AlGaN/GaN-heterostructures on (111) 3C-SiC/Si pseudo substrates for high frequency applications

We present the realization of high electron mobility transistors (HEMTs) based on AlGaN/GaN heterostructures, which were grown on silicon substrates using an ultrathin SiC transition layer. The growth of AlGaN/GaN heterostructures on 3C-SiC(111)/Si(111) was performed using metalorganic chemical vapour deposition (MOCVD). The 3C-SiC(111) transition layer was realized by low pressure CVD and prevented Ga-induced meltback etching and Si-outdiffusion in the subsequent MOCVD growth. The two-dimensional electron gas (2DEG) formed at the AlGaN/GaN interface showed an electron sheet density of 1.5 × 10¹³ cm^− 3 and a mobility of 870 cm²/Vs. The HEMTs DC and RF characteristics were analysed and showed a peak cut-off frequency as high as 29 GHz for a 250 nm gate length.     

AlGaN/GaN HEMTs passivated by Cat-CVD SiN Film

We demonstrate the excellent performance of a 140 W AlGaN/GaN HEMT in the C-band, which is passivated by a Cat-CVD SiN film. The interface trap density of the AlGaN surface passivated by Cat-CVD film after NH₃ treatment is 3 × 10¹² cm^− 2, which is the smallest of investigated deposition techniques. The lowest interface trap density achieved by the Cat-CVD technique makes it possible to operate the AlGaN/GaN HEMT in the C-band. We clarify that the Cat-CVD technique is necessary for developing future amplifiers.     

Enhanced ferroelectric properties of Pb(Zr0.80Ti0.20)O3/PbO thin films prepared by radio frequency magnetron sputtering

The Pb(Zr_0.80Ti_0.20)O₃ (PZT) thin films with and without a PbO buffer layer were deposited on the Pt(1 1 1)/Ti/SiO₂/Si(1 0 0) substrates by radio frequency (rf) magnetron sputtering method. The PbO buffer layer improves the microstructure and electrical properties of the PZT thin films. High phase purity and good microstructure of the PZT thin films with a PbO buffer layer were obtained. The effect of the PbO buffer layer on the ferroelectric properties of the PZT thin films was also investigated. The PZT thin films with a PbO buffer layer possess better ferroelectric properties with higher remnant polarization (P_r = 25.6 μC/cm²), and lower coercive field (E_c = 60.5 kV/cm) than that of the films without a PbO buffer layer (P_r = 9.4 μC/cm², E_c = 101.3 kV/cm). Enhanced ferroelectric properties of the PZT thin films with a PbO buffer layer is attributed to high phase purity and good microstructure.     

Properties of LiNbO3 based heterostructures grown by pulsed-laser deposition for optical waveguiding application

Epitaxial LiNbO₃ (LN) thin films have been grown onto (00.1) Al₂O₃ substrates and onto sapphire covered with a conductive ZnO buffer layer. For the two systems, the LN thin films are well crystallised and highly (00.1) oriented. Epitaxial relationships between the different layers are evidenced both on the LN/sapphire film and the LN/ZnO/sapphire heterostructure. The optical waveguiding propagation losses of the LN/sapphire films are very low (1 ± 0.5 dB/cm) while the LN/ZnO/sapphire heterostructure does not exhibit satisfying waveguiding properties mainly due to the high conductivity (600 S m^− 1) of the ZnO buffer layer.     

