactive sputtering deposition of tantalum pentoxide (Ta₂O₅) thin films was investigated. By combining Schiller's criterion and Reith’s “target preoxidation” procedure, high quality Ta₂O₅ thin films were prepared at a high deposition rate of about lOOÅ;/min. The deposited films were amorphous, with a refractive index around 2.07 and a dielectric constant of 20. An optical transmit-tance of 98.6% was obtained for a 4500Â thick film. The leakage current density is 5 × 10^?9 A/cm² at an electric field strength of 1 MV/cm and its breakdown field strength is above 2 MV/cm. The temperature coefficient of capacitance for capacitors fabricated using the deposited films is approximately +230 ppm/°C. X-ray photoelectron spectroscopy shows that the films are stoichiometric tantalum pentoxide, Ta₂O₅, and exhibit good stability.     

Influence of working pressure on the structural,optical and electrical properties of sputter deposited AZO thin films

Highly oriented crystalline aluminum doped zinc oxide (AZO) films were sputter deposited on glass substrates and a systematic investigation on the as deposited and etched films was reported for its further application in silicon thin film solar cell. Influence of the deposition pressure (from 2 to 8 mTorr) and post-annealing temperature (at 400 °C for 5 min) on the structural, optical and electrical properties of the as-deposited and etched samples were analyzed. The optimum condition for its reproducibility and large area deposition is determined and found that the depositions made at 8 mTorr at 200 W having the distance from source to substrate of 9 cm. All the AZO films exhibited a c-axis preferred orientation perpendicular to the substrate and their crystallinity was improved after annealing. From the XRD pattern the grain size, stress and strain of the films were evaluated and there is no drastic variation. Optical transmittance, resistivity, Hall mobility and carrier concentration for the as deposited and etched-annealed films were found to improve from 79 to 82%; 2.97 to 3.14×10⁻⁴ Ω cm; 25 to 38 cm²/V s; 8.39 to 5.96×10²⁰/cm³ respectively. Based on the triangle diagram between figure of merit and Hall mobility, we obtained a balance of point between the electrical and optical properties to select the deposition condition of film for device application.