III-Nitrides growth and AlGaN/GaN heterostructures on ferroelectric materials

The growth of III-nitrides on the ferroelectric materials lithium niobate (LN) and lithium tantalate (LT) via molecular beam epitaxy (MBE) using rf plasma source has been investigated. We have found that gallium nitride (GaN) epitaxial layers have a crystalline relationship with lithium niobate (tantalate) as follows: (0 0 0 1) GaN || (0 0 0 1) LN (LT) with [10−10] GaN || [11−20] LN (LT). The surface stability of LN and LT substrates has been monitored by in situ spectroscopic ellipsometry in the vacuum chamber. Three different temperature zones have been discerned; surface degas and loss of OH group (100–350 °C); surface segregation/accumulation of Li and O-species (400–700 °C); surface evaporation of O-species and Li desorption (over 750 °C). However, LT shows only surface degassing in the range of 100–800 °C. Therefore, congruent LN substrates were chemically unstable at the growth temperature of 550–650 °C, and therefore developed an additional phase of Li-deficient lithium niobate (LiNb₃O₈) along with lithium niobate (LiNbO₃), confirmed by X-ray diffraction. On the other hand, LT showed better chemical stability at these temperatures, with no additional phase development. The structural quality of GaN epitaxial layers has shown slight improvement on LT substrates over LN substrates, according to X-ray diffraction. Herein, we demonstrate AlGaN/GaN heterostructure devices on ferroelectric materials that will allow future development of multifunctional electrical and optical applications.     

Preparation, dielectric and ferroelectric properties of Pb5Ge3O11 and Pb5Ge2.85Si0.15O11 thin films fabricated by sol-gel process

Lead germanate-silicate (Pb₅Ge_2.85Si_0.15O₁₁) ferroelectric thin films were successfully fabricated on Pt/Ti/SiO₂/(100)Si substrates by the sol-gel process. The thin films were fabricated by multi-coating at preheating temperatures of 350 and 450 °C. After annealing the thin films at 600 °C, the films exhibited c-axis preferred orientation. The degree of c-axis preferred orientation of the thin films preheated at 350 °C was higher than that of films preheated at 450 °C. Grain growth was influenced by the annealing time. The thin films exhibited a well-saturated ferroelectric P-E hysteresis loop when preheated at 350 °C and annealed at 600 °C for 1.5 h. The values of the remanent polarization (Pr) and the coercive field (Ec) were approximately 2.1 μC/cm² and 100 kV/cm, respectively.     

Impact of SF6 plasma treatment on performance of AlGaN/GaN HEMT

Selective plasma treatment of an AlGaN/GaN heterostructure in the RF discharge of the electronegative SF₆ gas was studied. Shallow recess-gate etching of AlGaN (∼5 nm) was performed in CCl₄ plasma through a photoresist mask. Subsequently, recess-gate etching followed in situ by SF₆ plasma. The plasma treatment provides the following advantages in the technology of AlGaN/GaN high-electron mobility transistors (HEMT): It (1) simplifies their technology; (2) ensures sufficient selectivity; and (3) enables the technologist to set the threshold voltage of the HEMTs controllably. At the same time, the treatment can (1) provide the AlGaN/GaN heterostructure with surface passivation; (2) modify the 2DEG in any area of a HEMT channel; and (3) make it possible to convert a HEMT operation from depletion mode to enhancement mode. The treatment also improved significantly the DC and RF parameters of HEMTs studied.     

Electrical and structural characterizations of non-polar AlGaN/GaN heterostructures

A non-polar AlGaN/GaN structure is a strong candidate for the high-voltage device that can operate in enhancement-mode compared to the depletion-mode operation that is practically unavoidable for a standard polar AlGaN/GaN structure. Growth of non-polar GaN is non-trivial and a two-step nucleation scheme was developed to produce high-quality non-polar a-plane AlGaN/GaN structures on r-plane sapphire. The anisotropic nature of non-polar GaN requires a modification to a typical polar GaN-based transistor fabrication process. A KOH wet etch proceeded by a dramatically different mechanism compared to the standard polar c-face AlGaN/GaN structure. This device with Pt/Au Schottky gate displayed a barrier height of 0.76 eV and an ideality factor of 4 at 20 °C.     

Processing of nanocrystalline diamond thin films for thermal management of wide-bandgap semiconductor power electronics

High current densities in wide-bandgap semiconductor electronics operating at high power levels results in significant self-heating of devices, which necessitates the development thermal management technologies to effectively dissipate the generated heat. This paper lays the foundation for the development of such technology by ascertaining process conditions for depositing nanocrystalline diamond (NCD) on AlGaN/GaN High Electron Mobility Transistors (HEMTs) with no visible damage to device metallization. NCD deposition is carried out on Si and GaN HEMTs with Au/Ni metallization. Raman spectroscopy, optical and scanning electron microscopy are used to evaluate the quality of the deposited NCD films. Si device metallization is used as a test bed for developing process conditions for NCD deposition on AlGaN/GaN HEMTs. Results indicate that no visible damage occurs to the device metallization for deposition conditions below 290 °C for Si devices and below 320 °C for the AlGaN/GaN HEMTs. Possible mechanisms for metallization damage above the deposition temperature are enumerated. Electrical testing of the AlGaN/GaN HEMTs indicates that it is indeed possible to deposit NCD on GaN-based devices with no significant degradation in device performance.     

Investigation of the interface properties of MOVPE grown AlGaN/GaN high electron mobility transistor (HEMT) structures on sapphire

We have developed a virtual GaN substrate on sapphire based on a two-step growth method. By optimizing the growth scheme for the virtual substrate we have improved crystal quality and reduced interface roughness. Our Al_0.22Ga_0.78N/GaN HEMT structure grown on the optimized semi-insulating GaN virtual substrate, exhibits Hall mobilities as high as 1720 and 7350 cm²/Vs and sheet carrier concentrations of 8.4 × 1012 and 10.0 × 1012 cm^− 2 at 300 K and 20 K, respectively. The presence of good AlGaN/GaN interface quality and surface morphology is also substantiated by X-Ray reflectivity and Atomic Force Microscopy measurements. A simplified transport model is used to fit the experimental Hall mobility.     

Adsorption-Controlled Growth of BiFeO3 by MBE and Integration with Wide Band Gap Semiconductors

BiFeO3 thin films have been deposited on (001) SrTiO3, (101) DyScO3, (011) DyScO3, (0001) AlGaN/GaN, and (0001) 6H-SiC single crystal substrates by reactive molecular beam epitaxy in an adsorption-controlled growth regime. This is achieved by supplying a bismuth over-pressure and utilizing the differential vapor pressures between bismuth oxides and BiFeO₃ to control stoichiometry in accordance with thermodynamic calculations. Four-circle x-ray diffraction and transmission electron microscopy reveal phase-pure, epitaxial films with rocking curve full width at half maximum values as narrow as 7.2 arc seconds (0.002°). Epitaxial growth of (0001)-oriented BiFeO3 thin films on (0001) GaN, including AlGaN HEMT structures, and (0001) SiC has been realized using intervening epitaxial (111) SrTiO₃ / (100) TiO₂ buffer layers. The epitaxial BiFeO3 thin films have 2 in-plane orientations: [1120] BiFeO>sub>3 || [1120] GaN (SiC) plus a twin variant related by a 180° in-plane rotation. This epitaxial integration of the ferroelectric with the highest known polarization, BiFeO3, with high bandgap semiconductors is an important step toward novel field-effect devices.     

High quality a-plane GaN films grown on cone-shaped patterned r-plane sapphire substrates

Planar nonpolar (112?0) a-plane GaN films have been grown by metalorganic chemical-vapor deposition directly on cone-shaped patterned r-plane sapphire substrates (PRSS) fabricated by dry etching. High-resolution X-ray diffractometers 2θ-ω scan confirmed that the films grown on PRSS are solely a-plane oriented, and the full width at half maximum values (FWHM) of the X-ray rocking curves for (112?0) GaN along [0001]_GaN and [11?00]_GaN were found to be 684 and 828″, respectively. As compared to the film grown on conventional r-plane sapphire substrate which typically has (112?0) omega FWHM values of 900 and 2124″ along [0001]_GaN and [11?00]_GaN respectively, the film grown on PRSS exhibits overall reduced omega FWHM values, and much smaller anisotropy behavior of crystallinity with respect to the in-plane orientation. The surface morphology is also improved by utilizing the PRSS technique. Cross-sectional transmission electron microscopy analysis shows that the density of threading dislocations has been greatly reduced from ~ 1.0 × 10¹⁰ cm^− 2 above the flat sapphire regions to ~ 1.0 × 10⁷ cm^− 2 above the protruding cone patterns. The improvement of crystal quality and the increase of light extraction efficiency by using cone-shaped PRSS technique lead to a strong enhancement in the light emission of a-plane GaN films. These results indicate that growth of a-plane GaN films on cone-shaped PRSS shows promise for use in high-quality and high-cost-performance nonpolar GaN based devices.     

Enhanced ferroelectric properties in Bi-doped K0.5Na0.5NbO3 thin films prepared by pulsed laser deposition

Lead-free ferroelectric Bi-doped K_0.5Na_0.5NbO₃ (KNN) and undoped KNN films were prepared by pulsed laser deposition. Bi-doped film exhibited good crystallization and improved ferroelectric properties. The dielectric constant and loss tangent were 1038 and 0.138 at 1 kHz, respectively. The remanent polarization (P_r = 28 μC/cm²) of Bi-doped film was about four times larger than that of the undoped film, which attributed to the decrease of oxygen vacancies concentration. The coercive field (E_c = 24 kV/cm) of Bi-doped films was half of the undoped film. The conduction mechanisms of Bi-doped film determined to be Space-Charge-Limited-Current and Poole–Frenkle emission at low and high electric field, respectively.     

Electrical and optical investigations on Pb1 − 3x/2LaxZr0.2Ti0.8O3 thin films obtained by radiofrequency assisted pulsed laser deposition

Thin films of ferroelectric relaxor Pb_1 − 3x/2La_xZr_0.2Ti_0.8O₃, x = 0.22 have been integrated in an oxidic heterostructure for electro-optical investigations. The quadratic electro-optic behavior and optical properties have been studied by means of variable angle spectroscopic ellipsometry method in reflection mode. Birefringence values up to δΔ = 0.17° have been obtained for quadratic compositions at λ = 540 nm and 65° angle of incidence. Structural, chemical and morphologic properties of Pb_1-3x/2La_xZr_0.2Ti_0.8O₃ (x = 0.22) thin films have been investigated by x-ray diffraction and atomic force microscopy techniques. The dielectric and ferroelectric behavior has been investigated using dielectric spectroscopy and a ferroelectric test system.     

Effect of processing on the properties of Bi3.15Nd0.85Ti3O12 thin films

Various crystallization parameters were studied during the fabrication of Bi_3.15Nd_0.85Ti₃O₁₂ (BNdT) thin films on Pt/Ti/SiO₂/Si (100) by metal organic solution decomposition method. The effect of crystallization processes, crystallization ambients on the properties of BNdT thin films such as orientation, ferroelectric properties were examined. By adopting different fabrication processes, it is possible to get both highly c-axis oriented as well as randomly oriented thin films. Highly c-axis oriented BNdT thin film showed a large remnant polarization (2P_r) of 70 μC/cm² at an applied voltage of 10 V and exhibited a fatigue free behavior unto 2 × 10⁹ switching cycles. The improved ferroelectric properties of BNdT thin films suggest their suitability for high density ferroelectric random access memory applications.     

Ion beam studies of multi-quantum wells of III-nitrides

III-Nitrides have attracted much attention due to their versatile and wide range of applications, such as blue/UV light emitting diodes. Strained layer super lattices offer extra degree of freedom to alter the band gap of lattice-mismatched heterostructures. Swift heavy ion irradiation is a post-growth technique to alter the band gap of semiconductors, spatially. In the present study, strained AlGaN/GaN multi-quantum wells (MQWs) were grown on sapphire with insertion of AlN and GaN as buffer layers between substrate and epilayers. Such grown AlGaN/GaN MQWs, AlGaN/GaN heterostructures and GaN layers were irradiated with 200 MeV Au and 150 MeV Ag ions at a fluence of 5 × 10¹¹ ions/cm² and 5 × 10¹² ions/cm² respectively. As-grown and irradiated samples have been characterized by high resolution XRD, photoluminescence and RBS/channelling. Measured strain values show that strain increases upon irradiation and the luminescence properties are enhanced. RBS/channelling confirms the increase in strain values upon irradiation. In this paper we describe the effects of swift heavy ion irradiation on structural and optical properties.     

Effect of annealing ambient on structure and ferroelectric properties of Pb(Zr0.4Ti0.6)O3 thin films on LaNiO3 coated Si substrates

Pb(Zr_0.4Ti_0.6)O₃ [PZT(40/60)] thin films were deposited onto LaNiO₃ (LNO) coated Si substrates by sol-gel technique. Three kinds of gases, air, O₂ and N₂, were used as the annealing ambient. The effect of the annealing ambient on their structure and ferroelectric properties was investigated. The results showed that both the films annealed in air and O₂ were the complete perovskite phase with (1 0 0) preferential orientation, while those annealed in N₂ were random orientation including some pyrochlore phases. As compared with the air ambient, either too much O₂ or too much N₂ was detrimental to the ferroelectric properties of PZT films. The difference in structure and ferroelectric properties was mainly associated with the intermediate phases and the concentration of domain pinning centers in the films.     

Piezoelectric properties of Bi4Ti3O12 thin films annealed in different atmospheres

Bismuth titanate (Bi₄Ti₃O₁₂—BIT) films were evaluated for use as lead-free piezoelectric thin-films in micro-electromechanical systems. The films were grown by the polymeric precursor method on Pt/Ti/SiO₂/Si (1 0 0) (Pt) bottom electrodes at 700 °C for 2 h in static air and oxygen atmospheres. The domain structure was investigated by piezoresponse force microscopy (PFM). Annealing in static air leads to better ferroelectric properties, higher remanent polarization, lower drive voltages and higher piezoelectric coefficient. On the other hand, oxygen atmosphere favors the imprint phenomenon and reduces the piezoelectric coefficient dramatically. Impedance data, represented by means of Nyquist diagrams, show a dramatic increase in the resistivity for the films annealed in static air atmopshere.     

Large electrocaloric effect of highly (100)-oriented 0.68PbMg1/3Nb2/3O3-0.32PbTiO3 thin films with a Pb(Zr0.3Ti0.7)O3/PbOx buffer layer

0.68PbMg_1/3Nb_2/3O₃-0.32PbTiO₃ (PMN-PT) thin films with a lead zirconate titanate Pb(Zr_0.3Ti_0.7)O₃ (PZT)/PbO_x buffer layer were deposited on Pt/TiO₂/SiO₂/Si substrates by radio frequency magnetron sputtering technique, and pure perovskite crystalline phase with highly (100)-preferred orientation was formed in the ferroelectric films. We found that the highly (100)-oriented thin films possess not only excellent dielectric and ferroelectric properties but also a large electrocaloric effect (13.4 K at 15 V, i.e., 0.89 K/V) which is attributed to the large electric field-induced polarization and entropy change during the ferroelectric-paraelectric phase transition. The experimental results indicate that the use of PZT/PbO_x buffer layer can induce the crystal orientation and phase purity of the PMN-PT thin films, and consequently enhance their electrical properties.     

Effect of processing temperature on characteristics of metal-ferroelectric (BiFeO3)-insulator (HfLaO)-silicon capacitors

The effect of temperature in rapid thermal annealing (RTA) process on the physical and electrical properties of bismuth ferrite ceramic thin films on HfLaO/p-Si substrates has been investigated. In metal-ferroelectric-insulator-silicon (MFIS) capacitors, the high-k HfLaO dielectric layer was prepared as the insulator layer. On HfLaO/Si substrates the bismuth ferrite thin film was fabricated via sputtering process with a BiFeO₃ (BFO) target at room temperature followed by RTA. The RTA temperature ranged from 500 to 700 °C. It is found that the root mean square roughness of ceramic films increases for high-temperature process. The maximum ferroelectric memory window is 1.6 V obtained from a sweep voltage of ± 4 V at the lowest RTA temperature of 500 °C. This good ferroelectric memory performance can be attributed to the low leakage current as a result of smooth surface of nanocrystalline ferroelectric BFO and Bi₂Fe₄O₉ thin films.